JP6016108B2 - 基板の剥離装置及び剥離方法並びに電子デバイスの製造方法 - Google Patents

基板の剥離装置及び剥離方法並びに電子デバイスの製造方法 Download PDF

Info

Publication number
JP6016108B2
JP6016108B2 JP2012275538A JP2012275538A JP6016108B2 JP 6016108 B2 JP6016108 B2 JP 6016108B2 JP 2012275538 A JP2012275538 A JP 2012275538A JP 2012275538 A JP2012275538 A JP 2012275538A JP 6016108 B2 JP6016108 B2 JP 6016108B2
Authority
JP
Japan
Prior art keywords
peeling
substrate
plate
main surface
flexible plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012275538A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014118276A (ja
Inventor
泰則 伊藤
泰則 伊藤
洋 宇津木
洋 宇津木
圭 滝内
圭 滝内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP2012275538A priority Critical patent/JP6016108B2/ja
Priority to KR1020130156873A priority patent/KR102054699B1/ko
Priority to CN201310698272.9A priority patent/CN103871945B/zh
Priority to TW102147011A priority patent/TWI601682B/zh
Publication of JP2014118276A publication Critical patent/JP2014118276A/ja
Application granted granted Critical
Publication of JP6016108B2 publication Critical patent/JP6016108B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/511—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
    • B65H2301/5112—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface
    • B65H2301/51122—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface peeling layer of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
    • B65H29/54—Article strippers, e.g. for stripping from advancing elements
    • B65H29/56—Article strippers, e.g. for stripping from advancing elements for stripping from elements or machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2012275538A 2012-12-18 2012-12-18 基板の剥離装置及び剥離方法並びに電子デバイスの製造方法 Active JP6016108B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012275538A JP6016108B2 (ja) 2012-12-18 2012-12-18 基板の剥離装置及び剥離方法並びに電子デバイスの製造方法
KR1020130156873A KR102054699B1 (ko) 2012-12-18 2013-12-17 기판의 박리 장치 및 박리 방법, 및 전자 디바이스의 제조 방법
CN201310698272.9A CN103871945B (zh) 2012-12-18 2013-12-18 基板的剥离装置和剥离方法以及电子器件的制造方法
TW102147011A TWI601682B (zh) 2012-12-18 2013-12-18 Substrate stripping apparatus and stripping method, and electronic device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012275538A JP6016108B2 (ja) 2012-12-18 2012-12-18 基板の剥離装置及び剥離方法並びに電子デバイスの製造方法

Publications (2)

Publication Number Publication Date
JP2014118276A JP2014118276A (ja) 2014-06-30
JP6016108B2 true JP6016108B2 (ja) 2016-10-26

Family

ID=50910350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012275538A Active JP6016108B2 (ja) 2012-12-18 2012-12-18 基板の剥離装置及び剥離方法並びに電子デバイスの製造方法

Country Status (4)

Country Link
JP (1) JP6016108B2 (zh)
KR (1) KR102054699B1 (zh)
CN (1) CN103871945B (zh)
TW (1) TWI601682B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102165162B1 (ko) * 2014-03-12 2020-10-14 삼성디스플레이 주식회사 기판 박리 장치 및 이를 이용한 소자 제조 방법
JP6547403B2 (ja) * 2014-06-05 2019-07-24 Ａｇｃ株式会社 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
JP6873986B2 (ja) 2015-10-30 2021-05-19 コーニング インコーポレイテッド 第２基板に接合された第１基板を加工する方法
KR102073743B1 (ko) * 2017-12-19 2020-02-05 성진세미텍주식회사 필름 분리장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6418999B1 (en) * 1997-12-26 2002-07-16 Cannon Kabushiki Kaisha Sample separating apparatus and method, and substrate manufacturing method
JP2000084844A (ja) * 1998-09-17 2000-03-28 Asahi Glass Co Ltd 板状体の剥離方法及びその装置
FR2823373B1 (fr) * 2001-04-10 2005-02-04 Soitec Silicon On Insulator Dispositif de coupe de couche d'un substrat, et procede associe
CN101333079B (zh) * 2008-08-06 2012-10-31 友达光电股份有限公司 贴膜撕离装置及方法
CN102202994B (zh) * 2009-08-31 2014-03-12 旭硝子株式会社 剥离装置

Also Published As

Publication number Publication date
KR20140079310A (ko) 2014-06-26
TW201429854A (zh) 2014-08-01
CN103871945B (zh) 2017-04-12
JP2014118276A (ja) 2014-06-30
TWI601682B (zh) 2017-10-11
KR102054699B1 (ko) 2019-12-11
CN103871945A (zh) 2014-06-18

Similar Documents

Publication Publication Date Title
JP6003675B2 (ja) 基板の剥離装置及び剥離方法並びに電子デバイスの製造方法
JP6558646B2 (ja) 基板の吸着装置及び基板の貼合装置及び貼合方法並びに電子デバイスの製造方法
KR102535656B1 (ko) 적층체의 박리 장치 및 박리 방법, 및 전자 디바이스의 제조 방법
JP2013055307A (ja) 剥離装置、及び電子デバイスの製造方法
JP6354945B2 (ja) 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
JP6252118B2 (ja) 基板の剥離装置及び剥離方法並びに電子デバイスの製造方法
JP6016108B2 (ja) 基板の剥離装置及び剥離方法並びに電子デバイスの製造方法
JP2016147758A (ja) 積層体の剥離装置、及び剥離方法並びに電子デバイスの製造方法
KR102406292B1 (ko) 적층체의 박리 장치 및 박리 방법, 및 전자 디바이스의 제조 방법
TWI659847B (zh) 積層體之剝離裝置及剝離方法以及電子元件之製造方法
JP6471606B2 (ja) 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
JP6468462B2 (ja) 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
JP6269954B2 (ja) 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150818

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160609

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160613

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160720

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160902

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160915

R150 Certificate of patent or registration of utility model

Ref document number: 6016108

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250