JP6016415B2 - Inspection data creation device and circuit board inspection device - Google Patents

Description

  The present invention relates to an inspection data creation apparatus for creating inspection data used when inspecting a circuit board, and a circuit board inspection apparatus including the inspection data creation apparatus.

  As this type of circuit board inspection apparatus, an apparatus (hereinafter also referred to as “circuit board inspection apparatus”) used in the substrate inspection method disclosed by the applicant in Japanese Patent Laid-Open No. 1-156681 is known. In this circuit board inspection apparatus, reference data is created using a non-defective substrate, and an inspection of a substrate to be inspected is performed based on the reference data. Specifically, for example, the impedance between four inspection points A to D on a non-defective substrate is measured, and the measured value is used as reference data. In this case, first, a probe is brought into contact with each of the inspection points A to D. Next, by switching the switch connected to each probe, the inspection point A is connected to a low potential (reference potential), and other inspection points other than the inspection point A are connected to the high potential of the power supply for measurement as the same potential. To do. In this state, the impedance between the inspection point A and another inspection point is measured. Subsequently, the inspection point B is connected to a low potential, and other inspection points excluding the inspection point B are connected to the high potential of the measurement power source as the same potential. In this state, the impedance between the inspection point B and another inspection point is measured. Hereinafter, similarly, the impedance between the inspection point C and another inspection point, and the impedance between the inspection point D and another inspection point are measured. Next, data indicating the measured value of each impedance is stored in the storage unit as reference data. On the other hand, when inspecting a substrate to be inspected, the switches are switched in the same manner as described above, between inspection point A and another inspection point, between inspection point B and another inspection point, inspection point C. And the other inspection points, and the impedance between the inspection point D and the other inspection points are measured, respectively, and the quality of the substrate is determined by comparing the measured value with the above-described reference data.

Japanese Patent Laid-Open No. 1-156681 (page 2-3, FIG. 1)

  However, the above circuit board inspection apparatus has the following problems to be improved. That is, in this circuit board inspection apparatus, impedance between each inspection point is measured using a non-defective board, and data indicating the measured value is created as reference data. In this case, even in the case of a non-defective substrate, the impedance between the inspection points varies due to individual differences (manufacturing errors) for each non-defective substrate. In other words, depending on the non-defective substrate used when creating the reference data, the reference data may have a larger value or a smaller value, which may make it difficult to improve inspection accuracy. is there. In addition, inspection data indicating the combination of inspection points used when measuring impedance is manually created while referring to circuit design data indicating the circuit configuration of the board, and so it takes a lot of time to create it. However, due to this, there is a problem that it is difficult to improve the inspection efficiency.

  The present invention has been made in view of such problems, and a main object of the present invention is to provide an inspection data creation apparatus and a circuit board inspection apparatus capable of improving inspection accuracy and inspection efficiency.

In order to achieve the above object, the inspection data generating apparatus according to claim 1 is an electrical parameter measured at an inspection point provided on a conductor pattern in a circuit board in which an electronic component is mounted on a substrate having a conductor pattern. The inspection point that is the object of the measurement when the circuit board is inspected by executing the inspection process for determining that the electronic component is good when the measured value of the electric parameter is within the range of the upper and lower limit values of the electrical parameter An inspection data creation device for creating inspection data including information designating information and information indicating the upper and lower limit values , including information relating to the conductor pattern and information relating to the electronic component, the circuit configuration of the circuit board A storage unit for storing circuit design data to be shown, and a simulation for simulating the operation of the circuit board based on the circuit design data And a processing unit for executing ® down process, wherein the processing unit, the test data creation processing for creating the test data based on the circuit design data, provided on the circuit board on the basis of the circuit design data A step of identifying the inspection point being specified, and a starting point for connecting one inspection point among the specified inspection points to the low potential side when supplying the inspection signal and measuring the electrical parameter A step of selecting, extracting all the inspection points other than the inspection point of the starting point connected to the inspection point of the starting point through one or a plurality of the electronic components as a short group, and inspecting the inspection point of the short group With the same potential, connected to the high potential side and the previous inspection point connected to the low potential side before Specifying the theoretical value of the electrical parameter in a state in which a test signal is supplied based on the circuit design data, adding and subtracting a predetermined value to the theoretical value to obtain the upper and lower limit values, The extraction process for creating component data including information indicating the inspection point of the starting point, information indicating the inspection point of the short group, and information indicating the upper and lower limit values is repeated while changing the inspection point selected as the starting point And performing an aggregation to delete one of the two component data used when measuring the electrical parameter under the same conditions except that the low potential side and the high potential side are reversed. And a step of creating the inspection data by connecting the component data after aggregation .

The inspection data creation device according to claim 2 is the inspection data creation device according to claim 1, further comprising an operation unit capable of correcting the content of the circuit design data, and the processing unit includes: In the simulation process, a circuit diagram of the circuit board is displayed on a display unit based on the circuit design data, and the correction operation is performed when the circuit configuration of the displayed circuit diagram is corrected by the correction operation. Accordingly, the circuit design data is corrected and stored in the storage unit, and the inspection data is created based on the corrected circuit design data.

  According to a third aspect of the present invention, there is provided a circuit board inspection apparatus that inspects the circuit board using the inspection data generation apparatus according to the first or second aspect and the inspection data generated by the inspection data generation apparatus. And an inspection unit to perform.

4. The inspection data creation device according to claim 1 and the circuit board inspection device according to claim 3, wherein the processing unit executes a simulation process for simulating the operation of the circuit board based on the circuit design data stored in the storage unit. Creates inspection data based on the circuit design data. Therefore, according to the inspection data creation device and the circuit board inspection device, unlike the configuration in which the inspection data is created using the non-defective substrate, the inspection data (included in the inspection data) due to individual differences for each good substrate. Variation in the reference value) can be reliably prevented, and the decrease in inspection accuracy due to this variation can be reliably prevented. As a result, the inspection accuracy can be improved sufficiently. Further, according to the inspection data creation device and the circuit board inspection device, the processing unit automatically creates the inspection data using the circuit design data used for the simulation process. Compared with the conventional configuration for creating the inspection data, the inspection data can be created accurately in a short time, so that the inspection efficiency can be sufficiently improved. Further, according to the inspection data creation device and the circuit board inspection device, the processing unit executes both the simulation processing and the processing for creating the inspection data, so that, for example, the two processing units perform these processes separately. Compared with the configuration executed in (1), the configuration can be sufficiently simplified. In addition, the convenience can be sufficiently enhanced as compared to performing these processes using separate apparatuses. Further, according to the inspection data creation device and the circuit board inspection device, one of the two component data used when measuring the electrical parameter under the same conditions except that the low potential side and the high potential side are reversed. It is possible to shorten the inspection time by performing the aggregation for deleting.

  Further, in the inspection data creation device according to claim 2 and the circuit board inspection device according to claim 3, the processing unit corrects the circuit design data in accordance with the correction operation using the operation unit and stores it in the storage unit. At the same time, test data is created based on the corrected circuit design data. For this reason, in the inspection data creation device and the circuit board inspection device, for example, when it is necessary to correct the circuit configuration of the circuit board as a result of referring to the content of the simulation process executed by the processing unit, the correction content is displayed. The reflected circuit design data can be created immediately, and inspection data corresponding to the corrected circuit configuration can be created immediately. Therefore, according to the inspection data creation device and the circuit board inspection device, the inspection efficiency can be further improved.

1 is a configuration diagram showing a configuration of a circuit board inspection device 1. FIG. 2 is a plan view showing a configuration of a circuit board 100. FIG. 5 is a flowchart of an inspection data creation process 50. 5 is a flowchart of an extraction process 60.

  Hereinafter, embodiments of an inspection data creation device and a circuit board inspection device will be described with reference to the accompanying drawings.

  First, the configuration of the circuit board inspection apparatus 1 will be described. A circuit board inspection apparatus 1 shown in FIG. 1 is configured to be able to inspect a circuit board 100 (see also FIG. 2) in which an electronic component 103 is mounted on a substrate 101 having a conductor pattern 102. Specifically, as an example, the circuit board inspection apparatus 1 includes a substrate holding unit 11, a probe unit 12, a moving mechanism 13, a measuring unit 14, a scanner unit 15, a display unit 16, and a storage unit 17, as shown in FIG. The operation unit 18 and the processing unit 19 are provided. The storage unit 17 and the processing unit 19 constitute an inspection data creation device.

  As an example, the substrate holding unit 11 includes a holding table and a clamp mechanism (both not shown), and is configured to hold the circuit board 100.

  As shown in FIG. 1, the probe unit 12 includes a plurality of probes 21 that are brought into contact (probing) with a plurality of inspection points P provided on each conductor pattern 102 of the circuit board 100, and are configured in a jig shape. Has been. The moving mechanism 13 executes a probing process in which each probe 21 of the probe unit 12 is brought into contact with each inspection point P by moving the probe unit 12 in the vertical direction under the control of the processing unit 19.

  The measurement unit 14 performs measurement processing according to the control of the processing unit 19. In this measurement process, the measuring unit 14 is supplied with the inspection signal S1 supplied via the probe 21 of the probe unit 12 that is in contact with each inspection point P of the circuit board 100 and the inspection signal S1. A physical quantity (for example, an electrical parameter such as a resistance value or a capacitance) is measured based on the electrical signal S2 input through the probe 21.

  The scanner unit 15 includes a plurality of switches (not shown), and switches each switch to an on state or an off state according to the control of the processing unit 19, thereby causing each probe 21 and the measurement unit 14 of the probe unit 12 to move. (Connection and disconnection). The display unit 16 displays various images according to the control of the processing unit 19.

  The storage unit 17 stores the inspection data De created by the inspection data creation process 50 (see FIG. 3) executed by the processing unit 19. This inspection data De is data used in the inspection process executed by the processing unit 19, and is an inspection point P (supply of the inspection signal S1 and input of the electric signal S2) to be inspected in one inspection process. Resistance for comparing with the measurement value Rm of the information specifying the inspection point P) to be performed and the resistance value (electrical parameter measured at the inspection point P) measured based on the inspection signal S1 and the electrical signal S2 It includes information indicating the upper and lower limit value Ru (reference value) of the value.

  The storage unit 17 stores circuit design data Dd. The circuit design data Dd is circuit design data indicating the circuit configuration of the circuit board 100. For example, the circuit design data Dd is information indicating the shape of the conductor pattern 102 on the circuit board 100, and the inspection point P provided on the conductor pattern 102. Information indicating the position of the electronic component 103, information indicating the specification of the electronic component 103, information indicating the inspection point P to which the electronic component 103 is connected, and the like. The circuit design data Dd is used in a simulation process for simulating the operation (process) of the circuit board 100 and used in creating the inspection data De in the inspection data creation process 50.

  The operation unit 18 includes various operation buttons and is configured to be capable of instructing the processing unit 19 to execute each process. The operation unit 18 is configured to be able to perform a correction operation for correcting (changing) the circuit design data Dd stored in the storage unit 17.

  The processing unit 19 controls each component constituting the circuit board inspection apparatus 1 according to the operation signal output from the operation unit 18. The processing unit 19 functions as a processing unit, and executes a simulation process for simulating the operation of the circuit board 100 based on the circuit design data Dd stored in the storage unit 17.

  Further, the processing unit 19 executes the inspection data creation process 50 and creates the inspection data De based on the circuit design data Dd. Further, the processing unit 19 corrects the circuit design data Dd stored in the storage unit 17 in accordance with the correction operation using the operation unit 18 and stores the corrected circuit design data Dd in the storage unit 17 (overwriting). And memorize it). Further, the processing unit 19 functions as an inspection unit, and executes inspection processing on the circuit board 100 using the inspection data De created by the inspection data creation processing 50.

  Next, a method of using the circuit board inspection apparatus 1 will be described with reference to the drawings. It is assumed that circuit design data Dd is stored in the storage unit 17 in advance.

  The circuit board inspection apparatus 1 has a simulation function for simulating the operation (processing) of the circuit board 100 based on the circuit design data Dd stored in the storage unit 17. When using this simulation function, the operation unit 18 is operated to instruct the start of the simulation. In response to this, the processing unit 19 executes a simulation process. In this simulation process, the processing unit 19 performs the following process as an example. First, the processing unit 19 reads the circuit design data Dd from the storage unit 17, and then causes the display unit 16 to display a circuit diagram of the circuit board 100 based on the circuit design data Dd. In this simulation process, the processing unit 19 displays a waveform of an output signal when an electric signal is input to the circuit board 100 and a physical quantity to be measured (for example, an electrical parameter such as a resistance value or a capacitance). This is displayed on the part 16.

  Further, the circuit board inspection apparatus 1 has a correction function for correcting the circuit design data Dd. In this case, for example, when it is necessary to correct the circuit configuration of the circuit board 100 as a result of referring to the content displayed by the above-described simulation processing, the correction operation is performed using the operation unit 18. At this time, the processing unit 19 corrects the circuit design data Dd according to the correction operation, and overwrites and stores the corrected circuit design data Dd in the storage unit 17. Thus, by using this correction function, it is possible to immediately create circuit design data Dd reflecting the correction contents.

  Further, the circuit board inspection apparatus 1 has an inspection data creation function for automatically creating inspection data De based on the circuit design data Dd. When using the inspection data creation function, the operation unit 18 is operated to instruct creation of the inspection data De. In response to this, the processing unit 19 executes an inspection data creation process 50 shown in FIG. In the following description, a resistance value (an example of an electrical parameter) between the inspection points P provided on the circuit board 100 is measured, and the measured value Rm is compared with the upper and lower limit values Ru. An example of creating the inspection data De used when performing 100 pass / fail inspections will be described. Further, as shown in FIG. 2, the inspection data De is generated for the circuit board 100 on which the four electronic components 103a to 103d are mounted and the four inspection points P1 to P4 are provided on each conductor pattern 102. An example will be described.

  In the inspection data creation process 50, the processing unit 19 first reads circuit design data Dd from the storage unit 17 (step 51). Subsequently, the processing unit 19 specifies four inspection points P1 to P4 (see the drawing) provided on the circuit board 100 based on the circuit design data Dd. Next, the processing unit 19 selects one inspection point P (for example, the inspection point P1 shown in the figure) among the specified inspection points P1 to P4 (step 52). The inspection point P to be selected here is an inspection point P that is an object of the extraction process 60 (hereinafter also referred to as “starting point”) to be executed in the next step. In this circuit board inspection apparatus 1, the quality of the circuit board 100 is determined. When supplying the inspection signal S1 in the inspection, the inspection point P is connected to the low potential (reference potential) side.

  Subsequently, the processing unit 19 executes an extraction process 60 (see FIG. 4) starting from the selected inspection point P1 (step 53). In the extraction process 60, the processing unit 19 extracts the inspection point P connected to the high potential side when supplying the inspection signal S1 in the quality inspection of the circuit board 100 based on the circuit design data Dd. In this case, in this circuit board inspection apparatus 1, when there are a plurality of inspection points P connected via one or a plurality of electronic components 103 to the inspection point P selected as the starting point, the inspection point as the starting point The inspection point P other than P is connected to the high potential side with the same potential, and the circuit board 100 is inspected based on the resistance value measured in that state. For this reason, in this extraction process 60, the inspection point P corresponding to the inspection in this manner (hereinafter, this inspection is also referred to as “one-to-N inspection”) is extracted. In the following description, the plurality of inspection points P having the same potential are collectively referred to as a “short group”.

  Specifically, as shown in FIG. 4, in the extraction process 60, the processing unit 19 determines whether or not the electronic component 103 is connected to the inspection point P1 that is the starting point (step 61). In this case, as shown in FIG. 2, since the electronic parts 103a and 103b are connected to the inspection point P1, the processing unit 19 determines that effect.

  Next, the processing unit 19 specifies the inspection point P to which the electronic components 103a and 103b are connected and other than the inspection point P1 (the inspection point P as the starting point) (step 62). In this example, as shown in FIG. 2, since the electronic component 103a is connected to the inspection point P2 and the electronic component 103b is connected to the inspection point P3, the processing unit 19 identifies each inspection point P2, P3. .

  Subsequently, the processing unit 19 determines whether or not the inspection points P2 and P3 have already been extracted in the extraction processing 60 (extraction processing 60 starting from the inspection point P1) (step 63). In this case, since the inspection points P2 and P3 are not extracted at this time, the processing unit 19 extracts the inspection points P2 and P3 as the inspection points P of the short group (step 64).

  Next, the processing unit 19 determines whether or not the electronic component 103 is connected to the inspection points P2 and P3 (step 65). In this case, as shown in FIG. 2, since the electronic component 103c is connected to the inspection point P2 and the electronic component 103d is connected to the inspection point P3, the processing unit 19 determines that, and subsequently Step 62 is executed, and the inspection point P4 is specified as the inspection point P other than the inspection points P2 and P3 to which the electronic components 103c and 103d are connected.

  Next, the processing unit 19 executes the above-described step 63 to determine whether or not the inspection point P4 has already been extracted in the extraction processing 60. In this case, since the inspection point P4 is not extracted at this time, the processing unit 19 executes the above-described step 64 and extracts the inspection point P4 as the inspection point P of the short group.

  Subsequently, the processing unit 19 executes Step 65 to determine that the electronic components 103c and 103d are connected to the inspection point P4, and then executes Step 62 to connect the electronic components 103c and 103d. Inspection points P2 and P3 are specified as inspection points P other than the inspection point P4. In this case, since the inspection points P2 and P3 have already been extracted in the extraction process 60 at this time, the processing unit 19 determines that in step 63 and then executes step 66.

  In step 66, the processing unit 19 determines the resistance value between the inspection point P1 and the inspection points P2, 3 and 4 when each electronic component 103 is correctly connected to the conductor pattern 102 (each inspection point P). A theoretical value is specified based on the circuit design data Dd. In this case, a DC voltage as an inspection signal S1 is supplied between the inspection point P1 as the starting point and the inspection points P2, 3 and 4 with the inspection points P2, 3 and 4 as a short group at the same potential. In this case, since the inspection points P2, 3 and 4 have the same potential, a direct current as the electric signal S2 flows only between the inspection points P1 and P2 and between the inspection points P1 and P3. Therefore, the theoretical value of the resistance value between the inspection point P1 and the inspection points P2, 3 and 4 measured based on the inspection signal S1 and the electrical signal S2 is a combined resistance obtained by connecting the electronic components 103a and 103b in parallel. It becomes.

  For this reason, the processing unit 19 specifies the design resistance values (theoretical values) of the electronic components 103a and 103b based on the circuit design data Dd, and connects the electronic components 103a and 103b in parallel from the specified resistance values. The combined resistance is obtained and set as a theoretical value of the resistance value between the inspection point P1 and the inspection points P2,3,4. Next, the processing unit 19 adds and subtracts a predetermined value to the theoretical value of the resistance value to obtain the upper and lower limit value Ru (reference value) of the resistance value. Next, the processing unit 19 includes data indicating the inspection point P1 as the starting point, information indicating the inspection points P2 to P4 constituting the short group extracted in step 64 described above, and information indicating the upper and lower limit value Ru (hereinafter, this The data is also referred to as “component data Dc”) and stored in the storage unit 17, and the extraction process 60 (step 53 of the inspection data creation process 50) is terminated.

  On the other hand, when it is determined in step 61 described above that the electronic component 103 is not connected to the inspection point P1 that is the starting point, the processing unit 19 ends the extraction process 60 without executing steps 62 to 66.

  Subsequently, the processing unit 19 executes step 54 of the inspection data creation processing 50 shown in FIG. 3 to determine whether there is another inspection point P that is the next starting point. In this case, since inspection points P2 to P4 exist as other inspection points P, the processing unit 19 selects one inspection point P (for example, inspection point P2) (step 52), and extracts as described above. Process 60 is executed. Thereafter, the processing unit 19 performs steps 52 to 54 in the same manner.

  Next, when it is determined in step 54 described above that the next inspection point P that is the starting point does not exist, the processing unit 19 aggregates overlapping component data Dc (step 55). Specifically, for example, one component data Dc includes information indicating an inspection point Pa as a starting point and information indicating a short group composed of only one inspection point Pb. When the component data Dc includes information indicating the inspection point Pb as a starting point and information indicating a short group including only one inspection point Pa, the component data Dc is used when the inspection signal S1 is supplied during inspection. The inspection is performed under almost the same conditions except that the low potential side and the high potential side are reversed. For this reason, in order to omit one of the overlapping inspections under substantially the same conditions, one of the overlapping component data Dc is deleted. By executing step 55, the inspection time can be shortened.

  Subsequently, the processing unit 19 creates inspection data De based on each component data Dc after aggregation (step 56). In this case, the processing unit 19 includes, for example, each piece of information indicating the inspection point P as a starting point and the inspection point P constituting the short group in the inspection data De by connecting the component data Dc after aggregation. In addition, the inspection data De includes the upper and lower limit values Ru (reference values) of the resistance value between the inspection point P that is the starting point obtained in step 66 of the extraction process 60 and the inspection point P that constitutes the short group. Make it. Next, the processing unit 19 stores the inspection data De in the storage unit 17. Thus, the inspection data creation process 50 ends.

  Next, a method for inspecting the circuit board 100 using the circuit board inspection apparatus 1 will be described.

  First, the circuit board 100 is held by the board holding unit 11. Next, an inspection start operation is performed using the operation unit 18. In response to this, the processing unit 19 executes an inspection process.

  In this inspection process, the control unit 19 first controls the moving mechanism 13 to move the probe unit 12 downward. As a result, the tip of each probe 21 of the probe unit 12 is brought into contact (probing) with each inspection point P of the circuit board 100. The processing unit 19 also controls an inspection signal output unit (not shown) in the measurement unit 14 to start outputting the inspection signal S1 (DC voltage as an example).

  Subsequently, the processing unit 19 reads the inspection data De from the storage unit 17. Next, the processing unit 19 performs a first inspection. In this case, the processing unit 19 specifies the inspection points P1 to P4 (see FIG. 2) as the inspection points P to be subjected to the first inspection based on the inspection data De. Further, the processing unit 19 specifies the inspection point P1 among the inspection points P1 to P4 as the inspection point P that is connected to the low potential side, and the inspection points P (that connect the other inspection points P2 to P4 to the high potential side. It is specified as the inspection point P) of the short group.

  Subsequently, the processing unit 19 controls the scanner unit 15 to connect the probe 21 that is in contact with the inspection point P1 to a reference potential (for example, ground potential) and is in contact with the inspection points P2 to P4. With the probe 21 at the same potential, the probe 21 is connected to the high potential side of the inspection signal output unit in the measurement unit 14. Thus, the inspection signal S1 is supplied between the inspection point P1 and the inspection points P2 to P4.

  Next, the processing unit 19 causes the measurement unit 14 to perform a measurement process. In this case, the measuring unit 14 determines the resistance value between the inspection point P1 and the inspection points P2 to P4 based on the inspection signal S1 and the electric signal S2 (for example, direct current) generated by the supply of the inspection signal S1. Measure.

  Subsequently, the processing unit 19 specifies the upper and lower limit values Ru (reference values) of the resistance value between the inspection point P1 and the inspection points P2 to P4 based on the inspection data De based on the inspection data De. Next, the processing unit 19 compares the measured value Rm of the resistance value measured by the measuring unit 14 with the upper and lower limit values Ru, and determines whether the inspection point P1 and the inspection points P2 to P4 are acceptable (specifically, The electronic parts 103a and 103b are inspected.

  Subsequently, the processing unit 19 specifies the inspection point P2 as the inspection point P connected to the low potential side and the inspection points P (short group inspection points) connecting the other inspection points P1, P3, and P4 to the high potential side. Specify as P) and perform the second inspection. In the second inspection, the processing unit 19 controls the scanner unit 15 to connect the probe 21 in contact with the inspection point P2 to the reference potential and the probe in contact with the inspection points P1, P3, and P4. 21 is connected to the high potential side of the inspection signal output section with the same potential, and the measurement value Rm measured by the measurement section 14 is compared with the upper and lower limit values Ru, whereby the inspection point P2 and the inspection point P1, The quality between P3 and P4 (specifically, the quality of the electronic components 103a and 103c) is inspected.

  Next, the processing unit 19 specifies the inspection point P3 as the inspection point P connected to the low potential side, and the inspection points P (short group inspection points P) connecting the other inspection points P1, P2, and P4 to the high potential side. ) And perform the third inspection. In the third inspection, the processing unit 19 controls the scanner unit 15 to connect the probe 21 in contact with the inspection point P3 to the reference potential and the probes in contact with the inspection points P1, P2, and P4. 21 is connected to the high potential side of the inspection signal output section with the same potential, and the measurement value Rm measured by the measurement section 14 is compared with the upper and lower limit values Ru, and the inspection point P3 and the inspection point P1, The quality between P2 and P4 (specifically, the quality of the electronic components 103b and 103d) is inspected.

  Subsequently, the processing unit 19 specifies the inspection point P4 as the inspection point P connected to the low potential side, specifies the other inspection points P1 to P3 as the inspection points P connected to the high potential side, and performs the fourth inspection. I do. In the fourth inspection, the processing unit 19 controls the scanner unit 15 to connect the probe 21 that is in contact with the inspection point P4 to the reference potential, and the probe 21 that is in contact with the inspection points P1 to P3. With the same potential being connected to the high potential side of the inspection signal output unit, the measured value Rm measured by the measuring unit 14 is compared with the upper and lower limit values Ru, and the inspection point P4 and the inspection points P1 to P3 are compared. (Specifically, the quality of the electronic components 103c and 103d) is inspected.

  In this case, the processing unit 19 determines that each electronic component 103 is good when each of the measured values Rm is within the upper and lower limit values Ru in the above-described one to four inspections, and each measured value When any of Rm is outside the upper / lower limit value Ru, any one of the electronic components 103 is determined to be defective. Thus, the inspection for inspection points P1 to P4 is completed. Next, the processing unit 19 displays the inspection result on the display unit 16.

  Thus, in the inspection data creation device and the circuit board inspection device 1, the processing unit 19 that executes the simulation process for simulating the operation of the circuit board 100 based on the circuit design data Dd stored in the storage unit 17. The processing unit 19 creates inspection data De based on the circuit design data Dd. For this reason, according to the inspection data creation device and the circuit board inspection device 1, unlike the configuration in which the inspection data De is created using a non-defective substrate, the inspection data De (inspection data) due to individual differences for each good substrate. Since there is no variation in the upper and lower limit values Ru) included in the data De, it is possible to reliably prevent a decrease in inspection accuracy due to this variation, and as a result, the inspection accuracy can be improved sufficiently. Further, according to the inspection data creation device and the circuit board inspection device 1, the processing unit 19 automatically creates the inspection data De using the circuit design data Dd used for the simulation process. Compared to the conventional configuration in which the inspection data De is manually created while referring to the inspection data De, the inspection data De can be generated accurately in a short time. As a result, the inspection efficiency can be sufficiently improved. Furthermore, according to the inspection data creation device and the circuit board inspection device 1, the processing unit 19 executes both the simulation processing and the processing for creating the inspection data De, so that, for example, two processing units Compared with a configuration in which processing is executed separately, the configuration can be simplified sufficiently. In addition, the convenience can be sufficiently enhanced as compared to performing these processes using separate apparatuses.

  In the inspection data creation device and the circuit board inspection device 1, the processing unit 19 corrects the circuit design data Dd in accordance with the correction operation using the operation unit 18 and stores it in the storage unit 17. Inspection data De is created based on the circuit design data Dd. Therefore, in the inspection data creation device and the circuit board inspection device 1, for example, when it is necessary to correct the circuit configuration of the circuit board 100 as a result of referring to the contents of the simulation processing executed by the processing unit 19, The circuit design data Dd reflecting the correction contents can be created immediately, and the inspection data De corresponding to the corrected circuit configuration can be created immediately. Therefore, according to the inspection data creation device and the circuit board inspection device 1, the inspection efficiency can be further improved.

  The inspection data creation device and the circuit board inspection device are not limited to the above configuration. For example, the extraction process 60 executed in the inspection data creation process 50 is an example, and can be changed as appropriate. Further, in the above example, the example in which the test data De is created for the portion where the four electronic components 103 are mounted on the circuit board 100 has been described. However, the test is performed on the circuit board 100 having a more complicated circuit configuration. Of course, the present invention can be applied to the case of creating the production data De.

  In addition, the example in which the resistance value as an electrical parameter is measured and the circuit board 100 is inspected by comparing the measured value Rm with the upper and lower limit values Ru (reference value) has been described above, but other electrical parameters (for example, , Capacitance, current and voltage), and the circuit board 100 can be inspected by comparing the measured value with a reference value.

DESCRIPTION OF SYMBOLS 1 Circuit board inspection apparatus 14 Measurement part 17 Memory | storage part 18 Operation part 19 Processing part 100 Circuit board 101 Board | substrate 102 Conductor pattern 103 Electronic component De Inspection data Dd Circuit design data Rm Measurement value Ru Upper / lower limit value P Inspection point

Claims (3)

When the measured value of the electrical parameters measured at test point the electronic component to a substrate having a conductor pattern is provided on the conductive pattern of the circuit board which is mounted within the upper and lower limit values of the electrical parameter Inspection data including information specifying the inspection point to be measured and information indicating the upper and lower limit values when performing inspection processing for determining that the electronic component is good and inspecting the circuit board An inspection data creation device to be created,
A storage unit for storing circuit design data indicating the circuit configuration of the circuit board including information on the conductor pattern and information on the electronic component, and a simulation process for simulating the operation of the circuit board based on the circuit design data And a processing unit for executing
In the inspection data creation process for creating the inspection data based on the circuit design data, the processing unit ,
Identifying the inspection point provided on the circuit board based on the circuit design data;
Selecting one of the identified inspection points as a starting point to be connected to a low potential side when supplying the inspection signal and measuring the electrical parameter;
All the inspection points other than the starting inspection point connected to the starting inspection point via one or more electronic components are extracted as a short group, and the inspection points of the short group are set to the same potential. In the state, the circuit design data includes the theoretical values of the electrical parameters in a state where the inspection signal is supplied between the high-potential side and the inspection point of the starting point connected to the low-potential side. The upper and lower limit values are obtained by adding and subtracting a predetermined value to the theoretical value to determine the upper and lower limit values, information indicating the inspection point of the starting point, information indicating the inspection point of the short group, and the upper and lower limit values The extraction process for creating the component data including the information indicating the information is repeatedly executed while changing the inspection point selected as the starting point. And-up,
Performing aggregation to delete one of the two component data used when measuring the electrical parameter under the same conditions except that the low potential side and the high potential side are inverted; and
A test data creation apparatus that executes the step of creating the test data by connecting the component data after aggregation . An operation unit capable of correcting operation for correcting the contents of the circuit design data;
In the simulation process, the processing unit displays a circuit diagram of the circuit board on a display unit based on the circuit design data, and the circuit configuration of the displayed circuit diagram is corrected by the correction operation. wherein together to modify the circuit design data to be stored in the storage unit, the inspection data generating apparatus according to claim 1, wherein the creating the test data based on the circuit design data such modified according to the modified operation.   3. A circuit board inspection apparatus comprising: the inspection data creation apparatus according to claim 1; and an inspection unit that inspects the circuit board using the inspection data created by the inspection data creation apparatus.

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