JP5917817B2 - ワイヤーボンディング構造 - Google Patents
ワイヤーボンディング構造 Download PDFInfo
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- JP5917817B2 JP5917817B2 JP2011067006A JP2011067006A JP5917817B2 JP 5917817 B2 JP5917817 B2 JP 5917817B2 JP 2011067006 A JP2011067006 A JP 2011067006A JP 2011067006 A JP2011067006 A JP 2011067006A JP 5917817 B2 JP5917817 B2 JP 5917817B2
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- Prior art keywords
- wire
- electrode
- substrate
- bonding
- light emitting
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- Engineering & Computer Science (AREA)
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Description
12,13 配線パターン
12a,13a,14a 凹欠部
14 ダイボンド電極
15 発光素子
15a,15b 電極
16 ダイボンド用樹脂
17,18 ワイヤー
17a,18a 降下部
17b,18b 延伸部
17c,18c 垂れ部
19 封止樹脂
20 キャピラリ
21 金線
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Claims (1)
- 基板上に形成されたダイボンド電極上に取り付けられた素子のファースト電極と前記基板上に形成されたセカンド電極とをワイヤーにより接続し且つ封止樹脂で封止されるワイヤーボンディング構造であって、
前記ワイヤーが、前記素子のファースト電極から前記素子近傍の前記基板の表面に接近する位置まで垂れ下がる下降部と、この下降部の先端部分に作られるワイヤーの弛みを持った状態の垂れ部と、この垂れ部の先端から前記基板の表面近傍をその表面に沿って延伸して前記セカンド電極に接続される延伸部とを有し、
前記セカンド電極には、前記延伸部に適合する位置に切欠き又は孔からなる凹欠部が設けられ、
前記ダイボンド電極には、前記延伸部に相対する位置に切欠きからなる凹欠部が設けられ、
前記ワイヤーは、前記下降部の先端部分に作られるワイヤーの垂れ部が、前記ダイボンド電極及び前記セカンド電極の各電極面より基板表面に接近した位置に配置され、基板表面に接近した状態のまま前記延伸部が前記セカンド電極の凹欠部内を延伸して前記セカンド電極に接続され、前記ダイボンド電極の凹欠部により前記延伸部とダイボンド電極との接触が防止されることを特徴とするワイヤーボンディング構造。
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