JP5922965B2 - 基板保持装置、研磨装置、および研磨方法 - Google Patents

基板保持装置、研磨装置、および研磨方法 Download PDF

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Publication number
JP5922965B2
JP5922965B2 JP2012076677A JP2012076677A JP5922965B2 JP 5922965 B2 JP5922965 B2 JP 5922965B2 JP 2012076677 A JP2012076677 A JP 2012076677A JP 2012076677 A JP2012076677 A JP 2012076677A JP 5922965 B2 JP5922965 B2 JP 5922965B2
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Japan
Prior art keywords
retainer ring
ring
polishing
top ring
outer retainer
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JP2012076677A
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Japanese (ja)
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JP2013202755A (ja
JP2013202755A5 (https=
Inventor
誠 福島
誠 福島
安田　穂積
穂積 安田
並木　計介
計介 並木
鍋谷　治
治 鍋谷
真吾 富樫
真吾 富樫
暁 山木
暁 山木
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Ebara Corp
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Ebara Corp
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Priority to JP2012076677A priority Critical patent/JP5922965B2/ja
Priority to TW107108374A priority patent/TWI674171B/zh
Priority to TW102100196A priority patent/TWI639485B/zh
Priority to US13/752,659 priority patent/US9662764B2/en
Priority to KR1020130010473A priority patent/KR101879462B1/ko
Publication of JP2013202755A publication Critical patent/JP2013202755A/ja
Publication of JP2013202755A5 publication Critical patent/JP2013202755A5/ja
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2012076677A 2012-01-31 2012-03-29 基板保持装置、研磨装置、および研磨方法 Active JP5922965B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012076677A JP5922965B2 (ja) 2012-03-29 2012-03-29 基板保持装置、研磨装置、および研磨方法
TW107108374A TWI674171B (zh) 2012-01-31 2013-01-04 基板保持裝置、研磨裝置、及研磨方法
TW102100196A TWI639485B (zh) 2012-01-31 2013-01-04 基板保持裝置、研磨裝置、及研磨方法
US13/752,659 US9662764B2 (en) 2012-01-31 2013-01-29 Substrate holder, polishing apparatus, and polishing method
KR1020130010473A KR101879462B1 (ko) 2012-01-31 2013-01-30 기판 유지 장치, 연마 장치 및 연마 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012076677A JP5922965B2 (ja) 2012-03-29 2012-03-29 基板保持装置、研磨装置、および研磨方法

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JP2013202755A JP2013202755A (ja) 2013-10-07
JP2013202755A5 JP2013202755A5 (https=) 2015-03-05
JP5922965B2 true JP5922965B2 (ja) 2016-05-24

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6403981B2 (ja) * 2013-11-13 2018-10-10 株式会社荏原製作所 基板保持装置、研磨装置、研磨方法、およびリテーナリング
JP6232297B2 (ja) 2014-01-21 2017-11-15 株式会社荏原製作所 基板保持装置および研磨装置
JP6336893B2 (ja) * 2014-11-11 2018-06-06 株式会社荏原製作所 研磨装置
JP6392193B2 (ja) * 2015-10-14 2018-09-19 株式会社荏原製作所 基板保持装置および基板研磨装置ならびに基板保持装置の製造方法
KR101704492B1 (ko) * 2015-12-29 2017-02-09 주식회사 케이씨텍 화학 기계적 연마 장치용 연마 헤드
CN111266993B (zh) * 2018-12-05 2023-06-30 凯斯科技股份有限公司 化学机械式研磨装置用承载头的卡环及具备其的承载头
TWI840511B (zh) * 2019-02-28 2024-05-01 美商應用材料股份有限公司 用於化學機械研磨承載頭的固定器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6113468A (en) * 1999-04-06 2000-09-05 Speedfam-Ipec Corporation Wafer planarization carrier having floating pad load ring
JP4056205B2 (ja) * 1999-10-15 2008-03-05 株式会社荏原製作所 ポリッシング装置および方法
JP3753577B2 (ja) * 1999-11-16 2006-03-08 株式会社荏原製作所 基板保持装置及び該基板保持装置を備えたポリッシング装置
JP2002270556A (ja) * 2001-03-09 2002-09-20 Tokyo Seimitsu Co Ltd ウェーハ研磨装置
JP2003282505A (ja) * 2002-03-26 2003-10-03 Fujikoshi Mach Corp ウエーハの研磨装置
JP4264289B2 (ja) * 2003-04-22 2009-05-13 信越半導体株式会社 ウエーハ研磨装置及びその研磨ヘッド並びにウエーハ研磨方法
JP2008307674A (ja) * 2007-06-18 2008-12-25 Tokyo Seimitsu Co Ltd 分割加圧型リテーナリング
JP5199691B2 (ja) * 2008-02-13 2013-05-15 株式会社荏原製作所 研磨装置
JP5744382B2 (ja) * 2008-07-24 2015-07-08 株式会社荏原製作所 基板処理装置および基板処理方法

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Publication number Publication date
JP2013202755A (ja) 2013-10-07

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