JP6005537B2 - 半導体パッケージ用ステム及び半導体パッケージ - Google Patents

半導体パッケージ用ステム及び半導体パッケージ Download PDF

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JP6005537B2
JP6005537B2 JP2013013750A JP2013013750A JP6005537B2 JP 6005537 B2 JP6005537 B2 JP 6005537B2 JP 2013013750 A JP2013013750 A JP 2013013750A JP 2013013750 A JP2013013750 A JP 2013013750A JP 6005537 B2 JP6005537 B2 JP 6005537B2
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light emitting
disk
emitting element
semiconductor package
shaped
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JP2014146668A (ja
JP2014146668A5 (enExample
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勝哉 中澤
勝哉 中澤
岩彦 湯本
岩彦 湯本
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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JP2013013750A 2013-01-28 2013-01-28 半導体パッケージ用ステム及び半導体パッケージ Active JP6005537B2 (ja)

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JP2014146668A5 JP2014146668A5 (enExample) 2016-02-04
JP6005537B2 true JP6005537B2 (ja) 2016-10-12

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108141009B (zh) 2015-10-20 2020-10-13 松下半导体解决方案株式会社 光源装置、投光装置
JP7059675B2 (ja) * 2018-02-15 2022-04-26 ウシオ電機株式会社 半導体発光装置およびその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57177579A (en) * 1981-04-24 1982-11-01 Nec Corp Photosemiconductor device
JPS6068687A (ja) * 1983-09-26 1985-04-19 Toshiba Corp 半導体レ−ザ用パツケ−ジの製造方法
JPH01137688A (ja) * 1987-11-25 1989-05-30 Sony Corp レーザモジュールとその製造方法
JPH06314857A (ja) * 1993-03-04 1994-11-08 Mitsubishi Electric Corp 半導体発光装置
JP2008028273A (ja) * 2006-07-25 2008-02-07 Sanyo Electric Co Ltd 半導体レーザ装置
JP4702315B2 (ja) * 2007-03-29 2011-06-15 ヤマハ株式会社 半導体レーザモジュール
JP5587618B2 (ja) * 2010-01-25 2014-09-10 アルプス電気株式会社 発光装置

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