JP2016173354A - Inspection data creation device, inspection data creation method, and program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To raise an automatic creation rate regarding the inspection data of an electronic component that does not have an inspection point at both ends.SOLUTION: The present invention executes, for all of components to be inspected, a component selection process 81 for selecting a component to be inspected, a process 82 for creating a normal circuit netlist of circuitry including the component to be inspected, a process 83 for creating a fault circuit netlist when the component to be inspected of this circuitry is made to break down in one discretionary fault state, a process 84 for finding a normal time inspection result when the normal circuitry is inspected with one or more kinds of inspection function by simulation for each inspection function, a process 85 for finding a fault time inspection result when the fault circuitry is inspected with one or more kinds of inspection function by simulation for each inspection function, and a process 86 for comparing the normal time inspection result and the fault time inspection result to find a difference for each inspection function and specifying an inspection content that the circuitry is inspected with this differing inspection function to be individual inspection data.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an inspection data creation apparatus, an inspection data creation method, and a program for creating individual inspection data for inspecting circuit elements such as a plurality of electronic components constituting a circuit network formed on a substrate to be inspected. Is.

  As this type of inspection data creation device, the applicant of the present application has already proposed the inspection data creation device disclosed in Patent Document 1 below. This inspection data creation device uses an electrical parameter measurement value for an electronic component measured at an inspection point provided on a conductor pattern of a circuit board on which the electronic component is mounted, and a reference value for the electrical parameter. Inspection data creation for creating inspection data (inspection data including information specifying an inspection point to be measured and information indicating the reference value) for a substrate inspection apparatus that inspects a circuit board based on A storage unit for storing circuit design data indicating the circuit configuration of the circuit board including information on the conductor pattern and information on the electronic component, and a simulation process for simulating the operation of the circuit board based on the circuit design data A processing unit that executes simulation processing based on the circuit design data. To create the test data. In this case, the inspection points are provided at both ends of all electronic components.

JP2013-213787A (page 4-8, Fig. 1-2)

  However, the inspection data creation apparatus has the following problems to be improved. That is, in this inspection data creation device, as described above, inspection points need to be provided at both ends of the electronic component to be measured. However, for example, when there are electronic components built in the circuit board, or when there are electronic components in which the conductor pattern connected to the terminal is not formed on the surface of the circuit board, these electronic components Since there is no inspection point at both ends, there is a problem to be improved that inspection data for these electronic components cannot be created (resulting in a decrease in inspection coverage). .

  The present invention has been made in order to improve such a problem, and raises the automatic creation rate of individual inspection data for a circuit network including circuit elements such as electronic components in which inspection points are not set at both ends. It is a main object to provide an inspection data creation device, an inspection data creation method, and a program.

  In order to achieve the above object, an inspection data creation apparatus according to claim 1 is provided with at least one circuit element among a plurality of circuit elements electrically connected to each other constituting a circuit network formed on a substrate to be inspected. An inspection provided with a processing unit for creating individual inspection data for the circuit network when inspecting by inspecting the probe by contacting an inspection point disposed on the surface of the substrate to be inspected and connected to the circuit network The data generator for processing, wherein the processing unit is configured to perform a pre-defined test for the circuit network in a normal state based on a normal circuit net list when all of the plurality of circuit elements are in a normal state. A normal simulation process for obtaining a normal inspection result by executing a simulation for inspecting the content, with at least one circuit element of the plurality of circuit elements as an inspection target Based on the fault circuit netlist when the fault circuit is in a fault state and all the remaining circuit elements are in a normal state, a fault test result is executed by executing a simulation to inspect the circuit network in the fault state with the test contents And for the individual inspection using the inspection contents when the normal inspection result is different from the inspection inspection result as the data for individual inspection when inspecting the inspection object Execute data creation processing.

  The inspection data creation device according to claim 2 is the inspection data creation device according to claim 1, wherein the processing unit selects the at least one circuit element to be inspected based on the normal circuit netlist. A failure netlist creation process for creating a plurality of the fault circuit netlists is performed while changing in accordance with a predetermined procedure, and the simulation process at the time of the fault is performed based on the fault circuit netlist created in the fault netlist creation process Run.

  The inspection data creation device according to claim 3 is the inspection data creation device according to claim 1 or 2, wherein the processing unit performs the simulation for inspecting the inspection content with application of a voltage to the circuit network. In the normal simulation process and the failure simulation process, the individual inspection data creation process is executed to create the individual inspection data, and the normal inspection result and the failure time in the normal simulation process are generated. When there is the inspection object for which the individual inspection data has not been created without being different from the failure inspection result in the simulation processing, the normal simulation processing is performed by increasing the voltage value of the applied voltage. , Executing the failure simulation process and the individual inspection data creation process .

  The inspection data creation device according to claim 4 is the inspection data creation device according to any one of claims 1 to 3, wherein the processing unit creates the individual inspection data created in the individual inspection data creation processing. The inspection indicated by the individual inspection data in a state in which the parameter values of the circuit elements excluding the inspection object to be inspected by the individual inspection data in the circuit network are changed within the allowable range of the circuit elements. The normal-time simulation process and the failure-time simulation process are executed according to the contents, and a verification process for verifying whether the difference state between the normal-time inspection result and the failure-time inspection result is maintained is executed.

  The inspection data creation device according to claim 5 is mounted on an inspection target substrate by bringing a probe into contact with an inspection point disposed on the surface of the inspection target substrate in a substrate inspection device having one or more types of inspection functions. An inspection data creation device for creating individual inspection data for individually inspecting a plurality of electronic components, wherein the inspection data creation device is created based on design data for the substrate to be inspected, and is selected from the plurality of electronic components. A normal circuit network including a part to be inspected to be inspected and composed of at least two or more electronic parts connected to two or more inspection points, all of which are normal And a fault circuit for a fault circuit network that is the circuit network in which only the inspection target component is faulted in any one fault state A storage unit in which a list is stored, and a processing unit, wherein the processing unit is inspected by the one or more types of inspection functions by bringing the probe into contact with the inspection point connected to the normal network Normal-time simulation processing for obtaining a normal-time inspection result by simulating each of the one or more types of inspection functions using the normal circuit netlist, bringing the probe into contact with the inspection point connected to the faulty network A failure simulation process for obtaining a failure inspection result when the failure network is inspected by the one or more types of inspection functions by simulating each of the one or more types of inspection functions using the failure circuit netlist; and When the inspection result is the same as the normal inspection result and the normal inspection result for each of the one or more inspection functions When there are one or more types of inspection functions that compare the normal inspection results with the normal inspection results, the inspection function is used for one of the inspection functions. Data for individual inspection, which uses the contents of inspection for inspecting the circuit network including the target part as the data for individual inspection for inspecting whether or not the part to be inspected has failed in the arbitrary one failure state The creation process is executed for all the inspection target parts.

  The inspection data creation device according to claim 6 is the inspection data creation device according to claim 5, wherein the processing unit selects the inspection target component from the plurality of electronic components based on the design data. Specifying a circuit network including at least two or more electronic components including the inspection target component and connected to two or more inspection points, based on the component selection processing, the design data, A normal net list creation process for creating the normal circuit net as the normal circuit net list, and the normal net list creating process for creating the normal circuit net list as the normal circuit net when the electronic components included in the circuit network are all normal Based on the circuit net list, the circuit network when the inspection target component is failed in any one failure state is the failure circuit network. Netlists impaired circuitry executes a fault net list creation process of creating, as the fault circuit netlist.

  The inspection data creation device according to claim 7 is the inspection data creation device according to claim 5 or 6, wherein the inspection function involves application of a voltage to the circuit network, and the processing unit In the inspection data creation process, the inspection target parts for which the individual inspection data has not been created without the existence of one kind of the inspection function in which the normal inspection result and the failure inspection result are different, The voltage value of the applied voltage is increased to execute the normal simulation process, the failure simulation process, and the individual inspection data creation process.

  The inspection data creation device according to claim 8 is the inspection data creation device according to any one of claims 5 to 7, wherein the processing unit is the individual inspection data created in the individual inspection data creation processing. The parameter value of the electronic component excluding the inspection target component to be inspected by the individual inspection data in the circuit network is indicated by the individual inspection data in a state where the parameter value is changed within an allowable range of the electronic component. The normal-time simulation process and the failure-time simulation process are executed based on the inspection contents, and a verification process is executed to verify whether the difference between the normal-time inspection result and the failure-time inspection result is maintained.

  The inspection data generation method according to claim 9, wherein at least one circuit element among a plurality of circuit elements electrically connected to each other constituting a circuit network formed on the inspection target substrate is attached to the surface of the inspection target substrate. A test data creation method for creating individual test data for the circuit network when a test is performed by bringing a probe into contact with a test point connected to the circuit network. Based on a normal circuit net list when all elements are in a normal state, a normal state in which a normal inspection result is obtained by executing a simulation for inspecting the circuit network in a normal state with a predetermined inspection content Simulation processing, at least one circuit element of the plurality of circuit elements is inspected as a failure state, and all remaining circuit elements are in a normal state. On the basis of the fault circuit net list at the time, executing a simulation for inspecting the circuit network in the fault state with the test content to obtain a test result at the time of the fault, and the normal test result and the An individual inspection data creation process is performed in which the inspection content when the inspection result at the time of failure is different is used as the individual inspection data when the inspection object is inspected.

  The inspection data generation method according to claim 10 is mounted on an inspection target substrate by bringing a probe into contact with an inspection point disposed on the surface of the inspection target substrate in a substrate inspection apparatus having one or more types of inspection functions. An inspection data creation method for creating individual inspection data for individually inspecting a plurality of electronic components, wherein the storage unit is created based on design data about the substrate to be inspected, and A circuit network including at least two or more electronic components connected to two or more inspection points, including the inspection target components to be inspected from electronic components, all of the electronic components being normal A normal circuit net list for the normal circuit network, and a fault circuit network that is the circuit network in which only the component to be inspected is failed in any one fault state. All fault circuit netlists are stored, and the normal inspection result when the probe is brought into contact with the inspection point connected to the normal network and inspected by the one or more types of inspection functions is read from the storage unit. In addition, the normal circuit simulation is performed for each of the one or more types of inspection functions using the normal circuit netlist, and the probe is brought into contact with the inspection points connected to the faulty network. Simulation process for failure obtained by performing simulation for each of the one or more types of inspection functions using the fault circuit net list read from the storage unit when the fault circuit network is inspected by the inspection function And the normal inspection result for each of the one or more types of inspection functions and the same inspection as the normal inspection result. When there is one or more types of the inspection function in which the normal inspection result and the inspection result at the time of failure are different from each other when the inspection result at the time of inspection by the function is compared The data for individual inspection for inspecting whether or not the inspection target component has failed in the one arbitrary failure state, based on the inspection content that the circuit network including the inspection target component is inspected by the inspection function The individual inspection data creation process is executed for all the inspection target parts.

  The program according to claim 11 is arranged such that at least one circuit element among a plurality of circuit elements electrically connected to each other constituting a circuit network formed on the inspection target substrate is arranged on the surface of the inspection target substrate. A program for causing a computer to create individual inspection data for the circuit network when the probe is brought into contact with an inspection point connected to the circuit network and inspecting the computer, and the computer includes all the plurality of circuit elements. Based on a normal circuit net list when it is in a normal state, a normal time simulation process for obtaining a normal inspection result by executing a simulation for inspecting the circuit network in a normal state with a predetermined inspection content, At least one circuit element of the plurality of circuit elements is inspected as a failure state, and the remaining circuit elements are all Based on the fault circuit net list when in a normal state, a simulation process at the time of failure is performed to execute a simulation for inspecting the circuit network in the fault state with the inspection content to obtain a test result at the time of the failure, and the normal time An individual inspection data creation process is executed in which the inspection content when the inspection result is different from the inspection result at the time of failure is used as the individual inspection data when the inspection object is inspected.

  13. The program according to claim 12, wherein a plurality of electronic components are mounted on the inspection target board by bringing the probe into contact with an inspection point disposed on the surface of the inspection target board in the substrate inspection apparatus having one or more types of inspection functions. Is a program for causing a computer to create individual inspection data for individually inspecting, wherein the storage unit is created based on design data about the substrate to be inspected, and among the plurality of electronic components A circuit network including at least two electronic components connected to two or more inspection points, and including all of the electronic components that are normal. A normal circuit net list for the network, and a fault network that is the circuit network in which only the component to be inspected has failed in any one fault state The fault circuit netlist is stored, and the normal inspection result when the probe is brought into contact with the inspection point connected to the normal network and inspected by the one or more inspection functions is stored in the computer. A normal-time simulation process that is obtained by simulating each of the one or more types of inspection functions using the normal circuit net list read out from a unit; the probe is brought into contact with the inspection points connected to the faulty network; Failure obtained by simulating for each one or more inspection functions using the failure circuit netlist read from the storage unit when the failure circuit network is inspected by one or more inspection functions Simulation process, and the normal inspection result and the normal inspection for each of the one or more inspection functions When there is one or more types of the inspection function in which the normal inspection result and the inspection result at the time of failure are different by comparing the inspection result at the time of inspection with the same inspection function as the result In order to inspect whether or not the inspection target component has failed in the one arbitrary failure state, the inspection content of inspecting the circuit network including the inspection target component by one of the inspection functions The individual inspection data creation process as the individual inspection data is executed for all the inspection target parts.

  In the inspection data creation device according to claim 1, the inspection data creation method according to claim 9, and the program according to claim 11, based on the acquired normal circuit netlist and fault circuit netlist, normal time simulation processing, Execute the simulation process at the time of failure and the data creation process for individual inspection, and inspect with the normal inspection result of the inspection content specified in advance (for example, the inspection function possessed by the board inspection device) and the same inspection content as this normal inspection result If the inspection result at the time of failure (inspection result in a simulation using a faulty circuit network that caused the inspection object to fail) differs from this inspection content, whether or not this inspection object has failed Data for individual inspection to inspect

  Therefore, according to this inspection data creation device, inspection data creation method, and program, data for individual inspection of circuit elements in which inspection points are not set at both ends due to reasons such as being built in the inspection target board The automatic creation rate can be increased sufficiently. For this reason, it is possible to sufficiently improve the inspection coverage for the inspection target substrate based on the individual inspection data.

  According to the test data creation device according to claim 2, since the fault net list creation processing for creating the fault circuit net list based on the normal circuit net list is executed, the individual test can be performed only by acquiring the normal circuit net list. The automatic creation rate of the inspection data can be sufficiently increased, whereby the inspection coverage for the inspection target substrate based on the individual inspection data can be sufficiently improved.

  In the inspection data creation device according to claims 3 and 7, when there is an inspection object for which individual inspection data has not been generated, the voltage value of the applied voltage is increased for this inspection object (inspection target part). The normal inspection process, the failure simulation process, and the individual inspection data creation process are executed to create individual inspection data. In other words, when creating the individual inspection data, the process of creating the individual inspection data while sequentially increasing the voltage value of the applied voltage is applied to the circuit elements for which the individual inspection data has been created at a lower voltage value. Is performed while excluding it from the inspection object when a voltage having a higher voltage value is applied thereafter.

  Therefore, according to this inspection data creation device, the calculation amount of the simulation is larger than the calculation amount of the simulation when the simulation of applying the voltage at all the voltage values is executed for all the inspection objects (inspection target parts). Substrate inspection device with a more secure inspection (safer inspection in that the inspection with a high voltage value can be omitted when the inspection with the application of a low voltage value is sufficient) It is possible to create data for individual inspection that can be executed for the above.

  According to the inspection data creation device of claims 4 and 8, as a result of the verification process, the individual inspection data in which the difference state between the normal inspection result and the failure inspection result is maintained, and the difference state is maintained. Since it is possible to delete data for individual inspection that is not performed, the data for the individual inspection is used in the substrate inspection apparatus to inspect the circuit elements constituting the circuit network formed on the actual inspection target substrate. It is possible to greatly reduce the occurrence of defects (problems that failure of circuit elements (parts to be inspected) that could be detected in the simulation cannot be inspected). That is, the reliability of the individual inspection data can be greatly improved.

  In the inspection data creation device according to claim 5, the inspection data creation method according to claim 10, and the program according to claim 12, based on the acquired normal circuit net list and fault circuit net list, normal simulation processing, Execute the simulation process at the time of failure and the data creation process for individual inspection, and the inspection result at the time of inspection by the same inspection function as the normal inspection result for each inspection function that the board inspection device has (optional) When there are one or more types of inspection functions that differ from the result of the simulation using a fault network when a component to be inspected fails in one failure state, one of those inspection functions The inspection contents for inspecting the network including the inspection target part in the inspection target part have failed in any one of the above failure states. Whether the test data for testing.

  Therefore, according to this inspection data creation device, inspection data creation method, and program, data for individual inspection of electronic components in which inspection points are not set at both ends due to reasons such as being built in a substrate to be inspected The automatic creation rate can be increased sufficiently. For this reason, it is possible to sufficiently improve the inspection coverage for the inspection target substrate based on the individual inspection data.

  Further, according to the inspection data creation device of claim 6, since the process from the selection of the inspection target part to the creation of the normal circuit net list and the fault net list is executed based on the design data, only the design data is acquired. The automatic creation rate of the individual inspection data can be sufficiently increased, whereby the inspection coverage for the inspection target substrate based on the individual inspection data can be sufficiently improved.

1 is a configuration diagram of an inspection data creation device 1. FIG. 6 is a connection diagram of a circuit board 71. FIG. It is a result figure showing a simulation result for every inspection function fc about inspection object part ob. It is a flowchart about the test data creation process 80 for demonstrating operation | movement (test data creation method) of the test data creation apparatus 1. FIG. It is explanatory drawing for demonstrating the basic concept of the test data preparation method. It is a flowchart about the test data creation process 90 for demonstrating operation | movement (other test data creation method) of the test data creation apparatus 1. FIG.

  Hereinafter, embodiments of an inspection data creation device, an inspection data creation method, and a program will be described with reference to the accompanying drawings.

  First, the basic concept of the inspection data creation method will be described with reference to the drawings.

  This inspection data creation method is a plurality of circuit elements (for example, shown in FIG. 2) that are electrically connected to each other to form a circuit network (for example, a circuit network as shown in FIG. 2) formed on a substrate to be inspected. At least one circuit element electrically connected to each other through a conductor pattern (such as a resistor, a capacitor, and a diode) disposed on the surface of the substrate to be inspected. Individual inspection data for this network (when this inspection is performed by the probe of the substrate inspection apparatus brought into contact with the connected inspection points (for example, inspection points TP1 to TP4 shown in FIG. 2)) Data used in board inspection equipment) is created only by simulation.

  Here, the substrate inspection apparatus has one or more inspection functions for inspecting the circuit network, and allows any one of the probes to function as an output probe corresponding to each inspection function. The function of outputting an electrical signal (voltage or current) for inspection to the inspection point via this output probe, and the circuit of the above electric signal by causing any other probe of the probes to function as an input probe An electric signal generated at the inspection point due to the output to the network is provided via the input probe. Also, in the simulation, which inspection function of each inspection function is used, which corresponding to this inspection function, which of each probe functions as an output probe and an input probe, and an output probe that functions in this way The contents relating to the inspection such as which inspection point the input probe is brought into contact with are referred to as inspection contents (inspection conditions).

  The basic idea of this test data creation method is to perform a simulation (inspection simulation) with a single test content. All circuit elements that make up the network are normal. This circuit network (also referred to as a normal circuit network) that is in the state described in the nominal value) and this circuit network in a state in which only a specific circuit element of the circuit elements constituting this network is in failure (failure) A simulation obtained by performing a simulation for a normal network using a normal circuit netlist for a normal network and a fault circuit netlist for a fault network. The result (normal inspection result) and the simulation result (failure inspection result) obtained by simulation of the fault network When you are in this particular circuit element it is based on the logic that can be used this one test contents as individual inspection data when testing by simulation or has failed or is normal.

  This inspection data creation method will be specifically described with an example. As an example of this, it is used when inspecting whether each of three different circuit elements A, B, and C among a plurality of circuit elements included in a circuit network is normal or faulty by simulation. Data for individual inspection (that is, data for individual inspection used for inspection of circuit element A, data for individual inspection used for inspection of circuit element B, and individual inspection used for inspection of circuit element C) (Data for use) will be described using an example in which one of the three different inspection contents 1, 2, and 3 is determined. It is assumed that the normal circuit netlist NEno of the normal circuit network N0 in which all of the plurality of circuit elements included in the circuit network are normal is known.

  First, based on the normal circuit netlist NEno, the fault circuit netlist NEabA of the fault circuit network Na in which only the circuit element A is faulty, and the fault circuit netlist NEabB of the fault circuit network Nb in which only the circuit element B is faulty , And a fault circuit netlist NEabC of the fault network Nc in which only the circuit element C is faulty is created.

  Next, the simulation with the test content 1 is executed for the normal network N0 using the normal circuit netlist NEno, and the simulation result (the result with the test content 1 for the normal network N0 (the test at the normal time) Obtain the result REno1)). Similarly, the simulation with the inspection content 1 is executed for the fault network Na using the fault circuit netlist NEabA, and the simulation result (the result with the inspection content 1 for the fault network Na (at the time of failure) Test result REabA1)) is obtained and executed for the fault circuit network Nb using the fault circuit netlist NEabB, and the result of the simulation result (test content 1 for the fault circuit network Nb) REabB1)) is obtained and executed for the fault circuit network Nc using the fault circuit netlist NEabC, and the simulation result (the result of the test content 1 for the fault circuit network Nc (the test result REabC1 at the time of fault) ) To get.

  Subsequently, the simulation with the inspection content 2 is also executed in the same manner as the simulation with the inspection content 1, and the result of the inspection content 2 on the normal network N0 (normal inspection result REno2), failure Results of inspection content 2 for circuit Na (failure inspection result REabA2), results of inspection content 2 for failure network Nb (failure inspection result REabB2), and inspection content 2 for failure network Nc (Failure inspection result REabC2) is acquired. Also, the simulation with the inspection content 3 is executed in the same manner as the simulation with the inspection content 1 and 2, and the result of the inspection content 3 with respect to the normal network N0 (normal inspection result REno3), Result of inspection content 3 for failure network Na (failure inspection result REabA3), result of inspection content 3 for failure network Nb (failure inspection result REabB3), and inspection content 3 for failure network Nc (Failure inspection result REabC3) is acquired.

  As a result, the simulation results of the inspection contents 1, 2, and 3 as shown in FIG. Test result REno ”, fault test results REabA1, fault test results REabA2, fault test results REabA3 (hereinafter also referred to as“ test results REabA ”unless otherwise specified), Each failure inspection result REabB1, failure inspection result REabB2, failure inspection result REabB3 (hereinafter also referred to as “failure inspection result REabB” unless otherwise specified) for failure network Nb, and failure network Nc Failure inspection result REabC1, Failure inspection result REabC2 Failure during the inspection result REabC3 is obtained (hereinafter also referred to as "fail the test result REabC" when not particularly distinguished).

  Next, for each inspection content 1, 2 and 3, the normal inspection result REno is compared with each failure inspection result REabA, REabB, REabC (hereinafter also referred to as “failure inspection result REab” unless otherwise specified). Then, it is determined whether or not there is only one failure inspection result REab that is different from the normal inspection result REno.

  As a result of this determination, as shown in FIG. 5, in the simulation result with inspection content 1, only the failure inspection result REabB1 with a □ mark is different from the normal inspection result REno1, and in the simulation result with inspection content 2, Only the failure inspection result REabC2 marked with □ is different from the normal inspection result REno2, and only the failure inspection result REabA3 marked with □ is different from the normal inspection result REno3. Suppose you are in a state of being.

  In this case, since it is possible to detect the state in which only the circuit element B is broken by the simulation with the inspection content 1, when checking whether the circuit element B is normal or broken by the simulation This inspection content 1 is used as individual inspection data. Similarly, a state in which only the circuit element C is faulty can be detected by the simulation with the inspection content 2, so that when the circuit element C is normal or faulty, the simulation is inspected. Since this inspection content 2 is used as the individual inspection data, and the state of failure of only the circuit element A can be detected by the simulation of the inspection content 3, is this circuit element A normal? This inspection content 3 is used as individual inspection data when inspecting for failure by simulation.

  Next, the configuration of an inspection data creation apparatus that executes the above-described basic concept inspection data creation method will be described with reference to the drawings.

  An inspection data creation device 1 as an inspection data creation device shown in FIG. 1 includes, as an example, an input unit 2, a processing unit 3, a storage unit 4, and an output unit 5, and design data input from the input unit 2 ( Based on the design data (Dde) for the circuit board to be inspected, and Dde, and the specification data Dsp of the board inspection apparatus that executes the inspection for this circuit board, this board inspection apparatus is used when inspecting this circuit board. The inspection data Dte can be automatically created.

  The design data Dde of this example includes information indicating the specifications of all electronic components mounted on a circuit board (inspection target board) to be inspected by the inspection data creation device, information indicating the shape of the conductor pattern, conductor pattern Includes information indicating the mounting positions of all electronic components, information indicating the positions of inspection points provided on the conductor pattern positioned on the surface of the circuit board, and the like. In the specification data Dsp, the inspection function fc (for example, impedance or resistance value between a pair of inspection points (impedance as an example in this example)) included in the substrate inspection apparatus that performs inspection on the inspection target substrate is measured and inspected. An inspection function, a voltage inspection function for applying a voltage between a pair of inspection points and measuring and inspecting a voltage generated between the other pair of inspection points when the voltage is applied, and applying a voltage between the pair of inspection points In addition, information indicating a current inspection function for measuring and inspecting a current flowing between the pair of inspection points when the voltage is applied is included.

  As an example, the input unit 2 includes an external interface circuit, receives design data Dde and specification data Dsp transmitted from an external device, and outputs them to the processing unit 3.

  As an example, the processing unit 3 is configured by a computer and reads out and executes an operation program stored in the storage unit 4 to input the design data Dde and the specification data Dsp output from the input unit 2. Storage processing to be stored in the storage unit 4, inspection data creation processing 80 described later for creating inspection data Dte based on the design data Dde and the specification data Dsp stored in the storage unit 4, and the created inspection data Dte Is output to the output unit 5.

  The storage unit 4 includes, for example, a hard disk drive (HDD), a semiconductor memory such as a RAM, and the like. Further, the storage unit 4 stores in advance an operation program of the processing unit 3 (including a program for causing the processing unit 3 to execute the inspection data creation processing 80), as well as design data Dde, specification data Dsp, and inspection. Data Dte etc. are stored. For example, the output unit 5 includes an external interface circuit, inputs the inspection data Dte output from the processing unit 3, and inputs the inspection data Dte to an external device connected to the external interface circuit. Is output.

  Next, the operation of creating the inspection data Dte by the inspection data creation apparatus 1 will be described together with the inspection data creation method.

  First, the processing unit 3 inputs design data Dde and specification data Dsp output from an external device via the input unit 2 and stores them in the storage unit 4. In this example, as an example, design data Dde for a circuit board 71 on which an electric circuit as shown in FIG. 2 is formed is input. This electric circuit is an example of a circuit network, and as shown in the figure, five resistors 72, 75, 76, 77, 78, one capacitor 73 and one diode 74 as circuit elements are provided. Assume that each electronic component is included as a component to be inspected ob, and these electronic components are electrically connected to each other by a conductor pattern as a circuit element. Further, in this electric circuit, electronic components (a diode 74 and a resistor 75 as an example) surrounded by a broken line are built in the circuit board 71, but inspection points are directly connected to both ends of the built-in electronic components. I can't. Therefore, in this circuit board 71, as shown in the figure, there are four inspection points TP1 to TP4 (hereinafter also referred to as inspection points TP unless otherwise distinguished) at the end of the electronic components other than the built-in electronic components. ) Is connected. Further, it is assumed that the board inspection apparatus for inspecting the circuit board 71 is supplied with specification data Dsp for the board inspection apparatus indicating that it has two inspection functions fc of an impedance inspection function fc1 and a current inspection function fc2. .

  Next, the processing unit 3 executes inspection data creation processing 80 shown in FIG. 4 to create inspection data Dte.

  In this inspection data creation process 80, the processing unit 3 first executes a component selection process (step 81). In the component selection process, the processing unit 3 selects an inspection target component ob to be inspected among electronic components mounted on the circuit board 71 based on the design data Dde stored in the storage unit 4. In the inspection data creation processing 80 of this example, as an example, the inspection data Dte that can individually inspect the electronic components mounted on the circuit board 71 in the board inspection apparatus is created. For this reason, in this component selection process, the processing unit 3 selects one inspection target component ob to be inspected. In this example, the processing unit 3 first selects the resistor 72.

  Next, the processing unit 3 executes normal net list creation processing (step 82). In the normal net list creation process, the processing unit 3 identifies a circuit network including the electronic component (inspection target component ob) selected in step 81 and connected to two or more inspection points TP. Further, a circuit network when all the electronic components included in the specified circuit network (hereinafter also referred to as a specific circuit network) are normal is a normal circuit network, and a net list of the normal circuit network is a normal circuit net list NEno. At the same time, it is stored in the storage unit 4 in correspondence with the inspection object part ob. In this case, the normal circuit netlist NEno includes information (for example, number name) of the inspection point TP used when inspecting the inspection object part ob.

  When the resistor 72 is selected as the inspection target component ob, the processing unit 3 specifies a circuit network (series circuit of the resistor 72 and the capacitor 73) connected to the two inspection points TP1 and TP2, as an example. Further, the processing unit 3 uses the circuit network when all the electronic components included in the specific circuit network are normal (when the wire is not disconnected or short-circuited and the constant is within a normal range) as a normal circuit network, The net list of this normal circuit network is created as a normal circuit net list NEno. This normal circuit netlist NEno includes, for example, list number 100 [inspection point TP1, resistor 72-1], list number 101 [resistor 72-2, capacitor 73-1], list number 102 [capacitor 73-2, inspection point]. TP2]. The symbols “−1” and “−2” indicate “one end” and “the other end” of the electronic component described together with this symbol. For list numbers, see FIG.

  As the circuit network including the resistor 72, in addition to the circuit network described above, a circuit network constituted by a series circuit of a resistor 72, a capacitor 73 and a resistor 78 and connected to the inspection points TP1 and TP4, a resistor 72, a diode It is possible to specify various circuit networks such as a circuit network composed of 74 and resistors 75 to 77 and connected to the two inspection points TP1 and TP3. Is preferably a circuit network having a smaller number of electronic components other than the resistor 72.

  Subsequently, the processing unit 3 executes a failure net list creation process (step 83). In this failure net list creation process, the processing unit 3 causes the inspection target part ob to fail in any one failure state among one or more failure states based on the normal circuit net list NEno created in step 82. The faulty network is created as a faulty network, and the faulty network netlist is created as a faulty circuit netlist NEab and stored in the storage unit 4 in correspondence with the inspection object part ob. In this case, the fault circuit netlist NEab also includes information on the inspection point TP used when inspecting the inspection object part ob. In this example, in order to facilitate understanding of the invention, it is assumed that the above-described failure state of the electronic component is either a disconnection or a short-circuit failure, and there is no constant error failure.

  Therefore, the processing unit 3 uses, as the fault circuit netlist NEab, the fault circuit netlist NEabo (list number 200a [inspection point TP1], list number 201a [ Capacitor 73-2, inspection point TP2]) and fault circuit netlist NEabs (list number 200b [inspection point TP1, capacitor 73-1], list number when the resistor 72 as the inspection target component ob has a short circuit failure) 201b [capacitor 73-2, inspection point TP2]). Hereinafter, the fault circuit netlist NEabo and the fault circuit netlist NEabs are collectively referred to as a fault circuit netlist NEab.

  Next, the processing unit 3 executes a normal simulation process (step 84). In the normal simulation process, the processing unit 3 makes one or more probes contact the inspection point TP connected to the normal circuit network in the substrate inspection apparatus with respect to the normal circuit network created in step 82. The normal inspection result REno when inspected by the inspection function fc is obtained by simulation for each inspection function fc using the normal circuit netlist NEno and stored in the storage unit 4. In this case, for example, an upper limit value is obtained by adding a predetermined value to the normal inspection result obtained by simulation, and a lower limit value is obtained by subtracting the predetermined value. The upper limit value and the lower limit value are stored in the storage unit 4 as the normal inspection result REno.

  In this example, in the processing unit 3, based on the specification data Dsp stored in the storage unit 4, the inspection function fc of the board inspection apparatus is two inspection functions fc, an impedance inspection function fc1 and a current inspection function fc2. When the normal circuit network (the series circuit of the resistor 72 and the capacitor 73) identified in step 82 is detected, the probe is brought into contact with the inspection points TP1 and TP2, and the inspection is performed with the impedance inspection function fc1. The result REno1 and the normal inspection result REno2 when inspected by the current inspection function fc2 are obtained by simulation. Further, the processing unit 3 stores the normal inspection results REno1 and REno2 obtained by the simulation in the storage unit 4 (see FIG. 3). Hereinafter, the normal inspection result REno1 and the normal inspection result REno2 are collectively referred to as a normal inspection result REno.

  Subsequently, the processing unit 3 executes a failure simulation process (step 85). In this failure simulation process, the processing unit 3 makes a probe contact with all the fault circuit networks created in step 83 by bringing the probe into contact with the test point TP connected to the fault circuit network in the board inspection apparatus. The inspection result REab upon failure when inspected by two or more inspection functions fc is obtained by simulation for each inspection function fc using the failure circuit netlist NEab and stored.

  In this example, the inspection function fc of the board inspection apparatus is the two inspection functions fc of the impedance inspection function fc1 and the current inspection function fc2, and the failure circuit network created in step 83 is indicated by the failure circuit netlist NEabo, NEabs. There are two fault networks. For this reason, the processing unit 3 causes the failure inspection results REabo1 and REabs1 when the probes are brought into contact with the inspection points TP1 and TP2 and inspected by the impedance inspection function fc1, and the current inspection function fc2 The failure-time inspection results REabo2 and REabs2 when inspected in (1) are obtained by simulation. In addition, the processing unit 3 stores each failure inspection result REabo1, REabs1, REabo2, and REabs2 obtained by the simulation in the storage unit 4 as a failure netlist NEab (see FIG. 3).

  Next, the processing unit 3 executes an individual inspection data creation process (step 86). In the individual inspection data creation process, the processing unit 3 performs the normal inspection results REno1 and REno2 obtained by the simulation at step 84 and the respective fault inspection results REabo1, REabs1, REabo2, obtained by the simulation at step 85. Compared with REabs2 for each inspection function fc (in this example, for each of the impedance inspection function fc1 and the current inspection function fc2), there is an inspection function fc in which the normal inspection result REno is different from the failure inspection result REab. It is detected (determined) whether or not.

  In this example, the processing unit 3 compares the normal inspection result REno1 when the normal circuit network is inspected with the impedance inspection function fc1, and the failure inspection results REabo1 and REabs1 when the two faulty network are inspected. Thus, it is detected whether or not there is a difference between the normal inspection result REno1 and the normal inspection result REnos1 and REabs1. Further, the processing unit 3 compares the normal inspection result REno2 when the normal network is inspected with the current inspection function fc2 and the failure inspection results REabo2 and REabs2 when the two faulty networks are inspected. It is detected whether there are any of the inspection results REabo2 and REabs2 at the time of failure that are different from the inspection result REno2 at the normal time.

  As a result of the comparison, the processing unit 3 has the impedance inspection function for the fault circuit network indicated by the fault circuit netlist NEabo (the fault circuit netlist NEab when the resistor 72 as the inspection target component ob has a disconnection fault). At least one of the failure inspection result REabo1 when inspected by fc1 and the failure inspection result REabo2 when inspected by the current inspection function fc2 is a normal inspection result for the normal circuit network indicated by the normal circuit netlist NEno. When the normal test result REno of REno1 and REno2 is different from the corresponding normal test result REno, one test function fc of the impedance test function fc1 and the current test function fc2 having different test results and the test function fc To step 82 using the normal test result REno The inspection content of inspecting the specified specific network is specified as the individual inspection data Dteo for inspecting whether or not the resistor 72 as the inspection target component ob has a disconnection failure. It is stored in the storage unit 4 in correspondence with the resistor 72).

  Specifically, when the resistance 72 that is the component to be inspected has a disconnection failure, the inspection results of both the impedance inspection function fc1 and the current inspection function fc2 are normal corresponding to the normal inspection results REno1 and REno2. It is different from the time inspection result REno. Therefore, the inspection content of inspecting the specific circuit network by one inspection function fc of the impedance inspection function fc1 and the current inspection function fc2 is used for individual inspection for inspecting whether or not the resistor 72 is broken. Let it be data Dteo.

  When the test results of both the impedance test function fc1 and the current test function fc2 are different, any test function fc may be included in the individual test data Dteo, but the corresponding normal test result REno The inspection content in which the specific circuit network is inspected by the inspection function fc having the larger difference amount is set as individual inspection data Dteo for inspecting whether or not the resistor 72 as the inspection target component ob has a disconnection failure. Is preferred.

  Further, the processing unit 3 performs an inspection with the impedance inspection function fc1 for the fault circuit network indicated by the fault circuit netlist NEabs (the fault circuit netlist NEab when the resistor 72 as the inspection target component ob has a short-circuit fault). At least one of the failure inspection result REabs1 and the failure inspection result REabs2 when inspection is performed by the current inspection function fc2 is a normal inspection result REno1, REno2 for the normal circuit network indicated by the normal circuit netlist NEno. When the test result REno differs from the corresponding normal test result REno, the test function fc of the impedance test function fc1 and the current test function fc2 having different test results and the normality in the test function fc Using the hourly inspection result REno, specify in step 82 The inspection content of inspecting the specific circuit network is the inspection object component ob (in this example, the resistance 72) as the individual inspection data Dtes for inspecting whether or not the resistance 72 that is the inspection object component ob is short-circuited. ) To be stored in the storage unit 4.

  Specifically, when the resistance 72 that is the component to be inspected has a short circuit failure, the inspection results of both the impedance inspection function fc1 and the current inspection function fc2 are the corresponding normality of the normal inspection results REno1 and REno2. It is different from the time inspection result REno. Therefore, the individual inspection data for inspecting whether or not the resistor 72 is short-circuited is the inspection content in which the specific circuit network is inspected by one of the impedance inspection function fc1 and the current inspection function fc2. Let Dtes.

  When the test results of both the impedance test function fc1 and the current test function fc2 are different, any test function fc may be included in the individual test data Dtes, but the corresponding normal test result REno The inspection content in which the specific circuit network is inspected by the inspection function fc having the larger difference amount is set as individual inspection data Dtes for inspecting whether or not the resistor 72 as the inspection target component ob has a short circuit failure. Is preferred.

  Thereby, the information of the inspection point TP used when inspecting the resistor 72 as the inspection object part ob, the individual inspection data Dteo for inspecting whether or not the resistor 72 is broken, and the resistor 72 are short-circuited. The individual inspection data Dtes for inspecting whether there is a failure or not is stored in the storage unit 4 in a state associated with the resistor 72 as individual inspection data for the resistor 72 as a whole.

  Subsequently, based on the design data Dde stored in the storage unit 4, the processing unit 3 performs individual inspection for all the inspection target components ob to be inspected among the electronic components mounted on the circuit board 71. It is determined whether or not the creation of data has been completed (that is, whether or not there is an inspection target part ob for which individual inspection data has not been created) (step 87), and individual inspection data for all the inspection target parts ob is determined. When the creation has not been completed, the process returns to the above-described step 81, and the steps 81 to 87 are repeated, whereby the individual inspection data for all the inspection target parts ob are sequentially created.

  For the circuit board 71 on which the electric circuit shown in FIG. 2 is formed, for example, when the processing unit 3 uses the capacitor 73 as the inspection target part ob, the processing unit 3 has a circuit network (resistor 72 and The series circuit of the capacitor 73) is specified as a specific circuit network. Further, when the resistor 78 is the inspection object part ob, the circuit network (the circuit having only the resistor 78) connected to the two inspection points TP2 and TP4 is specified as the specific circuit network. Further, when the diode 74 is the inspection object part ob, a circuit network (a resistor 72, a diode 74 and a combined resistor (a series circuit of resistors 75 and 76 and a resistor 77 in parallel) connected to two inspection points TP1 and TP3. A series circuit of resistors) is specified as a specific network.

  In addition, regarding the capacitor 73, the resistor 78, and the diode 74, the failure inspection results REabo1 and REabs1 when inspected by the impedance inspection function fc1 in any of the disconnection failure and the short-circuit failure include the corresponding normal inspection results REno1. In addition, failure-time inspection results REabo2 and REabs2 when inspected by the current inspection function fc2 are different from the corresponding normal-time inspection results REno2. Therefore, the processing unit 3 creates the individual inspection data D for each inspection target part ob in the same manner as the case of the resistor 72 described above.

  On the other hand, one of the resistors 75, 76, 77 constituting the above combined resistor is made the same as the capacitor 73, the resistor 78, and the diode 74 according to the relationship with the resistance value of the other resistors. In both cases of disconnection failure and short-circuit failure, the failure inspection results REabo1 and REabs1 when inspected by the impedance inspection function fc1 are different from the corresponding normal inspection results REno1 and are inspected by the current inspection function fc2. The failure-time inspection results REabo2 and REabs2 may be different from the corresponding normal-time inspection results REno2. Further, according to the relationship with the resistance values of other resistors, at least one of the failure test results REbo1 and REabs1 when tested by the impedance test function fc1 is not different from the corresponding normal test result REno1 ( Or a state in which at least one of the failure inspection results REabo2 and REabs2 when inspected by the current inspection function fc2 is not different from the corresponding normal inspection result REno2 (same state) ) May occur.

  In this case, for example, when one of the resistors 75, 76, and 77 is in a disconnection failure or a short-circuit failure, the failure inspection results REabo1 and REabs1 when the impedance inspection function fc1 inspects are obtained. Are different from the corresponding normal inspection result REno1, and when the failure inspection results REabo2 and REabs2 when inspected by the current inspection function fc2 are different from the corresponding normal inspection result REno2, each of them is an inspection target. Individual inspection data for the part ob is created in the same manner as the capacitor 73, resistor 78, and diode 74 described above.

  On the other hand, for example, when the resistor 77 is the inspection object part ob and the same circuit network as that of the diode 74 described above is the specific circuit network, the resistance value of the resistor 77 is a series combined resistance value of the other resistors 75 and 76. If it is much larger than the normal inspection result REno1, the failure inspection result REabs1 at the time of the short circuit failure of the inspection results REabo1 and REabs1 at the time of inspection by the impedance inspection function fc1 is different from the normal inspection result REno1. The failure inspection result REabo1 at the time does not differ from the normal inspection result REno1. In this case, the fault inspection results REabo2 and REabs2 when inspected by the current inspection function fc2 are different from the normal inspection result REno2 in the short-circuit fault, but the disconnection is caused. There occurs a situation where the failure inspection result REabo2 at the time of failure does not differ from the normal inspection result REno2.

  For this reason, the processing unit 3 uses the inspection points TP1 and TP3 used when inspecting the resistor 77 as the inspection object part ob as the individual inspection data for the specific circuit network having the resistance 77 as the inspection object part ob. And test data Dtes for testing whether or not the resistor 77 has a short circuit failure (the test content is to test the normal network with one of the impedance test function fc1 and the current test function fc2) Are stored in the storage unit 4 in a state associated with the resistor 77. As for the resistor 77, at the time of a disconnection failure, the failure inspection results REabo1 and REabo2 of the impedance inspection function fc1 and the current inspection function fc2 are not different from the corresponding normal inspection results REno1 and REno2. For this reason, the processing unit 3 identifies the resistor 77 as a component that cannot be inspected for a disconnection failure, and associates information indicating that with the resistor 77 as part of the individual inspection data for the resistor 77. The stored state is stored in the storage unit 4.

  For example, when the resistor 75 is the inspection object part ob and the same network as that of the diode 74 is a normal network, the resistance value of the resistor 75 is small and the resistor 75 is connected in series with the resistor 75. When the resistance value of the resistor 76 is extremely large and the resistance value of the resistor 77 is extremely smaller than the resistance value of the resistor 76 (for example, the resistor 75 is 10Ω, the resistor 76 is 10 MΩ, and the resistor 77 is 100Ω). In such a case, both of the failure inspection results REabo1 and REabs1 when inspected by the impedance inspection function fc1 are not different from the normal inspection result REno1. Further, in this case, both of the inspection results REabo2 and REabs2 at the time of the inspection by the current inspection function fc2 are not different from the normal inspection result REno2.

  For this reason, the processing unit 3 uses the inspection points TP1 and TP3 used when inspecting the resistor 75 as the inspection object part ob as the individual inspection data for the specific circuit network having the resistance 75 as the inspection object part ob. And information indicating that neither a disconnection failure nor a short-circuit failure can be inspected (that is, a component that cannot be inspected) regardless of which one of the inspection functions fc of the impedance inspection function fc1 and the current inspection function fc2 is used. The data is stored in the storage unit 4 in association with 75.

  The processing unit 3 repeatedly executes Step 81 to Step 87, and the creation of the individual inspection data for all the inspection target parts ob is completed in Step 87 (that is, the inspection target part ob for which the individual inspection data has not been generated). If it is determined that there is no data, the inspection data creation process 80 is completed. Finally, the processing unit 3 executes output processing, reads out the entire individual inspection data for each inspection target part ob created in the inspection data creation processing 80 and stored in the storage unit 4, and inspects Output as output data Dte to the output unit 5.

  When the circuit board 71 is inspected, the board inspection apparatus inspects electronic components mounted on the circuit board 71 using the inspection data Dte, and determines whether the circuit board 71 is good or bad.

  Thus, in this inspection data creation device 1 and inspection data creation method, component selection processing, normal netlist creation processing, failure netlist creation processing, normal simulation processing, failure simulation processing, and individual inspection data creation A normal inspection result REno for each inspection function fc possessed by the substrate inspection apparatus and a failure inspection result REab (one or two or more failures) when inspected by the same inspection function fc as the normal inspection result REno. There is one or two or more types of inspection functions fc that are different from the inspection result in a simulation using a fault network when the inspection target part ob fails in any one of the failure states. The specific network identified in the normal net list creation process by one of the inspection functions fc. Testing the contents of a result, the inspection target part ob is to check data Dte for checking whether a failure in any one fault condition of the.

  Therefore, according to the inspection data creation device 1 and the inspection data creation method, an electronic component in which the inspection points TP are not set (connected) at both ends due to being built in the circuit board 71 (above-mentioned) In this example, the automatic creation rate can be sufficiently increased for the individual inspection data of the diode 74 and the resistor 75). For this reason, the test | inspection coverage rate about the circuit board 71 based on the test | inspection data Dte comprised by the data for individual test | inspection about each electronic component can fully be improved.

  In addition, according to the inspection data creation device 1 and the inspection data creation method, when there is no inspection function fc that is different between the normal inspection result REno and the failure inspection result REab, the inspection object part ob is inspected. By specifying the parts as inaccessible parts and using them as individual inspection data, when inspecting the circuit board 71 using the inspection data Dte, the parts that cannot be inspected are specified based on the individual inspection data. Since the inspection can be executed in a state (masked state) omitted from the inspection target component ob in advance, the inspection time can be shortened.

  In the above example, there are two cases where the inspection function fc of the substrate inspection apparatus is the impedance inspection function fc1 and the current inspection function fc2, but the inspection function fc may be one or three. It may be the above. In the above example, since the inspection function fc of the board inspection apparatus is the impedance inspection function fc1 and the current inspection function fc2, the number of inspection points TP connected to the specific circuit network is two. When the substrate inspection apparatus is provided with a voltage detection function for detecting a voltage output from another pair of inspection points TP in a state where a voltage is applied between the pair of inspection points TP, The number of inspection points TP connected to the network is four (three when one of the pair of inspection points TP on the voltage application side and one of the pair of inspection points TP on the voltage detection side are common) It is also possible to adopt the configuration as follows.

  Further, an external device (not shown) executes the component selection process (step 81), the normal net list creation process (step 82), and the failure net list creation process (step 83) in the inspection data creation process 80 described above. Thus, a normal circuit netlist NEno and a fault circuit netlist NEab are created for each part to be inspected, and the test data creation device 1 creates the normal circuit netlist NEno and the fault circuit netlist NEab created by the external device. While taking in and memorize | storing in the memory | storage part 4, using this normal circuit netlist NEno and fault circuit netlist NEab, said normal time simulation process (step 84), fault time simulation process (step 85), and individual test | inspection data By executing the creation process (step 86) It is also possible to adopt a configuration to create a separate test data Dteo for inspecting an inspection object component ob contained in a particular network.

  Moreover, in the above example, circuit elements such as electronic components mounted on the circuit board 71 (electronic components mounted on the surface of the circuit board 71 and electronic components built in the circuit board 71) are to be inspected. Although the component ob is used, for example, a formed component such as a resistor formed by screen-printing a paste of a resistor material on the surface of the circuit board 71 and performing a process such as heat curing is also one of the electronic components. Can also be included in the inspection object part ob.

  Also, a conductor pattern for electrically connecting electronic components can be handled as a circuit element constituting a circuit network in the same manner as the electronic components described above, and can be included in the inspection target component ob. That is, when the normal circuit netlist NEno and the fault circuit netlist NEab are acquired from an external device, a plurality of circuit elements (which are electrically connected to each other) that constitute a circuit network formed on a substrate to be inspected (circuit board) ( When the circuit element of at least one of the electronic component and the conductor pattern) is inspected by bringing a probe into contact with an inspection point disposed on the surface of the substrate to be inspected and connected to the circuit network, When creating the individual inspection data, based on the normal circuit net list when all of the plurality of circuit elements are in the normal state, the inspection contents defined in advance for the normal state network (for example, Normal-time simulation processing for executing a normal-inspection result by executing a simulation for inspection by the inspection function fc) of the substrate inspection apparatus Based on the fault circuit net list when at least one circuit element of the plurality of circuit elements is in a failure state as a test target and all the remaining circuit elements are in a normal state, Execute the simulation to inspect with this inspection content and obtain the inspection result at the time of failure, and inspect the inspection object with this inspection content when the normal inspection result and the inspection result at failure are different It is also possible to employ a configuration for executing an individual inspection data creation process as individual inspection data. Thereby, it is possible to inspect not only the electronic component but also the conductive pattern (including the bonded portion of the conductive pattern and the electronic component) with respect to the bonding state (the presence or absence of disconnection).

  It is also possible to adopt a configuration in which only the normal circuit netlist NEno is acquired from an external device, and the fault circuit netlist NEab is executed in the test data creation processing 80. In this case, for the circuit elements included in the normal circuit netlist NEno, at least one circuit element to be inspected is changed according to a predetermined procedure, and a plurality of fault nets are created as fault states. A list creation process is executed, and in the failure simulation process, a simulation is executed based on the fault circuit net list created in this way.

  In the above example, as in the electric circuit formed on the circuit board 71 shown in FIG. 2, any circuit element (electronic component and conductor pattern) is electrically connected to other circuit elements. On the other hand, for each part to be inspected, one specific circuit network (a part of the entire circuit network) including this part to be inspected is specified and its normal circuit netlist NEno is created. By executing the processing, the useless normal circuit net list NEno is not created, but it is connected between any one of a plurality of inspection points connected to this circuit network and any other. All the above-mentioned partial circuit networks are specified, a normal circuit netlist NEno is created for each specified partial network, and this netlist is based on the generated normal circuit netlist NEno. A fault circuit netlist NEab is created by causing at least one circuit element contained therein to fail, and using the normal circuit netlist NEno and the fault circuit netlist NEab created in this manner, the normal simulation process ( Step 84), a failure simulation process (step 85) and an individual inspection data creation process (step 86) are executed to perform an individual inspection for inspecting the inspection target part ob included in the entire circuit network. A configuration for creating data Dteo can also be employed.

  With respect to this configuration, for example, the normal circuit netlist NEno and the fault circuit network are created for the circuit network shown in FIG. 2 by using an example of creating individual test data Dteo for testing using two test points. The process until the list NEab is created will be specifically described. In this case, combinations of selecting two inspection points TP from the inspection points TP1 to TP4 are (TP1, TP2), (TP1, TP3), (TP1, TP4), (TP2, TP3), (TP2, TP4). , (TP3, TP4).

  Thus, for example, when only the electronic component is used as a circuit element (when the conductor pattern is not used as a circuit element), the normal circuit netlist NEno (list number 100 [inspection point TP1, Resistor 72-1], list number 101 [resistor 72-2, capacitor 73-1], list number 102 [capacitor 73-2, inspection point TP2]), and two normal circuits for the set of (TP1, TP3) Netlist NEno (list number 100 [inspection point TP1, resistor 72-1], list number 103 [resistor 72-2, diode 74-1], list number 104 [diode 74-2, resistor 77-1], list number 105 [resistor 77-2, inspection point TP3]), and normal circuit netlist NEno (list number 10) [Inspection point TP1, resistor 72-1], list number 103 [resistor 72-2, diode 74-1], list number 106 [diode 74-2, resistor 75-1], list number 107 [resistor 75-2, Resistor 76-1], list number 108 [resistor 76-2, resistor 77-2], list number 105 [resistor 77-2, inspection point TP3]).

  Also, the normal circuit netlist NEno (list number 100 [inspection point TP1, resistor 72-1], list number 101 [resistor 72-2, capacitor 73-1], list number 109 [list] for the set (TP1, TP4). Capacitor 73-2, resistor 78-1], list number 110 [resistor 78-2, test point TP4]), and two normal circuit netlists NEno (list number 102 [test point] for the set (TP2, TP3)) TP2, capacitor 73-2], list number 101 [capacitor 73-1, resistor 72-2], list number 103 [resistor 72-2, diode 74-1], list number 104 [diode 74-2, resistor 77- 1], list number 105 [resistor 77-2, inspection point TP3]), and normal circuit netlist NEn (List number 102 [inspection point TP2, capacitor 73-2], list number 101 [capacitor 73-1, resistor 72-2], list number 103 [resistor 72-2, diode 74-1], list number 106 [diode 74-2, resistor 75-1], list number 107 [resistor 75-2, resistor 76-1], list number 108 [resistor 76-2, resistor 77-2], list number 105 [resistor 77-2, inspection] Point TP3]).

  Also, the normal circuit netlist NEno (list number 102 [inspection point TP2, capacitor 73-2], list number 109 [capacitor 73-2, resistor 78-1], list number 110 [ Resistance 78-2, inspection point TP4]) and two normal circuit netlists NEno (list number 105 [resistance 77-2, inspection point TP3], list number 104 [diode 74-) 2, resistor 77-1], list number 103 [resistor 72-2, diode 74-1], list number 101 [resistor 72-2, capacitor 73-1], list number 109 [capacitor 73-2, resistor 78- 1], list number 110 [resistor 78-2, inspection point TP4]), and normal circuit netlist NEn (List number 105 [resistor 77-2, inspection point TP3], list number 108 [resistor 76-2, resistor 77-2], list number 107 [resistor 75-2, resistor 76-1], list number 106 [diode] 74-2, resistor 75-1], list number 103 [resistor 72-2, diode 74-1], list number 101 [resistor 72-2, capacitor 73-1], list number 109 [capacitor 73-2, resistor 78-1] and list number 110 [resistor 78-2, inspection point TP4]).

  In addition, based on each normal circuit netlist NEno created in this way, at least one circuit element included in the netlist is failed to create a fault circuit netlist NEab. Specifically, the normal circuit netlist NEno (list number 100 [inspection point TP1, resistor 72-1], list number 101 [resistor 72-2, capacitor 73-1], list number for the set of (TP1, TP2)) 102 [capacitor 73-2, inspection point TP2]), the electronic components included in this netlist are the resistor 72 and the capacitor 73. Therefore, at least one of the resistor 72 and the capacitor 73 is failed. A fault circuit netlist NEab is generated. Thereby, the individual test data Dteo is created based on the created normal circuit netlist NEno and the fault circuit netlist NEab.

  Further, in the above-described impedance inspection function fc1, current inspection function fc2, and voltage inspection function of the substrate inspection apparatus, voltage is applied between a pair of inspection points. Depending on the substrate inspection apparatus, the voltage to be applied may be applied. Some voltage values can be set in multiple stages (n stages, where n is an integer of 2 or more). When the above-described inspection data creation device or inspection data creation method is applied to create individual inspection data for this type of substrate inspection device, each normal circuit netlist NEno and each normal circuit in the simulation are applied. All the inspection functions of the board inspection apparatus while setting the voltage value of the applied voltage to the voltage value at all stages for each fault circuit netlist NEab created based on the circuit netlist NEno (In the above example, the individual inspection data is created using the impedance inspection function fc1, the current inspection function fc2, the voltage inspection function, and the like).

  However, in the configuration in which the voltage value of the voltage applied in each inspection function is set to the voltage value at all stages (n stages), normal-time simulation processing and failure-time simulation for applying a voltage value at a certain stage For circuit elements (such as electronic components and conductor patterns) for which individual inspection data can be created based on the normal inspection results and failure inspection results obtained in the process, the voltage of the voltage value at another stage is applied. As a result of executing normal time simulation processing, failure time simulation processing, and individual inspection data creation processing, the amount of calculation in the entire simulation becomes extremely large, and the time required for inspection data creation processing becomes extremely long. There is a problem.

  Therefore, a simulation (simulation using all inspection functions) of applying a voltage at one of the n-stage voltage values to each normal circuit netlist NEno and each fault circuit netlist NEab is executed. As a result, the circuit in which at least one type of simulation is different between the simulation result obtained from the simulation for the normal network (normal inspection result) and the simulation result obtained from the simulation for the fault network (failure inspection result) For elements (circuit elements in which a normal inspection result and a failure inspection result are different in a simulation using at least one inspection function), a simulation is performed in which a voltage is applied with the remaining voltage value among n-stage voltage values. Omitting the simulation By reducing the amount of calculation in total emissions, it is preferable to shorten the time required to create a separate test data.

  In this case, some substrate inspection apparatuses can set the voltage value of the voltage to be applied in a multi-stage with a constant voltage step such as 0.1 V between the lower limit value and the upper limit value. However, as in the circuit board 71 shown in FIG. 2, the semiconductor element such as the diode 74 (the voltage value of the applied voltage exceeds the forward voltage value Vf or the voltage less than the forward voltage value Vf). Depending on the value, an element that transitions to one of two states (in a diode, transitions to one of two states, an on state and an off state) is included as a circuit element. In a substrate inspection apparatus for inspecting a circuit board, as an example of multiple stages, 2 of a voltage value V1 less than the forward voltage value Vf and a voltage value V2 (> Vf> V1> 0) exceeding the forward voltage value Vf. Voltage value for the stage Which constant is generally used.

  In the following, individual inspection data for inspecting the circuit board 71 shown in FIG. 2 is created by the board inspection apparatus having a function capable of defining the voltage value of the applied voltage to the two voltage values V1 and V2. An example of this will be described with reference to the inspection data creation processing 90 shown in FIG. The same processes as those in the inspection data creation process 80 shown in FIG. Further, in the inspection data creation device 1 that executes the inspection data creation processing 90, although not shown, the storage unit 4 has the two voltage values V1 and V2 that are examples of multi-stage voltage values. Assume that it is stored in advance.

  In the inspection data creation process 90 shown in FIG. 6, the processing unit 3 firstly uses the lower voltage value of the two voltage values V1 and V2 stored in the storage unit 4 as the voltage value of the voltage to be applied. V1 is defined (step 91). Next, the processing unit 3 executes Steps 81 to 86 to create individual inspection data Dteo for the electronic component selected in Step 81. Specifically, in step 84, the processing unit 3 uses the inspection function fc to apply the voltage V1 to the inspection point TP connected to the normal network including the electronic component selected in step 81. A normal inspection result REno when the normal network is inspected is obtained by simulation. Further, in step 85, the processing unit 3 uses the failure function network fc to apply the voltage V1 to the inspection point TP connected to the failure circuit network including the electronic component selected in step 81. The failure inspection result REab is obtained by simulation. Further, when the processing unit 3 compares and compares the normal inspection result REno with the failure inspection result REab in Step 86, the processing unit 3 assigns the specific circuit network including the electronic component selected in Step 81 to each inspection result REno. , REab is generated as individual inspection data Dteo, which is inspected with the inspection content when REab is obtained.

  The processing unit 3 determines whether or not there are unselected parts in step 92 (that is, whether or not all electronic parts have been selected in the part selection process in step 81), and there are no unselected parts. Step 81 to Step 86 are executed. When the processing unit 3 determines in step 92 that there are no unselected components (that is, all electronic components have been selected in the component selection processing in step 81), the processing unit 3 determines all electronic components to be inspected. It is determined whether or not the creation of the individual inspection data Dteo has been completed (that is, whether or not there is an inspection target part ob for which the individual inspection data Dteo has not been created) (step 93).

  In step 93, the processing unit 3 determines that the creation of the individual inspection data Dteo for all the electronic parts to be inspected has been completed (that is, there is no inspection object part ob for which the individual inspection data Dteo has not been created). Sometimes, the inspection data creation process 90 is completed. On the other hand, the processing unit 3 has not completed the creation of the individual inspection data Dteo for all the electronic components to be inspected in Step 93 (that is, there is an inspection target part ob for which the individual inspection data Dteo has not been created yet). If it is determined that the process is in progress, the process proceeds to step 94.

  In this case, for example, the normal circuit netlist NEno (list number 100 [inspection point TP1, resistor 72-1], list number 101 [resistor 72-2] for the set (TP1, TP2) of the circuit board 71 shown in FIG. , Capacitor 73-1], list number 102 [capacitor 73-2, inspection point TP2]) and normal circuit netlist NEno (list number 100 [inspection point TP1, resistor 72-1] for the set of (TP1, TP4)) ], List number 101 [resistor 72-2, capacitor 73-1], list number 109 [capacitor 73-2, resistor 78-1], list number 110 [resistor 78-2, inspection point TP4]), An electronic component included in a netlist that does not include a semiconductor element such as a diode is individually specified as a component to be inspected. Since the inspection function fc for applying the voltage of the low voltage value V1 can be simulated when the inspection data is generated, the individual inspection data Dteo for all the electronic components included in the netlist is generated. .

  On the other hand, the normal circuit netlist NEno (for example, list number 100 [inspection point TP1, resistor 72-1], list number 103 [resistor 72-2, diode 74-1], list number for the set of (TP1, TP3)) 104 [diode 74-2, resistor 77-1], list number 105 [resistor 77-2, inspection point TP3], etc.) and normal circuit netlist NEno (for example, list number 105 for the set of (TP3, TP4)). [Resistor 77-2, inspection point TP3], list number 104 [diode 74-2, resistor 77-1], list number 103 [resistor 72-2, diode 74-1], list number 101 [resistor 72-2, Capacitor 73-1], list number 109 [capacitor 73-2, resistor 78-1], list number 110 [resistor 78]. 2, when the electronic component included in the netlist including the diode 74 is the inspection target component ob, the voltage value V1 of the voltage to be applied is the forward voltage value Vf of the diode 74. Therefore, no current flows in the simulation.

  Therefore, among the electronic components included in the normal circuit netlist NEno, the resistor 72, the capacitor 73, and the resistor 78 are based on the normal circuit netlist NEno for the other (TP, TP) pairs. The individual inspection data Dteo is created, but the individual inspection data Dteo is not created for the other electronic components (resistors 75, 76, 77). Since the diode 74 can be simulated to cause a failure of the diode 74, the individual inspection data Dteo is created.

  Therefore, in this example, the processing unit 3 determines in step 93 that there is a part to be inspected for which the individual inspection data Dteo has not been created, and then stores it in the storage unit 4 as the voltage value of the voltage to be applied. The higher voltage value V2 of the two voltage values V1 and V2 being defined is defined, that is, the voltage value of the applied voltage is increased (step 94), and the individual inspection data Dteo has not been created The creation of the individual inspection data Dteo for the electronic component is executed. In this case, the processing unit 3 creates the individual inspection data Dteo by executing the second step 81 to step 87 with processing contents substantially the same as the processing contents in the first step 81 to step 87 described above. To do. Hereinafter, steps different from the processing contents in the first step 81 to step 87 will be mainly described, and the description of the steps having the same processing contents will be omitted.

  The purpose in the second step 81 to step 87 is to create the individual inspection data Dteo for the electronic parts for which the individual inspection data Dteo has not been created. For this reason, in the second step 81, the processing unit 3 sequentially selects only uncreated electronic components of the individual inspection data Dteo (in this example, only the resistors 75, 76, 77) as the inspection target component ob. Step 82 to Step 86 are repeatedly executed until the individual inspection data Dteo for all inspection object parts ob is created in Step 87.

  In each simulation process 84, 85 for the second time, the voltage value V2 of the applied voltage exceeds the forward voltage value Vf of the diode 74 (that is, the diode 74 is turned on by applying the voltage of the voltage value V2). . For this reason, even when the electronic component included in the net list including the diode 74 is set as the inspection target component ob, it is possible to pass a current through the inspection target component ob in the simulation. Therefore, all of the individual inspection data Dteo for the electronic component selected as the inspection target component ob is created by executing the second step 81 to step 87. Finally, in step 87, the processing unit 3 determines that there is no inspection target part ob for which the individual inspection data Dteo has not been created, and completes the inspection data creation processing 90 shown in FIG.

  As described above, in the inspection data creation apparatus 1 that executes the inspection data creation processing 90 and the inspection data creation processing 90 (inspection data creation method), a netlist including the inspection target part ob in the simulation (normal) Individual inspection data for a substrate inspection apparatus capable of setting the voltage values of the voltages applied to the circuit netlist NEno and the fault circuit netlist NEab) in multiple levels (in the above example, two levels of voltage values V1 and V2 as an example). When creating Dteo, the voltage value of the applied voltage is increased sequentially from the lower side (the voltage value of the applied voltage is sequentially increased to the voltage value V1, then the voltage value V2), and the current is applied by applying the voltage. For the inspection object part ob included in the flowing netlist, the process of creating the individual inspection data Dteo is performed with a lower voltage value ( In this example, the electronic component for which the individual inspection data Dteo has been created at the voltage value V1) is excluded from the inspection target component ob when a voltage having a higher voltage value (voltage value V2 in this example) is applied thereafter. To do.

  Therefore, according to the inspection data creation apparatus 1 that executes the inspection data creation processing 90 and the inspection data creation processing 90 (inspection data creation method), it can be performed at all stages (two stages in this example). The amount of simulation calculation is sufficiently reduced compared to the amount of simulation calculation when a simulation of applying a voltage at a voltage value is executed for all inspection target parts ob. This is not only an inspection with a high voltage value V2 through which a current flows, but also an inspection with an application of a lower voltage value V1, in other words, an application of a voltage with a lower voltage value. For the inspection object part ob that only needs to be inspected in step (3), the inspection at a high voltage value can be omitted. To be able to create a separate test data Dteo capable of executing.

  In addition, although the example which creates the data Dteo for individual inspection with respect to the board | substrate inspection apparatus which can set the voltage value of the voltage to apply in two steps of voltage value V1, V2 was demonstrated, more voltage values of the voltage to apply are applied. Even when the individual inspection data Dteo for the substrate inspection apparatus that can be set in the above stages (3 stages, 4 stages,...) Is created, the above-described inspection data creation processing 90 can be applied as appropriate.

  By the way, in an actual inspection target board to be inspected by the board inspection apparatus, parameter values of a plurality of circuit elements electrically connected to each other constituting the circuit network (for example, resistance values when the circuit elements are resistors, and resistance values when the circuit elements are capacitors) Capacitance value, forward voltage value in the case of diodes, etc.) do not always coincide with the nominal values (values used in the above simulation) described in the catalog etc., but within the allowable range (tolerance) It varies. Accordingly, the individual inspection data Dteo created as described above is used in the substrate inspection apparatus, and a plurality of circuit elements electrically connected to each other constituting the circuit network formed on the actual inspection target substrate are used. When the inspection is executed, the result may be different from the result in the simulation (that is, the result that the failure of the circuit element (part to be inspected) that could be detected in the simulation cannot be inspected).

  Therefore, it is possible to adopt a configuration in which the processing unit 3 executes a verification process on the individual inspection data Dteo created as described above and increases the reliability of the individual inspection data Dteo. In this verification process, the processing unit 3 uses the individual test data Dteo for each circuit element created in the individual test data creation process as a test target to be tested with the individual test data Dteo in the circuit network. Normal state simulation processing and failure with the inspection contents indicated by the individual inspection data Dteo in the state where the parameter values of the circuit elements excluding the elements (parts to be inspected) are changed within the allowable range (tolerance) of the circuit elements A time simulation process is executed to verify whether or not the difference between the normal inspection result and the failure inspection result is maintained.

  As a result of the verification process, the individual inspection data Dteo in which the difference state between the normal inspection result and the failure inspection result is maintained, and the individual inspection data Dteo in which the difference state is not maintained is deleted. It is assumed that there is no individual inspection data Dteo for the circuit elements that are to be inspected by the individual inspection data Dteo. As a result, the individual inspection data Dteo obtained by executing the verification process in this way is used in the substrate inspection apparatus to inspect the circuit elements constituting the circuit network formed on the actual inspection target substrate. The reliability of the individual inspection data Dteo can be greatly improved because the occurrence of malfunctions (defects that cannot be inspected for failure of circuit elements (parts to be inspected) that could be detected by simulation) can be greatly reduced. Can do.

DESCRIPTION OF SYMBOLS 1 Inspection data creation apparatus 80 Inspection data creation processing 81 Parts selection processing 82 Normal net list creation processing 83 Fault net list creation processing 84 Normal time simulation processing 85 Fault time simulation processing 86 Individual inspection data creation processing

Claims (12)

At least one circuit element among a plurality of circuit elements electrically connected to each other constituting a circuit network formed on the inspection target substrate is disposed on the surface of the inspection target substrate and connected to the circuit network. An inspection data creation device comprising a processing unit for creating individual inspection data for the circuit network when inspecting by contacting a probe to an inspection point,
The processor is
Based on a normal circuit net list when all the plurality of circuit elements are in a normal state, a normal inspection result is executed by executing a simulation for inspecting the circuit network in a normal state with a predetermined inspection content. Normal time simulation processing,
Based on a fault circuit net list when at least one circuit element of the plurality of circuit elements is in a fault state as an inspection target and all the remaining circuit elements are in a normal state, the circuit network in the fault state is On the other hand, a simulation process at the time of failure is performed to obtain a test result at the time of failure by executing a simulation to inspect with the inspection content.
And an inspection for executing an individual inspection data creation process in which the inspection contents when the normal inspection result and the failure inspection result are different are used as the individual inspection data when the inspection object is inspected. Data creation device.   The processing unit performs a fault net list creation process for creating a plurality of fault circuit net lists while changing the at least one circuit element to be inspected according to a predetermined procedure based on the normal circuit net list. The inspection data creation device according to claim 1, wherein the test data creation apparatus executes the failure simulation process based on the fault circuit netlist created in the fault netlist creation process.   The processing unit executes the simulation inspecting with the inspection contents accompanied by application of voltage to the circuit network in the normal time simulation process and the failure time simulation process, and executes the individual inspection data creation process, Individual inspection data was created, and the individual inspection data was not created without the difference between the normal inspection result in the normal simulation process and the failure inspection result in the failure simulation process. 3. The inspection use according to claim 1, wherein when the inspection object exists, the voltage value of the applied voltage is increased to execute the normal simulation process, the failure simulation process, and the individual inspection data creation process. Data creation device.   The processing unit, for the individual inspection data created in the individual inspection data creation processing, sets the parameter value of the circuit element excluding the inspection object to be inspected by the individual inspection data in the circuit network. The normal-time simulation process and the failure-time simulation process are executed with the inspection content indicated by the individual inspection data in a state changed within the allowable range of the normal-time inspection result and the failure-time inspection result, The inspection data creation device according to claim 1, wherein verification processing for verifying whether the different state is maintained is performed. Individual for individually inspecting a plurality of electronic components mounted on an inspection target board by bringing a probe into contact with an inspection point provided on the surface of the inspection target board in a substrate inspection apparatus having one or more types of inspection functions An inspection data creation device for creating inspection data,
Created based on design data for the inspection target board, including inspection target parts to be inspected from among the plurality of electronic components, and at least two or more connected to the two or more inspection points A normal circuit net list for a normal network in which the electronic components are all normal, and the circuit network in which only the component to be inspected is failed in an arbitrary failure state. A storage unit storing a fault circuit netlist for the fault circuit network, and a processing unit,
The processing unit uses the normal circuit netlist to indicate a normal inspection result when the probe is brought into contact with the inspection point connected to the normal circuit network and inspected by the one or more types of inspection functions. Normal-time simulation processing that is determined by simulation for each of one or more inspection functions,
Using the fault circuit netlist, an inspection result at the time of failure when the probe is brought into contact with the inspection point connected to the fault circuit network and the fault circuit network is inspected by the one or more types of inspection functions. Failure simulation process for each type of inspection function
And comparing the normal inspection result for each of the one or more types of inspection functions with the normal inspection result when the inspection function is the same as the normal inspection result. When there are one or more types of inspection functions that are different from the time inspection result, the inspection content for inspecting the circuit network including the inspection target component by one of the inspection functions is indicated as the inspection target component. An inspection data creation device that executes the individual inspection data creation processing for the individual inspection data for inspecting whether or not there is a failure in any one failure state for all the inspection target parts. The processor is
A component selection process for selecting the inspection target component from the plurality of electronic components based on the design data,
Based on the design data, specify a circuit network including at least two or more electronic components connected to the two or more inspection points, including the inspection target component, and included in the circuit network A normal net list creating process for creating the normal circuit network as the normal circuit net list and the normal circuit net list as the normal circuit net list when the electronic components are all normal.
And based on the normal circuit netlist, the circuit network when the component to be inspected is failed in any one failure state is used as the fault circuit network, and the net list of the fault circuit network is used as the fault circuit netlist. The inspection data creation apparatus according to claim 5, wherein a failure netlist creation process to be created is executed. The inspection function involves the application of a voltage to the network;
In the individual inspection data creation process, the processing unit does not create the individual inspection data because the normal inspection result and the failure inspection result are different from each other in the inspection function. The inspection data according to claim 5 or 6, wherein the inspection target part executes the normal simulation process, the failure simulation process, and the individual inspection data creation process by increasing a voltage value of the applied voltage. Creation device.   For the individual inspection data created in the individual inspection data creation processing, the processing unit obtains parameter values of the electronic components excluding the inspection target parts to be inspected by the individual inspection data in the circuit network. Executing the normal simulation process and the failure simulation process with the inspection contents indicated by the individual inspection data in a state changed within the allowable range of the component, the normal inspection result and the failure inspection result The inspection data creation device according to claim 5, wherein a verification process is performed to verify whether or not the difference state is maintained. At least one circuit element among a plurality of circuit elements electrically connected to each other constituting a circuit network formed on the inspection target substrate is disposed on the surface of the inspection target substrate and connected to the circuit network. An inspection data creation method for creating individual inspection data for the circuit network when inspecting by contacting a probe to an inspection point,
Based on a normal circuit net list when all the plurality of circuit elements are in a normal state, a normal inspection result is executed by executing a simulation for inspecting the circuit network in a normal state with a predetermined inspection content. Normal time simulation processing,
Based on a fault circuit net list when at least one circuit element of the plurality of circuit elements is in a fault state as an inspection target and all the remaining circuit elements are in a normal state, the circuit network in the fault state is On the other hand, a simulation process at the time of failure is performed to obtain a test result at the time of failure by executing a simulation to inspect with the inspection content.
And an inspection for executing an individual inspection data creation process in which the inspection contents when the normal inspection result and the failure inspection result are different are used as the individual inspection data when the inspection object is inspected. Data creation method. Individual for individually inspecting a plurality of electronic components mounted on an inspection target board by bringing a probe into contact with an inspection point provided on the surface of the inspection target board in a substrate inspection apparatus having one or more types of inspection functions An inspection data creation method for creating inspection data,
The storage unit is created based on design data about the board to be inspected, includes an inspection target part to be inspected from among the plurality of electronic parts, and is connected to two or more inspection points. A normal circuit net list for a normal network in which the electronic components are all normal, and a circuit network composed of at least two or more electronic components, and only the component to be inspected fails in any one failure state A fault circuit netlist for a fault network that is the network that has been made to be stored;
Using the normal circuit net list read from the storage unit when normal inspection results are obtained when the probe is brought into contact with the inspection point connected to the normal network and the inspection is performed by the one or more types of inspection functions. Normal-time simulation processing obtained by simulation for each of the one or more types of inspection functions,
The fault circuit network in which a test result at the time of failure when the probe is brought into contact with the inspection point connected to the fault circuit network and the fault circuit network is inspected by the one or more types of inspection functions is read from the storage unit. A simulation process at the time of failure obtained by simulating each one or more types of inspection functions using a list;
And comparing the normal inspection result for each of the one or more types of inspection functions with the normal inspection result when the inspection function is the same as the normal inspection result. When there are one or more types of inspection functions that are different from the time inspection result, the inspection content for inspecting the circuit network including the inspection target component by one of the inspection functions is indicated as the inspection target component. A test data creation method for executing individual test data creation processing as the individual test data for testing whether or not there is a failure in the one arbitrary fault condition for all the inspection target parts. At least one circuit element among a plurality of circuit elements electrically connected to each other constituting a circuit network formed on the inspection target substrate is disposed on the surface of the inspection target substrate and connected to the circuit network. A program for causing a computer to create individual inspection data for the circuit network when inspecting by contacting a probe to an inspection point,
Based on the normal circuit net list when all of the plurality of circuit elements are in a normal state, the computer executes a simulation for inspecting the circuit network in the normal state with inspection contents defined in advance. Normal simulation process to obtain the inspection result at the time,
Based on a fault circuit net list when at least one circuit element of the plurality of circuit elements is in a fault state as an inspection target and all the remaining circuit elements are in a normal state, the circuit network in the fault state is On the other hand, a simulation process at the time of failure is performed to obtain a test result at the time of failure by executing a simulation to inspect with the inspection content.
And a program for executing individual inspection data creation processing in which the inspection content when the normal inspection result is different from the failure inspection result is used as the individual inspection data when inspecting the inspection object . Individual for individually inspecting a plurality of electronic components mounted on an inspection target board by bringing a probe into contact with an inspection point provided on the surface of the inspection target board in a substrate inspection apparatus having one or more types of inspection functions A program for causing a computer to create inspection data,
The storage unit is created based on design data about the board to be inspected, includes an inspection target part to be inspected from among the plurality of electronic parts, and is connected to two or more inspection points. A normal circuit net list for a normal network in which the electronic components are all normal, and a circuit network composed of at least two or more electronic components, and only the component to be inspected fails in any one failure state A fault circuit netlist for a fault network that is the network that has been made to be stored;
The normal circuit net list obtained by reading out a normal inspection result from the storage unit when the probe is brought into contact with the inspection point connected to the normal circuit network and inspected by the one or more types of inspection functions. Normal simulation processing to be obtained by simulating each of the one or more types of inspection functions in use,
The fault circuit network in which a test result at the time of failure when the probe is brought into contact with the inspection point connected to the fault circuit network and the fault circuit network is inspected by the one or more types of inspection functions is read from the storage unit. A simulation process at the time of failure obtained by simulating each one or more types of inspection functions using a list;
And comparing the normal inspection result for each of the one or more types of inspection functions with the normal inspection result when the inspection function is the same as the normal inspection result. When there are one or more types of inspection functions that are different from the time inspection result, the inspection content for inspecting the circuit network including the inspection target component by one of the inspection functions is indicated as the inspection target component. A program for executing the individual inspection data creation processing as the individual inspection data for inspecting whether or not there is a failure in the one arbitrary failure state for all the inspection target parts.

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