JP5810929B2 - ウェーハ搬送装置 - Google Patents

ウェーハ搬送装置 Download PDF

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Publication number
JP5810929B2
JP5810929B2 JP2012004548A JP2012004548A JP5810929B2 JP 5810929 B2 JP5810929 B2 JP 5810929B2 JP 2012004548 A JP2012004548 A JP 2012004548A JP 2012004548 A JP2012004548 A JP 2012004548A JP 5810929 B2 JP5810929 B2 JP 5810929B2
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Japan
Prior art keywords
wafer
chamber
loading
unloading
wafer transfer
Prior art date
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Expired - Fee Related
Application number
JP2012004548A
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English (en)
Japanese (ja)
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JP2013143558A (ja
JP2013143558A5 (https=
Inventor
巧 溝河
巧 溝河
保良 北澤
保良 北澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sinfonia Technology Co Ltd
Original Assignee
Sinfonia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sinfonia Technology Co Ltd filed Critical Sinfonia Technology Co Ltd
Priority to JP2012004548A priority Critical patent/JP5810929B2/ja
Priority to US13/740,721 priority patent/US9159600B2/en
Publication of JP2013143558A publication Critical patent/JP2013143558A/ja
Publication of JP2013143558A5 publication Critical patent/JP2013143558A5/ja
Application granted granted Critical
Publication of JP5810929B2 publication Critical patent/JP5810929B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2012004548A 2012-01-13 2012-01-13 ウェーハ搬送装置 Expired - Fee Related JP5810929B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012004548A JP5810929B2 (ja) 2012-01-13 2012-01-13 ウェーハ搬送装置
US13/740,721 US9159600B2 (en) 2012-01-13 2013-01-14 Wafer transport apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012004548A JP5810929B2 (ja) 2012-01-13 2012-01-13 ウェーハ搬送装置

Publications (3)

Publication Number Publication Date
JP2013143558A JP2013143558A (ja) 2013-07-22
JP2013143558A5 JP2013143558A5 (https=) 2013-08-29
JP5810929B2 true JP5810929B2 (ja) 2015-11-11

Family

ID=48780078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012004548A Expired - Fee Related JP5810929B2 (ja) 2012-01-13 2012-01-13 ウェーハ搬送装置

Country Status (2)

Country Link
US (1) US9159600B2 (https=)
JP (1) JP5810929B2 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9117865B2 (en) * 2012-04-12 2015-08-25 Applied Materials, Inc. Robot systems, apparatus, and methods having independently rotatable waists
TWI738166B (zh) 2013-01-22 2021-09-01 美商布魯克斯自動機械公司 基材運送
JP6438189B2 (ja) * 2013-10-01 2018-12-12 川崎重工業株式会社 ロボット及びロボットの制御方法
KR20160039957A (ko) * 2014-10-02 2016-04-12 삼성전자주식회사 이온 발생기를 갖는 기판 이송 시스템
JP6808395B2 (ja) * 2016-08-18 2021-01-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
EP3596752B1 (en) * 2017-03-15 2025-01-08 Lam Research Corporation Reduced footprint platform architecture with linear vacuum transfer module
KR102512865B1 (ko) * 2018-11-14 2023-03-23 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 반송 방법
KR102848955B1 (ko) * 2019-07-30 2025-08-20 삼성전자주식회사 반도체 제조 장치
CN113140483A (zh) * 2021-03-03 2021-07-20 上海璞芯科技有限公司 一种晶圆的传片方法和传片平台
CN113314448B (zh) * 2021-05-13 2022-07-22 长江存储科技有限责任公司 半导体传输设备及其控制方法
US12564974B2 (en) * 2021-08-18 2026-03-03 Applied Materials, Inc. Factory interface with redundancy
CN114284186A (zh) * 2022-01-13 2022-04-05 上海钧乾智造科技有限公司 一种硅片处理设备

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0567588A (ja) * 1991-09-06 1993-03-19 Hitachi Ltd 枚葉式イオンビームミリング装置および該装置用ホルダ
JPH0653304A (ja) * 1992-07-29 1994-02-25 Tokyo Electron Ltd 減圧処理装置
JPH06104178A (ja) * 1992-09-18 1994-04-15 Hitachi Ltd 真空処理方法及び真空処理装置
US5961269A (en) * 1996-11-18 1999-10-05 Applied Materials, Inc. Three chamber load lock apparatus
JPH10340938A (ja) * 1997-06-10 1998-12-22 Kokusai Electric Co Ltd 半導体製造装置
US6270306B1 (en) * 1998-01-14 2001-08-07 Applied Materials, Inc. Wafer aligner in center of front end frame of vacuum system
JP2000012647A (ja) * 1998-06-19 2000-01-14 Sumitomo Eaton Noba Kk ウエハ搬送装置及びその方法
TW442891B (en) * 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
JP2001335931A (ja) * 2000-05-25 2001-12-07 Hitachi Ltd 真空処理装置および処理方法
US6672864B2 (en) * 2001-08-31 2004-01-06 Applied Materials, Inc. Method and apparatus for processing substrates in a system having high and low pressure areas
JP4195227B2 (ja) * 2002-02-22 2008-12-10 東京エレクトロン株式会社 被処理体の導入ポート構造
JP4118592B2 (ja) 2002-04-22 2008-07-16 富士通株式会社 ロードポート及び半導体製造装置
US20050223837A1 (en) * 2003-11-10 2005-10-13 Blueshift Technologies, Inc. Methods and systems for driving robotic components of a semiconductor handling system
US7458763B2 (en) * 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US7431795B2 (en) * 2004-07-29 2008-10-07 Applied Materials, Inc. Cluster tool and method for process integration in manufacture of a gate structure of a field effect transistor
US7756599B2 (en) * 2004-10-28 2010-07-13 Tokyo Electron Limited Substrate processing apparatus, program for performing operation and control method thereof, and computer readable storage medium storing the program
JP4907077B2 (ja) * 2004-11-30 2012-03-28 株式会社Ｓｅｎ ウエハ処理装置及びウエハ処理方法並びにイオン注入装置
JP4642619B2 (ja) * 2005-09-22 2011-03-02 東京エレクトロン株式会社 基板処理システム及び方法
US20090162170A1 (en) * 2007-12-19 2009-06-25 Asm Japan K.K. Tandem type semiconductor-processing apparatus
US8616821B2 (en) * 2010-08-26 2013-12-31 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated apparatus to assure wafer quality and manufacturability

Also Published As

Publication number Publication date
JP2013143558A (ja) 2013-07-22
US9159600B2 (en) 2015-10-13
US20130183122A1 (en) 2013-07-18

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