JP5907652B2 - プラズマ処理装置 - Google Patents
プラズマ処理装置 Download PDFInfo
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- JP5907652B2 JP5907652B2 JP2010239107A JP2010239107A JP5907652B2 JP 5907652 B2 JP5907652 B2 JP 5907652B2 JP 2010239107 A JP2010239107 A JP 2010239107A JP 2010239107 A JP2010239107 A JP 2010239107A JP 5907652 B2 JP5907652 B2 JP 5907652B2
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- 238000012545 processing Methods 0.000 title claims description 75
- 230000005684 electric field Effects 0.000 claims description 20
- 230000008878 coupling Effects 0.000 claims description 15
- 238000010168 coupling process Methods 0.000 claims description 15
- 238000005859 coupling reaction Methods 0.000 claims description 15
- 230000010363 phase shift Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 description 22
- 239000007789 gas Substances 0.000 description 16
- 238000009616 inductively coupled plasma Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 12
- 238000005530 etching Methods 0.000 description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 9
- 239000004020 conductor Substances 0.000 description 8
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- 238000004804 winding Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 230000001066 destructive effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
- H01J37/3211—Antennas, e.g. particular shapes of coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/22—Removing surface-material, e.g. by engraving, by etching
- B44C1/227—Removing surface-material, e.g. by engraving, by etching by etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32155—Frequency modulation
- H01J37/32165—Plural frequencies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Description
Claims (10)
- 内部処理容積を有する処理チャンバと、
処理チャンバに近接して配置された、RFエネルギーを処理容積に結合するための第1RFコイルと、
処理チャンバに近接して配置された、RFエネルギーを処理容積に結合するための第2RFコイルであって、第2RFコイルが第1RFコイルに対して同軸に配置され、第1及び第2RFコイルが、第1RFコイルを流れるRF電流が第2RFコイルを流れるRF電流とは異相になるように構成される第2RFコイルと、
RF給電構造であって、
第1RFコイルに結合された第1RF給電部と、
第2RFコイルに結合され、第1RF給電部に対して同軸に配置された第2RF給電部を含むRF給電構造を含み、
第2RF給電部は、第1及び第2RFコイルに近接した第1端部と第1端部とは反対の第2端部とを有する導電性チューブを含み、導電性チューブの第1及び第2端部が2〜20cmの長さで隔てられているため、第1及び第2RF給電部にRF電流を流すことによって形成される磁場が、第1及び第2RFコイルにRF電流を流すことによって形成される電場の対称性に影響を及ぼさないプラズマ処理装置。 - 第1RFコイルが第1方向に巻回され、第2RFコイルが第1方向とは反対の第2方向に巻回される請求項1記載の装置。
- 第2RFコイルが第1RFコイルの周囲に同軸に配置される請求項1記載の装置。
- 第1RFコイル又は第2RFコイルのいずれかに連結された、流れるRF電流の位相をシフトさせるための位相シフト装置を含む請求項1記載の装置。
- 位相シフト装置がRF電流の位相をシフトさせることによって、第1RFコイルを流れるRF電流が、第2RFコイルを流れるRF電流とは180°異相である請求項4記載の装置。
- 内部処理容積を有する処理チャンバと、
処理チャンバに近接して配置された、RFエネルギーを処理容積に結合するための、第1方向に巻回された第1RFコイルと、
処理チャンバに近接して配置された、RFエネルギーを処理容積に結合するための第2RFコイルであって、第2RFコイルが第1RFコイルに対して同軸に配置され且つ第1方向とは反対の第2方向に巻回されているため、RF電流が第1RFコイルを第1方向に流れ、第2RFコイルを第2方向に流れる第2RFコイルと、
RF給電構造であって、
第1RFコイルに結合された第1RF給電部と、
第2RFコイルに結合され、第1RF給電部に対して同軸に配置された第2RF給電部を含むRF給電構造を含み、
第2RF給電部は、第1及び第2RFコイルに近接した第1端部と第1端部とは反対の第2端部とを有する導電性チューブを含み、導電性チューブの第1及び第2端部が2〜20cmの長さで隔てられているため、第1及び第2RF給電部にRF電流を流すことによって形成される磁場が、第1及び第2RFコイルにRF電流を流すことによって形成される電場の対称性に影響を及ぼさないRF給電構造を含むプラズマ処理装置。
- 第1RFコイルを流れるRF電流が、第2RFコイルを流れるRF電流に対して180°異相である請求項6記載の装置。
- 第2RFコイルが第1RFコイルの周囲に同軸に配置される請求項6記載の装置。
- 第1RFコイルが更に、複数の対称的に配置された第1コイル要素を含み、第2RFコイルが更に、複数の対称的に配置された第2コイル要素を含む請求項8記載の装置。
- 第1コイル要素の数が2であり、第2コイル要素の数が4である又は第1コイル要素の数が4であり、第2コイル要素の数が4である請求項9記載の装置。
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Application Number | Priority Date | Filing Date | Title |
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US25483309P | 2009-10-26 | 2009-10-26 | |
US61/254,833 | 2009-10-26 | ||
US12/821,609 | 2010-06-23 | ||
US12/821,609 US20110094994A1 (en) | 2009-10-26 | 2010-06-23 | Inductively coupled plasma apparatus |
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JP2011124221A JP2011124221A (ja) | 2011-06-23 |
JP5907652B2 true JP5907652B2 (ja) | 2016-04-26 |
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US (3) | US20110094994A1 (ja) |
JP (1) | JP5907652B2 (ja) |
KR (1) | KR101558295B1 (ja) |
CN (1) | CN102056393B (ja) |
TW (1) | TWI540941B (ja) |
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CN101742454B (zh) | 2008-11-26 | 2012-10-17 | 华为技术有限公司 | 一种移动受限终端紧急业务的管理方法、装置与系统 |
JP5572329B2 (ja) * | 2009-01-15 | 2014-08-13 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置およびプラズマ生成装置 |
US20110097901A1 (en) | 2009-10-26 | 2011-04-28 | Applied Materials, Inc. | Dual mode inductively coupled plasma reactor with adjustable phase coil assembly |
US20110094683A1 (en) | 2009-10-26 | 2011-04-28 | Applied Materials, Inc. | Rf feed structure for plasma processing |
-
2010
- 2010-06-23 US US12/821,609 patent/US20110094994A1/en not_active Abandoned
- 2010-06-28 TW TW099121079A patent/TWI540941B/zh active
- 2010-07-28 CN CN201010240670.2A patent/CN102056393B/zh active Active
- 2010-08-24 KR KR1020100081876A patent/KR101558295B1/ko active IP Right Grant
- 2010-10-25 JP JP2010239107A patent/JP5907652B2/ja active Active
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2013
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Also Published As
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KR20110046249A (ko) | 2011-05-04 |
US20110094994A1 (en) | 2011-04-28 |
US20160196953A1 (en) | 2016-07-07 |
KR101558295B1 (ko) | 2015-10-07 |
CN102056393A (zh) | 2011-05-11 |
TW201127225A (en) | 2011-08-01 |
JP2011124221A (ja) | 2011-06-23 |
US20130134129A1 (en) | 2013-05-30 |
US10573493B2 (en) | 2020-02-25 |
CN102056393B (zh) | 2016-01-20 |
TWI540941B (zh) | 2016-07-01 |
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