JP2013062445A5 - - Google Patents

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Publication number
JP2013062445A5
JP2013062445A5 JP2011201166A JP2011201166A JP2013062445A5 JP 2013062445 A5 JP2013062445 A5 JP 2013062445A5 JP 2011201166 A JP2011201166 A JP 2011201166A JP 2011201166 A JP2011201166 A JP 2011201166A JP 2013062445 A5 JP2013062445 A5 JP 2013062445A5
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JP
Japan
Prior art keywords
adhesive layer
stress
relaxation rate
stress relaxation
elastic modulus
Prior art date
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Application number
JP2011201166A
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English (en)
Japanese (ja)
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JP5951206B2 (ja
JP2013062445A (ja
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Priority to JP2011201166A priority Critical patent/JP5951206B2/ja
Priority claimed from JP2011201166A external-priority patent/JP5951206B2/ja
Publication of JP2013062445A publication Critical patent/JP2013062445A/ja
Publication of JP2013062445A5 publication Critical patent/JP2013062445A5/ja
Application granted granted Critical
Publication of JP5951206B2 publication Critical patent/JP5951206B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011201166A 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート Active JP5951206B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011201166A JP5951206B2 (ja) 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011201166A JP5951206B2 (ja) 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート

Publications (3)

Publication Number Publication Date
JP2013062445A JP2013062445A (ja) 2013-04-04
JP2013062445A5 true JP2013062445A5 (https=) 2014-10-23
JP5951206B2 JP5951206B2 (ja) 2016-07-13

Family

ID=48186842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011201166A Active JP5951206B2 (ja) 2011-09-14 2011-09-14 ダイシング・ダイボンディングシート

Country Status (1)

Country Link
JP (1) JP5951206B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7831967B2 (ja) * 2021-08-25 2026-03-17 リンテック株式会社 保護膜形成フィルム、保護膜形成用複合シート、保護膜付きワークの製造方法、及び、保護膜付きワーク加工物の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4841802B2 (ja) * 2003-05-02 2011-12-21 リンテック株式会社 粘着シートおよびその使用方法
JP4274867B2 (ja) * 2003-08-06 2009-06-10 リンテック株式会社 Ｉｃタグ
JP4776188B2 (ja) * 2004-08-03 2011-09-21 古河電気工業株式会社 半導体装置製造方法およびウエハ加工用テープ
JP4780653B2 (ja) * 2005-02-21 2011-09-28 日東電工株式会社 半導体装置の製造方法
US7768141B2 (en) * 2006-02-14 2010-08-03 Lg Innotek Co., Ltd. Dicing die attachment film and method for packaging semiconductor using same
JP4732472B2 (ja) * 2007-03-01 2011-07-27 日東電工株式会社 熱硬化型ダイボンドフィルム
JP2010189484A (ja) * 2009-02-16 2010-09-02 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法
JP2010219293A (ja) * 2009-03-17 2010-09-30 Furukawa Electric Co Ltd:The ウエハ加工用テープ

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