JP2014101511A - 蛍光体組成物及びこれを備えた発光素子パッケージ - Google Patents
蛍光体組成物及びこれを備えた発光素子パッケージ Download PDFInfo
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- 239000000203 mixture Substances 0.000 title claims abstract description 148
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 107
- 229910052688 Gadolinium Inorganic materials 0.000 claims abstract description 29
- 229910052796 boron Inorganic materials 0.000 claims abstract description 29
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 28
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 28
- 229910052765 Lutetium Inorganic materials 0.000 claims abstract description 17
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 11
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052692 Dysprosium Inorganic materials 0.000 claims abstract description 10
- 229910052772 Samarium Inorganic materials 0.000 claims abstract description 10
- 229910052775 Thulium Inorganic materials 0.000 claims abstract description 10
- 229910052769 Ytterbium Inorganic materials 0.000 claims abstract description 10
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 10
- 229910052693 Europium Inorganic materials 0.000 claims abstract description 9
- 230000005284 excitation Effects 0.000 claims description 15
- 238000000465 moulding Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 8
- 230000008859 change Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- -1 B 2 O 3 Inorganic materials 0.000 description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
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- 230000008569 process Effects 0.000 description 3
- 238000004626 scanning electron microscopy Methods 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000000498 ball milling Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
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- 230000001788 irregular Effects 0.000 description 2
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- 238000003860 storage Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 229910052789 astatine Inorganic materials 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
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- 150000001875 compounds Chemical class 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
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- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
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- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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Abstract
【解決手段】本発明に従う蛍光体組成物は、AzCxO12:REの組成式であり、前記zは0≦z≦3の範囲であり、前記xは0≦x≦5の範囲であり、前記AはY、Sc、Gd、及びLuのうち、少なくとも1つの元素を含み、前記CはB(Boron)、Al、及びGaのうち、少なくとも1つの元素を含み、前記REはEu、Ce、Sm、Yb、Dy、Gd、Tm、及びLuのうち、少なくとも1つの元素を含む。
本発明に従う発光装置は、上記の蛍光体組成物を含む。
【選択図】図1
Description
図1は本発明の第1実施形態に従う蛍光体組成物を含む発光素子パッケージ200の断面図であり、パッケージ構造はこれに限定されず、ツーカップパッケージ(two cup package)形態などにも実施形態の適用が可能である。
205 パッケージ胴体部
232 蛍光体組成物
230 モールディング部材
2100 カバー
2200 光源モジュール
2400 放熱体
2600 電源提供部
2700 内部ケース
2800 ソケット
Claims (16)
- AzCxO12:REの組成式であり、前記zは0≦z≦3の範囲であり、前記xは0≦x≦5の範囲であり、
前記AはY、Sc、Gd、及びLuのうち、少なくとも1つの元素を含み、
前記CはB(Boron)、Al、及びGaのうち、少なくとも1つの元素を含み、
前記REはEu、Ce、Sm、Yb、Dy、Gd、Tm、及びLuのうち、少なくとも1つの元素を含むことを特徴とする、蛍光体組成物。 - 前記AはYであることを特徴とする、請求項1に記載の蛍光体組成物。
- 前記AzCxO12:REの組成式でAzCxはY3(B5−xAlx)を含み、前記1≦x≦4であることを特徴とする、請求項2に記載の蛍光体組成物。
- 前記AはY及びGdであることを特徴とする、請求項3に記載の蛍光体組成物。
- 前記AzCxO12:REの組成式でAzはGd3−y−zYyを含み、前記yは0≦y≦2であることを特徴とする、請求項4に記載の蛍光体組成物。
- 前記AzCxO12:REの組成式でAzはGd3−y−zYyを含み、前記0<z≦0.5であることを特徴とする、請求項5に記載の蛍光体組成物。
- 前記CxはB5であることを特徴とする、請求項6に記載の蛍光体組成物。
- 前記CはB及びAlの元素を有することを特徴とする、請求項7に記載の蛍光体組成物。
- 前記Cxは(B、Al)5であることを特徴とする、請求項8に記載の蛍光体組成物。
- 前記AzCxO12:REの組成式は(Y、Gd)3−z(B、Al)5O12:CeVの組成式を含み、前記zは0.1≦z≦0.3の範囲であることを特徴とする、請求項9に記載の蛍光体組成物。
- 前記REはCevであることを特徴とする、請求項1乃至9のうち、いずれか1項に記載の蛍光体組成物。
- 前記Cevの組成(v)は0.1≦z≦0.3であることを特徴とする、請求項11に記載の蛍光体組成物。
- 前記蛍光体組成物は420nm乃至500nm領域の励起波長に対し、559nm乃至567nm領域の発光波長を有することを特徴とする、請求項1乃至12のうち、いずれか1項に記載の蛍光体組成物。
- 胴体部と、
前記胴体部の上に配置された第1及び第2電極層と、
前記第1及び第2電極層と電気的に連結された発光素子チップと、
前記発光素子チップの上に蛍光体組成物を含むモールディング部材と、を含み、
前記蛍光体組成物は、請求項1〜13のいずれかに記載の蛍光体組成物を含み、
前記蛍光体組成物は黄色光を発光することを特徴とする、発光素子パッケージ。 - 前記発光素子チップはUV LEDチップであることを特徴とする、請求項14に記載の発光素子パッケージ。
- 前記発光素子チップは、青色LEDチップであることを特徴とする、請求項15に記載の発光素子パッケージ。
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KR10-2012-0129972 | 2012-11-16 | ||
KR10-2012-0129971 | 2012-11-16 | ||
KR1020120129972A KR102035169B1 (ko) | 2012-11-16 | 2012-11-16 | 형광체 조성물 |
KR1020120129971A KR102035164B1 (ko) | 2012-11-16 | 2012-11-16 | 형광체 조성물 |
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US (2) | US20140138728A1 (ja) |
EP (1) | EP2733190B1 (ja) |
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KR101501020B1 (ko) * | 2014-02-17 | 2015-03-13 | 주식회사 루멘스 | 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법 |
US10982141B2 (en) | 2015-12-23 | 2021-04-20 | Lg Innotek Co., Ltd. | Phosphor composition, light-emitting device package comprising same, and lighting apparatus |
KR102578085B1 (ko) | 2016-04-29 | 2023-09-14 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 형광체 조성물, 이를 포함하는 발광 소자 패키지 및 조명 장치 |
US10361352B1 (en) * | 2018-03-22 | 2019-07-23 | Excellence Opto, Inc. | High heat dissipation light emitting diode package structure having at least two light cups and lateral light emission |
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- 2013-11-15 US US14/081,404 patent/US20140138728A1/en not_active Abandoned
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2016
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Also Published As
Publication number | Publication date |
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EP2733190B1 (en) | 2020-01-01 |
EP2733190A2 (en) | 2014-05-21 |
EP2733190A3 (en) | 2014-09-03 |
CN103820118A (zh) | 2014-05-28 |
US10008641B2 (en) | 2018-06-26 |
US20140138728A1 (en) | 2014-05-22 |
JP5868929B2 (ja) | 2016-02-24 |
CN103820118B (zh) | 2016-08-17 |
US20170110632A1 (en) | 2017-04-20 |
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