JP5878763B2 - タンパク質層を有する電子デバイス - Google Patents
タンパク質層を有する電子デバイス Download PDFInfo
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- JP5878763B2 JP5878763B2 JP2011551508A JP2011551508A JP5878763B2 JP 5878763 B2 JP5878763 B2 JP 5878763B2 JP 2011551508 A JP2011551508 A JP 2011551508A JP 2011551508 A JP2011551508 A JP 2011551508A JP 5878763 B2 JP5878763 B2 JP 5878763B2
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- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B82Y40/00—Manufacture or treatment of nanostructures
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- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
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- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1606—Graphene
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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Description
グラフェンとは、sp2結合炭素原子の1原子厚平面シートのみから実質的になる材料を一般的に指す。グラフェンには、炭素原子がハチの巣状の結晶格子に高密度に充填されている。
以下の記載において、グラフェン電子デバイス中の機能性層としてのハイドロフォビンタンパク質の使用方法を示す。一実施形態によれば、既存のシリコン技術は、自己組織化したタンパク質層からなる薄膜と適合しうる。一実施形態によれば、かようなデバイスはセンサーとして使用することができる。かようなセンシングデバイスを得る手段としては、グラフェンの表面を、その層と接触させる検体に対して特異性を有する認識要素で機能化することが挙げられる。
Lemmetyinen,H.;Peltonen,J. Linder,M.B.による,Self-assembled hydrophobin protein films at the air-water interface: Structural and molecular engineering Biochemistry,2007,46,234-2354の刊行物に記載されている。
最高品質(ZYAグレード、10μm2までのドメインサイズ)の高配向の熱分解グラファイト(HOPG)もしくはキッシュグラファイトの小さい断片(<1mg)、pH8の10mMリン酸ナトリウム緩衝溶液中の0.02〜0.026mMタンパク質(HFBI野生型または融合タンパク質NCysHFBI)、または脱イオン水を含む0.5〜1.0mlの溶液に対して先端ソニケーター中で超音波を照射することによって、グラフェンの剥離を行った。プローブの大きさは26μmに設定した。溶液の温度は、超音波処置の間氷浴中に試料を保持することによって制御した。試料は合計で10分間超音波処理下にさらしたが、溶液の沸騰を防ぐため、超音波処理の小中止を約1分間隔でし続けた。従って、超音波処理温度は0〜100℃の間に保たれた。超音波処理の後、試料を500rpmで15分間遠心分離して、グラファイトのより重い断片の堆積を促進した。上澄みはさらなる分析に使用した。
キッシュグラファイトおよびHOPGピラーからのグラフェン剥離もまた、実験によって試験した。グラファイト片およびハイドロフォビンタンパク質を水溶液中で40分間、超音波浴(Branson,Bransonic 1510,周波数40kHz)で超音波照射して、グラフェンおよび薄いグラファイトシートの剥離を行った。使用したタンパク質は、野生型HFBIおよびその融合(NCysHBFI)2二両体およびHFBI-ZEであった。超純水(Millipore)に0.3〜1ml容積のタンパク質が溶解した、1.0〜3mg/ml溶液中で剥離を行った。化学的に精製したキッシュグラファイトは、タンパク質溶液中に入れて上記のように処理した顆粒として加えた。HOPGから製造した、リソグラフィー処理したウェーハを、マイクロピラーおよび支持グラファイトウェーハを含むプレートレットとして溶液中に浸し、超音波浴中にて超音波処理した。
数層厚のグラフェン層の電気特性に対するハイドロフォビンタンパク質の効果を、ボトムゲート電界効果トランジスタのセットアップ上で測定した。図15は数層グラフェンFETの横断面を表す概要図である。基板は、300nmのSiO2層を有する高ドープp型シリコンウェーハとした。高pドープ基板は背面ゲートとして使用し、300nmSiO2はゲート酸化物として機能した。グラフェンはセロテープ(登録商標)法により基板に移し、共焦点ラマン顕微鏡法を用いてグラフェンシートの2重層特性を測定した。Au上部コンタクトはグラフェンの最上部上に蒸着し、パターニングした。Pt接着層を用いて、表面上での金の接着を向上させた。
酸化還元酵素/ハイロドロフォビン融合タンパク質(ラッカーゼおよびグルコース酸化酵素)を調製したところ、それは疎水性表面に接着することができ、特異的な基板と選択的に反応する。グルコース酸化酵素は糖尿病の診断および治療への応用において特に興味深い。これらのタンパク質は上記実施形態においても使用できる。
Claims (33)
- 生物的材料および電気的材料並びに該生物的材料と該電気的材料との界面を含む電子デバイスの製造方法であって、
該電子デバイスを製造する際、所望の位置でタンパク質の自己組織化を利用することを特徴とし、
前記電気的材料としてグラフェン又はシリコンからなる半導体層を含み、前記タンパク質がハイドロフォビンを含む機能化タンパク質であり、
前記タンパク質が、前記半導体層表面と接触させて設けられている
、電子デバイスの製造方法。 - 生物的材料および電気的材料並びに該生物的材料と該電気的材料との界面を含む電子デバイスの製造方法であって、
該電子デバイスを製造する際、所望の位置でタンパク質の自己組織化を利用することを特徴とし、
前記電気的材料としてグラフェン又はシリコンからなる半導体層を含み、前記タンパク質がハイドロフォビンを含む機能化タンパク質であり、
前記タンパク質が、前記半導体層上に設けられた疎水性層表面と接触させて設けられている
、電子デバイスの製造方法。 - 前記電気的材料がシリコン技術によって調製され、前記タンパク質は生体分子の認識に利用される、請求項1又は2に記載の電子デバイスの製造方法。
- 前記生物的材料はHFBIの単層膜を含み、該単層膜はエレクトロニクスで使用する従来材料と界面で結合する、請求項1〜3のいずれか1項に記載の電子デバイスの製造方法。
- 前記所望の位置は、前記電子デバイスの一部を形成し、疎水性の表面を含む、請求項1〜4のいずれか1項に記載の電子デバイスの製造方法。
- 前記電子デバイスは、基板と、疎水性領域および非疎水性領域を有する前記基板の表面と、を含み、前記疎水性領域が前記所望の位置を形成し、前記タンパク質が前記所望の位置で選択的に自己組織化する、請求項1〜5のいずれか1項に記載の電子デバイスの製造方法。
- 前記電子デバイスは、基板と、疎水性領域および親水性領域を有する前記基板の表面と、を含み、前記疎水性領域が前記所望の位置を形成し、前記タンパク質が前記所望の位置で選択的に自己組織化する、請求項1〜5のいずれか1項に記載の電子デバイスの製造方法。
- 前記タンパク質は前記所望の位置で層を形成する、請求項1〜7のいずれか1項に記載の電子デバイスの製造方法。
- 前記タンパク質は前記所望の位置で単層を形成する、請求項1〜8のいずれか1項に記載の電子デバイスの製造方法。
- タンパク質の前記層が前記電子デバイスに機能的誘電体として含まれる、請求項8に記載の電子デバイスの製造方法。
- タンパク質の前記単層が前記電子デバイスに機能的誘電体として含まれる、請求項9に記載の電子デバイスの製造方法。
- 前記タンパク質は両親媒性タンパク質を含む、請求項1〜11のいずれか1項に記載の電子デバイスの製造方法。
- 前記タンパク質はハイドロフォビンを含む、請求項1〜12のいずれか1項に記載の電子デバイスの製造方法。
- 前記タンパク質が融合タンパク質を含み、該融合たんぱく質は少なくとも2つの機能部位を含み、該機能部位の少なくとも1つはハイドロフォビンによって形成される、請求項1〜13のいずれか1項に記載の電子デバイスの製造方法。
- 前記ハイドロフォビンはクラスIIハイドロフォビンである、請求項13または14に記載の電子デバイスの製造方法。
- 前記ハイドロフォビンはTrichoderma reesei由来である、請求項13〜15のいずれか1項に記載の電子デバイスの製造方法。
- 前記タンパク質は、HFBI、融合タンパク質NCysHFBIおよび融合タンパク質HFBI−ZEの少なくとも1つを含む、請求項13〜16のいずれか1項に記載の電子デバイスの製造方法。
- 前記利用は、前記タンパク質を含む溶液中に前記表面を浸す工程を含む、請求項1〜17のいずれか1項に記載の電子デバイスの製造方法。
- 前記利用は、
前記電子デバイスの外側の前記所望の位置で前記タンパク質の層を形成する工程と、
形成した前記タンパク質の層を前記電子デバイスの表面と接触させて、前記電子デバイスの前記表面上に前記タンパク質の層を接着する工程と、
を含む、請求項1〜18のいずれか1項に記載の電子デバイスの製造方法。 - 構造部としてタンパク質層及び半導体層を含み、前記タンパク質層がハイドロフォビンタンパク質を含む機能化タンパク質を含み、
前記半導体層が、グラフェン又はシリコンからなり、
前記タンパク質層が、前記半導体層表面と接触させて設けられていることを特徴とする、電子デバイス。 - 構造部としてタンパク質層、グラフェン又はシリコンからなる半導体層、及び疎水性層を含み、前記タンパク質層がハイドロフォビンタンパク質を含み、
前記タンパク質層が、前記半導体層上に設けられた疎水性層表面と接触させて設けられていることを特徴とする、電子デバイス。 - 前記タンパク質層が前記電子デバイスで誘電体層を形成する、請求項20又は21に記載の電子デバイス。
- 前記電子デバイスがゲート誘電体を含む電界効果トランジスタであって、前記タンパク質層が前記ゲート誘電体の少なくとも一部を形成する、請求項20又は21に記載の電子デバイス。
- 前記タンパク質層に隣接した伝導チャネルを含み、前記タンパク質層が前記チャネルの伝導性を制御する機能化層である、請求項20〜23のいずれか1項に記載の電子デバイス。
- 疎水性表面を含む構造部を有し、前記タンパク質層を前記疎水性表面上に配置する、請求項20〜24のいずれか1項に記載の電子デバイス。
- 前記疎水性表面を含む構造部は、グラフェン、シリコンまたはポリスチレンからなる、請求項25に記載の電子デバイス。
- 前記タンパク質層が融合タンパク質を含む、請求項20〜26のいずれか1項に記載の電子デバイス。
- 前記融合タンパク質が第1機能部位および少なくとも1つの第2機能部位を含み、前記第1機能部位がハイドロフォビンによって形成される、請求項27に記載の電子デバイス。
- 前記タンパク質層がクラスIIハイドロフォビンを含む、請求項20〜28のいずれか1項に記載の電子デバイス。
- 前記タンパク質層はTrichoderma reesei由来のハイドロフォビンを含む、請求項20〜29のいずれか1項に記載の電子デバイス。
- 前記タンパク質層はHFBIおよび融合タンパク質NCysHFBIの少なくとも1つを含む、請求項20〜30のいずれか1項に記載の電子デバイス。
- 前記タンパク質層はタンパク質の秩序性ネットワークによって形成される、請求項20〜31のいずれか1項に記載の電子デバイス。
- 前記タンパク質層は金属ナノ粒子、半導体ナノ粒子および/または発色団などのナノ粒子を含む、請求項20〜32のいずれか1項に記載の電子デバイス。
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FR2929618B1 (fr) * | 2008-04-03 | 2011-03-18 | Commissariat Energie Atomique | Procede pour assembler deux surfaces ou une surface avec une molecule d'interet |
US8698226B2 (en) | 2008-07-31 | 2014-04-15 | University Of Connecticut | Semiconductor devices, methods of manufacture thereof and articles comprising the same |
FI122511B (fi) * | 2009-02-26 | 2012-02-29 | Valtion Teknillinen | Grafeenia sisältävät hiutaleet ja menetelmä grafeenin eksfoliaatiota varten |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP7229659B2 (ja) | 2017-11-02 | 2023-02-28 | 住友重機械工業株式会社 | 動力伝達装置 |
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JP5560292B2 (ja) | 2014-07-23 |
FI20095191A0 (fi) | 2009-02-26 |
WO2010097518A1 (en) | 2010-09-02 |
US20120058344A1 (en) | 2012-03-08 |
JP2012518595A (ja) | 2012-08-16 |
WO2010097517A3 (en) | 2010-12-29 |
WO2010097517A2 (en) | 2010-09-02 |
EP2401230A2 (en) | 2012-01-04 |
EP2401778A1 (en) | 2012-01-04 |
US20120052301A1 (en) | 2012-03-01 |
JP2012518915A (ja) | 2012-08-16 |
US9620727B2 (en) | 2017-04-11 |
FI20095191A (fi) | 2010-08-27 |
FI122511B (fi) | 2012-02-29 |
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