JP5898679B2 - 粘着テープおよび半導体ウエハ加工方法 - Google Patents

粘着テープおよび半導体ウエハ加工方法 Download PDF

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Publication number
JP5898679B2
JP5898679B2 JP2013518163A JP2013518163A JP5898679B2 JP 5898679 B2 JP5898679 B2 JP 5898679B2 JP 2013518163 A JP2013518163 A JP 2013518163A JP 2013518163 A JP2013518163 A JP 2013518163A JP 5898679 B2 JP5898679 B2 JP 5898679B2
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JP
Japan
Prior art keywords
semiconductor wafer
adhesive tape
pressure
sensitive adhesive
outer peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013518163A
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English (en)
Japanese (ja)
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JPWO2012165551A1 (ja
Inventor
太郎 稲田
太郎 稲田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Priority to JP2013518163A priority Critical patent/JP5898679B2/ja
Publication of JPWO2012165551A1 publication Critical patent/JPWO2012165551A1/ja
Application granted granted Critical
Publication of JP5898679B2 publication Critical patent/JP5898679B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2013518163A 2011-06-02 2012-05-31 粘着テープおよび半導体ウエハ加工方法 Active JP5898679B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013518163A JP5898679B2 (ja) 2011-06-02 2012-05-31 粘着テープおよび半導体ウエハ加工方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011123930 2011-06-02
JP2011123930 2011-06-02
JP2013518163A JP5898679B2 (ja) 2011-06-02 2012-05-31 粘着テープおよび半導体ウエハ加工方法
PCT/JP2012/064083 WO2012165551A1 (fr) 2011-06-02 2012-05-31 Ruban sensible à la pression et procédé de traitement de tranches semiconductrices

Publications (2)

Publication Number Publication Date
JPWO2012165551A1 JPWO2012165551A1 (ja) 2015-02-23
JP5898679B2 true JP5898679B2 (ja) 2016-04-06

Family

ID=47259403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013518163A Active JP5898679B2 (ja) 2011-06-02 2012-05-31 粘着テープおよび半導体ウエハ加工方法

Country Status (3)

Country Link
JP (1) JP5898679B2 (fr)
TW (1) TWI578375B (fr)
WO (1) WO2012165551A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5947313B2 (ja) * 2011-12-02 2016-07-06 デンカ株式会社 粘着シート及び粘着シートを用いた電子部品の製造方法
JP6545601B2 (ja) * 2015-10-23 2019-07-17 アキレス株式会社 セパレータ
WO2019016960A1 (fr) * 2017-07-21 2019-01-24 日立化成株式会社 Procédé de production d'un corps assemblé, corps assemblé, affichage à cristaux liquides et dispositif d'affichage d'image
WO2020175364A1 (fr) * 2019-02-26 2020-09-03 株式会社ディスコ Feuille adhésive d'affûtage de dos et procédé de fabrication d'un semi-conducteur étagé
KR20210128388A (ko) 2019-02-26 2021-10-26 가부시기가이샤 디스코 이면 연삭용 점착 시트 및 반도체 웨이퍼의 제조 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS64286A (en) * 1987-06-22 1989-01-05 Tatsuo Okazaki Rust inhibitive method for water supply
JPH041286A (ja) * 1990-04-18 1992-01-06 Toray Ind Inc 粘着フイルム
JPH0812949A (ja) * 1994-07-01 1996-01-16 Sekisui Chem Co Ltd 粘着フィルムもしくはテープ
JP2003027665A (ja) * 2001-07-18 2003-01-29 Three M Innovative Properties Co 硬質屋根材用粘着フィルム
JP2007324186A (ja) * 2006-05-30 2007-12-13 Hitachi High-Technologies Corp プラズマ処理装置
JP5431777B2 (ja) * 2009-04-20 2014-03-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
TW201308394A (zh) 2013-02-16
TWI578375B (zh) 2017-04-11
JPWO2012165551A1 (ja) 2015-02-23
WO2012165551A1 (fr) 2012-12-06

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