JP6014408B2 - プラズマ処理装置及びプラズマ処理方法 - Google Patents

プラズマ処理装置及びプラズマ処理方法 Download PDF

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JP6014408B2
JP6014408B2 JP2012174525A JP2012174525A JP6014408B2 JP 6014408 B2 JP6014408 B2 JP 6014408B2 JP 2012174525 A JP2012174525 A JP 2012174525A JP 2012174525 A JP2012174525 A JP 2012174525A JP 6014408 B2 JP6014408 B2 JP 6014408B2
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dielectric
film
plasma
dielectric ring
metal film
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JP2014036026A5 (enExample
JP2014036026A (ja
Inventor
藤田　大介
大介 藤田
泰清 森岡
泰清 森岡
貴雅 一野
貴雅 一野
淳 須山
淳 須山
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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JP2012174525A 2012-08-07 2012-08-07 プラズマ処理装置及びプラズマ処理方法 Active JP6014408B2 (ja)

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JP2012174525A JP6014408B2 (ja) 2012-08-07 2012-08-07 プラズマ処理装置及びプラズマ処理方法

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JP2012174525A JP6014408B2 (ja) 2012-08-07 2012-08-07 プラズマ処理装置及びプラズマ処理方法

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JP2014036026A JP2014036026A (ja) 2014-02-24
JP2014036026A5 JP2014036026A5 (enExample) 2015-10-08
JP6014408B2 true JP6014408B2 (ja) 2016-10-25

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9805951B1 (en) * 2016-04-15 2017-10-31 Taiwan Semiconductor Manufacturing Co., Ltd. Method of integration process for metal CMP
WO2019180889A1 (ja) 2018-03-22 2019-09-26 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法、及び静電シールド
WO2021124470A1 (ja) * 2019-12-18 2021-06-24 株式会社日立ハイテク プラズマ処理装置
JP7700637B2 (ja) * 2021-10-29 2025-07-01 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5304248A (en) * 1990-12-05 1994-04-19 Applied Materials, Inc. Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions
JP2003152063A (ja) * 2001-11-09 2003-05-23 Applied Materials Inc 静電チャック及び半導体製造装置
JP5492578B2 (ja) * 2003-04-24 2014-05-14 東京エレクトロン株式会社 プラズマ処理装置
JP4992389B2 (ja) * 2006-11-06 2012-08-08 東京エレクトロン株式会社 載置装置、プラズマ処理装置及びプラズマ処理方法
JP4659771B2 (ja) * 2007-02-13 2011-03-30 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP5227264B2 (ja) * 2009-06-02 2013-07-03 東京エレクトロン株式会社 プラズマ処理装置，プラズマ処理方法，プログラム

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