JP5808964B2 - LED package - Google Patents

Description

  The present invention relates to an LED package configured by combining light emitting elements having different emission colors.

  Conventionally, in an LED package serving as a light source for backlight or general illumination, color rendering may be provided by mixing light sources having different emission colors such as blue light emitting elements and red light emitting elements. Such a mixed-type LED package basically has a common substrate, a blue light emitting element and a red light emitting element mounted side by side on the common substrate, and a translucency for sealing the light emitting elements. It is comprised with the resin body which had. The LED package is formed by mounting light emitting elements on a common substrate at predetermined intervals and filling the common substrate with a resin material using a mold or the like.

  Patent Document 1 discloses a light emitting device including a blue light emitting element and a green light emitting element. The light-emitting device includes a yellow phosphor for emitting blue fluorescent light by exciting blue light from the blue light-emitting element, and a red fluorescent light by exciting green light from the green light-emitting element. It is sealed with a resin composed of a red phosphor for emitting light in color. This makes it possible to obtain white light emission that is rich in color rendering properties.

JP 2006-245443 A

  The above-mentioned Patent Document 1 aims to obtain white light emission as a whole. For this reason, it is possible to mix a yellow phosphor and a red phosphor in a combination of a blue light emitting element and a green light emitting element. However, in the combination of a blue light emitting element and a red light emitting element, if the type of phosphor to be excited is different, either or both of the light emission characteristics may be impaired, or the light emission color may be unintended as a whole. is there.

  Thus, if the blue light emitting element and the red light emitting element having different light emitting characteristics are sealed with a resin body containing the same type of phosphor, the uniqueness of the light emitting characteristics of each light emitting element is weakened. There was a problem that the color rendering properties as a whole were lacking. For example, when the resin body is sealed with a resin containing a phosphor for exciting a blue light emitting element, the red light emitting element is blocked from red light and the red light emitting action is weakened. On the other hand, when the resin body is formed of a highly transparent material, the red light emitted from the red light emitting element passes well, but the light emitted from the blue light emitting element becomes blue light as it is. The blue light emitting element is often used as a white light emitting color by sealing with a yellow resin material containing a phosphor, but when light emission from the red light emitting element is given priority, There is a problem that white light emission cannot be obtained.

  Although it is possible to combine the blue light emitting element and the red light emitting element by mounting them on separate substrates without using the common substrate as described above, the color mixing property at the boundary portion between the substrates may be impaired. . As a result, the balance of the color rendering properties as a whole may be deteriorated, and variations in light emission may occur, making it difficult to use as a single light source.

  Therefore, the object of the present invention is to seal with a resin body that can sufficiently draw out the characteristics of each light emitting element when light emitting elements having different light emitting characteristics are mounted on a common substrate. It is an object to provide an LED package capable of obtaining light emission with good balance and color rendering as a whole.

In order to solve the above-described problems, an LED package of the present invention encloses a substrate, at least one blue light emitting element and red light emitting element mounted adjacent to the substrate, and the blue light emitting element and red light emitting element. In the LED package including the resin body to be stopped, the resin body has a top surface set at a position higher than a top surface of the blue light emitting element and lower than a PN junction formed on the red light emitting element. A resin layer; and a second resin layer provided on the first resin layer and having an upper surface set at a position higher than the PN junction of the red light emitting element, wherein the red light emitting element is near the lower part of the PN junction. A step portion is formed on the peripheral side surface of the first resin layer, and an upper surface of the first resin layer is set on the step portion .

  According to the LED package of the present invention, even when the blue light emitting device and the red light emitting device are mounted adjacent to each other on the substrate, the first resin layer is higher than the upper surface of the blue light emitting device and the red light emitting device is used. Since the upper surface is set at a position lower than the PN junction formed on the upper portion of the element, the red light emitting element can obtain appropriate light emission only with the second resin layer without being affected by the first resin layer. . On the other hand, the blue light emitting element can obtain appropriate light emission by the first resin layer.

  When the first resin layer contains a phosphor, the blue light emitting element can be excited to emit white light, and when the second resin layer contains a diffusing agent, the red light emitting element The emitted red light can be diffused as it is.

It is sectional drawing (a) and the top view (b) of the LED package of 1st Embodiment. It is sectional drawing (a) and the top view (b) of the LED package of 2nd Embodiment. It is sectional drawing (a) and the top view (b) of the LED package of 3rd Embodiment. It is sectional drawing (a) and top view (b) of the LED package of 4th Embodiment.

  Hereinafter, embodiments of an LED package according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 shows an LED package 11 according to the first embodiment. The LED package 11 includes a common substrate 12, a blue light emitting element (blue element) 13 and a red light emitting element (red element) 14 mounted on the substrate 12, and a first resin for sealing these light emitting elements. It has a layer (phosphor-containing resin) 15 and a second resin layer (diffusing agent-containing resin) 16.

  The substrate 12 is formed in a quadrangular shape using an insulating material such as a general epoxy resin or BT resin, and has a pair of cathode and anode electrodes each having a blue element 13 and a red element 14 flip-chip mounted on the surface. An electrode pattern (not shown) is formed.

  The blue element 13 is mainly made of a gallium nitride compound semiconductor in order to emit a white light emission color for general illumination. The blue element 13 includes a substrate made of sapphire glass and a diffusion layer obtained by diffusing and growing an n-type semiconductor and a p-type semiconductor on the substrate. Each of the n-type semiconductor and the p-type semiconductor includes an n-type electrode and a p-type electrode, and a solder member is provided on a pair of electrode patterns (not shown) including a cathode electrode and an anode electrode provided on the substrate 12. The blue light is emitted around the PN junction 13a by flowing a constant current through a flip chip. The blue element 13 is converted into white light emission by sealing with the phosphor-containing resin 15.

  The red element 14 is made of an aluminum gallium arsenide or phosphorus gallium arsenide semiconductor and has a PN structure similar to that of the blue element. However, as described above, the blue element 13 has strength because the substrate is made of hard sapphire and can be formed thin. However, the red element 14 has a lower hardness than the blue element, so In order to handle in a state, a certain thickness is required. Therefore, when mounted on the substrate 12, the PN junction 14 a of the red element 14 is positioned higher than the upper surface 13 b of the blue element 13. The red element 14 is combined with the blue element 13 to produce a warm emission color.

  The phosphor-containing resin 15 is formed by containing a predetermined amount of phosphor in a transparent resin base material, and a mold (not shown) is mounted on the outer peripheral portion of the substrate 12. It is formed by pouring resin into. In this phosphor-containing resin 15, for example, an appropriate amount of a phosphor made of yttrium, aluminum, garnet (YAG), which is a raw material of fluorescent particles, or a dye, which is a raw material of pigment particles, is mixed in an epoxy resin or silicon resin base material. Can be formed.

  The diffusing agent-containing resin 16 is formed by containing a diffusing agent such as titanium oxide or SiO 2 in a transparent resin base material. Instead of the diffusing agent, metal particles having a high reflectance can be mixed with a transparent resin substrate.

  The phosphor-containing resin 15 fills the upper surface 13b of the blue element 13, but as described above, is formed at a height that does not reach the PN junction 14a of the red element 14 formed by a thick substrate. . For this reason, the light centering on the PN junction 13a of the blue element 13 is excited by the phosphor in the phosphor-containing resin 15, and emits white light. On the other hand, since the light emitted from the red element 14 is not excited by the phosphor-containing resin 15, it can be emitted with the red light as it is without being emitted or attenuated. .

  The diffusing agent-containing resin 16 is formed at a height satisfying the upper surface 14b of the red element 14 from the upper surface of the phosphor-containing resin 15 so as to include the PN junction 14a of the red element 14. For this reason, the diffusing agent-containing resin 16 has a light emission color in which white light emission by the phosphor-containing resin 15 and red light emission directly emitted from the red element 14 are mixed, and this light emission color is light. With the diffusing agent, light can be emitted with the brightness further increased.

  FIG. 2 shows an LED package 21 according to the second embodiment. In this embodiment, a first resin region (first fluorescent region) 15a and a second resin region (the first fluorescent region) are separated via a groove 27 that separates the phosphor-containing resin 15 into a region of the blue element 13 and a region of the red element 14. (Second fluorescent region) 15b. The first fluorescent region 15 a is set in a range centering on the blue element 13, and the second fluorescent region 15 b is set in a range centering on the red element 14. Further, the diffusing agent-containing resin 16 is filled so as to fill the groove 27, and is formed to have a height that fills the upper surface 14b of the red element 14 from the upper surface of the phosphor-containing resin 15. In this embodiment, the second fluorescent region 15b only serves as a base for sealing the red element 14, and does not affect the white light emission from the first fluorescent region 15a. For this reason, white light emission is limited to the range of the first fluorescent region 15a. On the other hand, since red light appears strongly in the range of the second fluorescent region 15b, a high color rendering effect can be obtained by mixing high-purity white light and red light via the common diffusing agent-containing resin 16. it can.

  FIG. 3 shows an LED package 31 according to the third embodiment. In this embodiment, the red element 14 having the stepped portion 38 at the top is used. The step portion 38 is formed by recessing a peripheral side surface in the vicinity of the lower portion of the PN junction 14a in an L-shaped cross section. The stepped portion 38 has an edge surface 38a at a position higher than the upper surface 13b of the blue element 13, and the phosphor-containing resin 15 is filled and formed in accordance with the height to the edge surface 38a, and diffused thereon. The agent-containing resin 16 is filled and formed. The diffusing agent-containing resin 16 is formed to a height that completely fills the upper surface 14 b from the PN junction 38 of the red element 14. By setting the stepped portion 38 in the red element 14, the phosphor-containing resin 15 can be filled with the edge surface 38a as a reference when filling the phosphor-containing resin 15, so that the phosphor-containing resin 15 is applied to the PN junction 14a. Can be prevented. Thereby, the red light emitted from the red element 14 is not blocked by the phosphor-containing resin 15.

  FIG. 4 shows an LED package 41 of the fourth embodiment. This LED package 41 is the same as the LED package 31 of the third embodiment described above, in which the phosphor-containing resin 15 is applied to the two fluorescent regions 15a and 15b via a groove portion 47 provided between the blue element 13 and the red element 14. Divided. As for the light emitting action, as in the second embodiment, white light emission is limited to the range of the fluorescent region 15a. Further, by providing the stepped portion 48 having the edge surface 48a on the red element 14, the reference for the height at which the phosphor-containing resin 15 is filled becomes clear, and the red element 14 is regulated so as not to hit the PN junction 14a. be able to.

  As described above, in the LED package of the present invention, since the PN junction serving as the light source of the red element is exposed outside the phosphor-containing resin, red light is less likely to be absorbed by the phosphor, The luminous efficiency of red light is improved. Further, by sealing the whole with a diffusing agent-containing resin, blue light, yellow light, and red light are mixed and white light with high color rendering properties can be obtained. Furthermore, by separating the region where the blue element is mounted and the region where the red element is mounted through the groove so as to bisect the phosphor-containing resin sealing the blue element and the red element, The conversion efficiency to white light was improved.

  When the step portion is provided in the red element, the height of the phosphor-containing resin is regulated by the step portion, so that the upper surface sealed with the phosphor-containing resin can be made horizontal. As a result, variations in light emission can be reduced.

  In the above embodiment, it is configured by one blue element and one red element. However, since it can be configured by a plurality of blue elements and red elements, an LED package having high luminance and high luminance is formed. be able to. Further, by using a green element or a yellow element instead of a red element, it is also possible to configure an LED package having various color rendering properties by combining white light emission by a blue element and a phosphor-containing resin. .

11, 21, 31, 41 LED package 12 Substrate 13 Blue element (blue light emitting element)
13a PN junction 14 Red element (red light emitting element)
14a PN junction 15 Phosphor-containing resin (first resin layer)
16 Diffusing agent-containing resin (second resin layer)
27, 47 Groove part 38, 48 Step part 38a, 48a Edge surface

Claims (4)

A substrate,
At least one blue light emitting element and red light emitting element mounted adjacently on the substrate;
In an LED package including a resin body that seals the blue light emitting element and the red light emitting element,
The resin body is higher than the upper surface of the blue light emitting element and has a first resin layer whose upper surface is set at a position lower than a PN junction formed on the red light emitting element;
A second resin layer provided on the first resin layer and having an upper surface set at a position higher than the PN junction of the red light emitting element ;
The LED package , wherein the red light emitting element has a step portion on a peripheral side surface near a lower portion of a PN junction, and an upper surface of the first resin layer is set in the step portion .   2. The LED package according to claim 1, wherein an upper surface of at least one blue light emitting element mounted on the substrate is set at a position lower than an upper surface of at least one red light emitting element mounted on the substrate.   The LED package according to claim 1, wherein the first resin layer contains at least a phosphor, and the second resin layer contains at least a diffusing agent. The first resin layer is separated into a first resin region formed around the blue light emitting element and a second resin region formed around the red light emitting element,
The groove portion is provided between the first resin region and the second resin region, and the second resin layer provided on the first resin layer is filled in the groove portion. LED package.

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