JP6019043B2 - 光学計測及びセンサ装置を用いるエッチングプロセス制御 - Google Patents

光学計測及びセンサ装置を用いるエッチングプロセス制御 Download PDF

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Publication number
JP6019043B2
JP6019043B2 JP2013554662A JP2013554662A JP6019043B2 JP 6019043 B2 JP6019043 B2 JP 6019043B2 JP 2013554662 A JP2013554662 A JP 2013554662A JP 2013554662 A JP2013554662 A JP 2013554662A JP 6019043 B2 JP6019043 B2 JP 6019043B2
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Prior art keywords
etch
etching
measurement
stage
optical
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Japanese (ja)
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JP2014514727A5 (enExample
JP2014514727A (ja
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マドリアガ，マニュエル
ティエン，シンカン
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H10P72/0421—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H10P50/242—
    • H10P72/0604—
    • H10P72/0612—
    • H10P74/203—
    • H10P74/23—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Drying Of Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
JP2013554662A 2011-02-17 2012-02-17 光学計測及びセンサ装置を用いるエッチングプロセス制御 Active JP6019043B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/029,349 US8193007B1 (en) 2011-02-17 2011-02-17 Etch process control using optical metrology and sensor devices
US13/029,349 2011-02-17
PCT/US2012/025746 WO2012112959A1 (en) 2011-02-17 2012-02-17 Etch process control using optical metrology and sensor devices

Publications (3)

Publication Number Publication Date
JP2014514727A JP2014514727A (ja) 2014-06-19
JP2014514727A5 JP2014514727A5 (enExample) 2015-04-09
JP6019043B2 true JP6019043B2 (ja) 2016-11-02

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ID=46148020

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JP2013554662A Active JP6019043B2 (ja) 2011-02-17 2012-02-17 光学計測及びセンサ装置を用いるエッチングプロセス制御

Country Status (5)

Country Link
US (1) US8193007B1 (enExample)
JP (1) JP6019043B2 (enExample)
KR (2) KR20140006039A (enExample)
TW (1) TWI464818B (enExample)
WO (1) WO2012112959A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8445296B2 (en) * 2011-07-22 2013-05-21 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and methods for end point determination in reactive ion etching
US9287097B2 (en) * 2011-11-30 2016-03-15 Sony Corporation Predicting ultraviolet ray damage with visible wavelength spectroscopy during a semiconductor manufacturing process
US9875946B2 (en) 2013-04-19 2018-01-23 Kla-Tencor Corporation On-device metrology
NL2013417A (en) 2013-10-02 2015-04-07 Asml Netherlands Bv Methods & apparatus for obtaining diagnostic information relating to an industrial process.
US10217681B1 (en) * 2014-08-06 2019-02-26 American Air Liquide, Inc. Gases for low damage selective silicon nitride etching
US20160240366A1 (en) * 2015-02-17 2016-08-18 Infineon Technologies Ag Processing of Semiconductor Devices
US10386829B2 (en) * 2015-09-18 2019-08-20 Kla-Tencor Corporation Systems and methods for controlling an etch process
US10192763B2 (en) * 2015-10-05 2019-01-29 Applied Materials, Inc. Methodology for chamber performance matching for semiconductor equipment
US10372114B2 (en) * 2016-10-21 2019-08-06 Kla-Tencor Corporation Quantifying and reducing total measurement uncertainty
US10763145B2 (en) * 2017-03-10 2020-09-01 Mitsubishi Electric Corporation Semiconductor manufacturing equipment and semiconductor manufacturing method
US10784174B2 (en) * 2017-10-13 2020-09-22 Lam Research Corporation Method and apparatus for determining etch process parameters
US11164768B2 (en) * 2018-04-27 2021-11-02 Kla Corporation Process-induced displacement characterization during semiconductor production
JP2020181959A (ja) 2019-04-26 2020-11-05 東京エレクトロン株式会社 学習方法、管理装置および管理プログラム
JP7413081B2 (ja) * 2020-02-28 2024-01-15 東京エレクトロン株式会社 基板処理システム
GB202010471D0 (en) * 2020-07-08 2020-08-19 Univ Exeter Control of processing equipment
US12106984B2 (en) * 2021-11-23 2024-10-01 Applied Materials, Inc. Accelerating preventative maintenance recovery and recipe optimizing using machine-learning based algorithm
US20230163001A1 (en) * 2021-11-23 2023-05-25 Applied Materials, Inc. Method to eliminate first wafer effects on semiconductor process chambers
CN114724943A (zh) * 2022-03-18 2022-07-08 福建晶安光电有限公司 一种等离子体蚀刻方法及系统
US12400888B2 (en) * 2022-03-31 2025-08-26 Tokyo Electron Limited Data fusion of multiple sensors
WO2025057374A1 (ja) * 2023-09-14 2025-03-20 株式会社日立ハイテク プラズマ処理装置およびプラズマ処理方法

Family Cites Families (21)

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Publication number Priority date Publication date Assignee Title
US5288367A (en) 1993-02-01 1994-02-22 International Business Machines Corporation End-point detection
US5658423A (en) 1995-11-27 1997-08-19 International Business Machines Corporation Monitoring and controlling plasma processes via optical emission using principal component analysis
US5862060A (en) 1996-11-22 1999-01-19 Uop Llc Maintenance of process control by statistical analysis of product optical spectrum
US6943900B2 (en) 2000-09-15 2005-09-13 Timbre Technologies, Inc. Generation of a library of periodic grating diffraction signals
US6785638B2 (en) 2001-08-06 2004-08-31 Timbre Technologies, Inc. Method and system of dynamic learning through a regression-based library generation process
US7216045B2 (en) 2002-06-03 2007-05-08 Timbre Technologies, Inc. Selection of wavelengths for integrated circuit optical metrology
US6979578B2 (en) 2002-08-13 2005-12-27 Lam Research Corporation Process endpoint detection method using broadband reflectometry
US7352478B2 (en) 2002-12-20 2008-04-01 International Business Machines Corporation Assessment and optimization for metrology instrument
US20040267397A1 (en) 2003-06-27 2004-12-30 Srinivas Doddi Optical metrology of structures formed on semiconductor wafer using machine learning systems
US7158221B2 (en) * 2003-12-23 2007-01-02 Applied Materials, Inc. Method and apparatus for performing limited area spectral analysis
US7065423B2 (en) * 2004-07-08 2006-06-20 Timbre Technologies, Inc. Optical metrology model optimization for process control
KR20060005830A (ko) 2004-07-14 2006-01-18 삼성전자주식회사 통합 슬롯이 탑재된 인쇄 회로 기판
US20060112796A1 (en) 2004-11-30 2006-06-01 Chang-Ying Chen Screwdriver with teethed head
US7467064B2 (en) 2006-02-07 2008-12-16 Timbre Technologies, Inc. Transforming metrology data from a semiconductor treatment system using multivariate analysis
US7596422B2 (en) * 2007-01-12 2009-09-29 Tokyo Electron Limited Determining one or more profile parameters of a structure using optical metrology and a correlation between profile models and key profile shape variables
KR101123171B1 (ko) * 2007-02-02 2012-03-20 렉사스 리서치 리미티드 플라즈마 에칭 프로세스의 프로세스 파라미터를 측정하는 방법 및 장치
US7591600B2 (en) * 2007-02-23 2009-09-22 Tokyo Electron Limited Method and system for monitoring photolithography processing based on a batch change in light sensitive material
US7742177B2 (en) 2008-01-22 2010-06-22 Tokyo Electron Limited Noise-reduction metrology models
US7589845B1 (en) * 2008-03-27 2009-09-15 Tokyo Electron Limited Process control using an optical metrology system optimized with signal criteria
US7761250B2 (en) 2008-06-18 2010-07-20 Tokyo Electron Limited Optical metrology system optimized with design goals
US8173451B1 (en) * 2011-02-16 2012-05-08 Tokyo Electron Limited Etch stage measurement system

Also Published As

Publication number Publication date
TWI464818B (zh) 2014-12-11
JP2014514727A (ja) 2014-06-19
KR20170107094A (ko) 2017-09-22
TW201241949A (en) 2012-10-16
WO2012112959A1 (en) 2012-08-23
US8193007B1 (en) 2012-06-05
KR20140006039A (ko) 2014-01-15

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