JP5989388B2 - パッケージ及びパッケージの製造方法 - Google Patents

パッケージ及びパッケージの製造方法 Download PDF

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Publication number
JP5989388B2
JP5989388B2 JP2012095488A JP2012095488A JP5989388B2 JP 5989388 B2 JP5989388 B2 JP 5989388B2 JP 2012095488 A JP2012095488 A JP 2012095488A JP 2012095488 A JP2012095488 A JP 2012095488A JP 5989388 B2 JP5989388 B2 JP 5989388B2
Authority
JP
Japan
Prior art keywords
electrode
package
housing
light emitting
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012095488A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013222931A5 (enExample
JP2013222931A (ja
Inventor
敏幸 岡部
敏幸 岡部
小林　剛
剛 小林
小林　敏男
敏男 小林
木村　康之
康之 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012095488A priority Critical patent/JP5989388B2/ja
Priority to EP13163043.6A priority patent/EP2654093B1/en
Priority to CN201310131498.0A priority patent/CN103378268B/zh
Priority to US13/864,402 priority patent/US8890295B2/en
Publication of JP2013222931A publication Critical patent/JP2013222931A/ja
Publication of JP2013222931A5 publication Critical patent/JP2013222931A5/ja
Application granted granted Critical
Publication of JP5989388B2 publication Critical patent/JP5989388B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0365—Manufacture or treatment of packages of means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection

Landscapes

  • Led Device Packages (AREA)
JP2012095488A 2012-04-19 2012-04-19 パッケージ及びパッケージの製造方法 Expired - Fee Related JP5989388B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012095488A JP5989388B2 (ja) 2012-04-19 2012-04-19 パッケージ及びパッケージの製造方法
EP13163043.6A EP2654093B1 (en) 2012-04-19 2013-04-10 Package and method for manufacturing package
CN201310131498.0A CN103378268B (zh) 2012-04-19 2013-04-16 封装件和封装件的制造方法
US13/864,402 US8890295B2 (en) 2012-04-19 2013-04-17 Package for mounting a light emitting element including a flat plate-shaped electrode and method for manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012095488A JP5989388B2 (ja) 2012-04-19 2012-04-19 パッケージ及びパッケージの製造方法

Publications (3)

Publication Number Publication Date
JP2013222931A JP2013222931A (ja) 2013-10-28
JP2013222931A5 JP2013222931A5 (enExample) 2015-04-02
JP5989388B2 true JP5989388B2 (ja) 2016-09-07

Family

ID=48326072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012095488A Expired - Fee Related JP5989388B2 (ja) 2012-04-19 2012-04-19 パッケージ及びパッケージの製造方法

Country Status (4)

Country Link
US (1) US8890295B2 (enExample)
EP (1) EP2654093B1 (enExample)
JP (1) JP5989388B2 (enExample)
CN (1) CN103378268B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10170674B2 (en) * 2013-06-28 2019-01-01 Citizen Watch Co., Ltd. LED device
JP6002858B2 (ja) * 2013-12-03 2016-10-05 日本カーバイド工業株式会社 発光素子搭載用基板、及び、それを用いた発光装置
USD778848S1 (en) * 2015-04-07 2017-02-14 Cree, Inc. Solid state light emitter component
JP6168096B2 (ja) 2015-04-28 2017-07-26 日亜化学工業株式会社 発光装置、パッケージ及びそれらの製造方法
JP6628031B2 (ja) * 2015-11-04 2020-01-08 ローム株式会社 電子部品
DE102016106270A1 (de) * 2016-04-06 2017-10-12 Osram Opto Semiconductors Gmbh Herstellung eines halbleiterbauelements
JP1566953S (enExample) * 2016-04-28 2017-01-16
TWI647867B (zh) * 2016-08-31 2019-01-11 大陸商開發晶照明（廈門）有限公司 Led金屬基板和led模組
US10378736B2 (en) * 2016-11-03 2019-08-13 Foshan Nationstar Optoelectronics Co., Ltd. LED bracket, LED bracket array, LED device and LED display screen
CN108269899B (zh) * 2016-12-30 2020-06-05 光宝光电(常州)有限公司 发光二极管封装结构及其制造方法
WO2019059703A2 (ko) * 2017-09-22 2019-03-28 엘지이노텍 주식회사 발광소자 패키지 및 조명 모듈
JP6809442B2 (ja) * 2017-11-27 2021-01-06 Tdk株式会社 センサシステム、センサモジュールおよびセンサシステムの実装方法
JP7231809B2 (ja) * 2018-06-05 2023-03-02 日亜化学工業株式会社 発光装置
USD865688S1 (en) * 2018-07-03 2019-11-05 Lumens Co., Ltd. LED package
WO2024235649A1 (en) * 2023-05-17 2024-11-21 Ams-Osram International Gmbh Optoelectronic semiconductor device and method for producing an optoelectronic semiconductor device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4066608B2 (ja) 2001-03-16 2008-03-26 日亜化学工業株式会社 パッケージ成形体及びその製造方法
JP3912607B2 (ja) * 2002-06-19 2007-05-09 サンケン電気株式会社 半導体発光装置の製法
JP2005197329A (ja) 2004-01-05 2005-07-21 Stanley Electric Co Ltd 表面実装型半導体装置及びそのリードフレーム構造
US20050199899A1 (en) * 2004-03-11 2005-09-15 Ming-Der Lin Package array and package unit of flip chip LED
WO2006016398A1 (ja) * 2004-08-10 2006-02-16 Renesas Technology Corp. 発光装置および発光装置の製造方法
JP2006222271A (ja) * 2005-02-10 2006-08-24 Ngk Spark Plug Co Ltd 発光素子実装用基板
KR100735310B1 (ko) * 2006-04-21 2007-07-04 삼성전기주식회사 다층 반사 면 구조를 갖는 엘이디 패키지 및 그 제조방법
TWI314366B (en) * 2006-04-28 2009-09-01 Delta Electronics Inc Light emitting apparatus
US7485480B2 (en) * 2006-09-21 2009-02-03 Harvatek Corporation Method of manufacturing high power light-emitting device package and structure thereof
US20080089072A1 (en) * 2006-10-11 2008-04-17 Alti-Electronics Co., Ltd. High Power Light Emitting Diode Package
US8058667B2 (en) * 2009-03-10 2011-11-15 Nepes Led Corporation Leadframe package for light emitting diode device
JPWO2010119830A1 (ja) * 2009-04-13 2012-10-22 パナソニック株式会社 発光ダイオード
DE102010025319B4 (de) * 2010-06-28 2022-05-25 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines oberflächenmontierbaren Halbleiterbauelements und oberflächenmontierbare Halbleiterbauelemente
US8253330B2 (en) * 2010-11-30 2012-08-28 GEM Weltronics TWN Corporation Airtight multi-layer array type LED

Also Published As

Publication number Publication date
CN103378268A (zh) 2013-10-30
CN103378268B (zh) 2017-10-03
EP2654093B1 (en) 2018-11-28
EP2654093A2 (en) 2013-10-23
JP2013222931A (ja) 2013-10-28
US20130277701A1 (en) 2013-10-24
EP2654093A3 (en) 2015-11-18
US8890295B2 (en) 2014-11-18

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