JP6145527B2 - Sheet processing apparatus and sheet processing method - Google Patents

Description

  The present invention relates to a sheet processing apparatus and a sheet processing method.

  2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, a semiconductor wafer (hereinafter simply referred to as a wafer) is cut into a predetermined shape and a predetermined size and separated into semiconductor chips (hereinafter sometimes simply referred to as chips) (dicing process). ) After forming the adhesive layer on this chip, the distance between the separated chips is expanded (expanding process), and then each chip is picked up and bonded to the substrate (bonding process). ing.

The adhesive layer is formed by sticking the diced chip to a stretchable adhesive sheet in the shape of a wafer and expanding it to expand the space between the chips. At the same time, the adhesive layer of the adhesive sheet is also broken. There is known a method of dividing into chips with an adhesive layer (see, for example, Patent Document 1), and the chip with an adhesive layer is bonded to an adherend such as a substrate.
Here, as the adherend to which such a chip is bonded, there may be employed an adherend having a bottom surface portion and a side surface portion and having a recess into which the bottom portion of the chip enters.

JP 2005-260204 A

  However, in the apparatus described in Patent Document 1, since the adhesive layer is broken by expanding, the broken adhesive layer has various shapes. Thereby, for example, when the adhesive layer is broken into a shape smaller than the bottom surface of the chip, there is a possibility that the bonding force between the adherend and the chip is insufficient in the bonding process. Moreover, since the chip | tip with the adhesive layer formed with the apparatus of patent document 1 has only the adhesive bond layer laminated | stacked on the bottom face, it has the side surface of a chip | tip with respect to the to-be-adhered body in which the recessed part was formed. There arises an inconvenience that they cannot be bonded and firmly bonded.

  An object of the present invention is to provide a sheet processing apparatus and a sheet processing method capable of providing an adhesive layer for appropriately adhering a piece to an adherend.

In order to achieve the above object, the sheet processing apparatus of the present invention includes a first support means for supporting a plurality of pieces and a laminated sheet in which an adhesive layer is laminated on one surface of a base sheet. Supported by the second support means opposed to the plurality of pieces supported by one support means, the plurality of pieces supported by the first support means, and the second support means By relatively moving the laminated sheet, contact means for bringing the laminated sheet and the plurality of pieces into contact with each other, and deforming the laminated sheet toward the gap between the plurality of pieces, fractured said adhesive layer positioned on the gap comprises a side adhesive means to form a folded portion by bonding the ends of the adhesive layer that the fracture on each side of the plurality of flake material, and The configuration is adopted.

On the other hand, the sheet processing method of the present invention supports a plurality of pieces, and supports a laminated sheet in which an adhesive layer is laminated on one surface of the base sheet so as to face the plurality of pieces. By relatively moving the plurality of pieces and the laminated sheet, the laminated sheet and the plurality of pieces are brought into contact with each other, and the laminated sheet is deformed toward the gap between the plurality of pieces. By doing so, the adhesive layer located in the gap is cleaved, and the folded portion is formed by bonding the cleaved end portions of the adhesive layer to the side surfaces of the plurality of pieces. Adopted.

1 is an overall view of a transfer apparatus according to an embodiment of the present invention. FIG. 2 is an operation explanatory diagram of the transfer device of FIG. 1. FIG. 3 is an operation explanatory diagram of the transfer device following FIG. 2. FIG. 4 is an operation explanatory diagram of the transfer device following FIG. 3. FIG. 9 is an overall view of a transfer device according to a modification of the present invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the present embodiment, unless otherwise specified, terms indicating directions such as “up”, “down”, “left”, and “right” are used with reference to FIG.
In the present embodiment, the transfer apparatus 1 as a sheet processing apparatus is attached to the adhesive sheet S1, and the wafer W separated into a plurality of chips WA is formed into a plurality of pieces, and these chips WA are used as an adhesive. The wafer W is transferred to a transfer sheet S2 as a laminated sheet in which the layer AD2 is laminated, and this wafer W is adhered and bonded via an adhesive layer AD1 laminated on one surface (lower surface) of the adhesive sheet S1. It is held on the ring frame RF1 via the sheet S1. The chip WA is formed in a hexahedron by dicing the wafer W into a lattice shape.
The transfer sheet S2 includes a base sheet BS2 and a heat-sensitive adhesive layer AD2 laminated on one surface (upper surface) of the base sheet BS2. The base sheet BS2 is attached to the second ring frame RF2. Affixed and held. The base sheet BS2 has a thickness of 30 μm, and the adhesive layer AD2 has a thickness of 10 μm.

  In FIG. 1, a transfer apparatus 1 includes a first support unit 2 that supports a wafer W via an adhesive sheet S1 and a ring frame RF1, and a second support unit 3 that supports the transfer sheet S2 so as to face the wafer W. A contact means 4 for separating the wafer W and the transfer sheet S2 from each other, a fluidizing means 5 for fluidizing the adhesive layer AD2 of the transfer sheet S2, and a side adhesion means 6 for deforming the transfer sheet S2. It is prepared for.

The first support means 2 is supported by the contact means 4 as a whole, a support member 21 having a circular recess 211 formed in the center, a plurality of arms 22 attached to the outer periphery of the support member 21, and the support member 21. A linear motion motor 23 as a drive device provided on the upper surface of the linear motor 23 and an expansion table 24 constituting an expanding means attached to an output shaft 23A of the linear motion motor 23 are provided.
Suction holes connected to decompression means (not shown) such as a decompression pump and a vacuum ejector are provided on the lower surfaces of the support member 21 and the expand table 24, respectively. The arm 22 is provided so as to be movable in the vertical direction by a linear motion motor (not shown) that is a driving device, and the first ring frame RF1 is sandwiched between and supported by the support surface 212 of the support member 21, The wafer W can be supported. When the expand table 24 is disposed in the recess 211, an inner support surface 241 that can form the same plane as the support surface 212 is formed, and a coil heater 52 that constitutes the fluidizing means 5 is provided therein. It has been.

The entire second support means 3 is supported by a frame (not shown) and can be arranged below the first support means 2. The second support means 3 includes a table 31 having a support surface 32, and a coil heater 51 constituting the fluidizing means 5 is provided inside the table 31.
The table 31 is configured to be able to support the transfer sheet S2 attached to the second ring frame RF2 on the support surface 32 facing the first support means 2 with the adhesive layer AD2 on the upper side. The support surface 32 is provided with intake / exhaust holes (not shown) communicating with the side surface adhering means 6.

  The abutting means 4 includes a linear motion motor 41 as a drive device, and a support member 21 is attached to a slider (not shown) of the linear motion motor 41.

  The side surface adhering means 6 includes a pressurizing means 61 such as a pressurizing pump or a turbine connected to the table 31, and pressurizes the transfer sheet S2 through an intake / exhaust hole (not shown) formed in the support surface 32, thereby transferring the transfer sheet S2. An air pressure difference (pressure difference) is generated on both surfaces of the sheet S2, and the transfer sheet S2 is deformed upward. Further, the side surface adhering means 6 includes a decompression means 62 such as a decompression pump or a vacuum ejector connected to the table 31, and sucks the transfer sheet S2 through an intake / exhaust hole (not shown) formed in the support surface 32. An atmospheric pressure difference (pressure difference) is generated on both surfaces of the transfer sheet S2, and the base sheet BS2 in the transfer sheet S2 is deformed downward.

  Note that the adhesive force of the adhesive layer AD1 of the adhesive sheet S1 is greater than the adhesive force of the adhesive layer AD2 of the transfer sheet S2 so that the adhesive layer AD1 of the transfer sheet S2 can be reliably peeled off from the wafer W attached to the adhesive layer AD2. It is preferable that the setting is weak. Furthermore, the transfer device 1 may be configured to include a UV lamp (not shown) that irradiates the adhesive sheet S1 with ultraviolet rays and weakens the adhesive force of the adhesive layer AD1.

In the transfer apparatus 1 described above, the procedure for transferring the wafer W to the adhesive layer AD2 of the transfer sheet S2 to form the folded portion will be described.
First, as illustrated in FIG. 1, the transfer device 1 supports the first ring frame RF1 integrated with the wafer W via the adhesive sheet S1 by sandwiching the first ring frame RF1 with the support surface 212 by the arm 22. On the other hand, the second support means 3 supports the transfer sheet S2 on the table 31 from the base sheet BS2 side, and disposes the adhesive layer AD2 to the wafer W. Then, the transfer device 1 drives the decompression unit 62 to suck and hold the transfer sheet S <b> 2 by the support surface 32.

  Next, as shown in FIG. 2, the transfer device 1 moves the expansion table 24 downward by driving the linear motion motor 23 to stretch the adhesive sheet S <b> 1 and widen the gaps between the chips WA (wafer W To expand the gap C between adjacent chips WA. When the detecting means such as a sensor (not shown) detects that the distance C between the chips has reached a predetermined distance, 150 μm in this embodiment, the driving of the linear motor 23 is stopped and the decompressing means (not shown) is driven. The adhesive sheet S1 is sucked and supported by the inner support surface 241. In this state, by driving the linear motion motor 41, the support member 21 is moved downward so that the bottom surface (the lower surface in FIG. 2) of each chip WA is brought into contact with the adhesive layer AD2 of the transfer sheet S2. The Then, the coil heaters 51 and 52 are driven to start heating, and the adhesive layer AD2 of the transfer sheet S2 is fluidized. In the case of the present embodiment, the adhesive layer AD2 is fluidized (softened) around 170 ° C., so that the coil heaters 51 and 52 are maintained at 180 ° C. by control means (not shown) such as a personal computer or a sequencer. To be controlled. In addition, the temperature of the coil heaters 51 and 52 can be appropriately changed according to the temperature at which the adhesive layer AD2 is fluidized and the characteristics thereof.

  Then, the pressurizing means 61 is driven, and the transfer sheet S2 is deformed by pressurizing the transfer sheet S2 from the base sheet BS2 side through an intake / exhaust hole (not shown). At this time, as shown in FIG. 3A, immediately below each chip WA, gas is not ejected from an unillustrated intake / exhaust hole, and gas is ejected only from an unillustrated intake / exhaust hole located between the chips C. As a result, a pressure difference (pressure difference) is generated on both surfaces of the transfer sheet S2, and the transfer sheet S2 is deformed so as to enter the inter-chip C due to the pressure difference (pressure difference). When the amount of the transfer sheet S2 entering the inter-chip C increases, the adhesive layer AD2 is fluidized by the coil heaters 51 and 52, and therefore, as shown in FIG. Cracks P enter the surface. When the transfer sheet S2 further enters the inter-chip C, the crack P spreads, and the adhesive layer AD2 is cleaved with the crack P as shown in FIG. Thereafter, as shown in FIG. 3D, the edge portion of the cut adhesive layer AD2 is folded back by further entering the inter-chip C of the transfer sheet S2, and the four side surfaces of the respective chips WA. Each of WA1 (side surface WA1 includes a front side surface and a back side surface in the figure) is pressed and bonded. As a result, the adhesive layer AD2 can be bonded to each of the four side surfaces WA1 of each chip WA to form the folded portion AD3 having a length of about 75 μm in the vertical direction in FIG.

  Next, the transfer device 1 stops the pressurizing unit 61 and drives the decompression unit 62 to suck air through a suction / exhaust hole (not shown) of the support surface 32, thereby causing a pressure difference (pressure) on both surfaces of the transfer sheet S <b> 2. Difference). Then, as shown in FIG. 3E, the base sheet BS2 out of the transfer sheet S2 that has entered the inter-chip C is sucked onto the support surface 32. Here, the adhesive force of the adhesive layer AD2 is set so that the adhesive force with the base sheet BS2 is weaker than the adhesive force with the chip WA, and the base sheet BS2 is peeled from the folded portion AD3 and supported. It is pulled back on the surface 32. Thereby, a gap of about 130 μm is formed between the folded portions AD3.

  Subsequently, the suction support of the adhesive sheet S1 on the inner support surface 241 is released while the decompression means 62 is driven. In this state, when the linear motor 41 is driven to move the first support means 2 upward, the adhesive sheet S1 is gradually peeled inward from the outer edge position of the wafer W as shown in FIG. Finally, it is peeled from each chip WA.

  According to this embodiment, the side surface adhering means 6 deforms the transfer sheet S2 toward the inter-chip C between the plurality of chips WA, and adheres the adhesive layer AD2 to each side surface WA1 of the chip WA to return the folded portion AD3. Can be formed. The chip WA with the adhesive layer AD2 formed in this way has not only the bottom surface of the chip WA but also the side surfaces WA1 when the recess is formed in the adherend (not shown) in the next bonding process. Can be bonded to the recess, and the bonding area of the chip WA to an adherend (not shown) can be increased, so that they can be bonded more firmly.

  As described above, the best configuration, method, and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to particular embodiments, but with respect to the embodiments described above, such as shape and the like, without departing from the scope and spirit of the invention. In the detailed configuration, various modifications can be made by those skilled in the art. Moreover, since the description which limited the shape etc. which were disclosed above was illustrated in order to make an understanding of this invention easy, it does not limit this invention, Therefore The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, as shown in FIG. 5, the transfer apparatus 1A as a sheet processing apparatus may simultaneously perform contact of the transfer sheet S2 with the wafer W and cleaving of the adhesive layer AD2. The transfer apparatus 1A supports a wafer W in which an inter-chip C is formed in advance between the chips WA, and includes a first support unit 2A to which a pressurizing unit 61 and a decompression unit 62 are connected, and a first support unit 2A. A second support means 3A for supporting the transfer sheet S2 on the support surface 32A via the second ring frame RF2 and a gas as a fluid from the substrate sheet BS2 side of the transfer sheet S2 toward the wafer W, which is an outer peripheral portion; , And a contact means 4A for bringing the transfer sheet S2 into contact with the wafer W in a non-contact state.

  The first support means 2A has a support member 21A having a support surface 212A on its upper surface, and a coil heater 53 constituting the fluidizing means 5A is built in the support member 21A. The abutting means 4A includes a pressurizing means 42 such as a pressurizing pump or a turbine as a fluid ejecting means, and an exhaust plate 43 formed with an exhaust hole (not shown) to which the pressurizing means 42 is connected. The coil heater 54 constituting the fluidizing means 5A is built in the inside. In this case, the pressurizing means 61 and the decompressing means 62 connected to the first support means 2 and the pressurizing means 42 connected to the exhaust plate 43 constitute the side surface adhering means 6A.

  As a procedure for forming the folded portion AD3 by the transfer device 1A, first, a wafer W in which an inter-chip C is formed in advance between the chips WA is placed on the first support means 2A, and a transfer sheet S2 is further attached. The ring frame RF2 is placed on the support surface 32A of the second support means 3A so that the adhesive layer AD2 is on the lower side. Then, the decompression means 62 is driven to suck and hold the wafer W and the second ring frame RF2. Next, the pressing means 42 of the contact means 4A is driven to press the transfer sheet S2 toward the wafer W, and the transfer sheet S2 is brought into contact with the wafer W. After that, by continuing the pressurization of the pressurizing means 42, the transfer sheet S2 is deformed into the inter-chip C in the same manner as described above, and the adhesive layer AD2 is cleaved. When the cleaving is completed and the folded portion AD3 is adhered to each of the four side surfaces WA1 of each chip WA, the driving of the pressurizing unit 42 and the decompressing unit 62 is stopped, and then the pressurizing unit 61 is driven to transfer the sheet. The base material sheet BS2 portion of S2 is pushed out of C between the chips. At this time, the chips WA are urged from above the transfer sheet S2 to the support surface 212A side by the gas ejected from the exhaust plate 43 or the exhaust plate 43 so that the chips WA are not detached from the support surface 212A. An urging means may be provided. Thereby, the adhesive layer AD2 can be provided on the side surface WA1 of the chip WA.

In the embodiment, the adhesive layer AD2 may have a shape that is larger than the bottom surface of the chip WA and is cleaved in advance at a position within the inter-chip C.
Furthermore, in the said embodiment, as a fluid which the pressurization means 42 and 61 spray, a liquid, a gel-like thing, etc. may be sufficient besides gas. Further, if the fluid ejected from the pressurizing means 42 and 61 is heated by the heating means, the coil heaters 51 to 54 can be omitted, and the adhesive layer AD2 is fluidized by the heat of the fluid and transferred. The sheet S2 can be deformed.
Further, the decompression means 62 may adopt a means capable of sucking the gas, liquid, gel-like thing sprayed by the pressurization means 42, 61.

Furthermore, the pressurizing means 61 connected to the table 31 is not provided, and the space formed by the first ring frame RF1 and the second ring frame RF2 is a sealed space, and this space is depressurized or pressurized. Accordingly, a configuration may be employed in which the transfer sheet S2 is deformed toward the inter-chip C, or the base sheet BS2 is pushed out from a sealed space. At this time, it is preferable to provide a shielding means for preventing pressure reduction or pressurization between the support surface 32A and the transfer sheet S2.
In the embodiment, the contact means 4 stops the first support means 2 and moves the second support means 3 or moves both the second support means 3 and the contact means 4. By doing so, the wafer W and the transfer sheet S2 may be brought into contact with or separated from each other, or the adhesive sheet S1 may be peeled from the wafer W.

The wafer W supported by the first support means 2 may be one in which the inter-chip C is formed in advance. In this case, the expanding table 24 may not be provided.
Moreover, in the said embodiment, although the hexahedral chip | tip WA was illustrated as a piece body and the folding part AD3 was formed in each of each of the four side surfaces WA1 of each chip WA, the piece body may be a pentahedron or less. Alternatively, it may be a seven-hedron or more, and a configuration in which the folded portion AD3 is formed on each side surface of each polyhedron is sufficient.
Further, the fluidizing means 5 and 5A can be appropriately changed according to the configuration and properties of the adhesive layer AD2 in addition to the coil heaters 51 to 54, and can fluidize the adhesive layer AD2, for example, infrared An irradiation device, an ultraviolet irradiation device, a microwave generation device, a vibration device, or the like can be used.

In addition, the types and materials of the adhesive sheet S1 and the transfer sheet S2 in the present invention are not particularly limited. For example, those having an intermediate layer between the base sheet and the adhesive layers AD1 and AD2, and other layers Three or more layers may be used. Further, the adhesive sheet S1 and the transfer sheet S2 may be protective sheets, dicing tapes, die attach films, other arbitrary sheets, films, tapes and the like, adhesive sheets having arbitrary uses and shapes. Further, the adhesive layers AD1 and AD2 may be a pressure-sensitive adhesive or a heat-sensitive adhesive.
Examples of the semiconductor wafer include a silicon semiconductor wafer and a compound semiconductor wafer. In addition, the plurality of pieces are not limited to chips obtained by dicing a semiconductor wafer, but also optical disks, glass plates, steel plates, resin plates, and other members, as well as members and articles of any form Or the like can be targeted.

Further, the adhesive sheet S1 and the transfer sheet S2 may not be attached to the ring frames RF1 and RF2.
Further, even if there is no fluidizing means, the adhesive layer AD2 is such that a crack P is formed on the surface of the adhesive layer AD2 due to the transfer sheet S2 entering the inter-chip C, and the crack P is used as a cut. In the case where the adhesive layer AD2 can be bonded to each side surface WA1 of the chip WA to form the folded portion AD3 without the fluidizing means, or the adhesive layer AD2 has been cleaved in advance. For example, the fluidizing means may or may not be provided.
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

1,1A transfer device (sheet processing device)
2,2A 1st support means 3,3A 2nd support means 4,4A Contact means 6,6A Side surface adhesion means AD2 Adhesive layer AD3 Folding part BS2 Base material sheet C Between chips (gap)
S2 Transfer sheet (Laminated sheet)
WA chip (single piece)
WA1 side

Claims (2)

First support means for supporting a plurality of pieces,
A second support means for supporting a laminated sheet in which an adhesive layer is laminated on one surface of the base sheet so as to face the plurality of pieces supported by the first support means;
The laminated sheet and the plurality of pieces are brought into contact with each other by relatively moving the plurality of pieces supported by the first support means and the laminated sheet supported by the second support means. A contact means;
By deforming the laminated sheet toward the gap between the plurality of pieces, the adhesive layer located in the gap is cleaved, and the edge of the cleaved adhesive layer is cut into the pieces. And a side surface adhering means that forms a folded portion by adhering to each side surface of the sheet processing apparatus. Supports multiple pieces,
Supporting a laminated sheet in which an adhesive layer is laminated on one surface of the base sheet, facing the plurality of pieces,
By relatively moving the plurality of pieces and the laminated sheet, the laminated sheet and the plurality of pieces are brought into contact with each other,
By deforming the laminated sheet toward the gap between the plurality of pieces, the adhesive layer located in the gap is cleaved, and the edge of the cleaved adhesive layer is cut into the pieces. A sheet processing method comprising forming a folded portion by bonding to each side surface of the sheet.