JP2004288689A - Method for manufacturing electronic part and method for manufacturing electronic parts assembly - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic part which can efficiently produce the electronic part of a stable quality and to provide a method for manufacturing an electronic parts assembly. <P>SOLUTION: In the method for manufacturing the electronic part in individual pieces by dividing a semiconductor wafer from which a plurality of chips 3 are formed, the semiconductor wafer adhered to a dicing sheet is diced and divided into the chips 3 of the individual pieces, the chips 3 of the individual pieces are temporarily held simultaneously together with the dicing sheet with a holding sheet 5. Then these chips 3 are adhered to a pickup sheet 7 having an interfacial force on the smooth front surface. When supplying, the chip 3 is taken out in each individual piece from the pickup sheet. Thus, suitable holding forces are kept the dicing sheet and the pickup sheet. The stable dicing and the normal pickup are made compatible so that the electronic part can be efficiently produced with a stabilized quality without cracks, cuts, etc. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component manufacturing method for manufacturing individual electronic components by dividing a semiconductor wafer in which a plurality of electronic components are formed, and a method for manufacturing an aggregate of electronic components.
[0002]
[Prior art]
2. Description of the Related Art In a process of manufacturing an electronic component such as a semiconductor chip, the semiconductor chip is cut out from a semiconductor wafer in which a large number of individual chips are formed. The individual chips are cut out with the semiconductor wafer adhered to a dicing sheet having an adhesive layer on the surface, and the cut out semiconductor chips are peeled off from the dicing sheet by a pickup head and picked up ( See, for example, Patent Document 1.
[0003]
[Patent Document 1]
Japanese Utility Model Laid-Open No. 2-67645
[Problems to be solved by the invention]
However, in the above-described conventional method, since the semiconductor chip is firmly attached to the adhesive layer, in order to reliably peel the semiconductor chip from the dicing sheet and take it out during the pick-up operation, the semiconductor chip must be attached to the lower surface of the dicing sheet. It has to be pushed up by a pushing up mechanism such as an ejector pin. For this reason, the semiconductor chip may be damaged by this push-up at the time of pickup, and this is particularly remarkable in a thin semiconductor chip.
[0005]
On the other hand, if the adhesive strength of the dicing sheet is reduced to avoid such a problem of damage, the individual pieces cannot be held with a sufficient holding force at the time of dicing for cutting the semiconductor wafer, resulting in misalignment or peeling. This may cause problems during dicing. As described above, in the conventional electronic component manufacturing process, it is difficult to perform both stable dicing and normal pick-up of individual components after dicing, and electronic components of stable quality without cracking or chipping. There was a problem that it was difficult to efficiently produce
[0006]
Therefore, an object of the present invention is to provide a method of manufacturing an electronic component and a method of manufacturing an aggregate of electronic components that can efficiently produce electronic components of stable quality.
[0007]
[Means for Solving the Problems]
2. The electronic component manufacturing method according to claim 1, wherein the semiconductor wafer in which a plurality of electronic components are formed is divided into individual electronic components, and the semiconductor wafer is diced into a dicing sheet. A first attaching step of attaching the dicing sheet, a dicing step of dicing the semiconductor wafer attached to the dicing sheet into individual electronic parts, and temporarily holding the dicing individual electronic parts together with the dicing sheet A temporary holding step of holding by the member, a dicing sheet peeling step of peeling the dicing sheet from the electronic component held by the temporary holding member, and attaching the electronic component held by the temporary holding member to the pickup sheet A second attaching step, and a temporary holding step of separating the temporary holding member from the electronic component attached to the pickup sheet. A release step, taking out the electronic component for each piece from the pick-up sheet and a pickup step.
[0008]
An electronic component manufacturing method according to a second aspect is the electronic component manufacturing method according to the first aspect, further comprising a holding force adjusting step of adjusting a holding force of the electronic component by the pickup sheet prior to the second attaching step. .
[0009]
According to a third aspect of the present invention, there is provided a method of manufacturing an assembly of electronic components, wherein a plurality of individual electronic components obtained by dividing a semiconductor wafer in which a plurality of electronic components are formed are attached to a pickup sheet and assembled. A manufacturing method, comprising: a first attaching step of attaching the semiconductor wafer to a dicing sheet; a dicing step of dicing the semiconductor wafer attached to the dicing sheet into individual electronic components; A temporary holding step of holding the electronic components together with the dicing sheet together with a temporary holding member, a dicing sheet peeling step of peeling the dicing sheet from the electronic component held by the temporary holding member, and a temporary holding. A second attaching step of attaching the electronic component held by the member to the pickup sheet; And a temporary hold releasing step of separating the temporary holding member from the electronic component.
[0010]
According to a fourth aspect of the present invention, there is provided a method of manufacturing an electronic component aggregate according to the third aspect, wherein the holding force of the electronic component by the pickup sheet is reduced prior to the second attaching step. And adjusting the holding force.
[0011]
According to the present invention, the electronic components of the diced pieces are collectively held together with the dicing sheet by the temporary holding member, and after these electronic components are reattached to the pickup sheet, the electronic components are attached to the pickup sheet. By taking out the attached electronic components from the pickup sheet for each piece, it is possible to give the dicing sheet and the pickup sheet an appropriate holding force according to each operation, and to achieve stable dicing and after dicing. In addition, a normal pickup of individual parts can be made compatible with each other, so that electronic parts of stable quality without cracks or chips can be efficiently produced.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1, 2, and 3 are process explanatory views of an electronic component manufacturing method according to an embodiment of the present invention, FIG. 4 is a perspective view of an electronic component holding jig according to an embodiment of the present invention, and FIG. FIG. 6 is a partial perspective view of an electronic component supply device according to one embodiment of the present invention, FIG. 6 is a perspective view of a sheet peeling jig of the electronic component supply device according to one embodiment of the present invention, and FIG. FIG. 8 and FIG. 9 are explanatory views of a sheet peeling operation in the electronic component supply method according to the embodiment, and FIG. 8 and FIG.
[0013]
First, an electronic component manufacturing method will be described with reference to FIGS. In this electronic component mounting method, individual electronic components are manufactured by dividing a semiconductor wafer in which a plurality of electronic components are formed. In FIG. 1A, the dicing sheet 1 has a configuration in which an adhesive layer 1b is formed on a surface of a sheet-like base material 1a made of a resin. The dicing sheet 1 is used for holding the semiconductor wafer 2 in a dicing step of dividing a semiconductor wafer 2 in which semiconductor chips as a plurality of electronic components are formed into individual semiconductor chips.
[0014]
The semiconductor wafer 2 is bonded with the circuit forming surface 2a facing upward and the back surface 2b facing the adhesive layer 1b of the dicing sheet 1 (first bonding step). Thereby, as shown in FIG. 1B, the semiconductor wafer 2 is held with the back surface 1b adhered to the adhesive layer 1b. Next, the semiconductor wafer 2 is sent to a dicing step while being held on the dicing sheet 1. Then, as shown in FIG. 1C, the semiconductor wafer 2 is divided into individual semiconductor chips 3 (hereinafter simply referred to as “chips 3”) by a dicing blade 4 (dicing step).
[0015]
Next, the individual chips 3 after dicing held by the dicing sheet 1 are affixed together to a holding sheet 5 as a temporary holding member, as shown in FIG. The holding sheet 5 is a resin film on which the adhesive layer 5b is formed as in the case of the dicing sheet 1. As a result, as shown in FIG. 2B, the chip 3 is held together with the dicing sheet by the holding sheet 5 with the circuit forming surface 3a facing the adhesive layer 5b (temporary holding step).
[0016]
Next, the chip 3 sandwiched between the dicing sheet 1 and the holding sheet 5 is sent to a UV irradiation device 6, and the lower surface of the dicing sheet 1 is irradiated with ultraviolet rays. Thereby, the adhesive force of the adhesive layer 1b decreases, and the holding force for holding the chip 3 decreases. Next, as shown in FIG. 2D, the dicing sheet 1 is peeled off from the chips 3 held by the holding sheet 5 (a dicing sheet peeling step). At this time, since the adhesive force of the adhesive layer 1b is reduced by the UV irradiation, the dicing sheet 1 can be reliably peeled off from the chip 3.
[0017]
Next, as shown in FIGS. 3A and 3B, the chip 3 is attached to the pickup sheet 7 which is a sheet-like member while being held by the holding sheet 5 (second attaching step). The pickup sheet 7 is formed by forming a polymer compound such as silicone rubber, silicone gel, or butyl rubber into a film. The smooth surface of the pick-up sheet 7 has an interfacial force that holds the solid surface in contact with it. When the chip 3 is pressed against this smooth surface, the chip 3 is attached to the pick-up sheet 7 by the interfacial force. Will be retained.
[0018]
Prior to the second attaching step (sheet attaching step), the pickup sheet 7 is heated to a predetermined temperature by the heating device 8. Thereby, the degree of polymerization and the degree of cross-linking of the polymer compound constituting the pickup sheet 7 are set to a state corresponding to the desired interfacial force, and the holding force of the sticking surface 7 a is adjusted to hold the chip 3. (Holding force adjustment step).
[0019]
Thereafter, as shown in FIG. 3C, the chip 3 sandwiched between the pickup sheet 7 and the holding sheet 5 is sent to the UV irradiation device 6, and the upper surface of the holding sheet 5 is irradiated with ultraviolet rays. . Thereby, similarly to the case of the above-mentioned dicing sheet 1, the adhesive force of the adhesive layer 5b decreases, and the holding force for holding the chip 3 decreases. Next, as shown in FIG. 3D, the holding sheet 5 is separated from the chip 3 held by the pickup sheet 7 (temporary holding releasing step). At this time, since the adhesive force of the adhesive layer 5b is reduced by the UV irradiation, the holding sheet 5 can be reliably separated from the chip 3.
[0020]
Through the steps described above, an assembly of electronic components in which the chips 3 obtained by dividing the semiconductor wafer 2 into individual pieces are attached to the pickup sheet 7 and assembled are completed. Thereafter, the pickup sheet 7 is mounted in an extended state on the wafer ring 9 which is a ring-shaped sheet holding member (see FIG. 4). In the subsequent steps, the chip 3 is handled in this state. Even when the chip 3 is picked up by the pickup head and supplied to the mounting apparatus, the chip 3 is held in a state where the pickup sheet 7 is held on the wafer ring 9. Supplied. That is, the pickup sheet 7 and the wafer ring 9 are holding jigs for holding the electronic components divided into individual pieces and positioning them at the pickup position by the pickup head.
[0021]
Next, the pickup of the chip 3 will be described. As shown in FIG. 5, the wafer ring 9 holding the pickup sheet 7 is mounted on a component supply unit 14 of an electronic component mounting apparatus 11. Below the component wafer ring 9, a sheet peeling mechanism 15 is provided. As shown in FIG. 6, a suction and peeling tool 16 is mounted on a support cylinder 15 a extending upward from the sheet peeling mechanism 15, and the upper surface of the suction and peeling tool 16 is applied to the pickup sheet 7. The suction surface 16a is in contact with and sucks vacuum. A plurality of linear suction grooves 17 are formed on the suction surface 16a, and the suction holes 17a provided at the bottom of each suction groove 17 are connected to a vacuum suction source through the inside of the support cylinder 15a. . By vacuum suction through the suction holes 17a, the pickup sheet 7 is separated from the chip 3 as described later. The chip 3 from which the pickup sheet 7 has been peeled off is picked up by the suction nozzle 18a (pickup step), and is mounted on the substrate 13 placed on the substrate holding table 12 by moving the mounting head 18.
[0022]
Here, the operation of adsorbing and peeling the pickup sheet 7 in the above-described pickup step will be described with reference to FIG. First, the suction surface 16a of the suction separation tool 16 is brought into contact with the lower surface of the pickup sheet 7. Then, the vacuum suction source is driven, and vacuum suction is performed from the suction hole 17a as shown in FIG. 7A, and the chip 3 attached to the pickup sheet 7 is bent and deformed into a shape recessed into the suction groove 17. Let it. In this bending deformation, the sticking interface between the pickup sheet 7 and the chip 3 is opened at the end face of the chip 3, so that the separation of the chip 3 and the pickup sheet 7 is started. At this time, since the interfacial force of the pickup sheet 7 has been adjusted as described above, the chip 3 can be peeled satisfactorily.
[0023]
Thereafter, the peeling of the pickup sheet 7 from the chip 3 further progresses, and in a state where the adhesive sheet 5 is sucked into the suction holes 17a in the suction grooves 17 as shown in FIG. The bending disappears due to the restoring force, and returns to a flat state. Then, as shown in FIG. 7C, the pickup 3 is completed by moving the suction nozzle 18a up and down with respect to the chip 3 to take it out.
[0024]
After all the chips 3 have been picked up from one pick-up sheet 7 in this way, the pick-up sheet 7 is collected together with the wafer ring 9 and reused in a subsequently executed sheet sticking process. That is, when the pickup sheet 7 is peeled off from the chip 3 in the above-described pickup step, it is necessary to simply stick the lower surface of the pickup sheet 7 and to push up by the ejector pins which has been performed in the conventional peeling operation. Therefore, the pickup sheet 7 is not damaged and can be reused.
[0025]
In the above-described embodiment, an example was shown in which the adhesive layer of the dicing sheet 1 and the holding sheet 5 used was such that the adhesive strength was reduced by UV irradiation. However, the present invention is not limited to this. An ordinary adhesive layer which does not reduce the adhesive strength may be used. In this case, according to the peeling (see FIG. 8C) in which the sheet is gradually pulled from the end starting from the end of the chip 3 by pulling the sheet obliquely (see FIG. 8C), the sheet is chipped without UV irradiation. 3 can be peeled off.
[0026]
In the above-described embodiment, the holding sheet 5 having the same adhesive layer as the dicing sheet 1 is used as a method of temporarily holding the chips 3 separated into individual pieces. Vacuum adsorption may be used as a method for performing the above. Hereinafter, description will be made with reference to FIGS. FIG. 8A shows a state where the suction holding tool 10 is positioned above the dicing sheet 1 (see FIG. 1C) holding the chips 3 separated into individual pieces by dicing.
[0027]
The suction holding tool 10 is connected to the vacuum suction means 19, and the suction holding tool 10 is moved down with respect to the dicing sheet 1 to drive the vacuum suction means 19, as shown in FIG. The chip 3 is held by suction on the suction surface formed by the porous member. Then, in this state, as shown in FIG. 8C, the dicing sheet 1 is peeled downward starting from the end of the chip 3 (peeling). As a result, as shown in FIG. 8D, the dicing sheet 1 is peeled from the chip 3 (dicing sheet peeling step).
[0028]
Next, as shown in FIGS. 9A and 9B, the chip 3 is attached to the pickup sheet 7 as a sheet-like member while being held by the suction holding tool 10 (second attaching step). Prior to the second adhering step, the pickup sheet 7 is heated to a predetermined temperature by the heating device 8 as in the above-described example, and the holding force of the adhering surface 7a is strong enough to hold the chip 3. (The holding force adjustment step). Thereafter, as shown in FIGS. 9C and 9D, the chip 3 is separated from the suction holding tool 10 by releasing the vacuum suction of the suction holding tool 10 (temporary holding release step). According to this method, the chip 3 can be efficiently replaced from the dicing sheet 1 to the pickup sheet 7.
[0029]
As described above, in the electronic component manufacturing method according to the present embodiment, the diced individual electronic components are collectively held together with the dicing sheet by the temporary holding member, and these electronic components are formed on the pickup sheet. After the replacement, the electronic components are taken out of the pickup sheet for each piece.
[0030]
This allows the dicing sheet to have a sufficient adhesive force to hold each piece with a sufficient holding force at the time of dicing for cutting the semiconductor wafer, and also enables the sticking force of the pickup sheet to be suitable for the pick-up operation. The holding force can be set. Therefore, both stable dicing and normal pick-up of individual pieces after dicing can be achieved, and electronic components of stable quality without cracks, chips, etc. can be efficiently produced.
[0031]
In addition, as the method of peeling off the chip 3 held by the pickup sheet 7, the method of peeling by suction without using ejector pins is used, so that the pickup sheet 7 is not damaged at the time of peeling. Therefore, the same pickup sheet 7 can be reused repeatedly, and resource saving is promoted.
[0032]
【The invention's effect】
According to the present invention, the electronic components of the diced pieces are collectively held together with the dicing sheet by the temporary holding member, and after these electronic components are re-attached to the pickup sheet, the electronic components are attached to the pickup sheet. By taking out the attached electronic components from the pickup sheet for each piece, it is possible to give the dicing sheet and the pickup sheet an appropriate holding force according to each operation, and to achieve stable dicing and after dicing. In addition, a normal pickup of individual parts can be made compatible with each other, so that electronic parts of stable quality without cracks or chips can be efficiently produced.
[Brief description of the drawings]
FIG. 1 is a process explanatory view of an electronic component manufacturing method according to an embodiment of the present invention; FIG. 2 is a process explanatory view of an electronic component manufacturing method according to an embodiment of the present invention; FIG. FIG. 4 is a perspective view of an electronic component holding jig according to one embodiment of the present invention. FIG. 5 is a partial perspective view of an electronic component supply device according to one embodiment of the present invention. FIG. 6 is a perspective view of a sheet peeling jig of the electronic component supply device of one embodiment of the present invention. FIG. 7 is an explanatory diagram of a sheet peeling operation in the electronic component supplying method of one embodiment of the present invention. 8: Process explanatory diagram of an electronic component manufacturing method according to one embodiment of the present invention [FIG. 9] Process explanatory diagram of an electronic component manufacturing method according to one embodiment of the present invention [Description of reference numerals]
REFERENCE SIGNS LIST 1 dicing sheet 2 semiconductor wafer 3 chip 5 holding sheet 7 pickup sheet 9 wafer ring 10 suction holding tool 11 electronic component mounting device 14 component supply unit 15 sheet peeling mechanism

Claims (4)

An electronic component manufacturing method for manufacturing an individual electronic component by dividing a semiconductor wafer in which a plurality of electronic components are formed, comprising: a first attaching step of attaching the semiconductor wafer to a dicing sheet; A dicing step of dicing the semiconductor wafer affixed to the sheet into individual electronic components and a temporary holding step of holding the dicing individual electronic components together with the dicing sheet together with a temporary holding member; A dicing sheet peeling step of peeling the dicing sheet from the electronic component held by the member, a second attaching step of attaching the electronic component held by the temporary holding member to the pickup sheet, A temporary holding release step of separating the temporary holding member from the attached electronic component, and separating the electronic component into individual pieces. Electronic component manufacturing method characterized by comprising a pickup step of taking from the pick-up sheet to. 2. The electronic component manufacturing method according to claim 1, further comprising a holding force adjusting step of adjusting a holding force of the electronic component by the pickup sheet before the second attaching step. A method for manufacturing an aggregate of electronic components in which individual electronic components obtained by dividing a semiconductor wafer in which a plurality of electronic components are formed are attached to a pickup sheet and assembled, and the semiconductor wafer is attached to a dicing sheet. A first attaching step, a dicing step of dicing the semiconductor wafer stuck on the dicing sheet into individual electronic parts, and a dicing sheet together with the dicing sheet by the temporary holding member. A temporary holding step of holding, a dicing sheet peeling step of peeling the dicing sheet from the electronic component held by the temporary holding member, and a step of attaching the electronic component held by the temporary holding member to the pickup sheet. 2 sticking step and temporary holding for separating the temporary holding member from the electronic component attached to the pickup sheet Method for producing a collection of electronic components, which comprises a removal step. 4. The method of manufacturing an electronic component assembly according to claim 3, further comprising a holding force adjusting step of adjusting a holding force of the electronic component by the pickup sheet prior to the second attaching step.

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