JP6018961B2 - めっき装置およびめっき方法 - Google Patents

めっき装置およびめっき方法 Download PDF

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Publication number
JP6018961B2
JP6018961B2 JP2013063800A JP2013063800A JP6018961B2 JP 6018961 B2 JP6018961 B2 JP 6018961B2 JP 2013063800 A JP2013063800 A JP 2013063800A JP 2013063800 A JP2013063800 A JP 2013063800A JP 6018961 B2 JP6018961 B2 JP 6018961B2
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Prior art keywords
substrate
substrate holder
suction
suction nozzle
suction mechanism
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JP2013063800A
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English (en)
Japanese (ja)
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JP2014189806A (ja
JP2014189806A5 (enExample
Inventor
智則 平尾
智則 平尾
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Ebara Corp
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Ebara Corp
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Priority to JP2013063800A priority Critical patent/JP6018961B2/ja
Priority to US14/223,972 priority patent/US9388504B2/en
Priority to TW103110989A priority patent/TWI613322B/zh
Priority to TW106145064A priority patent/TWI657165B/zh
Publication of JP2014189806A publication Critical patent/JP2014189806A/ja
Publication of JP2014189806A5 publication Critical patent/JP2014189806A5/ja
Priority to US15/179,835 priority patent/US10294576B2/en
Application granted granted Critical
Publication of JP6018961B2 publication Critical patent/JP6018961B2/ja
Priority to US16/380,843 priority patent/US10577706B2/en
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JP2013063800A 2013-03-26 2013-03-26 めっき装置およびめっき方法 Active JP6018961B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2013063800A JP6018961B2 (ja) 2013-03-26 2013-03-26 めっき装置およびめっき方法
US14/223,972 US9388504B2 (en) 2013-03-26 2014-03-24 Plating apparatus and plating method
TW103110989A TWI613322B (zh) 2013-03-26 2014-03-25 鍍覆裝置及鍍覆方法
TW106145064A TWI657165B (zh) 2013-03-26 2014-03-25 鍍覆裝置
US15/179,835 US10294576B2 (en) 2013-03-26 2016-06-10 Plating apparatus
US16/380,843 US10577706B2 (en) 2013-03-26 2019-04-10 Plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013063800A JP6018961B2 (ja) 2013-03-26 2013-03-26 めっき装置およびめっき方法

Publications (3)

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JP2014189806A JP2014189806A (ja) 2014-10-06
JP2014189806A5 JP2014189806A5 (enExample) 2015-12-03
JP6018961B2 true JP6018961B2 (ja) 2016-11-02

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JP2013063800A Active JP6018961B2 (ja) 2013-03-26 2013-03-26 めっき装置およびめっき方法

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JP (1) JP6018961B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6746185B2 (ja) * 2016-02-01 2020-08-26 アスカコーポレーション株式会社 半導体ウェハめっき用治具
JP6951269B2 (ja) * 2018-01-29 2021-10-20 株式会社荏原製作所 基板処理装置、基板処理装置の制御装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
JP7059172B2 (ja) * 2018-12-21 2022-04-25 株式会社荏原製作所 基板ホルダのシールから液体を除去するための方法
PT3758049T (pt) * 2019-06-26 2022-03-21 Atotech Deutschland Gmbh & Co Kg Dispositivo e método para mover um objeto para uma estação de processamento, sistema de transporte e aparelho de processamento

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2911882B1 (ja) * 1998-06-23 1999-06-23 日本エレクトロプレイテイング・エンジニヤース株式会社 カップ式めっき装置
US6660139B1 (en) * 1999-11-08 2003-12-09 Ebara Corporation Plating apparatus and method
JP3284496B2 (ja) * 2000-08-09 2002-05-20 株式会社荏原製作所 めっき装置及びめっき液除去方法
JP2003247098A (ja) * 2002-02-21 2003-09-05 Ebara Corp めっき装置
JP2005068450A (ja) * 2003-08-26 2005-03-17 Noge Denki Kogyo:Kk 長尺材の連続めっき加工における減圧式洗浄方法及び装置
JP2008255374A (ja) * 2007-03-30 2008-10-23 Kayaba Ind Co Ltd 表面処理装置および表面処理方法
JP5785480B2 (ja) * 2011-11-16 2015-09-30 株式会社荏原製作所 無電解めっき装置及び無電解めっき方法

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Publication number Publication date
JP2014189806A (ja) 2014-10-06

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