KR20170063393A - Boltless-type illuminating device - Google Patents

Abstract

According to an embodiment of the present invention, an illumination device includes: a heat dissipation body having a light emitting module mounted thereon and having a fixing slot recessed from an outer surface; And a socket having a fixed hook inserted into one end of the heat dissipating body to which the diffusion cover is coupled and protruding from the inner side, wherein the fixing slot is formed to be perpendicular to a longitudinal direction of the heat dissipating body, Is inserted into the fixing slot while the heat dissipating body is inserted into the socket to prevent the socket from being separated from the heat dissipating body.

Description

[0001] BOLLESS-TYPE ILLUMINATING DEVICE [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lighting device, and more particularly, to a lighting device in which a fastening method using a bolt is removed.

In general, research and development on lighting devices is being carried out in consideration of energy efficiency and satisfying consumer needs. The lighting apparatuses such as incandescent lamps, fluorescent lamps, and three-wavelength lamps, which are widely used and widely used, are used by consumers because of their simplicity in manufacture and use, but their life spans are short, energy is consumed in a large amount, , And ultraviolet rays harmful to the human body are also detected. The environmental pollution problem is also serious because it includes Ar gas and He gas which are harmful to the environment.

In order to solve such a problem, recently, an LED lighting device which improves the life span of the lighting device and greatly improves the energy efficiency has been developed and released. Since the power consumption of this LED lighting device is less than 5W, it can save electric power charges by 80% or more, and the lifetime is semi-permanent (10 years). In addition, there are no ultraviolet ray emission and environmental regulation elements (Ar, He), and there is no pollution problem that occurs when the fluorescent lamp is discarded.

Korean Registered Patent No. 10-1218333 (December 27, 2012)

It is an object of the present invention to provide a lighting apparatus which can simplify the assembly process and minimize the time required for assembly.

Other objects of the present invention will become more apparent from the following detailed description and the accompanying drawings.

According to an embodiment of the present invention, an illumination device includes: a heat dissipation body having a light emitting module mounted thereon and having a fixing slot recessed from an outer surface; And a fixing hook protruding from an inner side of the socket body, wherein the fixing slot is formed to be perpendicular to a longitudinal direction of the heat radiating body, So as to prevent the socket from being separated from the heat-dissipating body.

The socket has a cylindrical shape with one side located on the opposite side of the heat dissipating body closed and connected to each other through the one side closed with the inner terminal and the outer terminal located inside and outside the socket, And the lighting device further includes a driving circuit module mounted on the heat radiating body to drive the light emitting module, wherein the driving circuit module includes a lower substrate and a terminal module mounted on the lower substrate, The terminal module may have a terminal slot into which the inner terminal is inserted when the heat dissipating body is inserted into the socket.

The light emitting module includes an upper substrate and a light emitting body mounted on the upper substrate to emit light, wherein the heat dissipating body comprises: a flat plate-like support plate on which the upper substrate is mounted on the upper surface and the lower substrate is mounted on the lower surface; And a heat sink connected to the support plate and disposed around the lower substrate to form an inner space in which the lower substrate is mounted. The fixing slot may be formed on the outer surface of the heat sink.

The support plate may be positioned higher than the center axis of the socket.

The lighting apparatus may further include a housing module inserted in an inner space of the heat dissipating body and having the drive circuit module mounted therein, wherein the housing module includes: a protective upper plate installed between the support plate and the lower substrate; And a protection lower plate connected to the protection plate and disposed around the lower substrate to form an inner space in which the lower substrate is mounted.

Wherein the socket has an outer tube and an inner tube respectively located on the outer side and the inner side of the heat dissipating body in a state where the heat dissipating body is inserted into the socket, the fixing hook protruding from the inner side surface of the outer tube, The inner tube may have an opening formed at a position corresponding to the fixing hook.

According to an embodiment of the present invention, since the socket is assembled to the heat dissipating body through the fixing hook, a separate fastener is not used, thereby minimizing the assembly time.

In addition, when the inner terminal is directly connected to the outer terminal, it is inserted into the terminal module of the driving circuit module, and the reliability of the connection state between the inner terminal and the terminal module can be secured.

1 is a schematic view of a lighting apparatus according to an embodiment of the present invention.
2 is an exploded view showing the illumination device shown in Fig.
3 is a perspective view showing the heat dissipating body and the housing module shown in FIG.
Fig. 4 is a perspective view showing the heat dissipating body shown in Fig. 2. Fig.
FIG. 5 is a perspective view showing the housing module shown in FIG. 2. FIG.
6 is a perspective view showing the drive circuit module shown in Fig.
7 is a perspective view showing a process of inserting the inner terminal shown in FIG. 2 into the terminal module.
Figs. 8 and 9 are sectional views showing the socket shown in Fig. 2. Fig.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to FIGS. 1 and 9. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the embodiments described below. The embodiments are provided to explain the present invention to a person having ordinary skill in the art to which the present invention belongs. Accordingly, the shape of each element shown in the drawings may be exaggerated to emphasize a clearer description.

Fig. 1 is a schematic view of a lighting apparatus according to an embodiment of the present invention, and Fig. 2 is an exploded view showing the lighting apparatus shown in Fig. 1. Fig. As shown in FIGS. 1 and 2, the lighting device has substantially the same shape as a conventional fluorescent lamp, and thus can be used as an alternative to a conventional fluorescent lamp. Specifically, the lighting device has a circular bar shape in a state where the heat dissipating body 11 and the diffusion cover 15 are fastened, and a pair of sockets 142 are fastened to both ends of the heat dissipating body 11.

The socket 142 has a cylindrical shape made of an insulating material, and one side of the socket 142 located on the opposite side of the heat-radiating body 11 is closed by a disk. The outer terminal 144 is located on the outer side of the socket 142 and the inner terminal 146 is located on the inner side of the socket 142 and electrically connected to each other through a circular plate closing one side of the heat dissipating body 11.

2, the light emitting modules 122 and 124 are mounted on the heat dissipating body 11, and the diffusion cover 15 is fastened to the heat dissipating body 11 to form an upper space of the heat dissipating body 11, 122, and 124 are protected. The diffusion cover 15 covers one surface of the heat dissipating body 11 to protect the light emitting modules 122 and 124 from the outside as well as to amplify, diffuse and output the light generated from the light emitting body 122. The diffusion cover 15 may be formed of transparent or semi-transparent plastic through which light can be transmitted, or may be formed of various materials.

FIG. 3 is a perspective view showing the heat dissipating body and the housing module shown in FIG. 2, and FIG. 4 is a perspective view showing the heat dissipating body shown in FIG. The heat dissipating body 11 has a half cylinder structure having a semicircular cross section, and a hollow portion extending in the longitudinal direction is formed inside the semicircular structure.

Specifically, the heat dissipating body 11 has a flat plate-like support plate and a heat dissipating plate positioned below the support plate. The heat dissipating plate has a convex shape toward the lower part, so that the hollow portion (or inner space) It is generally semi-cylindrical. The light emitting modules 122 and 124 are mounted on a support plate and the housing module 110 and the drive circuit module 16 to be described later are accommodated in the hollow portion (or internal space) of the heat dissipating body 11.

The upper substrate 124 extends along the longitudinal direction of the heat dissipating body 11 and the light emitting bodies 122 are arranged along the longitudinal direction of the upper substrate 124. The upper substrate 124 may be divided into a plurality of substrates. When the upper substrate 124 is integrally manufactured, the upper substrate 124 can be deformed due to the length thereof, and the upper substrate 124 can be manufactured by separating the upper substrate 124 into a plurality of substrates. A plurality of substrates can be connected by a film cable or a general coated cable, and the solder can be connected by soldering after narrowing the space between the substrates.

The upper substrate 124 may be an insulator or an aluminum material. The upper substrate 124 made of an insulator has a low heat transfer rate and is difficult to emit heat generated from the light emitting body 122. When the lighting apparatus is continuously used for a long time, the heat generated from the light emitting body 122 may overheat and deform, The efficiency of the light source 122 is rapidly lowered and the life of the lighting apparatus can be shortened. On the other hand, the upper substrate 124 made of aluminum can rapidly release the heat generated by the light emitting body 122 to the outside, thereby preventing the heat from being deformed and the efficiency of the light emitting body 122 being lowered.

A conductive pattern for supplying power to the light emitting body 122 is formed on the surface of the upper substrate 124, and the light emitting bodies 122 may be connected to each other in series by the conductive pattern. The electric wire W to be described later is connected to the lower substrate 116 and the upper substrate 124 to supply power from the outside to the upper substrate 124 and the light emitting body 122. On the other hand, one surface of the upper substrate 124 on which the light emitting unit 122 is mounted may be painted or coated with a color that is easily white or easily reflected, so that light generated from the light emitting unit 122 is reflected to the outside.

The heat dissipating body 11 serves to externally dissipate heat generated from the light emitting body 122 and to maintain the shape of the lighting apparatus. The light emitting body 122 (or the light emitting diode) generates a lot of heat in use. Therefore, it is preferable that the heat dissipating body 11 is formed of a material having a high heat transfer coefficient (for example, aluminum). The heat dissipating body 11 may be formed on the outer surface of the heat dissipating plate so as to improve the heat dissipating effect. That is, in order to rapidly discharge the heat to the outside, the heat dissipating area must be wide, and the heat dissipating area can be increased through the unevenness. The concavoconvex form may be a plurality of linear protrusions extending along the longitudinal direction and spaced apart from each other by a predetermined distance and having a predetermined height. The linear protrusions not only enhance the heat radiating effect of the heat dissipating body 11 but also improve the grip.

On the other hand, with the heat dissipating body 11 fastened to the socket 142, the support plate is located higher than the center of the socket 142. Specifically, as shown in Fig. 4, when a central axis (indicated by a dotted line) of the socket 142 and a virtual horizontal line (indicated by a dotted line) perpendicular to the central axis are arranged in parallel with the longitudinal direction of the heat dissipating body 11 , And the support plate is positioned at a high distance from the horizontal line by a predetermined distance (d). A protective upper plate 110a and a lower substrate 116, which will be described later, are mounted in a space between the central axis (or horizontal line) and the support plate.

The heat dissipating body 11 (particularly, the heat dissipating plate) has a fixing slot 112 formed to be perpendicular to the longitudinal direction, and the fixing slot 112 may have a hole shape passing through the heat dissipating plate or a recessed groove shape Lt; / RTI > A fixing hook 142c to be described later may be inserted into the fixing slot 112 to fix the socket 142 to the heat dissipating body 11. [

The wing 151 located at both ends of the diffusion cover 15 is inserted into the outer slot 119 and fastened to the heat dissipating body 11. The heat dissipating body 11 has an outer slot 118 positioned at an upper portion thereof. That is, when the wing 151 is pushed from one end of the outer slot 119 and the wing 151 is completely inserted into the outer slot 119, the diffusion cover 15 is engaged with the heat dissipating body 11.

FIG. 5 is a perspective view showing the housing module shown in FIG. 2. FIG. The heat dissipating body 11 has an inner slot 119 located at a lower portion of the support plate and a protective top plate 110a of a housing module 110 to be described later is inserted into the inner slot 119 to connect the housing module 110 And is fixed inside the heat-radiating body (11). The housing module 110 includes a protective upper plate 110a having a flat plate shape and a lower protective plate 110b positioned below the protective upper plate 110a and the lower protective plate 110b has a convex shape downward, The internal space (or hollow portion) of the module 110 is generally semi-cylindrical. The drive circuit module 16 is accommodated in the hollow portion (or internal space) of the housing module 110.

6 is a perspective view showing the drive circuit module shown in Fig. The driving circuit module 16 includes a lower substrate 116 and a terminal module 162 mounted on the lower substrate 116. The lower substrate 116 may be accommodated in the hollow portion of the housing module 110 together with the terminal module 162 and fixed to the protective upper plate 110a and may be insulated by the housing module 110 made of an insulating material, do.

7 is a perspective view showing a process of inserting the inner terminal shown in FIG. 2 into the terminal module. The terminal module 162 has a terminal slot into which the inner terminal is inserted and the terminal slot of the terminal module 16 corresponds to the inner terminal 146 when the lower substrate 116 is received in the hollow portion of the housing module 110 As shown in FIG. When the socket 142 is fastened to the heat dissipating body 11, the inner terminal 146 is inserted into the terminal slot and electrically connected to the lower substrate 116, and the power supplied from the outside through the outer terminal 144 And may be supplied to the lower substrate 116.

Figs. 8 and 9 are sectional views showing the socket shown in Fig. 2. Fig. 8 and 9, the outer terminal 144 and the inner terminal 146 are electrically connected to each other through a circular plate that closes one side of the heat dissipating body 11. The socket 142 has an outer tube 142a and an inner tube 142b which are both cylindrically shaped and the inner tube 142b is located inside the outer tube 142a and is spaced from the outer tube 142a. The fixing hook 142c protrudes from the inner surface of the outer tube 142a and the inner tube 142b has an opening corresponding to the fixing hook 142c. Therefore, the fixing hook 142c can sufficiently protrude to the inside of the inner tube 142b through the opening. The fixing hook 142c has a shape in which the cross-sectional area increases along the direction away from the heat-radiating body 11. [

9, the socket 142 has a support slot S formed on both sides of the inner side, and the support slot S is formed in the lower portion of the socket 142 in a state where the socket 142 is fastened to the heat- And is disposed at a height corresponding to the substrate 116.

Hereinafter, a method of fastening the socket 142 to the heat dissipating body 11 will be described. The outer terminal 144 and the inner terminal 146 are disposed at substantially the same height as the center of the socket 142 and the terminal module 162 is inserted into the hollow portion of the housing module 110 while the drive circuit module 16 is housed in the hollow portion of the housing module 110. [ Are disposed at the corresponding heights of the inner terminals 146. [0064]

The operator approaches the heat dissipating body 11 and adjusts the position of the inner terminal 146 so that the inner terminal 146 can be accurately inserted into the terminal slot. The fixing hook 142c can be inserted into the fixing slot 112 and the socket 142 can be fastened to the heat dissipating body 11. [

At this time, the lower substrate 116 is inserted into and supported by the support slot S, and through which the socket 142 can be pivoted upward, downward, leftward, and rightward. That is, when the socket 142 is fastened to the heat-dissipating body 11 by the fixing hook 142c and the fixing slot 112 without a bolt, there is no need for a separate fastener and the flow of the socket 142 is concerned, There is a danger that the socket 142 is separated from the heat-radiating body 11. [ Accordingly, the reliability of the fastening as well as the deformation or breakage of the socket 142 through the lower substrate 116 can be improved.

According to the above description, it is possible to simplify the assembling process and minimize the time required for assembling. Particularly, unlike the above-described embodiment, the fixing hook 142c may be formed in the heat dissipating body 11, and the fixing slot 112 may be formed in the socket 142. [

Although the present invention has been described in detail by way of preferred embodiments thereof, other forms of embodiment are possible. Therefore, the technical idea and scope of the claims set forth below are not limited to the preferred embodiments.

Claims (6)

A heat dissipating body on which the light emitting module is mounted, the heat dissipating body having a fixing slot formed to be recessed from the outer side;
And a socket having one end of the heat dissipating body inserted and having a fixing hook protruding from an inner side surface thereof,
The fixing slot is formed to be perpendicular to the longitudinal direction of the heat dissipating body,
Wherein the fixing hook is inserted into the fixing slot while the heat dissipating body is inserted into the socket to prevent the socket from being detached from the heat dissipating body. The method according to claim 1,
The socket has a cylindrical shape with one side located on the opposite side of the heat dissipating body closed,
The inner terminal and the outer terminal are connected to each other through the one side closed at the inner side and the outer side of the socket,
The lighting apparatus may further include a driving circuit module mounted on the heat dissipating body to drive the light emitting module,
Wherein the driving circuit module includes a lower substrate and a terminal module mounted on the lower substrate,
Wherein the terminal module has a terminal slot into which the inner terminal is inserted when the heat dissipating body is inserted into the socket. 3. The method of claim 2,
The light emitting module includes an upper substrate and a light emitting body mounted on the upper substrate to emit light,
The heat-
A support plate having a flat plate shape in which the upper substrate is mounted on an upper surface and the lower substrate is mounted on a lower surface; And
And a heat sink connected to the support plate and disposed around the lower substrate to form an internal space in which the lower substrate is mounted,
Wherein the fixing slot is formed on an outer surface of the heat sink. The method of claim 3,
And the support plate is positioned higher than the central axis of the socket. The method of claim 3,
The illumination device includes:
And a housing module inserted in an inner space of the heat dissipating body and having the drive circuit module mounted therein,
The housing module includes:
A protective upper plate provided between the support plate and the lower substrate; And
And a protection lower plate connected to the protection plate and disposed around the lower substrate to form an inner space in which the lower substrate is mounted. The method according to claim 1,
The socket includes:
And an outer tube and an inner tube respectively located on the outer side and the inner side of the heat dissipating body in a state where the heat dissipating body is inserted into the socket,
The fixing hook protrudes from the inner surface of the outer tube,
And the inner tube has an opening formed at a position corresponding to the fixing hook.

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