JP5939838B2

JP5939838B2 - Lighting device

Info

Publication number: JP5939838B2
Application number: JP2012045544A
Authority: JP
Inventors: 昌幸神野
Original assignee: Mitsubishi Electric Corp; Mitsubishi Electric Lighting Corp
Current assignee: Mitsubishi Electric Corp; Mitsubishi Electric Lighting Corp
Priority date: 2012-03-01
Filing date: 2012-03-01
Publication date: 2016-06-22
Anticipated expiration: 2032-03-01
Also published as: JP2013182777A

Description

この発明は半導体発光素子を用いた照明装置に関する。 The present invention relates to an illumination device using a semiconductor light emitting element.

従来の高天井用ＬＥＤ照明器具等では、ＬＥＤモジュールを内蔵する本体の背面外郭に、放熱フィンが設けられている（例えば特許文献１の図３の放熱部１５ｃ）。しかし、放熱フィンと放熱フィンとの間に埃が堆積しやすいという課題があった。 In conventional high ceiling LED lighting fixtures or the like, heat radiating fins are provided on the outer surface of the back of the main body incorporating the LED module (for example, the heat radiating portion 15c in FIG. 3 of Patent Document 1). However, there is a problem that dust easily accumulates between the heat radiating fins.

特開２０１０−７３６５４号公報JP 2010-73654 A

本発明は、高天井用などに使用され、背面外郭に複数の放熱フィンが設けられたＬＥＤ照明装置において、放熱フィンの間の埃の堆積を低減する照明装置の提供を目的とする。 An object of the present invention is to provide an illuminating device that reduces dust accumulation between radiating fins in an LED illuminating device that is used for a high ceiling or the like and is provided with a plurality of radiating fins on the outer surface of the back surface.

この発明の照明装置は、
光源として複数の半導体発光素子を用いる照明装置において、
前記複数の半導体発光素子が実装される実装面と前記実装面の反対側の面である裏面とを有する基板と、
前記基板が取り付けられる装置本体であって、前記基板の裏面と対向して前記基板が取り付けられる基板取付部と、前記基板取付部に取り付けられた前記基板の実装面から前記裏面に向かう方向である延伸方向に延び、前記基板から熱を吸熱して伝熱する複数の放熱部とを有する装置本体と、
前記複数の放熱部を前記延伸方向と反対方向から見下ろした場合に前記複数の放熱部を覆うように前記装置本体に配置されると共に、外形が前記延伸方向に凸となる凸形状の本体カバー部と
を備えたことを特徴とする。 The lighting device of the present invention is
In an illumination device using a plurality of semiconductor light emitting elements as a light source,
A substrate having a mounting surface on which the plurality of semiconductor light emitting elements are mounted and a back surface opposite to the mounting surface;
An apparatus main body to which the substrate is attached, a substrate attachment portion to which the substrate is attached facing the back surface of the substrate, and a direction from the mounting surface of the substrate attached to the substrate attachment portion toward the back surface An apparatus body having a plurality of heat radiating portions extending in the stretching direction and absorbing heat from the substrate to transfer heat;
A convex body cover portion that is disposed in the apparatus main body so as to cover the plurality of heat dissipation portions when the plurality of heat dissipation portions are looked down from the direction opposite to the extending direction, and whose outer shape is convex in the extending direction. It is characterized by comprising.

本発明により、高天井用などに使用され、背面外郭に複数の放熱フィンが設けられたＬＥＤ照明装置において、放熱フィンの間の埃堆積を低減することができる。 According to the present invention, dust accumulation between heat radiation fins can be reduced in an LED lighting device that is used for a high ceiling or the like and has a plurality of heat radiation fins provided on the outer surface of the back surface.

実施の形態１のＬＥＤ照明装置１００の斜視図。1 is a perspective view of an LED lighting device 100 according to Embodiment 1. FIG. 実施の形態１のＬＥＤ照明装置１００の分解斜視図。1 is an exploded perspective view of an LED lighting device 100 according to Embodiment 1. FIG. 実施の形態１のＬＥＤ照明装置１００の上面図等及び断面図。FIG. 2 is a top view and a cross-sectional view of the LED lighting device 100 according to the first embodiment. 実施の形態１の本体１４０の上面図等及び断面図。2 is a top view and a cross-sectional view of a main body 140 according to Embodiment 1. FIG. 実施の形態１のＬＥＤ照明装置１００の天面カバー１３０と本体１４０との組み付けを示す斜視図。FIG. 3 is a perspective view showing assembly of the top cover 130 and the main body 140 of the LED lighting apparatus 100 according to the first embodiment. 実施の形態２のＬＥＤ照明装置２０１Ａの斜視図。The perspective view of LED lighting apparatus 201A of Embodiment 2. FIG. 図６のＡ矢視及びＡ’矢視を示す図。The figure which shows A arrow view and A 'arrow view of FIG. 実施の形態２のＬＥＤ照明装置２０１Ｂの斜視図。The perspective view of LED lighting apparatus 201B of Embodiment 2. FIG. 実施の形態２のＬＥＤ照明装置２０１Ｃの斜視図。The perspective view of LED lighting apparatus 201C of Embodiment 2. FIG. 実施の形態２の本体カバー部２０Ａ、２０Ｂ、２０Ｃの断面Ｆ−Ｆ、断面Ｇ−Ｇ、断面Ｈ−Ｈ。Sections FF, sections GG, and sections HH of main body cover portions 20A, 20B, and 20C of the second embodiment. 実施の形態２の本体カバー部が外側放熱フィン２４を持つ構成を示す斜視図。FIG. 6 is a perspective view showing a configuration in which a main body cover portion of Embodiment 2 has outer heat radiating fins 24. 実施の形態２の本体カバー部が外側放熱フィン２４を持つ構成を示す上面図。FIG. 6 is a top view showing a configuration in which a main body cover portion according to a second embodiment has outer heat radiation fins 24. 実施の形態２の本体カバー部２０Ｄの形状を説明する図。The figure explaining the shape of main body cover part 20D of Embodiment 2. FIG. 図１３のＤ矢視を示す図。The figure which shows the D arrow view of FIG. 実施の形態２のＬＥＤ照明装置２０１Ｄの構成を示す図。FIG. 5 shows a configuration of an LED illumination device 201D according to a second embodiment. 図１５のＥ矢視の別のＬＥＤ配置を示す図。The figure which shows another LED arrangement | positioning of E arrow view of FIG. 図１３（ｃ）に対応する放熱部の別の構成を示す図。The figure which shows another structure of the thermal radiation part corresponding to FIG.13 (c). 図１７の断面Ｘ―Ｘ、Ｙ―Ｙ、Ｚ―Ｚを示す図。FIG. 18 is a diagram illustrating cross sections XX, YY, and ZZ in FIG. 17. 実施の形態２のＬＥＤ照明装置２００の斜視図。The perspective view of the LED lighting apparatus 200 of Embodiment 2. FIG. 実施の形態２のＬＥＤ照明装置２００の分解斜視図。FIG. 6 is an exploded perspective view of the LED lighting device 200 according to the second embodiment. 実施の形態２のＬＥＤ照明装置２００の上面図等及び断面図。The top view etc. and sectional drawing of the LED lighting apparatus 200 of Embodiment 2. FIG. 実施の形態２の本体２４０の上面図等及び断面図。The top view etc. and sectional drawing of the main body 240 of Embodiment 2. FIG. 実施の形態２の本体２４０の斜視図。FIG. 6 is a perspective view of a main body 240 according to the second embodiment.

実施の形態１．
図１〜図５を参照して、実施の形態１のＬＥＤ照明装置１００を説明する。ＬＥＤ照明装置１００の特徴は、後述の図５に示したように、本体１４０に天面カバー１３０を取り付けた点である。 Embodiment 1 FIG.
With reference to FIGS. 1-5, the LED lighting apparatus 100 of Embodiment 1 is demonstrated. The feature of the LED lighting device 100 is that a top cover 130 is attached to the main body 140 as shown in FIG.

図１は、ＬＥＤ照明装置１００の斜視図である。図１（ａ）は、ＬＥＤ照明装置１００の発光面側が見える斜視図であり、図１（ｂ）は、ＬＥＤ照明装置１００の上側が見える斜視図である。図２は、ＬＥＤ照明装置１００の構成を示す、分解斜視図である。図２に示すように、ＬＥＤ照明装置１００は、アーム部１１０、電源装置１２０、天面カバー１３０（本体カバー部）、本体１４０（装置本体）、ＬＥＤ基板１７０、反射板１８１、パッキン１８３、カバー１８４を備える。なお、パッキン１８３はなくてもよい。アーム部１１０は、上側アーム１１１、第１サイドアーム１１２Ａ、第２サイドアーム１１２Ｂが互いにボルト１１３、ナット１１４で結合される。また、ＬＥＤ基板１７０、反射板１８１は、ネジ１８２で本体１４０に取り付けられる。なお、ＬＥＤ基板１７０がネジ１８２で取り付けられる後述の円形ベース部１４３０のベース下面１４３１は、基板取付部である。 FIG. 1 is a perspective view of the LED lighting device 100. FIG. 1A is a perspective view showing the light emitting surface side of the LED lighting device 100, and FIG. 1B is a perspective view showing the upper side of the LED lighting device 100. FIG. FIG. 2 is an exploded perspective view showing the configuration of the LED lighting device 100. As shown in FIG. 2, the LED lighting device 100 includes an arm unit 110, a power supply device 120, a top cover 130 (main body cover unit), a main body 140 (device main body), an LED substrate 170, a reflector 181, a packing 183, and a cover. 184. The packing 183 may not be provided. In the arm portion 110, the upper arm 111, the first side arm 112 A, and the second side arm 112 B are coupled to each other by a bolt 113 and a nut 114. The LED substrate 170 and the reflection plate 181 are attached to the main body 140 with screws 182. Note that a base lower surface 1431 of a circular base portion 1430 (described later) to which the LED substrate 170 is attached with screws 182 is a substrate attachment portion.

（放熱経路）
図２を参照して放熱経路を説明する。ＬＥＤ基板１７０のＬＥＤ素子１７４の発熱に伴う熱は、例えば、ＬＥＤ基板１７０から本体１４０（円形ベース部１４３０）に伝導し、放熱フィン１４４１〜１４４３（図５等で後述）、及び天面カバー１３０から大気に放熱される。 (Heat dissipation path)
The heat dissipation path will be described with reference to FIG. The heat accompanying the heat generation of the LED element 174 of the LED board 170 is conducted, for example, from the LED board 170 to the main body 140 (circular base portion 1430), and radiating fins 1441-1443 (described later in FIG. 5 and the like), and the top cover 130. Heat is released to the atmosphere.

図３は、ＬＥＤ照明装置１００の上面図等及び断面図である。図３の（ａ）〜（ｈ）において、（ａ）は上面図、（ｂ）は正面図、（ｃ）は底面図、（ｄ）は左側面図、（ｅ）は右側面図である。（ｆ）は断面Ａ−Ａ、（ｇ）は断面Ｃ−Ｃ、（ｈ）は断面Ｄ−Ｄである。図４は、本体１４０の上面図等及び断面図である。（ａ）は上面図、（ｂ）は正面図、（ｃ）は底面図、（ｄ）は右側面図である。（ｅ）は断面Ｂ−Ｂ、（ｆ）は断面Ｃ−Ｃである。図５は、天面カバー１３０と本体１４０との組み付けを示す斜視図である。 FIG. 3 is a top view and a cross-sectional view of the LED lighting device 100. 3 (a) to (h), (a) is a top view, (b) is a front view, (c) is a bottom view, (d) is a left side view, and (e) is a right side view. . (F) is a section AA, (g) is a section CC, (h) is a section DD. FIG. 4 is a top view and a cross-sectional view of the main body 140. (A) is a top view, (b) is a front view, (c) is a bottom view, and (d) is a right side view. (E) is a section BB, and (f) is a section CC. FIG. 5 is a perspective view showing assembly of the top cover 130 and the main body 140.

図１〜図５を参照して、ＬＥＤ照明装置１００を具体的に説明する。ＬＥＤ照明装置１００は、図１（ａ）に示すように光源として複数のＬＥＤ（半導体発光素子）を用いる。複数のＬＥＤは、ＬＥＤ基板１７０（図２）に実装される。以降、ＬＥＤ基板１７０のうちＬＥＤが実装される面を実装面１７１といい、実装面１７１の反対側の面を基板裏面１７２という。図２に示すように、本体１４０には、ＬＥＤ基板１７０が取り付けられる。本体１４０は、ＬＥＤ基板１７０の基板裏面１７２と対向してＬＥＤ基板１７０が取り付けられる基板取付部となる後述の円形ベース部１４３０を有する。また本体１４０は、円形ベース部１４３０に取り付けられたＬＥＤ基板１７０の実装面１７１から基板裏面１７２に向かう方向である延伸方向１７３に延び、ＬＥＤ基板１７０から熱を吸熱して伝熱する複数の放熱フィン１４４１（放熱部、図５で後述）を有する。また、図５に示すように、第２中空円筒部１４２０の外側表面に、その外周に沿って複数の放熱フィン１４４２を有する。また第１中空円筒部１４１０の内側表面に、その内周に沿って、複数の放熱フィン１４４３を有する。このうち主要なフィンは、放熱フィン１４４１である。 The LED lighting device 100 will be specifically described with reference to FIGS. The LED illumination device 100 uses a plurality of LEDs (semiconductor light emitting elements) as light sources as shown in FIG. The plurality of LEDs are mounted on the LED substrate 170 (FIG. 2). Hereinafter, the surface on which the LED is mounted in the LED substrate 170 is referred to as a mounting surface 171, and the surface opposite to the mounting surface 171 is referred to as a substrate back surface 172. As shown in FIG. 2, the LED board 170 is attached to the main body 140. The main body 140 has a circular base portion 1430 (to be described later) serving as a substrate attachment portion to which the LED substrate 170 is attached so as to face the substrate back surface 172 of the LED substrate 170. The main body 140 extends in a stretching direction 173 that is a direction from the mounting surface 171 of the LED substrate 170 attached to the circular base portion 1430 toward the substrate back surface 172, and absorbs heat from the LED substrate 170 to transfer heat. Fins 1441 (heat dissipating part, which will be described later with reference to FIG. 5). Further, as shown in FIG. 5, a plurality of radiating fins 1442 are provided on the outer surface of the second hollow cylindrical portion 1420 along the outer periphery thereof. A plurality of heat radiation fins 1443 are provided on the inner surface of the first hollow cylindrical portion 1410 along the inner periphery thereof. Among these, the main fins are the radiation fins 1441.

（天面カバー１３０と本体１４０との組み付け）
図３（ａ）、（ｂ）、（ｄ）、（ｅ）、図５に示すように、放熱フィン１４４１に着目すると、天面カバー１３０は、複数の放熱フィン１４４１を延伸方向１７３と反対方向から見下ろした場合に複数の放熱フィン１４４１を覆うように本体１４０に配置される。また、天面カバー１３０は、外形が延伸方向１７３に凸となる凸形状（あるいは山形状）である。ここで凸形状の意味は、図３（ｂ）、（ｄ）、（ｅ）に示すように、天面カバー１３０が側面図あるいは正面図でみたときに、山形状（あるいは台形形状）に見えることを意味する。すなわち天面カバー１３０を山形状（あるいは台形形状）にして斜面を形成することで、放熱フィン１４４１の間への埃の堆積を防止すると共に、天面カバー１３０自身への埃堆積を低減する。 (Assembly of top cover 130 and main body 140)
As shown in FIGS. 3A, 3 B, 3 D, 5 E, and 5, when attention is paid to the radiation fin 1441, the top cover 130 has a plurality of radiation fins 1441 extending in a direction opposite to the extending direction 173. When it looks down, it arrange | positions at the main body 140 so that the several radiation fin 1441 may be covered. The top cover 130 has a convex shape (or a mountain shape) whose outer shape is convex in the extending direction 173. Here, as shown in FIGS. 3B, 3D, and 3E, the convex shape means a mountain shape (or trapezoidal shape) when the top cover 130 is viewed from a side view or a front view. Means that. That is, by forming the slope by making the top cover 130 into a mountain shape (or trapezoidal shape), dust accumulation between the radiation fins 1441 is prevented and dust accumulation on the top cover 130 itself is reduced.

さらに、天面カバー１３０と本体１４０との組み付けを詳しく説明する。図５に示すように、本体１４０は、円形ベース部１４３０、第１中空円筒部１４１０、第２中空円筒部１４２０、複数の放熱フィン１４４１を備える。円形ベース部１４３０は、略円盤形状であって、一方の面であるベース下面１４３１（基板取付部、図４（ｃ）、（ｆ））に、ＬＥＤ基板１７０が取り付けられる。第１中空円筒部１４１０は、円形ベース部１４３０のベース下面１４３１の反対側の面であるベース上面１４３２（図４（ｆ））に円形ベース部１４３０と略同心（図４（ａ））に配置され、円形ベース部１４３０のベース上面１４３２から延伸方向１７３に起立（図４（ｆ））する所定の内径を有する略円筒形状であり、かつ板状体である。第２中空円筒部１４２０は、円形ベース部１４３０のベース上面１４３２（図４（ｆ））に円形ベース部１４３０と略同心（図４（ａ））に配置され、円形ベース部１４３０のベース上面１４３２から延伸方向１７３に起立（図４（ｆ））すると共に、第１中空円筒部１４１０の内径よりも大きい内径と、円形ベース部１４３０の外径よりも小さい外径とを有する略円筒形状であり、かつ、板状体である。 Further, the assembly of the top cover 130 and the main body 140 will be described in detail. As shown in FIG. 5, the main body 140 includes a circular base portion 1430, a first hollow cylindrical portion 1410, a second hollow cylindrical portion 1420, and a plurality of radiating fins 1441. The circular base portion 1430 has a substantially disk shape, and the LED substrate 170 is attached to the base lower surface 1431 (substrate attachment portion, FIGS. 4C and 4F) which is one surface. The first hollow cylindrical portion 1410 is disposed substantially concentrically with the circular base portion 1430 (FIG. 4A) on the base upper surface 1432 (FIG. 4F) which is the surface opposite to the base lower surface 1431 of the circular base portion 1430. The circular base portion 1430 has a substantially cylindrical shape having a predetermined inner diameter that rises in the extending direction 173 from the base upper surface 1432 (FIG. 4F), and is a plate-like body. The second hollow cylindrical portion 1420 is disposed substantially concentrically with the circular base portion 1430 (FIG. 4A) on the base upper surface 1432 (FIG. 4F) of the circular base portion 1430, and the base upper surface 1432 of the circular base portion 1430. And a substantially cylindrical shape having an inner diameter larger than the inner diameter of the first hollow cylindrical portion 1410 and an outer diameter smaller than the outer diameter of the circular base portion 1430. And it is a plate-shaped body.

複数の放熱フィン１４４１（複数の放熱部）のそれぞれは、図５に示すように第１中空円筒部１４１０の外側と第２中空円筒部１４２０の内側との間において円形ベース部１４３０の半径方向に放射状に配置される。複数の放熱フィン１４４１のそれぞれは、板厚の面である一方の板厚側面１４４１−１が第１中空円筒部１４１０の外側表面１４１１に接続し、他方の板厚側面１４４１−２が第２中空円筒部１４２０の内側表面１４２１に接続する。そして、それぞれの放熱フィン１４４１は、図５、図３（ｇ）（ｆ）等に示すように、外側表面１４１１の付近及び内側表面１４２１の付近よりも、外側表面１４１１と内側表面１４２１との中間付近のほうが、延伸方向１７３（図５）の高かさが高い延伸方向に凸の凸形状１４４１−３（図３（ｇ）（ｆ））である。図５に示すように、第１中空円筒部１４１０は板厚側面１４４１−１と略同じ高さである。同様に、第２中空円筒部１４２０は、板厚側面１４４１−２と略同じ高さである。図３（ａ）に示すように、天面カバー１３０は、延伸方向１７３と反対方向から見下ろした場合に略円形状であり、外縁１３３が第２中空円筒部１４２０の外径に略一致する（図５）。また本体カバー部の凸形状は、複数の放熱フィン１４４１の凸形状１４４１−３に適合する形状である。図５で説明すれば、放熱フィン１４４１の凸形状１４４１−３の先端は、天面カバー１３０の裏面に当接する（図３（ｆ）、（ｇ））。この当接によって放熱フィン１４４１から天面カバー１３０に熱が伝導する。 Each of the plurality of radiating fins 1441 (the plurality of radiating portions) is arranged in the radial direction of the circular base portion 1430 between the outer side of the first hollow cylindrical portion 1410 and the inner side of the second hollow cylindrical portion 1420 as shown in FIG. Arranged radially. Each of the plurality of radiating fins 1441 has one plate thickness side surface 1441-1 that is a plate thickness surface connected to the outer surface 1411 of the first hollow cylindrical portion 1410, and the other plate thickness side surface 1441-2 is a second hollow surface. Connect to the inner surface 1421 of the cylindrical portion 1420. As shown in FIGS. 5, 3 (g), (f), etc., each radiating fin 1441 is intermediate between the outer surface 1411 and the inner surface 1421 rather than the vicinity of the outer surface 1411 and the vicinity of the inner surface 1421. In the vicinity, the convex shape 1441-3 (FIGS. 3G and 3F) is convex in the extending direction, where the height of the extending direction 173 (FIG. 5) is higher. As shown in FIG. 5, the first hollow cylindrical portion 1410 has substantially the same height as the plate thickness side surface 1441-1. Similarly, the second hollow cylindrical portion 1420 has substantially the same height as the plate thickness side surface 1441-2. As shown in FIG. 3A, the top cover 130 has a substantially circular shape when viewed from the opposite direction to the extending direction 173, and the outer edge 133 substantially matches the outer diameter of the second hollow cylindrical portion 1420 ( FIG. 5). The convex shape of the main body cover portion is a shape that matches the convex shape 1441-3 of the plurality of heat radiation fins 1441. If it demonstrates in FIG. 5, the front-end | tip of the convex shape 1441-3 of the radiation fin 1441 will contact | abut to the back surface of the top cover 130 (FIG.3 (f), (g)). Due to this contact, heat is conducted from the radiation fin 1441 to the top cover 130.

なお、ＬＥＤ照明装置１００では本体１４０には、図５に示すように本体側風穴１４５０（図４（ａ）（ｃ））が形成されておいる。したがって本体１４０は、中央部分に穴のあいたドーナツ形状である（図４（ａ），（ｃ），（ｅ），図５等）。天面カバー１３０にも、本体１４０に取り付けられた際に本体側風穴１４５０と連通するカバー側風穴１３２（図５）が形成されている。従って、本体側風穴１４５０、カバー側風穴１３２を通過する空気によって放熱性が向上する。 In the LED lighting device 100, a main body side air hole 1450 (FIGS. 4A and 4C) is formed in the main body 140 as shown in FIG. Therefore, the main body 140 has a donut shape with a hole in the center (FIGS. 4A, 4C, 4E, FIG. 5 and the like). The top cover 130 also has a cover-side air hole 132 (FIG. 5) that communicates with the main-body side air hole 1450 when attached to the main body 140. Therefore, heat dissipation is improved by the air passing through the main body side air hole 1450 and the cover side air hole 132.

（下降形状）
円形ベース部１４３０は、第２中空円筒部１４２０の外径よりも外側の外周領域１４３３（図４（ｆ）、図５）が、外側方向に向かうにしたがって、延伸方向１７３と反対の方向に下降する下降形状１４３４（図４（ｆ））である。つまり、第２中空円筒部１４２０の円形ベース部１４３０からの起立部の外側周囲を囲む外周領域１４３３は、延伸方向１７３と反対の方向に下降する斜面形状である。この斜面形状によって外周領域１４３３における埃の体積を低減することができる。 (Descent shape)
In the circular base portion 1430, the outer peripheral region 1433 (FIGS. 4F and 5) outside the outer diameter of the second hollow cylindrical portion 1420 descends in the direction opposite to the extending direction 173 as it goes outward. This is a descending shape 1434 (FIG. 4F). That is, the outer peripheral region 1433 surrounding the outer periphery of the upright portion from the circular base portion 1430 of the second hollow cylindrical portion 1420 has a slope shape that descends in the direction opposite to the extending direction 173. This slope shape can reduce the volume of dust in the outer peripheral region 1433.

以上に説明した実施の形態１のＬＥＤ照明装置１００は以下の効果を有する。
（１）天面カバー１３０で複数の放熱フィン１４４１を覆うので、複数の放熱フィン１４４１の間に埃が堆積することを低減できる。
（２）また、複数の放熱フィン１４４２が形成される外周領域１４３３を下降形状１４３４（斜面形状）としたので放熱フィン１４４２間に埃が堆積することを低減できる。
（３）また、複数の放熱フィン１４４１の先端と天面カバー１３０の内側とが当接するようにしたので、複数の放熱フィン１４４１の熱を天面カバー１３０からも放熱することができる。 The LED lighting device 100 of Embodiment 1 described above has the following effects.
(1) Since the plurality of heat radiation fins 1441 are covered with the top cover 130, it is possible to reduce the accumulation of dust between the plurality of heat radiation fins 1441.
(2) Further, since the outer peripheral region 1433 where the plurality of heat radiation fins 1442 are formed has a descending shape 1434 (slope shape), accumulation of dust between the heat radiation fins 1442 can be reduced.
(3) Since the tips of the plurality of heat radiation fins 1441 are in contact with the inside of the top cover 130, the heat of the plurality of heat radiation fins 1441 can be radiated from the top cover 130.

実施の形態２．
次に図６〜図２３を参照して実施の形態２を説明する。図６〜図１８では実施の形態２の概念を説明し、図１９〜図２３でその概念を用いた具体的なＬＥＤ照明装置２００を説明する。実施の形態２の特徴は、実施の形態１における天面カバー１３０と本体１４０とを一体成形（例えばアルミダイキャスト）し、放熱フィン１４１１のＬＥＤ基板１７０側の先端を、ＬＥＤ基板１７０の基板裏面１７２に当接（熱的に接続）した構成である。実施の形態２では実施の形態１の放熱フィン１４１１に相当する要素は棒状でもよいし、平板状や中空円筒状や中空円筒の一部分（上方からみて３６０度を中空円筒とした場合、３６０度未満）の形状でもよいので、放熱フィン１４１１に相当する要素を放熱部とも呼ぶ。 Embodiment 2. FIG.
Next, the second embodiment will be described with reference to FIGS. 6 to 18 explain the concept of the second embodiment, and FIGS. 19 to 23 explain a specific LED lighting device 200 using the concept. The feature of the second embodiment is that the top cover 130 and the main body 140 in the first embodiment are integrally formed (for example, aluminum die casting), and the front end of the radiation fin 1411 on the LED substrate 170 side is the back surface of the LED substrate 170. 172 is in contact with (thermally connected). In the second embodiment, the element corresponding to the heat radiation fin 1411 of the first embodiment may be a rod shape, a flat plate shape, a hollow cylinder shape, or a part of a hollow cylinder (when 360 ° is a hollow cylinder when viewed from above, it is less than 360 ° ), The element corresponding to the heat radiation fin 1411 is also referred to as a heat radiation portion.

（ＬＥＤ照明装置２０１Ａ）
図６は、実施の形態２のＬＥＤ照明装置２０１Ａの斜視図である。
（１）ＬＥＤ照明装置２０１Ａは、ＬＥＤ基板３０と、本体カバー部２０Ａとを備えている。本体カバー部２０Ａの一部が天面カバー１３０に相当する一体成形カバー２９である。
（２）ＬＥＤ基板３０は、複数のＬＥＤ素子３１が実装されるＬＥＤ実装面３３とＬＥＤ実装面３３の反対側の面である基板裏面３４とを有する。図６では基板裏面３４の破線は、ＬＥＤ素子３１を示している。
図７は図６のＡ矢視でありＬＥＤ実装面３３のＬＥＤ素子３１（４個）を示している。
（３）本体カバー部２０Ａは、本体を兼ねている。つまり本体カバー部２０Ａは、実施の形態１の天面カバー１３０と本体１４０とを兼ねている。本体カバー部２０では、ＬＥＤ基板３０を取り付ける基板取付部は省略している。
（４）本体カバー部２０Ａは、一体成形を想定している。一体成形によって放熱部と一体成形カバー２９との接続部２８（図１０）が確実に同一部材で一体につながるので、第１の棒状リブ２１Ａ等がＬＥＤ基板３０から吸熱した熱を確実に高い効率で一体成形カバー２９に伝導できる。
（５）本体を兼ねる本体カバー部２０Ａは、ＬＥＤ基板３０が基板裏面３４側から取り付けられる基板取付部（図示は省略した）と、取り付けられたＬＥＤ基板３０のＬＥＤ実装面３３から基板裏面３４に向かう延伸方向１７３に延び、ＬＥＤ基板３０から熱を吸熱して伝熱かつ放熱する「後述の第１の棒状リブ２１Ａ、第２の棒状リブ２２Ａ」とを有する。複数の放熱部の構成は、例えば、ＬＥＤ基板３０に実装される複数のＬＥＤ素子３１の配置に応じて決定される。
（６）本体カバー部２０Ａは、複数の放熱部を備えるが、図６では、棒状の放熱部として第１の棒状リブ２１Ａと第２の棒状リブ２２Ａを示した。なお放熱部をリブと呼ぶのは放熱部の機能と共に強度部材としての機能も有するからである。放熱部に強度部材の機能も持たせることで、本体カバー部２０Ａの重量を低減できる。図示の見易さのため２本としているが、棒状の放熱部は例えば合計４本であり、残りの２本もそれぞれ基板裏面３４のＬＥＤ素子３１の裏側に対応する箇所にその先端が当接する。第１の棒状リブ２１Ａ等は、基板裏面３４に面する側の一体成形カバー２９の裏面から起立し、その先端が基板裏面３４に接続して、ＬＥＤ基板３０から熱を吸収する。
（７）図６に示したように、第１の棒状リブ２１Ａ、第２の棒状リブ２２Ａ等は、先端の少なくとも一部の領域（図６では全部の領域）が、ＬＥＤ実装面３３に実装されたＬＥＤ素子３１の実装位置の略反対側の基板裏面３４の位置に接続する。基板裏面３４のうちでもＬＥＤ素子３１のちょうど裏側にあたる範囲が温度の高い領域である。よって放熱部である第２の棒状リブ２２Ａの先端をこの領域に接続することで、ＬＥＤ基板３０から効率よく吸熱できる。
（８）また、図７（ｂ）のＡ’矢視のように、本体カバー部２０Ａの一体成形カバー２９は、第１の棒状リブ２１Ａ、第２の棒状リブ２２Ａ等を延伸方向１７３と反対方向（Ａ’矢視）から見下ろした場合に、第１の棒状リブ２１Ａ、第２の棒状リブ２２Ａ等を覆うように配置される。また図６に示すように、外形が延伸方向１７３に凸となる凸形状（山形状、あるいはかさ形状）である。この一体成形カバー２９の形状によって、放熱部である第１の棒状リブ２１Ａ、第２の棒状リブ２２Ａ等の間における埃の堆積を低減できる。 (LED lighting device 201A)
FIG. 6 is a perspective view of the LED lighting apparatus 201A of the second embodiment.
(1) The LED lighting device 201A includes an LED substrate 30 and a main body cover portion 20A. A part of the main body cover portion 20 A is an integrally formed cover 29 corresponding to the top cover 130.
(2) The LED substrate 30 includes an LED mounting surface 33 on which a plurality of LED elements 31 are mounted, and a substrate back surface 34 that is a surface opposite to the LED mounting surface 33. In FIG. 6, the broken line on the substrate back surface 34 indicates the LED element 31.
FIG. 7 is an arrow A view of FIG. 6 and shows the LED elements 31 (four) on the LED mounting surface 33.
(3) The main body cover portion 20A also serves as the main body. That is, the main body cover 20A serves as both the top cover 130 and the main body 140 of the first embodiment. In the main body cover part 20, the board attaching part for attaching the LED board 30 is omitted.
(4) The main body cover portion 20A is assumed to be integrally molded. Since the connecting portion 28 (FIG. 10) between the heat radiating portion and the integrally molded cover 29 is reliably connected by the same member by integral molding, the heat absorbed by the first rod-shaped rib 21A and the like from the LED substrate 30 is surely highly efficient. Can be conducted to the integrally formed cover 29.
(5) The main body cover portion 20A that also serves as the main body includes a board attachment portion (not shown) to which the LED substrate 30 is attached from the substrate rear surface 34 side, and an LED mounting surface 33 of the attached LED substrate 30 to the substrate rear surface 34. It has a “first rod-shaped rib 21A and a second rod-shaped rib 22A, which will be described later” that extend in the extending direction 173 and that absorbs heat from the LED substrate 30 to transfer and dissipate heat. The configuration of the plurality of heat radiation units is determined according to the arrangement of the plurality of LED elements 31 mounted on the LED substrate 30, for example.
(6) The main body cover portion 20A includes a plurality of heat radiating portions. In FIG. 6, the first rod-shaped rib 21A and the second rod-shaped rib 22A are shown as the rod-shaped heat radiating portions. The reason why the heat dissipating part is called a rib is that it has a function as a strength member as well as a function of the heat dissipating part. By giving the heat radiating portion the function of a strength member, the weight of the main body cover portion 20A can be reduced. For the sake of clarity, the number is two, but there are a total of four rod-shaped heat radiation portions, for example, and the other two are in contact with the tips corresponding to the back side of the LED element 31 on the back surface 34 of the substrate, respectively. . The first rod-shaped ribs 21 A and the like stand up from the back surface of the integrally formed cover 29 on the side facing the substrate back surface 34, and their tips are connected to the substrate back surface 34 to absorb heat from the LED substrate 30.
(7) As shown in FIG. 6, the first rod-shaped rib 21 A, the second rod-shaped rib 22 A, etc. are mounted on the LED mounting surface 33 at least at a part of the tip (all regions in FIG. 6). The connected LED element 31 is connected to the position of the back surface 34 on the substantially opposite side of the mounting position. A range corresponding to the back side of the LED element 31 in the substrate back surface 34 is a high temperature region. Therefore, it is possible to efficiently absorb heat from the LED substrate 30 by connecting the tip of the second rod-shaped rib 22A, which is a heat radiating portion, to this region.
(8) Also, as shown by the arrow A ′ in FIG. 7B, the integrally formed cover 29 of the main body cover portion 20A is opposite to the first bar-shaped rib 21A, the second bar-shaped rib 22A and the like in the extending direction 173. When looking down from the direction (A ′ arrow), the first rod-shaped rib 21A, the second rod-shaped rib 22A, and the like are arranged to cover. Further, as shown in FIG. 6, the outer shape is a convex shape (mountain shape or bulk shape) that is convex in the extending direction 173. Due to the shape of the integrally formed cover 29, dust accumulation between the first rod-shaped rib 21A, the second rod-shaped rib 22A, and the like, which are heat radiating portions, can be reduced.

（ＬＥＤ照明装置２０１Ｂ）
図８は、実施の形態２のＬＥＤ照明装置２０１Ｂの斜視図である。
（１）ＬＥＤ照明装置２０１Ｂは、ＬＥＤ照明装置２０１Ａに対して、ＬＥＤ基板３０におけるＬＥＤ素子３１の配置が異なり、これに対応して放熱部が板状である。つまり本体カバー部２０Ｂは、放熱部として第１の板状リブ２１Ｂと第２の板状リブ２２Ｂを有する。
（２）図８にしたように、第１の板状リブ２１Ｂ、第２の板状リブ２２Ｂ等は、先端の少なくとも一部の領域（図８では一部の領域）が、ＬＥＤ実装面３３に実装されたＬＥＤ素子３１の実装位置の略反対側の基板裏面３４の位置に接続する。
（３）ＬＥＤ照明装置２０１Ｂの構成の場合も、ＬＥＤ照明装置２０１Ａと同様の効果を得ることができる。 (LED lighting device 201B)
FIG. 8 is a perspective view of the LED lighting apparatus 201B of the second embodiment.
(1) The LED illumination device 201B differs from the LED illumination device 201A in the arrangement of the LED elements 31 on the LED substrate 30, and the heat dissipation portion is plate-shaped correspondingly. That is, the main body cover portion 20B has the first plate-like ribs 21B and the second plate-like ribs 22B as heat radiating portions.
(2) As shown in FIG. 8, the first plate-like rib 21 B, the second plate-like rib 22 B, and the like have at least a partial region (partial region in FIG. 8) at the tip, and the LED mounting surface 33 Are connected to the position of the substrate back surface 34 on the substantially opposite side of the mounting position of the LED element 31 mounted on the board.
(3) In the case of the configuration of the LED lighting device 201B, the same effect as that of the LED lighting device 201A can be obtained.

（ＬＥＤ照明装置２０１Ｃ）図９は、実施の形態２のＬＥＤ照明装置２０１Ｃの斜視図である。
（１）ＬＥＤ照明装置２０１Ｃは、ＬＥＤ照明装置２０１Ａに対して、ＬＥＤ基板３０におけるＬＥＤ素子３１の配置が異なる。ＬＥＤ素子３１の配置は、円周状の配置である。これに対応して放熱部が中空円筒板状である。つまり本体カバー部２０Ｃは、放熱部として中空円筒状リブ２１Ｃを有する。
（２）図９にしたように、中空円筒状リブ２２Ｃは、先端の少なくとも一部の領域（図９では一部の領域）が、ＬＥＤ実装面３３に実装されたＬＥＤ素子３１の実装位置の略反対側の基板裏面３４の位置に接続する。
（３）ＬＥＤ照明装置２０１Ｃの構成の場合も、ＬＥＤ照明装置２０１Ａと同様の効果を得ることができる。 (LED Lighting Device 201C) FIG. 9 is a perspective view of the LED lighting device 201C of the second embodiment.
(1) The LED illumination device 201 C differs from the LED illumination device 201 A in the arrangement of the LED elements 31 on the LED substrate 30. The arrangement of the LED elements 31 is a circumferential arrangement. Correspondingly, the heat dissipating part has a hollow cylindrical plate shape. That is, the main body cover portion 20C has the hollow cylindrical rib 21C as a heat radiating portion.
(2) As shown in FIG. 9, the hollow cylindrical rib 22 C has at least a part of the tip (part of the part in FIG. 9) of the mounting position of the LED element 31 mounted on the LED mounting surface 33. Connection is made to the position of the substrate back surface 34 on the substantially opposite side.
(3) In the case of the configuration of the LED lighting device 201C, the same effect as that of the LED lighting device 201A can be obtained.

図１０に、本体カバー部２０Ａ、２０Ｂ、２０Ｃの断面Ｆ−Ｆ、断面Ｇ−Ｇ、断面Ｈ−Ｈを示した。なお、本体カバー部２０Ａ等は、図１１、図１２に示すように、一体成形カバー２９のおもて面に、ＬＥＤ基板３０の基板裏面３４に接続する複数の放熱部とは異なる別の複数の第２の放熱部（外側放熱フィン２４）が一体成形によって形成されてもよい。外側放熱フィン２４を形成することで、さらに放熱性が向上する。 FIG. 10 shows a cross section FF, a cross section GG, and a cross section HH of the main body cover portions 20A, 20B, and 20C. As shown in FIGS. 11 and 12, the main body cover portion 20 A and the like are different from the plurality of heat radiating portions connected to the substrate rear surface 34 of the LED substrate 30 on the front surface of the integrally formed cover 29. The second heat radiating portion (outer heat radiating fins 24) may be formed by integral molding. By forming the outer heat radiating fins 24, the heat dissipation is further improved.

（ＬＥＤ照明装置２０１Ｄ）
次に図１３〜図１８を参照してＬＥＤ照明装置２０１Ｄを説明する。ＬＥＤ照明装置２０１Ｄは図１５（ａ）に示すように、ＬＥＤ基板３０と本体カバー部２０Ｄを備えている。本体カバー部２０Ｄは本体カバー部２０Ａ等と同様に、本体の機能を兼用する。 (LED lighting device 201D)
Next, the LED illumination device 201D will be described with reference to FIGS. As shown in FIG. 15A, the LED illumination device 201D includes an LED substrate 30 and a main body cover portion 20D. The main body cover portion 20D also functions as the main body, like the main body cover portion 20A.

ＬＥＤ照明装置２０１Ｄの特徴は、本体カバー部２０Ｄがドーナツ形状である点である。図１３は、本体カバー部２０Ｄの形状を説明する図である。（ａ）は略富士山型の凸形断面２５（後述の櫛形状）を示す。富士山型の頂上側２５−１を下にした形状である。（ｂ）は回転体の断面を示す。（ｃ）はＣ矢視を示す。また、図１４は、Ｄ矢視を示す。 The feature of the LED illumination device 201D is that the main body cover portion 20D has a donut shape. FIG. 13 is a diagram illustrating the shape of the main body cover 20D. (A) shows a substantially Mt. Fuji-shaped convex section 25 (comb shape described later). It is the shape which made Mt. Fuji type top side 25-1 downward. (B) shows the cross section of a rotary body. (C) shows C arrow view. Moreover, FIG. 14 shows D arrow view.

本体カバー部２０Ｄ（本体と一体成形である）は、その外形が図１３（ａ）に示すように、略富士山型の凸形断面２５を回転軸２６から横方向に移動させた位置に配置して回転軸２６まわりに１回転してできるドーナツ形状の回転体形状をなす。本体カバー部２０Ｄは、凸形断面２５の回転方向に連続する少なくとも一部の領域の断面が、略富士山型の凸形断面２５のうち斜面と頂上の形状を維持しつつ内部の一部が削除されて略富士山型の凸形断面２５の底辺側２５−２に向かう複数の歯２５−３を有する櫛形状の断面である。そして、複数の放熱部のそれぞれは、略富士山型の櫛形状の断面における櫛のそれぞれの歯２５−３の部分が回転軸まわりに回転してできるそれぞれの中空円筒の少なくとも一部分である。本体カバー部２０Ｄにおける放熱部は、図１３（ｃ）に示す中空円筒状リブ２１Ｄ−１，２１Ｄ−２であり、この例では全部が中空円筒形状である。また、頂上側２５−１の回転形状によって実施の形態１の天面カバー１３０に相当する一体成形カバー２９が形成される。 As shown in FIG. 13A, the main body cover portion 20D (integrated with the main body) is disposed at a position where the convex section 25 of a substantially Mt. Fuji shape is moved laterally from the rotation shaft 26. Thus, a donut-shaped rotating body formed by one rotation around the rotating shaft 26 is formed. The main body cover portion 20D has a cross section of at least a part of the region extending continuously in the rotation direction of the convex cross section 25, and a part of the inside is removed while maintaining the shape of the slope and the top of the convex cross section 25 having a substantially Mt. Fuji shape. This is a comb-shaped cross section having a plurality of teeth 25-3 directed toward the bottom side 25-2 of the substantially Mt. Fuji-shaped convex cross section 25. Each of the plurality of heat radiating portions is at least a part of each hollow cylinder formed by rotating a portion of each tooth 25-3 of the comb in a substantially Mt. The heat radiating portions in the main body cover portion 20D are hollow cylindrical ribs 21D-1 and 21D-2 shown in FIG. 13C, and in this example, all are hollow cylindrical shapes. Further, the integrally formed cover 29 corresponding to the top cover 130 of the first embodiment is formed by the rotational shape of the top side 25-1.

図１５は、ＬＥＤ照明装置２０１Ｄの構成を示す図である。（ａ）は縦断面であり、（ｂ）はＥ矢視である。（ｂ）に示すように、ＬＥＤ素子３１は同心円状に配置されおり、このＬＥＤ素子３１配置に対応して、中空円筒状リブ２１Ｄ−１，２１Ｄ−２は中空円筒形状となっている。つまり（ａ）に示すように、中空円筒状リブ２１Ｄ−１，２１Ｄ−２の先端（歯２５−３の先端に相当）が、ＬＥＤ実装面３３に実装されたＬＥＤ素子３１の実装位置の略反対側の基板裏面３４の位置（破線の円周上）に接続する。また（ａ），（ｂ）に示すように、ＬＥＤ基板３０のドーナツの穴に相当する部分にも穴が開いており、ＬＥＤ照明装置２０１ＤはＥ方向、反Ｅ方向に空気が通過し、放熱性の向上を図っている。 FIG. 15 is a diagram illustrating a configuration of the LED illumination device 201D. (A) is a longitudinal section, and (b) is an E arrow view. As shown to (b), the LED element 31 is arrange | positioned concentrically, and the hollow cylindrical rib 21D-1, 21D-2 becomes a hollow cylinder shape corresponding to this LED element 31 arrangement | positioning. That is, as shown in (a), the tips of the hollow cylindrical ribs 21D-1 and 21D-2 (corresponding to the tips of the teeth 25-3) are the mounting positions of the LED elements 31 mounted on the LED mounting surface 33. It connects to the position (on the circumference of the broken line) of the substrate back surface 34 on the opposite side. Further, as shown in (a) and (b), a hole corresponding to the hole of the donut of the LED substrate 30 is also opened, and the LED illumination device 201D allows air to pass through in the E direction and the anti-E direction to dissipate heat. The improvement of the nature is aimed at.

図１６は、図１５（ｂ）に相当する図（Ｅ矢視）であり、ＬＥＤ素子３１の配置が異なる場合である。図１６では、ＬＥＤ素子３１は円周上に配置されるが、部分的に密集して配置される。よって、この部分的配置に対応して、中空円筒状リブ２１Ｄ−１，２１Ｄ−２は、その中空円筒の一部分とした構成である。図１７は、図１３（ｃ）に対応する図である。また図１８（ａ）〜（ｃ）は、それぞれ図１７の断面Ｘ―Ｘ、Ｙ―Ｙ、Ｚ―Ｚを示す。図１８（ａ）〜（ｃ）の破線は、櫛形状の凸形断面２５において欠けている歯２５−３を示している。図１７の放熱部２７Ａは、図１６の３つのＬＥＤ素子３１であるＬＥＤ素子群２７Ｂに対応している。つまり放熱部２７Ａの先端は、ＬＥＤ素子群２７Ｂの実装位置の略反対側の基板裏面３４の位置に接続する。 FIG. 16 is a view corresponding to FIG. 15B (see arrow E), and shows a case where the arrangement of the LED elements 31 is different. In FIG. 16, the LED elements 31 are arranged on the circumference, but are partially densely arranged. Therefore, corresponding to this partial arrangement, the hollow cylindrical ribs 21D-1 and 21D-2 are configured as a part of the hollow cylinder. FIG. 17 is a diagram corresponding to FIG. FIGS. 18A to 18C show cross sections XX, YY, and ZZ in FIG. 17, respectively. The broken lines in FIGS. 18A to 18C show the teeth 25-3 that are missing in the comb-shaped convex section 25. FIG. 17 corresponds to the LED element group 27B which is the three LED elements 31 of FIG. That is, the tip of the heat dissipating part 27A is connected to the position of the substrate back surface 34 on the substantially opposite side of the mounting position of the LED element group 27B.

以上に説明したＬＥＤ照明装置２０１Ｄは、放熱部の形状が、図９のＬＥＤ照明装置２０１Ｃと同様な中空円筒形状であるが、ＬＥＤ照明装置２０１ＤもＬＥＤ照明装置２０１Ａ等と同様の効果を有する。 The LED illumination device 201D described above has a hollow cylindrical shape similar to that of the LED illumination device 201C in FIG. 9 in the shape of the heat dissipation portion, but the LED illumination device 201D also has the same effect as the LED illumination device 201A and the like.

（ＬＥＤ照明装置２００）
次に、実施の形態２のＬＥＤ照明装置２００を説明する。ＬＥＤ照明装置２００は、上記の実施の形態２で述べた概念を具体的なＬＥＤ照明装置としたものである。ＬＥＤ照明装置２００は、図１３〜図１８で述べたＬＥＤ照明装置２０１Ｄの具体化である。従ってＬＥＤ照明装置２００はＬＥＤ照明装置２０１Ｄと同じ効果を持つ。 (LED lighting device 200)
Next, the LED lighting apparatus 200 of Embodiment 2 is demonstrated. The LED lighting device 200 is a specific LED lighting device based on the concept described in the second embodiment. The LED lighting device 200 is an embodiment of the LED lighting device 201D described in FIGS. Therefore, the LED lighting device 200 has the same effect as the LED lighting device 201D.

以下に図１９〜図２３を参照してＬＥＤ照明装置２００を説明する。図１９〜図２３は実施の形態１の図１〜図５に対応する。上記のようにＬＥＤ照明装置２００はＬＥＤ照明装置２０１の具体化であり、ＬＥＤ照明装置２００の特徴は、本体１４０と天面カバー１３０とが一体成形されると共に、櫛形状の歯２５−３の先端がＬＥＤ基板の基板裏面に接続することにある。 The LED lighting device 200 will be described below with reference to FIGS. 19 to 23 correspond to FIGS. 1 to 5 of the first embodiment. As described above, the LED lighting device 200 is an embodiment of the LED lighting device 201. The LED lighting device 200 is characterized in that the main body 140 and the top cover 130 are integrally formed and the comb-shaped teeth 25-3 are formed. The tip is to be connected to the back surface of the LED substrate.

（１）図１９は、ＬＥＤ照明装置２００の斜視図である。図１９（ａ）は、ＬＥＤ照明装置２００の発光面側が見える斜視図であり、図１９（ｂ）は、ＬＥＤ照明装置２００の上側が見える斜視図である。
（２）図２０は、ＬＥＤ照明装置２００の構成を示す、分解斜視図である。図２０に示すように、ＬＥＤ照明装置２００は、アーム部２１０、電源装置２２０、本体２４０（本体カバー部を兼ねる）、ＬＥＤ基板２７０、反射板２８１、パッキン２８３、カバー２８４を備える。なお、パッキン２８３はなくてもよい。実施の形態１のＬＥＤ照明装置１００に対して天面カバー１３０と本体１４０とが一体成形されて本体２４０となった他は、ＬＥＤ照明装置２００ＬＥＤ照明装置１００と同様の構成である。図２０に示すようにＬＥＤ基板２７０は、実施の形態１のＬＥＤ照明装置１００の円形ベース部１４３０のベース下面１４３１に相当する箇所に取り付けられるが、この部分が基板取付部である。この基板取付部は、図２２（ｆ）に示す断面Ｃ−Ｃのネジ穴２４７である。
（３）図２１は、ＬＥＤ照明装置２００の上面図等及び断面図である。図２１の（ａ）〜（ｈ）において、（ａ）は上面図、（ｂ）は正面図、（ｃ）は底面図、（ｄ）は左側面図、（ｅ）は右側面図である。（ｆ）は断面Ａ−Ａ、（ｇ）は断面Ｃ−Ｃ、（ｈ）は断面Ｄ−Ｄである。
（４）図２２は、本体２４０の上面図等及び断面図である。（ａ）は上面図、（ｂ）は正面図、（ｃ）は底面図、（ｄ）は右側面図である。（ｅ）は断面Ｂ−Ｂ、（ｆ）は断面Ｃ−Ｃである。
（５）図２３は、本体２４０の斜視図である。 (1) FIG. 19 is a perspective view of the LED lighting device 200. FIG. 19A is a perspective view in which the light emitting surface side of the LED lighting apparatus 200 can be seen, and FIG. 19B is a perspective view in which the upper side of the LED lighting apparatus 200 can be seen.
(2) FIG. 20 is an exploded perspective view showing the configuration of the LED lighting device 200. As shown in FIG. 20, the LED lighting device 200 includes an arm part 210, a power supply device 220, a main body 240 (also serving as a main body cover part), an LED substrate 270, a reflecting plate 281, a packing 283, and a cover 284. Note that the packing 283 may be omitted. The configuration is the same as that of the LED lighting device 200 LED lighting device 100 except that the top cover 130 and the main body 140 are integrally formed with the LED lighting device 100 of the first embodiment to become the main body 240. As shown in FIG. 20, the LED substrate 270 is attached to a location corresponding to the base lower surface 1431 of the circular base portion 1430 of the LED lighting device 100 of Embodiment 1, and this portion is a substrate attachment portion. This board attaching portion is a screw hole 247 having a cross section CC shown in FIG.
(3) FIG. 21 is a top view of the LED lighting device 200 and a cross-sectional view thereof. 21A to 21H, (a) is a top view, (b) is a front view, (c) is a bottom view, (d) is a left side view, and (e) is a right side view. . (F) is a section AA, (g) is a section CC, (h) is a section DD.
(4) FIG. 22 is a top view and a sectional view of the main body 240. (A) is a top view, (b) is a front view, (c) is a bottom view, and (d) is a right side view. (E) is a section BB, and (f) is a section CC.
(5) FIG. 23 is a perspective view of the main body 240.

（本体２４０）
以下、ＬＥＤ照明装置２００の特徴は本体２４０にあるので、ＬＥＤ照明装置２０１Ｄ（図１５）との対比で本体２４０を説明する。本体２４０は本体カバー部を兼ねる。図２３に本体カバー部２４１の斜視図を示した。また、図２１（ｆ）の破線で囲む部分が、本体カバー部２４１の断面である。この断面を図１３（ａ）の回転軸２６まわりに回転することで、天面カバー１３０の形状の一体成形カバーが形成される。図２３に示すように、本体カバー部２４１の表面には、外側表面に外側放熱フィン２４４が形成され、内側表面（内径側表面）に内側放熱フィン２４５が形成されている。本体カバー部２４１の断面が図１３で述べた凸形断面２５である。図２１（ｆ）に示す略富士山型の凸形断面２４２は、図１３（ａ）の凸形断面２５に対応する。本体カバー部２４１側が頂上側２４３である。なお、図２１（ｆ）の断面Ａ−Ａは櫛形状ではない。櫛形状の断面は図２１（ｇ）、図２２（ｆ）に現れている。図２１（ｇ）を参照して説明する。図２１（ｇ）の断面Ｃ−Ｃは、富士山型の凸形断面２４２とはなっていないが、これは外側放熱フィン２４４、内側放熱フィン２４５が形成されている断面のためである。本体２４０の特徴は本体とカバーとの一体化及び内部の断面形状にあり、外側放熱フィン２４４、内側放熱フィン２４５は必須の構成要素ではない。したがって外側放熱フィン２４４、内側放熱フィン２４５がない場合は、断面Ｃ−Ｃには富士山型の凸形断面２４２が現れる。図２１（ｇ）の断面Ｃ−Ｃは、内部の一部が削除されて底辺に向かう複数の歯２４６を有する櫛形状の断面をなしている。図１３で述べたが、複数の放熱部のそれぞれは、櫛形状の断面における櫛のそれぞれの歯の部分が回転軸２６まわりに回転してできるそれぞれの中空円筒の少なくとも一部分である。つまり、図１３（ｃ）の場合は１周全部が一つの中空円筒状の放熱部であったが、本体２４０では、図２２（ｃ）に示すように、１周が４分割された形状である。その分割の区分け部になる断面が図２１（ｃ）の断面Ａ−Ａのように、櫛形状の出現しない断面である。なお、本体２４０はドーナツ形状であるので、中央の穴を図２３の矢印Ｋの方向（あるいはその反対方向）に空気が通過できるので、放熱効果に優れている。 (Main body 240)
Hereinafter, since the feature of the LED lighting device 200 is in the main body 240, the main body 240 will be described in comparison with the LED lighting device 201D (FIG. 15). The main body 240 also serves as a main body cover part. FIG. 23 shows a perspective view of the main body cover 241. Further, a portion surrounded by a broken line in FIG. 21 (f) is a cross section of the main body cover portion 241. By rotating this cross section around the rotation shaft 26 in FIG. 13A, an integrally formed cover having the shape of the top cover 130 is formed. As shown in FIG. 23, on the surface of the main body cover portion 241, outer radiating fins 244 are formed on the outer surface, and inner radiating fins 245 are formed on the inner surface (inner diameter side surface). The cross section of the main body cover 241 is the convex cross section 25 described in FIG. A substantially Mt. Fuji-shaped convex section 242 shown in FIG. 21 (f) corresponds to the convex section 25 of FIG. 13 (a). The main body cover portion 241 side is the top side 243. Note that the cross section AA in FIG. 21F is not comb-shaped. A comb-shaped cross section appears in FIGS. 21 (g) and 22 (f). This will be described with reference to FIG. The cross section CC in FIG. 21G is not the Mt. Fuji-shaped convex cross section 242, but this is because the outer heat dissipating fins 244 and the inner heat dissipating fins 245 are formed. The main body 240 is characterized by the integration of the main body and the cover and the internal cross-sectional shape, and the outer radiating fins 244 and the inner radiating fins 245 are not essential components. Therefore, when there is no outer heat radiating fin 244 and inner heat radiating fin 245, a Mt. Fuji-shaped convex cross section 242 appears in the cross section CC. A cross-section C-C in FIG. 21G is a comb-shaped cross-section having a plurality of teeth 246 that are partially removed from the inside and are directed toward the bottom. As described with reference to FIG. 13, each of the plurality of heat radiating portions is at least a part of each hollow cylinder formed by rotating each tooth portion of the comb in the comb-shaped cross section around the rotation shaft 26. That is, in the case of FIG. 13C, the entire circumference is one hollow cylindrical heat radiating portion, but in the main body 240, as shown in FIG. 22C, the circumference is divided into four parts. is there. A cross-section that becomes a division part of the division is a cross-section in which a comb shape does not appear like a cross-section AA in FIG. Since the main body 240 has a donut shape, air can pass through the central hole in the direction of the arrow K in FIG. 23 (or the opposite direction), so that the heat dissipation effect is excellent.

つまり放熱部２７Ａの先端は、ＬＥＤ素子群２７Ｂの実装位置の略反対側の基板裏面３４の位置に接続する。 That is, the tip of the heat dissipating part 27A is connected to the position of the substrate back surface 34 on the substantially opposite side of the mounting position of the LED element group 27B.

以上の実施の形態２のＬＥＤ照明装置２０１Ａ〜２０１Ｄ、２００は、本体背面の外郭（本体カバー部）を凸形状（山形状）とし、その表面に放熱フィンを有することで、放熱性能を確保しつつ、ほこりの堆積を軽減できる。また実施の形態２のＬＥＤ照明装置２０１Ａ等では、本体カバー部の裏面から起立する放熱部を形成し、放熱部の先端をＬＥＤ素子の実装位置の略反対側の基板裏面の位置に接続する。また放熱部は強度部材の機能も有する。よって、軽量化を図りながらＬＥＤモジュールの熱を器具外郭に伝熱し、放熱できる。また、本体とカバーとをＡＤＣ（アルミダイキャスト）による一体成形とすることで、部品点数の削減が図れる。 The LED lighting devices 201A to 201D and 200 according to Embodiment 2 described above ensure heat radiation performance by forming the outer shell (main body cover part) on the back surface of the main body into a convex shape (mountain shape) and having heat radiation fins on the surface thereof. Dust accumulation can be reduced. Further, in the LED lighting device 201A and the like of the second embodiment, a heat radiating portion standing from the back surface of the main body cover portion is formed, and the tip of the heat radiating portion is connected to a position on the back surface of the substrate substantially opposite to the LED element mounting position. The heat radiating portion also has a function of a strength member. Therefore, the heat of the LED module can be transferred to the outer shell of the instrument while reducing the weight, and can be dissipated. In addition, the number of parts can be reduced by integrally forming the main body and the cover by ADC (aluminum die casting).

１００ＬＥＤ照明装置、１１０アーム部、１１１上側アーム、１１２Ａ第１サイドアーム、１１２Ｂ第２サイドアーム、１１３ボルト、１１４ナット、１２０電源装置、１３０天面カバー、１３１斜面、１３２カバー側風穴、１３３外縁、１４０本体、１４１０第１中空円筒部、１４２０第２中空円筒部、１４３０円形ベース部、１４３１ベース下面、１４３２ベース上面、１４３３外周領域、１４３４下降形状、１４４１放熱フィン、１４４１−１板厚側面、１４４１−２板厚側面、１４４１−３凸形状、１４４２放熱フィン、１４４３放熱フィン、１４５０本体側風穴、１７０ＬＥＤ基板、１７１実装面、１７２基板裏面、１７３延伸方向、１７４ＬＥＤ素子、１８１反射板、１８２ネジ、１８３パッキン、１８４カバー、１８５ネジ、２０Ａ本体カバー部、２０Ａ−１本体カバー部、２１Ａ第１の棒状リブ、２２Ａ第２の棒状リブ、２３カバー側風穴、２４外側放熱フィン、２０Ｂ本体カバー部、２１Ｂ第１の板状リブ、２２Ｂ第２の板状リブ、２０Ｃ本体カバー部、２１Ｃ中空円筒状リブ、２０Ｄ本体カバー部、２１Ｄ櫛形断面、２１Ｄ−１中空円筒状リブ、２１Ｄ−２中空円筒状リブ、２４放熱フィン、２５凸形断面、２５−１頂上側、２５−２底辺側、２５−３歯、２６回転軸、２７Ａ放熱部、２７ＢＬＥＤ素子群、２８接続部、２９一体成形カバー、２００ＬＥＤ照明装置、２１０アーム部、２１１上側アーム、２１２Ａ第１サイドアーム、２１２Ｂ第２サイドアーム、２１３ボルト、２１４ナット、２２０電源装置、２４０本体、２４１本体カバー部、２４２凸形断面、２４３頂上側、２４４外側放熱フィン、２４５内側放熱フィン、２４６歯、２４７ネジ穴、２７０ＬＥＤ基板、２８１反射板、２８２ネジ、２８３パッキン、２８４カバー、２８５ネジ、３０ＬＥＤ基板、３１ＬＥＤ素子、３２基板風穴、３３ＬＥＤ実装面、３４基板裏面。 100 LED lighting device, 110 arm portion, 111 upper arm, 112A first side arm, 112B second side arm, 113 bolt, 114 nut, 120 power supply device, 130 top cover, 131 slope, 132 cover side air hole, 133 outer edge , 140 body, 1410 first hollow cylindrical portion, 1420 second hollow cylindrical portion, 1430 circular base portion, 1431 base lower surface, 1432 base upper surface, 1433 outer peripheral region, 1434 descending shape, 1441 heat radiation fin, 1441-1 plate thickness side surface, 1441-2 Thickness side surface, 1441-3 Convex shape, 1442 Radiation fin, 1443 Radiation fin, 1450 Body side air hole, 170 LED substrate, 171 Mounting surface, 172 Substrate back surface, 173 Stretch direction, 174 LED element, 181 Reflector, 182 , 183 packing, 184 cover, 185 screw, 20A body cover part, 20A-1 body cover part, 21A first rod-shaped rib, 22A second rod-shaped rib, 23 cover side air hole, 24 outer radiating fin, 20B body cover section 21B 1st plate-like rib, 22B 2nd plate-like rib, 20C main body cover part, 21C hollow cylindrical rib, 20D main body cover part, 21D comb-shaped cross section, 21D-1 hollow cylindrical rib, 21D-2 hollow cylinder Rib, 24 Radiation fin, 25 Convex cross section, 25-1 Top side, 25-2 Bottom side, 25-3 Teeth, 26 Rotating shaft, 27A Heat radiation part, 27B LED element group, 28 Connection part, 29 Integrated molding cover , 200 LED lighting device, 210 arm portion, 211 upper arm, 212A first side arm, 212B second side arm 213 bolts, 214 nuts, 220 power supply, 240 main body, 241 main body cover, 242 convex cross section, 243 top side, 244 outer radiating fins, 245 inner radiating fins, 246 teeth, 247 screw holes, 270 LED board, 281 Reflector, 282 screw, 283 packing, 284 cover, 285 screw, 30 LED substrate, 31 LED element, 32 substrate air hole, 33 LED mounting surface, 34 substrate back surface.

Claims

In an illumination device using a plurality of semiconductor light emitting elements as a light source,
A substrate having a mounting surface on which the plurality of semiconductor light emitting elements are mounted and a back surface opposite to the mounting surface;
An apparatus main body to which the substrate is attached, a substrate attachment portion to which the substrate is attached facing the back surface of the substrate, and a direction from the mounting surface of the substrate attached to the substrate attachment portion toward the back surface An apparatus body having a plurality of heat radiating portions extending in the stretching direction and absorbing heat from the substrate to transfer heat;
A convex body cover portion that is disposed in the apparatus main body so as to cover the plurality of heat dissipation portions when the plurality of heat dissipation portions are looked down from the direction opposite to the extending direction, and whose outer shape is convex in the extending direction. And
The apparatus main body and the main body cover part are:
Integrally molded,
The body cover part is
Thin wall molding by the integral molding,
Each of the plurality of heat dissipation units is
Standing up from the back surface of the body cover part on the side facing the back surface side of the substrate, the tip is connected to the back surface of the substrate and absorbs heat from the substrate,
The body cover part and the apparatus body to be integrally molded are
The outer shape is a donut-shaped rotating body that is formed by rotating a convex section of a substantially Mt. Fuji shape in a lateral direction from the rotational axis and rotating around the rotational axis. The cross section of at least a part of the region continuous in the rotation direction of the substantially Mt. Fuji-type convex cross section, while maintaining the shape of the slope and the top, a part of the inside is deleted, and the substantially Mt. Fuji-type convex cross section A comb-shaped cross section having a plurality of teeth toward the bottom of the
Each of the plurality of heat dissipation units is
The illumination device according to claim 1, wherein each tooth portion of the comb in the substantially Mt. Fuji-shaped cross section is at least a part of each hollow cylinder formed by rotating around the rotation axis.

Each of the plurality of heat dissipation units is
2. The illumination according to claim 1, wherein at least a partial region of the tip is connected to the position of the back surface substantially opposite to the mounting position of the semiconductor light emitting element mounted on the mounting surface of the substrate. apparatus.

The body cover part is
A plurality of second heat radiating portions different from the plurality of heat radiating portions are formed on the front surface of the main body cover portion opposite to the back surface of the main body cover portion by the integral molding. The illuminating device according to claim 1, wherein the illuminating device is characterized in that

In an illumination device using a plurality of semiconductor light emitting elements as a light source,
A substrate having a mounting surface on which the plurality of semiconductor light emitting elements are mounted and a back surface opposite to the mounting surface;
An apparatus main body to which the substrate is attached, a substrate attachment portion to which the substrate is attached facing the back surface of the substrate, and a direction from the mounting surface of the substrate attached to the substrate attachment portion toward the back surface An apparatus body having a plurality of heat radiating portions extending in the stretching direction and absorbing heat from the substrate to transfer heat;
A convex body cover portion that is disposed in the apparatus main body so as to cover the plurality of heat dissipation portions when the plurality of heat dissipation portions are looked down from the direction opposite to the extending direction, and whose outer shape is convex in the extending direction. And
The apparatus main body is
A circular base portion having a substantially disk shape, wherein the substrate is attached to a lower surface which is one surface;
The upper surface of the circular base portion opposite to the lower surface is disposed substantially concentrically with the circular base portion, and has a substantially cylindrical shape having a predetermined inner diameter standing in the extending direction from the upper surface of the circular base portion. A first hollow cylindrical portion of a plate-like body;
The upper surface of the circular base portion is disposed substantially concentrically with the circular base portion, stands up in the extending direction from the upper surface of the circular base portion, and has an inner diameter larger than the outer diameter of the first hollow cylindrical portion, A plate-like second hollow cylindrical portion having a substantially cylindrical shape having an outer diameter smaller than the outer diameter of the circular base portion,
Each of the plurality of heat dissipation units is
A plate-like heat dissipating fin,
Between the outer side of the first hollow cylindrical part and the inner side of the second hollow cylindrical part, the circular base part is radially arranged in the radial direction, and one plate thickness side surface which is a plate thickness surface is the first hollow side. Connected to the outer surface of the cylindrical portion and the other thickness side surface is connected to the inner surface of the second hollow cylindrical portion, near the outer surface of the first hollow cylindrical portion and the inner surface of the second hollow cylindrical portion The height near the middle of the outer surface of the first hollow cylindrical portion and the inner surface of the second hollow cylindrical portion is higher in the stretching direction than in the vicinity of ,
The first hollow cylindrical portion is
The height is substantially the same as the one plate thickness side,
The second hollow cylindrical portion is
It is approximately the same height as the other plate thickness side surface,
The body cover part is
When viewed from the direction opposite to the extending direction, the shape is substantially circular, the outer edge substantially matches the outer diameter of the second hollow cylindrical portion, and the convex shape of the main body cover portion is the convexity of the plurality of radiating fins. An illumination device characterized by having a shape that conforms to the shape.

The circular base portion is
5. The illumination according to claim 4, wherein an outer peripheral region outside the outer diameter of the second hollow cylindrical portion has a descending shape that descends in a direction opposite to the extending direction as it goes outward. apparatus.

The apparatus main body is
An air hole is formed that allows air to pass through in the stretching direction with the substrate attached,
The body cover part is
The illumination device according to any one of claims 1 to 5, wherein a cover-side air hole communicating with the air hole of the device body is formed.

In an illumination device using a plurality of semiconductor light emitting elements as a light source,
A substrate having a mounting surface on which the plurality of semiconductor light emitting elements are mounted and a back surface opposite to the mounting surface;
An apparatus main body to which the substrate is attached, a substrate attachment portion to which the substrate is attached facing the back surface of the substrate, and a direction from the mounting surface of the substrate attached to the substrate attachment portion toward the back surface An apparatus body having a plurality of heat radiating portions extending in the stretching direction and absorbing heat from the substrate to transfer heat;
A convex body cover portion that is disposed in the apparatus main body so as to cover the plurality of heat dissipation portions when the plurality of heat dissipation portions are looked down from the direction opposite to the extending direction, and whose outer shape is convex in the extending direction. And a main body cover portion formed with a slope that absorbs heat from the substrate to dissipate heat to the atmosphere and prevents dust accumulation.

The slope of the body cover part is
The lighting device according to claim 7, which forms an annular shape.

The body cover portion is the slope,
A first slope having an annular shape, and an annular second slope located inside the annular shape of the first slope and smaller than the annular shape of the first slope,
The lighting device includes:
The lighting device according to claim 7 or 8, wherein a through hole is provided below the second slope.