JP5852810B2 - 半導体装置の作製方法 - Google Patents

半導体装置の作製方法 Download PDF

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Publication number
JP5852810B2
JP5852810B2 JP2011180658A JP2011180658A JP5852810B2 JP 5852810 B2 JP5852810 B2 JP 5852810B2 JP 2011180658 A JP2011180658 A JP 2011180658A JP 2011180658 A JP2011180658 A JP 2011180658A JP 5852810 B2 JP5852810 B2 JP 5852810B2
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Japan
Prior art keywords
semiconductor device
protective material
layer
terminal portion
step layer
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Expired - Fee Related
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JP2011180658A
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English (en)
Japanese (ja)
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JP2012069928A5 (enExample
JP2012069928A (ja
Inventor
鶴目　卓也
卓也 鶴目
章裕 千田
章裕 千田
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2011180658A priority Critical patent/JP5852810B2/ja
Publication of JP2012069928A publication Critical patent/JP2012069928A/ja
Publication of JP2012069928A5 publication Critical patent/JP2012069928A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/88—Terminals, e.g. bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2011180658A 2010-08-26 2011-08-22 半導体装置の作製方法 Expired - Fee Related JP5852810B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011180658A JP5852810B2 (ja) 2010-08-26 2011-08-22 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010189324 2010-08-26
JP2010189324 2010-08-26
JP2011180658A JP5852810B2 (ja) 2010-08-26 2011-08-22 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2012069928A JP2012069928A (ja) 2012-04-05
JP2012069928A5 JP2012069928A5 (enExample) 2014-09-11
JP5852810B2 true JP5852810B2 (ja) 2016-02-03

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Family Applications (1)

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JP2011180658A Expired - Fee Related JP5852810B2 (ja) 2010-08-26 2011-08-22 半導体装置の作製方法

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US (1) US8617995B2 (enExample)
JP (1) JP5852810B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9229481B2 (en) 2013-12-20 2016-01-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP7185252B2 (ja) 2018-01-31 2022-12-07 三国電子有限会社 接続構造体の作製方法
JP7160302B2 (ja) * 2018-01-31 2022-10-25 三国電子有限会社 接続構造体および接続構造体の作製方法
JP7046351B2 (ja) 2018-01-31 2022-04-04 三国電子有限会社 接続構造体の作製方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0969638A (ja) 1995-08-31 1997-03-11 Shin Etsu Polymer Co Ltd 太陽電池用保護フィルム
JPH0970886A (ja) 1995-09-05 1997-03-18 Fuji Electric Co Ltd 太陽電池モジュールの製造装置
JP2000284308A (ja) * 1999-03-30 2000-10-13 Ricoh Co Ltd 液晶表示装置の接続方法
TW512543B (en) 1999-06-28 2002-12-01 Semiconductor Energy Lab Method of manufacturing an electro-optical device
US7316841B1 (en) * 1999-08-30 2008-01-08 Sakura Color Products Corporation Eraser
TW468283B (en) 1999-10-12 2001-12-11 Semiconductor Energy Lab EL display device and a method of manufacturing the same
TW471011B (en) 1999-10-13 2002-01-01 Semiconductor Energy Lab Thin film forming apparatus
TW495808B (en) 2000-02-04 2002-07-21 Semiconductor Energy Lab Thin film formation apparatus and method of manufacturing self-light-emitting device using thin film formation apparatus
CN100430515C (zh) * 2001-02-01 2008-11-05 株式会社半导体能源研究所 沉积装置和沉积方法
JP4801278B2 (ja) 2001-04-23 2011-10-26 株式会社半導体エネルギー研究所 発光装置及びその作製方法
JP2003119207A (ja) * 2001-10-11 2003-04-23 Jsr Corp 光硬化性組成物、その硬化物、及び積層体
US7579771B2 (en) 2002-04-23 2009-08-25 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and method of manufacturing the same
JP4216008B2 (ja) 2002-06-27 2009-01-28 株式会社半導体エネルギー研究所 発光装置およびその作製方法、ならびに前記発光装置を有するビデオカメラ、デジタルカメラ、ゴーグル型ディスプレイ、カーナビゲーション、パーソナルコンピュータ、ｄｖｄプレーヤー、電子遊技機器、または携帯情報端末
JP2004095760A (ja) * 2002-08-30 2004-03-25 Optrex Corp プリント配線板
JP4373085B2 (ja) 2002-12-27 2009-11-25 株式会社半導体エネルギー研究所 半導体装置の作製方法、剥離方法及び転写方法
JP4373086B2 (ja) 2002-12-27 2009-11-25 株式会社半導体エネルギー研究所 発光装置
JP2004281976A (ja) 2003-03-19 2004-10-07 Dainippon Printing Co Ltd 透明カバーフィルム
JP4809600B2 (ja) * 2003-10-28 2011-11-09 株式会社半導体エネルギー研究所 半導体装置の作製方法
US7229900B2 (en) * 2003-10-28 2007-06-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method of manufacturing thereof, and method of manufacturing base material
EP1528594B1 (en) * 2003-10-28 2019-05-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP4974452B2 (ja) * 2003-10-28 2012-07-11 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2005303158A (ja) * 2004-04-15 2005-10-27 Nec Corp デバイスの形成方法
GB2439001B (en) * 2005-03-18 2011-03-09 Konica Minolta Holdings Inc Method of forming organic compound layer, method of manufacturing organic el element and organic el element
JP4404109B2 (ja) * 2007-07-03 2010-01-27 ソニー株式会社 表示装置の製造方法
JP5480554B2 (ja) * 2008-08-08 2014-04-23 株式会社半導体エネルギー研究所 半導体装置

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Publication number Publication date
US20120049340A1 (en) 2012-03-01
JP2012069928A (ja) 2012-04-05
US8617995B2 (en) 2013-12-31

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