JP5868929B2 - 蛍光体組成物及びこれを備えた発光素子パッケージ - Google Patents
蛍光体組成物及びこれを備えた発光素子パッケージ Download PDFInfo
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- JP5868929B2 JP5868929B2 JP2013233977A JP2013233977A JP5868929B2 JP 5868929 B2 JP5868929 B2 JP 5868929B2 JP 2013233977 A JP2013233977 A JP 2013233977A JP 2013233977 A JP2013233977 A JP 2013233977A JP 5868929 B2 JP5868929 B2 JP 5868929B2
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- 239000000203 mixture Substances 0.000 title claims description 129
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims description 96
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 26
- 229910052796 boron Inorganic materials 0.000 claims description 25
- 230000005284 excitation Effects 0.000 claims description 15
- 229910052765 Lutetium Inorganic materials 0.000 claims description 14
- 229910052684 Cerium Inorganic materials 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 10
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 9
- 229910052692 Dysprosium Inorganic materials 0.000 claims description 9
- 229910052772 Samarium Inorganic materials 0.000 claims description 9
- 229910052775 Thulium Inorganic materials 0.000 claims description 9
- 229910052769 Ytterbium Inorganic materials 0.000 claims description 9
- 229910052693 Europium Inorganic materials 0.000 claims description 8
- 229910052727 yttrium Inorganic materials 0.000 description 24
- 229910052782 aluminium Inorganic materials 0.000 description 23
- 238000000034 method Methods 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 13
- 229910052733 gallium Inorganic materials 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 230000008859 change Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- -1 B 2 O 3 Inorganic materials 0.000 description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004626 scanning electron microscopy Methods 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000000498 ball milling Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- 238000003746 solid phase reaction Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 229910052789 astatine Inorganic materials 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/778—Borates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
図1は本発明の第1実施形態に従う蛍光体組成物を含む発光素子パッケージ200の断面図であり、パッケージ構造はこれに限定されず、ツーカップパッケージ(two cup package)形態などにも実施形態の適用が可能である。
205 パッケージ胴体部
232 蛍光体組成物
230 モールディング部材
2100 カバー
2200 光源モジュール
2400 放熱体
2600 電源提供部
2700 内部ケース
2800 ソケット
Claims (7)
- (Gd3−y−zYy)C5O12:REZの組成式であり、前記zは0<z≦0.5の範囲であり、前記yは1≦y≦2の範囲であり、
前記CはB(Boron)を含み、
前記REはEu、Ce、Sm、Yb、Dy、Gd、Tm、及びLuのうち、少なくとも1つの元素を含むことを特徴とする、蛍光体組成物。 - 前記REはCeを含むことを特徴とする、請求項1に記載の蛍光体組成物。
- 前記蛍光体組成物は420nm乃至500nm領域の励起波長に対し、559nm乃至567nm領域の発光波長を有し、
前記REはCeであり、前記zは0.1≦z≦0.3であることを特徴とする、請求項1に記載の蛍光体組成物。 - 胴体部と、
前記胴体部の上に配置された第1及び第2電極層と、
前記第1及び第2電極層と電気的に連結された発光素子チップと、
前記発光素子チップの上に蛍光体組成物を含むモールディング部材と、を含み、
前記蛍光体組成物は、請求項1〜3のいずれかに記載の蛍光体組成物を含み、
前記蛍光体組成物は黄色光を発光することを特徴とする、発光素子パッケージ。 - 前記発光素子チップはUV LEDチップであることを特徴とする、請求項4に記載の発光素子パッケージ。
- 前記発光素子チップは、青色LEDチップであることを特徴とする、請求項4に記載の発光素子パッケージ。
- 前記発光素子チップは420nm乃至500nm領域の波長を発光し、
前記蛍光体組成物は前記発光波長に対し、559nm乃至567nm領域の発光波長を有することを特徴とする、請求項4に記載の発光素子パッケージ。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120129972A KR102035169B1 (ko) | 2012-11-16 | 2012-11-16 | 형광체 조성물 |
KR10-2012-0129972 | 2012-11-16 | ||
KR10-2012-0129971 | 2012-11-16 | ||
KR1020120129971A KR102035164B1 (ko) | 2012-11-16 | 2012-11-16 | 형광체 조성물 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014101511A JP2014101511A (ja) | 2014-06-05 |
JP5868929B2 true JP5868929B2 (ja) | 2016-02-24 |
Family
ID=49551538
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013233977A Active JP5868929B2 (ja) | 2012-11-16 | 2013-11-12 | 蛍光体組成物及びこれを備えた発光素子パッケージ |
Country Status (4)
Country | Link |
---|---|
US (2) | US20140138728A1 (ja) |
EP (1) | EP2733190B1 (ja) |
JP (1) | JP5868929B2 (ja) |
CN (1) | CN103820118B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101501020B1 (ko) * | 2014-02-17 | 2015-03-13 | 주식회사 루멘스 | 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법 |
CN108473868B (zh) * | 2015-12-23 | 2021-07-09 | Lg伊诺特有限公司 | 荧光体组合物、包括该荧光体组合物的发光器件封装和照明装置 |
KR102578085B1 (ko) | 2016-04-29 | 2023-09-14 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 형광체 조성물, 이를 포함하는 발광 소자 패키지 및 조명 장치 |
US10361352B1 (en) * | 2018-03-22 | 2019-07-23 | Excellence Opto, Inc. | High heat dissipation light emitting diode package structure having at least two light cups and lateral light emission |
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DE19638667C2 (de) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
JP2000265169A (ja) * | 1999-03-17 | 2000-09-26 | Yiguang Electronic Ind Co Ltd | 白色光源の製造方法 |
US6409938B1 (en) * | 2000-03-27 | 2002-06-25 | The General Electric Company | Aluminum fluoride flux synthesis method for producing cerium doped YAG |
TWI282357B (en) * | 2001-05-29 | 2007-06-11 | Nantex Industry Co Ltd | Process for the preparation of pink light-emitting diode with high brightness |
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KR100610249B1 (ko) * | 2003-12-23 | 2006-08-09 | 럭스피아 주식회사 | 황색 발광 형광체 및 그것을 채용한 백색 반도체 발광장치 |
JP4779384B2 (ja) * | 2005-02-28 | 2011-09-28 | 三菱化学株式会社 | Ce付活希土類アルミン酸塩系蛍光体及びこれを用いた発光素子 |
US7927512B2 (en) | 2005-08-04 | 2011-04-19 | Nichia Corporation | Phosphor and light emitting device |
KR100533922B1 (ko) * | 2005-08-05 | 2005-12-06 | 알티전자 주식회사 | 황색 형광체 및 이를 이용한 백색 발광 장치 |
KR101264580B1 (ko) | 2005-09-27 | 2013-05-14 | 미쓰비시 가가꾸 가부시키가이샤 | 형광체 및 그 제조방법, 및 상기 형광체를 사용한 발광장치 |
CN1807547B (zh) * | 2006-01-27 | 2011-06-15 | 罗维鸿 | 用于固体光源的荧光无机物 |
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CN100999662A (zh) * | 2006-12-29 | 2007-07-18 | 中国科学院长春应用化学研究所 | 一种蓝光激发的白光led用荧光粉的制备方法 |
CN101113333B (zh) * | 2007-08-28 | 2010-12-15 | 厦门大学 | 铈激活的钇铝石榴石荧光粉的制备方法 |
DE102008051029A1 (de) * | 2008-10-13 | 2010-04-15 | Merck Patent Gmbh | Dotierte Granat-Leuchtstoffe mit Rotverschiebung für pcLEDs |
TWI361216B (en) * | 2009-09-01 | 2012-04-01 | Ind Tech Res Inst | Phosphors, fabricating method thereof, and light emitting device employing the same |
TWI418610B (zh) * | 2011-03-07 | 2013-12-11 | Ind Tech Res Inst | 螢光材料、及包含其之發光裝置 |
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2013
- 2013-11-08 EP EP13192060.5A patent/EP2733190B1/en active Active
- 2013-11-12 JP JP2013233977A patent/JP5868929B2/ja active Active
- 2013-11-15 CN CN201310572266.9A patent/CN103820118B/zh active Active
- 2013-11-15 US US14/081,404 patent/US20140138728A1/en not_active Abandoned
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2016
- 2016-12-27 US US15/390,980 patent/US10008641B2/en active Active
Also Published As
Publication number | Publication date |
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US20140138728A1 (en) | 2014-05-22 |
EP2733190A3 (en) | 2014-09-03 |
US20170110632A1 (en) | 2017-04-20 |
EP2733190B1 (en) | 2020-01-01 |
JP2014101511A (ja) | 2014-06-05 |
CN103820118B (zh) | 2016-08-17 |
EP2733190A2 (en) | 2014-05-21 |
CN103820118A (zh) | 2014-05-28 |
US10008641B2 (en) | 2018-06-26 |
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