JP5951206B2 - ダイシング・ダイボンディングシート - Google Patents

ダイシング・ダイボンディングシート Download PDF

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Publication number
JP5951206B2
JP5951206B2 JP2011201166A JP2011201166A JP5951206B2 JP 5951206 B2 JP5951206 B2 JP 5951206B2 JP 2011201166 A JP2011201166 A JP 2011201166A JP 2011201166 A JP2011201166 A JP 2011201166A JP 5951206 B2 JP5951206 B2 JP 5951206B2
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JP
Japan
Prior art keywords
mass
adhesive layer
parts
acrylic polymer
bonding sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011201166A
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English (en)
Japanese (ja)
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JP2013062445A5 (https=
JP2013062445A (ja
Inventor
裕介 根津
裕介 根津
泰紀 柄澤
泰紀 柄澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2011201166A priority Critical patent/JP5951206B2/ja
Publication of JP2013062445A publication Critical patent/JP2013062445A/ja
Publication of JP2013062445A5 publication Critical patent/JP2013062445A5/ja
Application granted granted Critical
Publication of JP5951206B2 publication Critical patent/JP5951206B2/ja
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Die Bonding (AREA)
  • Dicing (AREA)
JP2011201166A 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート Active JP5951206B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011201166A JP5951206B2 (ja) 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011201166A JP5951206B2 (ja) 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート

Publications (3)

Publication Number Publication Date
JP2013062445A JP2013062445A (ja) 2013-04-04
JP2013062445A5 JP2013062445A5 (https=) 2014-10-23
JP5951206B2 true JP5951206B2 (ja) 2016-07-13

Family

ID=48186842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011201166A Active JP5951206B2 (ja) 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート

Country Status (1)

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JP (1) JP5951206B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7831967B2 (ja) * 2021-08-25 2026-03-17 リンテック株式会社 保護膜形成フィルム、保護膜形成用複合シート、保護膜付きワークの製造方法、及び、保護膜付きワーク加工物の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4841802B2 (ja) * 2003-05-02 2011-12-21 リンテック株式会社 粘着シートおよびその使用方法
JP4274867B2 (ja) * 2003-08-06 2009-06-10 リンテック株式会社 Ｉｃタグ
JP4776188B2 (ja) * 2004-08-03 2011-09-21 古河電気工業株式会社 半導体装置製造方法およびウエハ加工用テープ
JP4780653B2 (ja) * 2005-02-21 2011-09-28 日東電工株式会社 半導体装置の製造方法
US7768141B2 (en) * 2006-02-14 2010-08-03 Lg Innotek Co., Ltd. Dicing die attachment film and method for packaging semiconductor using same
JP4732472B2 (ja) * 2007-03-01 2011-07-27 日東電工株式会社 熱硬化型ダイボンドフィルム
JP2010189484A (ja) * 2009-02-16 2010-09-02 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法
JP2010219293A (ja) * 2009-03-17 2010-09-30 Furukawa Electric Co Ltd:The ウエハ加工用テープ

Also Published As

Publication number Publication date
JP2013062445A (ja) 2013-04-04

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