JP5858698B2 - 太陽電池用インターコネクタ材料、太陽電池用インターコネクタ、およびインターコネクタ付き太陽電池セル - Google Patents
太陽電池用インターコネクタ材料、太陽電池用インターコネクタ、およびインターコネクタ付き太陽電池セル Download PDFInfo
- Publication number
- JP5858698B2 JP5858698B2 JP2011202489A JP2011202489A JP5858698B2 JP 5858698 B2 JP5858698 B2 JP 5858698B2 JP 2011202489 A JP2011202489 A JP 2011202489A JP 2011202489 A JP2011202489 A JP 2011202489A JP 5858698 B2 JP5858698 B2 JP 5858698B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- interconnector
- solar cell
- plating
- plating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims description 45
- 238000007747 plating Methods 0.000 claims description 123
- 229910045601 alloy Inorganic materials 0.000 claims description 64
- 239000000956 alloy Substances 0.000 claims description 64
- 229910020938 Sn-Ni Inorganic materials 0.000 claims description 63
- 229910008937 Sn—Ni Inorganic materials 0.000 claims description 63
- 229910000679 solder Inorganic materials 0.000 claims description 62
- 238000009792 diffusion process Methods 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 10
- 238000007654 immersion Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 7
- 238000009751 slip forming Methods 0.000 claims description 4
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 238000001336 glow discharge atomic emission spectroscopy Methods 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 102
- 239000011701 zinc Substances 0.000 description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 238000006467 substitution reaction Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910017755 Cu-Sn Inorganic materials 0.000 description 2
- 229910017927 Cu—Sn Inorganic materials 0.000 description 2
- 239000003518 caustics Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- ONDPHDOFVYQSGI-UHFFFAOYSA-N zinc nitrate Chemical compound [Zn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ONDPHDOFVYQSGI-UHFFFAOYSA-N 0.000 description 2
- 229910018100 Ni-Sn Inorganic materials 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 229910018532 Ni—Sn Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229960002089 ferrous chloride Drugs 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 description 1
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
- C25D7/126—Semiconductors first coated with a seed layer or a conductive layer for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Photovoltaic Devices (AREA)
- Electroplating Methods And Accessories (AREA)
- Coating With Molten Metal (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011202489A JP5858698B2 (ja) | 2011-09-16 | 2011-09-16 | 太陽電池用インターコネクタ材料、太陽電池用インターコネクタ、およびインターコネクタ付き太陽電池セル |
PCT/JP2012/071411 WO2013038889A1 (ja) | 2011-09-16 | 2012-08-24 | 太陽電池用インターコネクタ材料、太陽電池用インターコネクタ、およびインターコネクタ付き太陽電池セル |
CN201280045102.4A CN103814157B (zh) | 2011-09-16 | 2012-08-24 | 太阳能电池用互连件材料、太阳能电池用互连件及带互连件的太阳能电池单元 |
KR1020147009313A KR101968788B1 (ko) | 2011-09-16 | 2012-08-24 | 태양전지용 인터커넥터 재료, 태양전지용 인터커넥터, 및 인터커넥터를 구비한 태양전지 셀 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011202489A JP5858698B2 (ja) | 2011-09-16 | 2011-09-16 | 太陽電池用インターコネクタ材料、太陽電池用インターコネクタ、およびインターコネクタ付き太陽電池セル |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013065640A JP2013065640A (ja) | 2013-04-11 |
JP5858698B2 true JP5858698B2 (ja) | 2016-02-10 |
Family
ID=47883123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011202489A Expired - Fee Related JP5858698B2 (ja) | 2011-09-16 | 2011-09-16 | 太陽電池用インターコネクタ材料、太陽電池用インターコネクタ、およびインターコネクタ付き太陽電池セル |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5858698B2 (zh) |
KR (1) | KR101968788B1 (zh) |
CN (1) | CN103814157B (zh) |
WO (1) | WO2013038889A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013258305A (ja) * | 2012-06-13 | 2013-12-26 | Toyo Kohan Co Ltd | 太陽電池用インターコネクタ、およびインターコネクタ付き太陽電池セル |
JP2014047360A (ja) * | 2012-08-29 | 2014-03-17 | Auto Network Gijutsu Kenkyusho:Kk | コネクタ端子及びコネクタ端子用材料 |
JP5887305B2 (ja) * | 2013-07-04 | 2016-03-16 | Jx金属株式会社 | 電磁波シールド用金属箔、電磁波シールド材、及びシールドケーブル |
DK3555347T3 (da) * | 2016-12-16 | 2023-08-21 | Topsoe As | Aflejring af en belægning på en sammenkobling til fastoxidcellestabler |
CN110760803A (zh) * | 2019-11-29 | 2020-02-07 | 东北大学 | 一种用于固体氧化物燃料电池不锈钢连接体的复合涂层及其制备方法 |
CN112331412A (zh) * | 2020-10-20 | 2021-02-05 | 南通德晋昌光电科技有限公司 | 一种互联条的供应系统及其加工工艺 |
CN113937177A (zh) * | 2021-10-15 | 2022-01-14 | 苏州元昱新能源有限公司 | 一种铝基材光伏焊带的制造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05345969A (ja) * | 1992-06-12 | 1993-12-27 | Kobe Steel Ltd | 半田付け性及びめっき密着性に優れたAl系合金金属材 |
JPH1121660A (ja) * | 1997-07-03 | 1999-01-26 | Hitachi Cable Ltd | 太陽電池用接続線 |
JP4622375B2 (ja) | 2004-08-06 | 2011-02-02 | 日立電線株式会社 | 太陽電池用平角導体及び太陽電池用リード線 |
JP2006206977A (ja) * | 2005-01-28 | 2006-08-10 | Toyo Kohan Co Ltd | ハンダ性に優れた表面処理Al板 |
JP5101798B2 (ja) * | 2005-02-14 | 2012-12-19 | 東洋鋼鈑株式会社 | 表面処理Al板 |
JP2008006206A (ja) * | 2006-06-30 | 2008-01-17 | Toto Ltd | 便座装置 |
KR101612955B1 (ko) * | 2009-06-17 | 2016-04-15 | 엘지전자 주식회사 | 인터커넥터 및 이를 구비한 태양 전지 모듈 |
CN102071446B (zh) * | 2011-03-01 | 2012-05-02 | 无锡新大中薄板有限公司 | 可焊性铝卷材连续电镀工艺 |
CN202054913U (zh) * | 2011-03-01 | 2011-11-30 | 无锡新大中薄板有限公司 | 可焊性镀锡铝合金带 |
-
2011
- 2011-09-16 JP JP2011202489A patent/JP5858698B2/ja not_active Expired - Fee Related
-
2012
- 2012-08-24 WO PCT/JP2012/071411 patent/WO2013038889A1/ja active Application Filing
- 2012-08-24 CN CN201280045102.4A patent/CN103814157B/zh not_active Expired - Fee Related
- 2012-08-24 KR KR1020147009313A patent/KR101968788B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2013065640A (ja) | 2013-04-11 |
CN103814157B (zh) | 2016-05-11 |
CN103814157A (zh) | 2014-05-21 |
KR101968788B1 (ko) | 2019-04-12 |
KR20140066221A (ko) | 2014-05-30 |
WO2013038889A1 (ja) | 2013-03-21 |
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