JP5860628B2 - Transfer apparatus and transfer method - Google Patents

Description

  The present invention relates to a transfer apparatus and a transfer method.

  2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, a semiconductor wafer (hereinafter simply referred to as a wafer) is cut into a predetermined shape and a predetermined size and separated into semiconductor chips (hereinafter sometimes simply referred to as chips) (dicing process). ) After forming the adhesive layer on this chip, the distance between the separated chips is expanded (expanding process), and then each chip is picked up and bonded to the substrate (bonding process). ing.

  The adhesive layer is formed by sticking the diced chip to a stretchable adhesive sheet in the shape of a wafer and expanding it to expand the space between the chips. At the same time, the adhesive layer of the adhesive sheet is also broken. There is known a method of dividing into chips with an adhesive layer (for example, see Patent Document 1).

JP 2005-260204 A

  However, in the apparatus described in Patent Document 1, since the adhesive layer is broken by expanding, the broken adhesive layer has various shapes. Thereby, for example, when the adhesive layer is broken into a shape larger than the chip, the adhesive layer is bonded to an extra portion of the adherend at the bonding destination, and further the adhesive layer If it is broken into a shape smaller than the chip, there arises a disadvantage that the bonding force between the adherend and the chip is insufficient at the bonding destination.

  An object of the present invention is to provide a transfer apparatus and a transfer method capable of accurately dividing an adhesive layer along the shape of a piece-like body.

  In order to achieve the above object, the transfer device of the present invention is a transfer device for transferring a plurality of pieces to a transfer sheet in which an adhesive layer is laminated on one surface of a base sheet, A first support means for supporting a piece, a second support means for supporting the transfer sheet opposite to the plurality of pieces supported by the first support means, and a support by the first support means; A contact means for bringing the transfer sheet and the plurality of pieces into contact with each other by relatively moving the plurality of pieces and the transfer sheet supported by the second support means; And a cleaving means for cleaving the adhesive layer located in the gap by deforming the transfer sheet toward the gap between the flakes.

At this time, it is preferable to have fluidizing means for fluidizing the adhesive layer.
Further, it is preferable that the cleaving means deforms the transfer sheet by generating a pressure difference on both surfaces of the transfer sheet.
Furthermore, it is preferable that the contact means includes a fluid ejecting means for ejecting a fluid from the base sheet side of the transfer sheet toward the plurality of pieces.

  The plurality of pieces are attached to one surface of an adhesive sheet, supported by the first support means via the adhesive sheet, and expand means that expands the gap by stretching the adhesive sheet. It is preferable to have.

  On the other hand, the transfer method of the present invention is a transfer method in which a plurality of pieces are transferred to a transfer sheet having an adhesive layer laminated on one surface of a base sheet, and the plurality of pieces are supported. The transfer sheet is supported so as to face the plurality of pieces, and the plurality of pieces and the transfer sheet are moved relative to each other so that the transfer sheet and the plurality of pieces are brought into contact with each other. And adopting a configuration in which the adhesive sheet positioned in the gap is cleaved by deforming the transfer sheet toward the gap between the plurality of pieces.

  According to the present invention as described above, the cleaving means cleaves the adhesive layer located in the gap by deforming the transfer sheet toward the gap between the plurality of pieces, so that the adhesive layer is cut into pieces. It can be accurately divided along the shape of the body. Thereby, the said inconvenience in the bonding destination which arises when it fractures | ruptures with various shapes can be eliminated.

  At this time, by fluidizing the adhesive layer by the fluidizing means, the adhesive layer is easily cleaved, and the adhesive layer can be surely divided into the shape of a piece. Further, if the cleaving means deforms the transfer sheet by generating a pressure difference, the gap distance and the number of pieces can be obtained only by generating a pressure difference using a device such as a pressurizing device or a decompressing device. Regardless of this, it is possible to reliably cut the adhesive layer where necessary. Therefore, compared to a case where a mold matching the shape of the gap is prepared and the transfer sheet is deformed, the apparatus structure can be simplified, and the enlargement of the apparatus and the complicated control can be suppressed. In addition, if the transfer sheet is configured to have fluid ejecting means for ejecting fluid from the base sheet side toward the plurality of pieces, the transfer member and the pieces are pressed and deformed by directly contacting a pressing member. Compared with the case of making it, damage to a transfer sheet or a piece can be prevented. Further, when the expanding means is employed, the piece-like body can be transferred to the transfer sheet in a state where the gap is widened to a desired distance, and it is not necessary to widen the gap in advance, so that the production efficiency can be increased.

1 is an overall view of a transfer apparatus according to an embodiment of the present invention. FIG. 2 is an operation explanatory diagram of the transfer device of FIG. 1. FIG. 3 is an operation explanatory diagram of the transfer device following FIG. 2. FIG. 4 is an operation explanatory diagram of the transfer device following FIG. 3. FIG. 9 is an overall view of a transfer device according to a modification of the present invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the present embodiment, unless otherwise specified, terms indicating directions such as “up”, “down”, “left”, and “right” are used with reference to FIG.
In the present embodiment, the transfer device 1 is attached to the adhesive sheet S1, and the wafer W separated into a plurality of chips WA is formed into a plurality of pieces, and these chips WA are laminated with an adhesive layer AD2. The wafer W is affixed via an adhesive layer AD1 laminated on one surface (lower surface) of the adhesive sheet S1, and is attached to the ring frame RF1 via the adhesive sheet S1. Is retained. The chip WA is formed in a hexahedron by dicing the wafer W into a lattice shape.
The transfer sheet S2 includes a base sheet BS2 and a heat-sensitive adhesive layer AD2 laminated on one surface (upper surface) of the base sheet BS2. The base sheet BS2 is attached to the second ring frame RF2. Affixed and held. The base sheet BS2 has a thickness of 30 μm, and the adhesive layer AD2 has a thickness of 10 μm.

  In FIG. 1, a transfer apparatus 1 includes a first support unit 2 that supports a wafer W via an adhesive sheet S1 and a ring frame RF1, and a second support unit 3 that supports the transfer sheet S2 so as to face the wafer W. A contact means 4 for separating the wafer W and the transfer sheet S2 from each other, a fluidizing means 5 for fluidizing the adhesive layer AD2 of the transfer sheet S2, and a cleaving means 6 for cleaving the adhesive layer AD2. It is prepared for.

The first support means 2 is supported by the contact means 4 as a whole, a support member 21 having a circular recess 211 formed in the center, a plurality of arms 22 attached to the outer periphery of the support member 21, and the support member 21. A linear motion motor 23 as a drive device provided on the upper surface of the linear motor 23 and an expansion table 24 constituting an expanding means attached to an output shaft 23A of the linear motion motor 23 are provided.
Suction holes connected to decompression means (not shown) such as a decompression pump and a vacuum ejector are provided on the lower surfaces of the support member 21 and the expand table 24, respectively. The arm 22 is provided so as to be movable in the vertical direction by a linear motion motor (not shown) that is a driving device, and can be supported by sandwiching the first ring frame RF1 with the support surface 212 of the support member 21. Yes. When the expand table 24 is disposed in the recess 211, an inner support surface 241 that can form the same plane as the support surface 212 is formed, and a coil heater 52 that constitutes the fluidizing means 5 is provided therein. It has been.

The entire second support means 3 is supported by a frame (not shown) and can be arranged below the first support means 2. The second support means 3 includes a table 31 having a support surface 32, and a coil heater 51 constituting the fluidizing means 5 is provided inside the table 31.
The table 31 is configured to be able to support the transfer sheet S2 attached to the second ring frame RF2 on the support surface 32 facing the first support means 2 with the adhesive layer AD2 on the upper side. The support surface 32 is provided with intake / exhaust holes (not shown) communicating with the cleaving means 6.

  The abutting means 4 includes a linear motion motor 41 as a drive device, and a support member 21 is attached to a slider (not shown) of the linear motion motor 41.

  The cleaving means 6 includes a pressure means 61 such as a pressure pump or a turbine connected to the table 31, and pressurizes the transfer sheet S2 through a suction / exhaust hole (not shown) formed in the support surface 32, thereby transferring the transfer sheet. An atmospheric pressure difference (pressure difference) is generated on both surfaces of S2, and the transfer sheet S2 is deformed upward. Further, the cleaving means 6 includes a pressure reducing means 62 such as a pressure reducing pump or a vacuum ejector connected to the table 31, and the transfer sheet S2 is sucked through an intake / exhaust hole (not shown) formed in the support surface 32, thereby transferring the transfer sheet S2. An atmospheric pressure difference (pressure difference) is generated on both surfaces of the sheet S2, and the base sheet BS2 in the transfer sheet S2 is deformed downward.

  It should be noted that the adhesive force of the adhesive layer AD1 of the adhesive sheet S1 is greater than the adhesive force of the adhesive layer AD2 of the transfer sheet S2 so that the adhesive layer AD1 of the transfer sheet S2 can be reliably peeled off from the wafer W attached thereto. It is preferable that the setting is weak. Furthermore, the transfer device 1 may be configured to include a UV lamp (not shown) that irradiates the adhesive sheet S1 with ultraviolet rays and weakens the adhesive force of the adhesive layer AD1.

In the transfer device 1 described above, a procedure for transferring the wafer W to the adhesive layer AD2 of the transfer sheet S2 will be described.
First, as illustrated in FIG. 1, the transfer device 1 supports the first ring frame RF1 integrated with the wafer W via the adhesive sheet S1 by sandwiching the first ring frame RF1 with the support surface 212 by the arm 22. On the other hand, the second support means 3 supports the transfer sheet S2 on the table 31 from the base sheet BS2 side, and disposes the adhesive layer AD2 to the wafer W. Then, the transfer device 1 drives the decompression unit 62 to suck and hold the transfer sheet S <b> 2 by the support surface 32.

  Next, as shown in FIG. 2, the transfer device 1 moves the expansion table 24 downward by driving the linear motion motor 23 to stretch the adhesive sheet S <b> 1 and widen the gaps between the chips WA (wafer W To expand the gap C between adjacent chips WA. When the detecting means such as a sensor (not shown) detects that the distance C between the chips has reached a predetermined distance, 150 μm in this embodiment, the driving of the linear motor 23 is stopped and the decompressing means (not shown) is driven. The adhesive sheet S1 is sucked and supported by the inner support surface 241. In this state, the chip WA is brought into contact with the adhesive layer AD2 of the transfer sheet S2 by moving the support member 21 downward by driving the linear motion motor 41. Then, the coil heaters 51 and 52 are driven to start heating, and the adhesive layer AD2 of the transfer sheet S2 is fluidized. In the case of the present embodiment, the adhesive layer AD2 is fluidized (softened) around 170 ° C., so that the coil heaters 51 and 52 are maintained at 180 ° C. by control means (not shown) such as a personal computer or a sequencer. To be controlled. In addition, the temperature of the coil heaters 51 and 52 can be appropriately changed according to the temperature at which the adhesive layer AD2 is fluidized and the characteristics thereof.

  Then, the pressurizing means 61 is driven, and the transfer sheet S2 is deformed by pressurizing the transfer sheet S2 from the base sheet BS2 side through an intake / exhaust hole (not shown). At this time, as shown in FIG. 3A, immediately below each chip WA, gas is not ejected from an unillustrated intake / exhaust hole, and gas is ejected only from an unillustrated intake / exhaust hole located between the chips C. As a result, a pressure difference (pressure difference) is generated on both surfaces of the transfer sheet S2, and the transfer sheet S2 is deformed so as to enter the inter-chip C due to the pressure difference. When the amount of the transfer sheet S2 entering the inter-chip C increases, the adhesive layer AD2 is fluidized by the coil heaters 51 and 52, and therefore, as shown in FIG. Cracks P enter the surface. When the transfer sheet S2 further enters the inter-chip C, the crack P spreads, and the adhesive layer AD2 is cleaved with the crack P as shown in FIG. Thereafter, as shown in FIG. 3D, the edge portion of the cut adhesive layer AD2 is moved into the four side surfaces WA1 (side surfaces) of each chip WA by further entering the inter-chip C of the transfer sheet S2. WA1 is pressed and bonded to each other (including the front side surface and the back side surface). Thus, the adhesive layer AD2 can be accurately divided along the shape of each chip WA.

  Next, the transfer device 1 stops the pressurizing unit 61 and drives the decompression unit 62 to suck air through a suction / exhaust hole (not shown) of the support surface 32, thereby causing a pressure difference (pressure) on both surfaces of the transfer sheet S <b> 2. Difference). Then, as shown in FIG. 3E, the base sheet BS2 out of the transfer sheet S2 that has entered the inter-chip C is sucked onto the support surface 32. Here, the adhesive force of the adhesive layer AD2 is set so that the adhesive force with the base sheet BS2 is weaker than the adhesive force with the chip WA, and the base sheet BS2 is peeled from the folded portion AD3 and supported. It is pulled back on the surface 32. As a result, on each of the four side surfaces WA1 of each chip WA, a folded portion AD3 having a length of about 75 μm in the vertical direction in FIG. 3 is formed, and a gap of about 130 μm is formed between the folded portions AD3.

  Subsequently, the suction support of the adhesive sheet S1 on the inner support surface 241 is released while the decompression means 62 is driven. In this state, when the linear motor 41 is driven to move the first support means 2 upward, the adhesive sheet S1 is gradually peeled inward from the outer edge position of the wafer W as shown in FIG. Finally, it is peeled from each chip WA.

  According to the present embodiment, the cleaving means 6 deforms the transfer sheet S2 toward the inter-chip C between the plurality of chips WA, and cleaves the adhesive layer AD2 located between the inter-chips C. Therefore, the adhesive layer AD2 Can be accurately divided along the shape of the chip WA.

  As described above, the best configuration, method, and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to particular embodiments, but with respect to the embodiments described above, such as shape and the like, without departing from the scope and spirit of the invention. In the detailed configuration, various modifications can be made by those skilled in the art. Moreover, since the description which limited the shape etc. which were disclosed above was illustrated in order to make an understanding of this invention easy, it does not limit this invention, Therefore The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, as shown in FIG. 5, the transfer device 1A may simultaneously perform the contact of the transfer sheet S2 with the wafer W and the cleaving of the adhesive layer AD2. The transfer apparatus 1A supports a wafer W in which an inter-chip C is formed in advance between the chips WA, and includes a first support unit 2A to which a pressurizing unit 61 and a decompression unit 62 are connected, and a first support unit 2A. A second support means 3A for supporting the transfer sheet S2 on the support surface 32A via the second ring frame RF2 and a gas as a fluid from the substrate sheet BS2 side of the transfer sheet S2 toward the wafer W, which is an outer peripheral portion; , And a contact means 4A for bringing the transfer sheet S2 into contact with the wafer W in a non-contact state.

  The first support means 2A has a support member 21A having a support surface 212A on its upper surface, and a coil heater 53 constituting the fluidizing means 5A is built in the support member 21A. The abutting means 4A includes a pressurizing means 42 such as a pressurizing pump or a turbine as a fluid ejecting means, and an exhaust plate 43 formed with an exhaust hole (not shown) to which the pressurizing means 42 is connected. The coil heater 54 constituting the fluidizing means 5A is built in the inside. In this case, the cleaving means 6 </ b> A is configured by the pressurizing means 61 and the decompressing means 62 connected to the first support means 2 and the pressurizing means 42 connected to the exhaust plate 43.

  As a transfer procedure of the wafer W by the transfer apparatus 1A, first, the wafer W in which the inter-chip C is formed in advance between the chips WA is placed on the first support means 2A, and the transfer sheet S2 is further attached to the second ring. The frame RF2 is placed on the support surface 32A of the second support means 3 so that the adhesive layer AD2 faces downward. Then, the decompression means 62 is driven to suck and hold the wafer W and the second ring frame RF2. Next, the pressing means 42 of the contact means 4A is driven to press the transfer sheet S2 toward the wafer W, and the transfer sheet S2 is brought into contact with the wafer W. After that, by continuing the pressurization of the pressurizing means 42, the transfer sheet S2 is deformed into the inter-chip C in the same manner as described above, and the adhesive layer AD2 is cleaved. When the cleaving is completed and the folded portion AD3 is adhered to each of the four side surfaces WA1 of each chip WA, the driving of the pressurizing unit 42 and the decompressing unit 62 is stopped, and then the pressurizing unit 61 is driven to transfer the sheet. The base material sheet BS2 portion of S2 is pushed out of C between the chips. At this time, the chips WA are urged from above the transfer sheet S2 to the support surface 212A side by the gas ejected from the exhaust plate 43 or the exhaust plate 43 so that the chips WA are not detached from the support surface 212A. An urging means may be provided. Thus, the adhesive layer AD2 is accurately divided along the shape of the chip WA.

Moreover, in the said embodiment, as a fluid which the pressurization means 42 and 61 spray, a liquid, a gel-like thing, etc. may be sufficient besides gas. Further, if the fluid ejected from the pressurizing means 42 and 61 is heated by the heating means, the coil heaters 51 to 54 can be omitted, and the adhesive layer AD2 is fluidized by the heat of the fluid and transferred. The sheet S2 can be deformed.
Further, the decompression means 62 may adopt a means capable of sucking the gas, liquid, gel-like thing sprayed by the pressurization means 42, 61.

Furthermore, the pressurizing means 61 connected to the table 31 is not provided, and the space formed by the first ring frame RF1 and the second ring frame RF2 is a sealed space, and this space is depressurized or pressurized. Accordingly, a configuration may be employed in which the transfer sheet S2 is deformed toward the inter-chip C, or the base sheet BS2 is pushed out from a sealed space. At this time, it is preferable to provide a shielding means for preventing pressure reduction or pressurization between the support surface 32A and the transfer sheet S2.
In the embodiment, the contact means 4 stops the first support means 2 and moves the second support means 3 or moves both the second support means 3 and the contact means 4. By doing so, the wafer W and the transfer sheet S2 may be brought into contact with or separated from each other, or the adhesive sheet S1 may be peeled from the wafer W.

The wafer W supported by the first support means 2 may be one in which the inter-chip C is formed in advance. In this case, the expanding table 24 may not be provided.
Moreover, in the said embodiment, although the hexahedral chip | tip WA was illustrated as a piece body and the folding part AD3 was formed in each of each of the four side surfaces WA1 of each chip WA, the piece body may be a pentahedron or less. Alternatively, it may be a seven-hedron or more, and a configuration in which the folded portion AD3 is formed on each side surface of each polyhedron is sufficient.
Further, the fluidizing means 5 and 5A can be appropriately changed according to the configuration and properties of the adhesive layer AD2 in addition to the coil heaters 51 to 54, and can fluidize the adhesive layer AD2, for example, infrared An irradiation device, an ultraviolet irradiation device, a microwave generation device, a vibration device, or the like can be used.

In addition, the types and materials of the adhesive sheet S1 and the transfer sheet S2 in the present invention are not particularly limited. For example, those having an intermediate layer between the base sheet and the adhesive layers AD1 and AD2, and other layers Three or more layers may be used. Further, the adhesive sheet S1 and the transfer sheet S2 may be protective sheets, dicing tapes, die attach films, other arbitrary sheets, films, tapes and the like, adhesive sheets having arbitrary uses and shapes. Further, the adhesive layers AD1 and AD2 may be a pressure-sensitive adhesive or a heat-sensitive adhesive.
Examples of the semiconductor wafer include a silicon semiconductor wafer and a compound semiconductor wafer. In addition, the plurality of pieces are not limited to chips obtained by dicing a semiconductor wafer, but also optical disks, glass plates, steel plates, resin plates, and other members, as well as members and articles of any form Or the like can be targeted.

Further, the adhesive sheet S1 and the transfer sheet S2 may not be attached to the ring frames RF1 and RF2.
Further, even if there is no fluidizing means, the adhesive layer AD2 is such that a crack P is formed on the surface of the adhesive layer AD2 due to the transfer sheet S2 entering the inter-chip C, and the crack P is used as a cut. In this case, it is not necessary to provide the fluidizing means 5 and 5A.
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1,1A Transfer apparatus 2,2A 1st support means 3,3A 2nd support means 4,4A Contact means 5,5A Fluidization means 6,6A Cleaving means 42 Pressurizing means (fluid ejecting means)
AD2 Adhesive layer BS2 Base material sheet C Between chips (gap)
S1 Adhesive sheet S2 Transfer sheet W Wafer WA Chip (Fragment)

Claims (6)

A transfer device for transferring a plurality of pieces to a transfer sheet in which an adhesive layer is laminated on one surface of a base sheet,
First support means for supporting the plurality of pieces,
Second support means for supporting the transfer sheet opposite to the plurality of pieces supported by the first support means;
The transfer sheet and the plurality of pieces are brought into contact with each other by relatively moving the plurality of pieces supported by the first support means and the transfer sheet supported by the second support means. A contact means;
A transfer apparatus comprising: a cleaving unit that cleaves the adhesive layer positioned in the gap by deforming the transfer sheet toward the gap between the plurality of pieces.   The transfer apparatus according to claim 1, further comprising fluidizing means for fluidizing the adhesive layer.   The transfer apparatus according to claim 1, wherein the cleaving unit deforms the transfer sheet by generating a pressure difference between both surfaces of the transfer sheet.   The contact means includes fluid ejecting means for ejecting fluid from the base sheet side of the transfer sheet toward the plurality of strips. The transfer device according to any one of the above. The plurality of pieces are affixed to one surface of an adhesive sheet, supported by the first support means via the adhesive sheet,
The transfer device according to claim 1, further comprising an expanding unit that expands the gap by stretching the adhesive sheet. A transfer method for transferring a plurality of pieces to a transfer sheet in which an adhesive layer is laminated on one surface of a base sheet,
Supporting the plurality of pieces,
Supporting the transfer sheet opposite to the plurality of pieces,
By relatively moving the plurality of pieces and the transfer sheet, the transfer sheet and the plurality of pieces are brought into contact with each other,
A transfer method comprising: cleaving the adhesive layer located in the gap by deforming the transfer sheet toward the gap between the plurality of pieces.

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