JP5920981B2 - 基板処理システム - Google Patents

基板処理システム Download PDF

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Publication number
JP5920981B2
JP5920981B2 JP2012213573A JP2012213573A JP5920981B2 JP 5920981 B2 JP5920981 B2 JP 5920981B2 JP 2012213573 A JP2012213573 A JP 2012213573A JP 2012213573 A JP2012213573 A JP 2012213573A JP 5920981 B2 JP5920981 B2 JP 5920981B2
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substrate
carrier
processing
unit
block
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JP2012213573A
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Japanese (ja)
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JP2014067940A (ja
JP2014067940A5 (enExample
Inventor
郁雄 須中
郁雄 須中
勝洋 森川
勝洋 森川
智伸 古庄
智伸 古庄
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2012213573A priority Critical patent/JP5920981B2/ja
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Publication of JP2014067940A5 publication Critical patent/JP2014067940A5/ja
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Publication of JP5920981B2 publication Critical patent/JP5920981B2/ja
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2012213573A 2012-09-27 2012-09-27 基板処理システム Active JP5920981B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012213573A JP5920981B2 (ja) 2012-09-27 2012-09-27 基板処理システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012213573A JP5920981B2 (ja) 2012-09-27 2012-09-27 基板処理システム

Publications (3)

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JP2014067940A JP2014067940A (ja) 2014-04-17
JP2014067940A5 JP2014067940A5 (enExample) 2014-11-27
JP5920981B2 true JP5920981B2 (ja) 2016-05-24

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JP2012213573A Active JP5920981B2 (ja) 2012-09-27 2012-09-27 基板処理システム

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JP (1) JP5920981B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101919122B1 (ko) * 2014-08-12 2018-11-15 주식회사 제우스 공정 분리형 기판 처리장치 및 처리방법
JP6929105B2 (ja) * 2017-04-06 2021-09-01 東京エレクトロン株式会社 基板処理装置および基板処理方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08115968A (ja) * 1994-10-13 1996-05-07 Touyoko Kagaku Kk 多段式複数チャンバ真空熱処理装置
US6749390B2 (en) * 1997-12-15 2004-06-15 Semitool, Inc. Integrated tools with transfer devices for handling microelectronic workpieces
JPH1074818A (ja) * 1996-09-02 1998-03-17 Tokyo Electron Ltd 処理装置
JP3462405B2 (ja) * 1998-10-29 2003-11-05 東京エレクトロン株式会社 処理装置
JP3845585B2 (ja) * 2002-01-25 2006-11-15 東京エレクトロン株式会社 処理装置
JP4209658B2 (ja) * 2002-10-22 2009-01-14 東京エレクトロン株式会社 基板処理装置
JP4464993B2 (ja) * 2007-06-29 2010-05-19 東京エレクトロン株式会社 基板の処理システム
JP5284808B2 (ja) * 2009-01-26 2013-09-11 株式会社Ｓｏｋｕｄｏ ストッカー装置及び基板処理装置
JP2010251380A (ja) * 2009-04-10 2010-11-04 Tokyo Seimitsu Co Ltd ウエハローディング・アンローディング方法および装置

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JP2014067940A (ja) 2014-04-17

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