JP2012133989A - Led lamp having angle adjustment function - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED lamp which has a high heat radiation performance and has an angle adjustment function with a compact size.SOLUTION: The LED lamp is provided with a hooking sealing cap 3 as a mounting support member which is installed detachably on a hooking sealing plug 100 as a mounting part, a case 5 which is supported capable of changing angles to the hooking sealing cap 3 and has a heat sink 6 integrally inside and outside fins 5d integrally outside, a chip substrate 9 which has an LED element 9a and is in contact with the heat sink 6 of the case 5, and is installed with the LED element 9 arranged on the opposite side to the heat sink 6, and a condensing lens 11 which is installed on the opposite side to the heat sink 6 of the chip substrate 9 in the case 5. The heat sink 6 is provided with a plate part 6a in contact with the chip substrate 9 and a plurality of annular fins (inside fins) 6b that are installed concentrically on the opposite side to the chip substrate 9 of the plate part 6a.

Description

  The present invention relates to an LED lamp that is attached to a mounted portion such as a wiring duct rail disposed on a ceiling, for example, and has an angle adjustment function that can change a light emission direction.

  In recent years, LED bulbs having a light emitting diode (LED) as a light source have been developed. This LED bulb has a feature that power consumption is remarkably smaller than that of a conventional incandescent bulb.

  The LED bulb is constructed by integrating an LED and an Edison-type base so that existing facilities for incandescent bulbs can be used, and the base is attached to a socket provided separately. The thing is common (for example, refer patent document 1). Therefore, in the form in which the base of the LED bulb is attached to the socket, the LED bulb and the socket are arranged in series, so that it is long in the axial direction of the LED bulb.

JP 2002-208305 A

  However, in the case of producing an LED bulb having an angle adjusting function such as a spotlight, in addition to the LED bulb, a mounted portion such as a wiring duct rail previously arranged on the ceiling or wall And an attachment support member for supporting the LED bulb so that the angle of the LED bulb can be changed is required. In addition, in order to adjust the angle and direct the light emitted from the LED bulb in a specific direction, a condensing lens is generally provided on the light emission side of the LED bulb, and for this purpose, it is provided so as to surround the LED bulb from the side to the rear. There is a problem that the heat dissipation of the LED bulb is reduced by the case and the condensing lens provided so as to cover the front side of the LED bulb.

  This invention is made | formed in view of such a situation, and it aims at providing the compact LED lamp which has an angle adjustment function provided with high heat dissipation.

  An LED lamp having an angle adjustment function according to the present invention is mounted on a predetermined mounting portion in a detachable manner, and is supported by the mounting support member so that the angle can be changed. A case having an external fin integrally on the outside, a chip substrate having an LED element, in contact with the heat sink of the case and disposed on the opposite side of the heat sink, and in the case A condenser lens provided on the opposite side of the chip substrate from the heat sink, and the heat sink is provided on a plate-like portion in contact with the chip substrate and on the opposite side of the plate-like portion from the chip substrate. And an internal fin. In the present invention, a chip substrate having LED elements is used, and the light emission direction thereof coincides with the thickness direction of the substrate. Therefore, the axial length of the case in which the chip substrate is incorporated may be shortened. It becomes possible. Further, since the chip substrate is in contact with the heat sink provided in the case, heat generated in the chip substrate is radiated from the internal fins of the heat sink. Furthermore, since the heat sink is provided integrally with the case, heat can be transferred from the heat sink to the case with good conductivity. Furthermore, since the external fin is provided outside the case, heat can be released from the case to the outside by the external fin. Therefore, even if the chip substrate is surrounded by the case and the condensing lens, it is possible to provide a compact LED lamp having a high heat dissipation and an angle adjustment function.

  In this configuration, the inner fin includes a plurality of annular fins provided concentrically, and the plurality of annular fins are closer to the outer peripheral side of the plate-like portion so that the interval between adjacent fins is smaller and the fin height is higher. Is preferably formed so as to be high. In this configuration, as the annular fin of the heat sink is closer to the outer peripheral side of the plate-like portion, the gap between adjacent fins is narrower and the fin height is higher, so the outer periphery of the heat sink As the distance approaches, the contact area with the air increases, and as a result, the heat dissipation effect at the outer periphery of the heat sink increases. As a result, it is possible to increase the temperature gradient that lowers the temperature on the outer peripheral side than the temperature on the central side, improve the thermal conductivity, and increase the heat dissipation efficiency of the entire heat sink.

  In this configuration, the control circuit for controlling the lighting of the LED element is supported in a fall-prevented state by a protrusion that protrudes inwardly on the inner surface of the case, and is generated from the control circuit via the protrusion. A configuration may be employed in which heat is conducted to the case. In this configuration, the heat generated from the control circuit is conducted to the case through a path different from the conduction path of the heat generated from the chip substrate, so that the heat dissipation characteristics of the heat sink do not change or change. It will be less.

  In the present invention, a chip substrate having LED elements is used, and the light emission direction thereof coincides with the thickness direction of the substrate. Therefore, the axial length of the case in which the chip substrate is incorporated may be shortened. It becomes possible. Further, since the chip substrate is in contact with the heat sink provided in the case, heat generated in the chip substrate is radiated from the internal fins of the heat sink. Furthermore, since the heat sink is provided integrally with the case, heat can be transferred from the heat sink to the case with good conductivity. Furthermore, since the external fin is provided outside the case, heat can be released from the case to the outside by the external fin. Therefore, even if the chip substrate is surrounded by the case and the condensing lens, it is possible to provide a compact LED lamp having a high heat dissipation and an angle adjustment function.

It is front sectional drawing which shows the LED lamp which has an angle adjustment function which concerns on one Embodiment of this invention. It is explanatory drawing of the heat sink with which the LED lamp which has an angle adjustment function of FIG. 1 was equipped. It is a front view which shows the other attachment support member applied to this invention. It is a front view which shows the other attachment support member applied to this invention. It is a front view which shows the other attachment support member applied to this invention. It is front sectional drawing which shows the LED lamp which has an angle adjustment function which concerns on other embodiment of this invention. It is a top view which shows the case which comprises the LED lamp which has an angle adjustment function of FIG. It is explanatory drawing in the case of changing the light emission direction of the LED lamp which has an angle adjustment function of FIG. It is explanatory drawing which shows the example which applied the LED lamp which has an angle adjustment function to the structure of a bracket type. It is explanatory drawing which shows the example which applied the LED lamp which has an angle adjustment function to the structure of a pendant type. It is explanatory drawing which shows the example which applied the LED lamp which has an angle adjustment function to the structure of a ceiling type. It is explanatory drawing which shows the structure which attached the LED lamp which has an angle adjustment function directly to the ceiling.

  Hereinafter, embodiments of the present invention will be described.

  FIG. 1 is a front sectional view showing an LED lamp having an angle adjusting function according to an embodiment of the present invention.

  The LED lamp 1 having the angle adjustment function includes a hooking sealing cap 3 as a mounting support member that is detachably attached to a hooking sealing plug 100 that is suspended from a ceiling, and a hooking ceiling cap 3. Case 5 supported so that the angle can be changed, control circuit 7 provided inside the case 5, chip substrate 9 provided with an LED element 9 a provided inside the case 5, and the inside lower side of the case 5 And it comprises the condensing lens 11 provided below the chip substrate 9.

  The hook sealing cap 3 includes an upper member 3a, a lower member 3b, and a shaft portion 3c that supports the lower member 3b so as to be rotatable with respect to the upper member 3a. The upper member 3a has a pair of hook portions 3d to be hooked on the hook sealing plug 100 on its upper surface, and is attached by inserting these hook portions 3d into the hook sealing plug 100 and rotating them slightly around the vertical axis. Further, along with this attachment, electrical connection is made with the hooking sealing plug 100.

  In a state in which the hook portion 3d is attached to the hook sealing plug 100, the lower member 3b can be rotated in the forward and reverse directions around the shaft portion 3c, that is, around the vertical axis A. The lower member 3b has hanging portions 3e at both ends, and hemispherical support portions 3f are provided on inner surfaces of the hanging portions 3e facing each other.

  The case 5 is an integrally molded product and has a case main body 5a. A circular support hole 5i is provided in the upper part of the case body 5a, and the support part 3f is locked in the support hole 5i, thereby supporting the case 5 and rotating around the horizontal axis B. It can be turned. That is, the LED lamp 1 is configured to function as a so-called spotlight.

  The case body 5a is formed in line symmetry with respect to the axis thereof, and a heat sink 6 is provided inside the case body 5a. The heat sink 6 allows the inside of the case body 5a to be connected to the upper cavity 5b and the lower side. There are two side cavities 5c. A plurality of external fins 5d are radially formed outside the case body 5a so as to extend along the axis of the case body 5a. Further, a flange 5g protruding outward is formed on the outer side of the lower end of the case body 5a, and a lamp shade 5h indicated by a two-dot chain line can be suspended via the flange 5g.

  The heat sink 6 and the external fin 5d are formed integrally with the case main body 5a, and are made of the same high thermal conductivity resin as the case 5a. As the resin, for example, “Rahima” (trade name) manufactured by Teijin Limited, which is a high thermal conductivity carbon fiber having a higher thermal conductivity than silver is used.

  In addition, a plurality of through holes 5 e are partially provided along the circumferential direction around the axis at the place where the condenser lens 11 of the case 5 is provided.

  The heat sink 6 includes a plate-like portion 6a whose outer peripheral portion is connected to the inner surface of the case 5, and a plurality of, in the illustrated example, five annular fins 6b provided above the plate-like portion 6a. These five annular fins 6b constitute internal fins.

  Above the heat sink 6, the control circuit 7 is disposed apart from the heat sink 6, and the control circuit 7 is in a fall-prevented state on an annular support piece 5 f that protrudes inward from the inner surface of the case 5. It is supported by. The support piece 5f is formed continuously in the circumferential direction orthogonal to the axis of the case body 5a. Note that the support piece 5f does not need to be in a continuous state, and may be in a discontinuous state partially missing.

  A chip substrate 9 is provided below the heat sink 6. The chip substrate 9 is provided in a state in which the LED element 9a faces downward and is in contact with the plate-like portion 6a. The condensing lens 11 disposed on the lower side of the chip substrate 9 has a plurality of protrusions 11a partially formed along the outer peripheral portion, and condenses by press-fitting these protrusions 11a into the through holes 5e. The lens 11 is attached to the case 5. Further, the condensing lens 11 can be removed by removing the projection 11a from the through hole 5e. The protrusions 11a have a size that can enter the through hole 5e, and are provided in the same number in the circumferential direction orthogonal to the axial direction of the case main body 5a and at positions corresponding to the through holes 5e.

  FIG. 2 is an explanatory view (plan view) of a heat sink provided in the LED lamp 1.

  The five annular fins 6b extend in the axial direction of the case body 5a, are formed in circular shapes having different radii in plan view, and are arranged concentrically. These five annular fins 6b do not need to be completely concentric and may be slightly shifted. Of these annular fins 6b, the innermost (minimum diameter) annular fin 13a, one outer annular fin 13b, one outer annular fin 13c, and one outer annular fin. 13d, and the outermost outermost (maximum diameter) annular fin 13e is denoted by 13e, and the center of the annular fin 13a is denoted by O.

  An interval L2 between the annular fin 13b and the annular fin 13a is narrower than a distance L1 from the center O of the annular fin 13a, and an interval L3 between the annular fin 13c and the annular fin 13b is smaller than an interval L2, and the annular fin 13d and the annular fin 13d are annular. An interval L4 with the fin 13c is narrower than the interval L3, and an interval L5 between the annular fin 13e and the annular fin 13d is narrower than the interval L4. That is, the interval becomes narrower toward the outer peripheral side. Therefore, since the contact area of the annular fin 6b with the air increases as it goes to the outer peripheral side, the heat dissipation efficiency increases as it goes to the outer peripheral side. Accordingly, it is possible to increase the temperature gradient that lowers the temperature on the outer peripheral side than the temperature on the central side, improve the thermal conductivity, and increase the heat dissipation efficiency of the heat sink 6 as a whole.

  Further, the heights H1 to H5 of the annular fins 13a to 13e are increased toward the outer peripheral side. That is, the height H2 of the annular fin 13b is higher than the height H1 of the annular fin 13a, the height H3 of the annular fin 13c is higher than the height H2 of the annular fin 13b, and the height H4 of the annular fin 13d is the annular fin. The height H3 of the annular fin 13e is higher than the height H4 of the annular fin 13d. Therefore, since the contact area of the annular fin 6b with the air increases as it goes to the outer peripheral side, the heat dissipation efficiency increases as it goes to the outer peripheral side. Accordingly, it is possible to increase the temperature gradient that lowers the temperature on the outer peripheral side than the temperature on the central side, improve the thermal conductivity, and increase the heat dissipation efficiency of the heat sink 6 as a whole.

  In the LED lamp 1 having the angle adjusting function configured as described above, the chip substrate 9 having the LED elements 9a is used, and the light emission direction thereof coincides with the thickness direction of the chip substrate 9. It is possible to shorten the axial length of the case 5 containing the substrate 9. Further, since the chip substrate 9 is in contact with the heat sink 6 provided in the case 5, the heat generated in the chip substrate 9 is radiated from the heat sink 6. At this time, since the annular fins 6b are formed so that the distances L1 to L5 between adjacent fins are narrower and the fin heights H1 to H5 are higher as they approach the outer peripheral side of the plate-like portion 6a. As it approaches the outer peripheral part, the contact area with the air increases, and as a result, the heat dissipation effect of the outer peripheral part increases. As a result, the temperature gradient that lowers the temperature on the outer peripheral side than the temperature on the central side can be increased, the thermal conductivity can be improved, and the heat dissipation efficiency of the entire heat sink 6 can be increased. Can be efficiently dissipated. Further, since the heat sink 6 is provided integrally with the case main body 5a, heat can be transferred from the heat sink 6 to the case main body 5a with good conductivity. Furthermore, since the external fin 5d is provided outside the case body 5a, heat can be released from the case 5 to the outside by the external fin 5d. Therefore, even if the chip substrate 9 is surrounded by the case 5 and the condenser lens 11, it is possible to provide the compact LED lamp 1 having high heat dissipation.

  In the present embodiment, since the case 5 is formed of a resin having high thermal conductivity, heat generated in the chip substrate 9 is transferred to the case 5 with high thermal conductivity via the heat sink 6. The heat dissipation effect becomes higher.

  Further, in the present embodiment, the heat generated from the control circuit 7 is conducted to the case 5 via a path different from the conduction path of the heat generated from the chip substrate 9. Does not change or changes little.

  In the above-described embodiment, the case 5 is formed of a resin having high thermal conductivity. However, the present invention is not limited to this, and the case 5 may be formed of aluminum. However, even in this case, the heat sink 6 and the external fin 5d are also formed integrally with the case body 5a from aluminum.

  In the above-described embodiment, as the plurality of annular fins 6b of the heat sink 6 approach the outer peripheral portion of the plate-like portion 6a, the distances L1 to L5 between adjacent fins are reduced and the fin heights H1 to H5 are increased. However, the present invention is not limited to this. For example, the distance L1 to L5 between adjacent fins may be narrowed as the outer peripheral part of the plate-like part 6a is approached, or the fin heights H1 to H5 are only increased as the outer peripheral part of the plate-like part 6a is approached. But you can. Moreover, it is not necessary to make the distances L1 to L5 between the fins closer to the outer peripheral portion of the plate-like portion 6a, the group on the outer peripheral portion side of the plate-like portion 6a is the same interval, and the inner group is closer to the outer peripheral portion side. May be narrow and at the same interval. Furthermore, regarding the height, it is not necessary to increase so as to approach the outer peripheral portion of the plate-like portion 6a, the group of the outer peripheral portion side of the plate-like portion 6a is the same height, the inner group is lower than the outer peripheral portion side, And it may be the same height.

  Further, in the above-described embodiment, five annular fins 6b are provided as internal fins of the heat sink 6. However, the present invention is not limited to this, and three, four, or six or more annular fins may be provided. Good.

  3-5 is a figure which shows the other example of the attachment support member applicable to the LED lamp 1 which has an angle adjustment function of this invention.

  3 includes an upper member 23a having an upper portion 23d attached to a wiring duct rail (not shown) as an attached portion provided on a ceiling or the like, and a case 5 around a horizontal axis B. The lower member 23b is rotatably supported, and the lower member 23b is supported in a suspended state, and the shaft portion 23c is attached to the upper member 23a so as to be rotatable about the vertical axis A. There is generally called a wiring duct system.

  The attachment support member 24 in FIG. 4 suspends the upper member 24a that is directly attached to the attachment portion such as the ceiling 110, the lower member 24b that supports the case 5 so as to be rotatable about the horizontal axis B, and the lower member 24b. The shaft portion 24c is supported in a state and has a shaft portion 24c attached to the upper member 24a so as to be rotatable about the vertical axis A. The shaft portion 24c is generally called a flange type.

  The mounting support member 25 in FIG. 5 suspends the upper member 25a that can be mounted with a convex portion such as furniture as a mounted portion, the lower member 25b that supports the case 5 so as to be rotatable about the horizontal axis B, and the lower member 25b. A shaft portion 25c supported in a lowered state and having an upper portion attached to the upper member 25a so as to be rotatable about the vertical axis A, and the upper member 25a is constituted by a clip having a clamping portion 25s. Yes, it is generally called a clip type.

  The mounting support member shown in FIGS. 3 to 5 is an example applicable to the LED lamp 1 having the angle adjustment function of the present invention, and mounting support members having other configurations may be used.

  FIG. 6 is a front sectional view showing an LED lamp having an angle adjustment function according to another embodiment of the present invention, and FIG. 7 is a plan view showing a case constituting the LED lamp having the angle adjustment function. In FIG. 6 and FIG. 7, the same parts as those in FIG.

  The LED lamp 1 </ b> A having the angle adjustment function constitutes a so-called embedded spotlight provided inside the embedded frame 30 embedded in the mounting hole 111 provided in the ceiling 110. The embedded frame 30 is recessed upward, and is detachably attached to the attachment hole 111 via the attachment member 31 in a state where the lower end peripheral portion 30 a is in contact with the lower surface periphery of the attachment hole 111. The mounting member 31 is obtained by processing a leaf spring, and the embedded frame 30 is mounted by sandwiching the peripheral portion of the mounting hole 111 in the thickness direction between the mounting member 31 and the lower peripheral portion 30a.

  The LED lamp 1A has a configuration in which the height position of the horizontal axis B is arranged close to the lower side. More specifically, outside the portion near the lower end of the case 5, a support hole 5i is provided in the extended piece 5j extended upward, while the lower member 3b of the hooking sealing cap 3 is extended downward. Further, by providing a support portion 3f that is locked to the support hole 5i at the lower end portion of the lower member 3b, the height position of the horizontal axis B ′ determined by the position of the support portion 3f is set to the chip substrate 9. Is set at almost the same height. Here, the position of the support portion 3f when the horizontal axis B 'is at the low position is C, and the position of the support portion 3f when the horizontal axis B is at the high position shown in FIG. 1 is D (see FIG. 8). ).

  In this configuration, as shown in FIG. 8, the chip substrate 9 and the horizontal axis B ′ are at substantially the same height position even if the light emission direction H is inclined by the angle θ from the vertically downward direction Ho. The amount of displacement of the lower end F of 5 in the horizontal direction is small. However, in the configuration in which the height position of the horizontal axis B is located at the upper end portion of the case 5 and away from the chip substrate 9, the lower end of the case 5 is inclined when the light emission direction H is inclined by the same angle θ from the direct downward direction Ho. The displacement of F in the horizontal direction is larger by the displacement amount E than in the case of the horizontal axis B ′. Therefore, the lower end F of the case 5 is greatly displaced, and depending on the angle θ, there is a possibility that the lower end F hits the inner surface of the embedded frame 30 and cannot be tilted to a desired angle. There is an inconvenience that the lower end on the opposite side may be greatly displaced downward and jump out of the lower end opening of the embedded frame 30. On the other hand, by setting the height position of the horizontal axis B ′ at substantially the same height position as the chip substrate 9 as shown in FIGS.

  Although the height position of the horizontal axis B ′ is preferably a position close to the height position of the chip substrate 9, the position is shifted according to the outer shape of the case 5 and the inner shape of the embedded frame 30. You may do it.

  6 and 7 exemplify the case where the hooking sealing cap 3 is used as the attachment support member, the present invention is not limited to this. In the embedded LED lamp 1A having an angle adjusting function, a wiring duct system shown in FIG. 3, a flange type shown in FIG. 4, or a clip type mounting support member shown in FIG. 5 can be used.

  Furthermore, the LED lamps 1 and 1A having the angle adjusting function of the present invention can be used in the form shown in FIGS. The example shown in FIG. 9 is a bracket type in which a hooking sealing cap 3 is attached to the other end of a support member 31 having one end attached to a wall-mounted metal fitting 30, and a case 5 having a chip substrate or the like is attached to the hooking sealing cap 3. It is the composition. In addition, 32 in FIG. 9 is a cover which covers the hook sealing cap 3.

  The example shown in FIG. 10 has a pendant type configuration in which the hooking sealing cap 3 is attached to the lower end of the wire cord 33 suspended from the ceiling, and the case 5 having a chip substrate or the like is attached to the lower side of the hooking sealing cap 3. is there. Note that reference numeral 34 in FIG. 10 denotes a cover that covers the hooking sealing cap 3.

  In the example shown in FIG. 11, the hanging sealing cap 3 is attached to the ceiling fitting 35 attached to the ceiling so as to be supported by the ceiling fitting 35, and the case 5 having a chip substrate or the like is provided below the hanging sealing cap 3. It is an installed sealing type configuration.

  In the example shown in FIG. 12, the attachment member 31 is attached to the case 5, and the peripheral portion of the attachment hole 111 is sandwiched in the thickness direction between the attachment member 31 and the flange 5 g provided outside the lower end of the case 5. Thus, an LED lamp having an angle adjusting function is directly attached to the ceiling 110. In FIG. 12, the attachment member 31 is attached to the extended piece 5 j of the case 5, but it may be attached to another part of the case 5.

  9 to 12, the hooking sealing cap 3 is used. Instead of the hooking sealing cap 3, the wiring duct system shown in FIG. 3, the flange type shown in FIG. 4, or FIG. A clip-type attachment support member shown in FIG.

100 hook sealing plug (attached part)
110 Ceiling (attached part)
1, 1A LED lamp with angle adjustment function 3 Catch ceiling cap (mounting support member)
5 Case 5d External fin 6 Heat sink 6a Plate-like part 6b Annular fin (internal fin)
H1 to H5 Ring fin height L1 to L5 Distance between fins 7 Control circuit 9 Chip substrate 9a LED element 11 Condensing lens 23, 24, 25 Mounting support member

Claims (3)

An attachment support member detachably attached to a predetermined attached portion;
A case that is supported by the mounting support member so that the angle can be changed, and has a heat sink integrally inside and an external fin integrally on the outside,
A chip substrate having an LED element, in contact with the heat sink of the case, and disposed on the opposite side of the heat sink from the LED element;
In the case, provided with a condenser lens provided on the opposite side of the heat sink of the chip substrate,
An LED lamp having an angle adjustment function, wherein the heat sink includes a plate-like portion that comes into contact with the chip substrate, and an internal fin that is provided on the opposite side of the plate-like portion from the chip substrate. The LED lamp having an angle adjusting function according to claim 1,
The inner fin includes a plurality of annular fins provided concentrically, and the plurality of annular fins are closer to the outer peripheral side of the plate-like portion so that the interval between adjacent fins is narrower and the fin height is higher. The LED lamp which has an angle adjustment function characterized by being formed in this. The LED lamp having an angle adjustment function according to claim 1 or 2,
A control circuit for controlling the lighting of the LED element is supported in a fall-prevented state by a protrusion protruding inward on the inner surface of the case, and heat generated from the control circuit via the protrusion is generated in the case. An LED lamp having an angle adjusting function, characterized in that the LED lamp has a function of adjusting an angle.

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