JP5900006B2 - 電子デバイスの封止方法 - Google Patents

電子デバイスの封止方法 Download PDF

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Publication number
JP5900006B2
JP5900006B2 JP2012033809A JP2012033809A JP5900006B2 JP 5900006 B2 JP5900006 B2 JP 5900006B2 JP 2012033809 A JP2012033809 A JP 2012033809A JP 2012033809 A JP2012033809 A JP 2012033809A JP 5900006 B2 JP5900006 B2 JP 5900006B2
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Japan
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lid
region
sealing material
base
material layer
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JP2012033809A
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Japanese (ja)
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JP2013171907A5 (enExample
JP2013171907A (ja
Inventor
俊二 冨岡
俊二 冨岡
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2012033809A priority Critical patent/JP5900006B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

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  • Pressure Sensors (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2012033809A 2012-02-20 2012-02-20 電子デバイスの封止方法 Expired - Fee Related JP5900006B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012033809A JP5900006B2 (ja) 2012-02-20 2012-02-20 電子デバイスの封止方法

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Application Number Priority Date Filing Date Title
JP2012033809A JP5900006B2 (ja) 2012-02-20 2012-02-20 電子デバイスの封止方法

Publications (3)

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JP2013171907A JP2013171907A (ja) 2013-09-02
JP2013171907A5 JP2013171907A5 (enExample) 2015-03-19
JP5900006B2 true JP5900006B2 (ja) 2016-04-06

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JP2012033809A Expired - Fee Related JP5900006B2 (ja) 2012-02-20 2012-02-20 電子デバイスの封止方法

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JP (1) JP5900006B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015119378A (ja) * 2013-12-19 2015-06-25 日本電波工業株式会社 高安定発振器
JPWO2016111038A1 (ja) * 2015-01-08 2017-09-07 株式会社村田製作所 圧電振動部品及びその製造方法
JP6499886B2 (ja) * 2015-03-11 2019-04-10 田中貴金属工業株式会社 電子部品封止用キャップ
JP6862681B2 (ja) * 2016-05-23 2021-04-21 日本電気硝子株式会社 気密パッケージの製造方法及び気密パッケージ
CN106304827B (zh) * 2016-10-08 2021-03-05 西安西光精细化工有限公司 一种抗高过载电子部件灌封工艺
JP2020036179A (ja) * 2018-08-30 2020-03-05 日本電波工業株式会社 圧電デバイス

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11191601A (ja) * 1997-12-26 1999-07-13 Sumitomo Metal Smi Electron Devices Inc 半導体パッケージ気密封止用リッド
JP3960156B2 (ja) * 2002-07-19 2007-08-15 千住金属工業株式会社 板状基板封止用リッドの製造方法
JP2009295780A (ja) * 2008-06-05 2009-12-17 Daishinku Corp 表面実装型電子部品の製造方法

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JP2013171907A (ja) 2013-09-02

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