JP5958796B2 - Icタグ - Google Patents
Icタグ Download PDFInfo
- Publication number
- JP5958796B2 JP5958796B2 JP2012038941A JP2012038941A JP5958796B2 JP 5958796 B2 JP5958796 B2 JP 5958796B2 JP 2012038941 A JP2012038941 A JP 2012038941A JP 2012038941 A JP2012038941 A JP 2012038941A JP 5958796 B2 JP5958796 B2 JP 5958796B2
- Authority
- JP
- Japan
- Prior art keywords
- tag
- base
- inlet
- substrate
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000002093 peripheral effect Effects 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 13
- 239000011358 absorbing material Substances 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 description 7
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 235000013372 meat Nutrition 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000011359 shock absorbing material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Landscapes
- Credit Cards Or The Like (AREA)
Description
2 包装体
3 フック
5 連結ひも
10 ICタグ
11 カード基体
12 一方の基体
13 他方の基体
14a、14a 開孔
14b、14b 開孔
15 融着部
17 薄肉部
18 凹部
18a 周縁突起
18b 溝
19 厚肉部
20 インレット
21 インレット基材
22 ICチップ
23 アンテナ
24 カバー層
Claims (5)
- ICタグにおいて、
カード基体と、
カード基体に内蔵され、インレット基材と、インレット基材上に設けられたICチップおよびアンテナとを有するインレットとを備え、
カード基体は長方形状を有し、その四隅にR形状が形成され、
カード基体の各辺の周縁部に、連結ひもが挿通される一対の開孔が設けられ、各辺の周縁部には複数の薄肉部が設けられ、前記開孔および前記薄肉部は各辺の周縁部の中央部を中心として両側に対称に形成されていることを特徴とするICタグ。 - カード基体は一方の基体と、一方の基体に嵌合される他方の基体とを有し、一方の基体と他方の基体との間にインレットが挟持されていることを特徴とする請求項1記載のICタグ。
- 一方の基体に凹部が形成され、当該凹部内にインレットが装着され、かつ凹部内のインレット上に他方の基体が嵌込まれることを特徴とする請求項2記載のICタグ。
- 他方の基体は、その周縁に超音波シールを施すことにより一方の基体に融着されていることを特徴とする請求項3記載のICタグ。
- カード基体内のインレット上に、衝撃吸収材が設けられていることを特徴とする請求項1乃至4のいずれか記載のICタグ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012038941A JP5958796B2 (ja) | 2012-02-24 | 2012-02-24 | Icタグ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012038941A JP5958796B2 (ja) | 2012-02-24 | 2012-02-24 | Icタグ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013175037A JP2013175037A (ja) | 2013-09-05 |
JP5958796B2 true JP5958796B2 (ja) | 2016-08-02 |
Family
ID=49267884
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012038941A Expired - Fee Related JP5958796B2 (ja) | 2012-02-24 | 2012-02-24 | Icタグ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5958796B2 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11250209A (ja) * | 1998-03-04 | 1999-09-17 | Dainippon Printing Co Ltd | 非接触型icカード |
US20050108912A1 (en) * | 2003-11-25 | 2005-05-26 | Alexander Bekker | Identification tag and related identification tag system |
JP4699709B2 (ja) * | 2004-04-28 | 2011-06-15 | アートウエルド株式会社 | Icタグの製造方法 |
JP2007099484A (ja) * | 2005-10-07 | 2007-04-19 | Dainippon Printing Co Ltd | 商品管理用タグ |
US7777628B2 (en) * | 2007-09-14 | 2010-08-17 | Tilson Jr Thomas M | Radio frequency identification system and method for use in cast concrete components |
ES2632106T3 (es) * | 2010-02-11 | 2017-09-08 | Soundcraft, Inc. | Etiqueta de identificación de frecuencia de radio reforzada |
JP2011257986A (ja) * | 2010-06-09 | 2011-12-22 | Toppan Forms Co Ltd | 非接触型データ受送信体 |
-
2012
- 2012-02-24 JP JP2012038941A patent/JP5958796B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2013175037A (ja) | 2013-09-05 |
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