JPWO2021084902A1 - - Google Patents
Info
- Publication number
- JPWO2021084902A1 JPWO2021084902A1 JP2021554128A JP2021554128A JPWO2021084902A1 JP WO2021084902 A1 JPWO2021084902 A1 JP WO2021084902A1 JP 2021554128 A JP2021554128 A JP 2021554128A JP 2021554128 A JP2021554128 A JP 2021554128A JP WO2021084902 A1 JPWO2021084902 A1 JP WO2021084902A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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WO2018003602A1 (en) * | 2016-06-28 | 2018-01-04 | リンテック株式会社 | Alignment jig, alignment method, and transfer method |
US20190035688A1 (en) * | 2017-07-26 | 2019-01-31 | Ultra Display Technology Corp. | Method of batch transferring micro semiconductor structures |
US20190081200A1 (en) * | 2017-09-13 | 2019-03-14 | PlayNitride Inc. | Method of manufacturing micro light-emitting element array, transfer carrier, and micro light-emitting element array |
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JPH04340251A (en) * | 1991-02-07 | 1992-11-26 | Fujitsu Ltd | Manufacture of semiconductor device |
JP2004288689A (en) | 2003-03-19 | 2004-10-14 | Matsushita Electric Ind Co Ltd | Method for manufacturing electronic part and method for manufacturing electronic parts assembly |
JP2015046569A (en) | 2013-07-31 | 2015-03-12 | マイクロン テクノロジー, インク. | Semiconductor device manufacturing method |
CN106601657B (en) | 2016-12-12 | 2019-12-17 | 厦门市三安光电科技有限公司 | Micro-component transfer system, micro-component transfer method, micro-component manufacturing apparatus, and electronic device |
WO2018157937A1 (en) | 2017-03-02 | 2018-09-07 | Ev Group E. Thallner Gmbh | Method and device for bonding chips |
KR102515684B1 (en) | 2017-11-16 | 2023-03-30 | 린텍 가부시키가이샤 | Manufacturing method of semiconductor device |
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WO2018003602A1 (en) * | 2016-06-28 | 2018-01-04 | リンテック株式会社 | Alignment jig, alignment method, and transfer method |
US20190035688A1 (en) * | 2017-07-26 | 2019-01-31 | Ultra Display Technology Corp. | Method of batch transferring micro semiconductor structures |
US20190081200A1 (en) * | 2017-09-13 | 2019-03-14 | PlayNitride Inc. | Method of manufacturing micro light-emitting element array, transfer carrier, and micro light-emitting element array |
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