JP5795021B2 - 放熱構造体 - Google Patents
放熱構造体 Download PDFInfo
- Publication number
- JP5795021B2 JP5795021B2 JP2013079472A JP2013079472A JP5795021B2 JP 5795021 B2 JP5795021 B2 JP 5795021B2 JP 2013079472 A JP2013079472 A JP 2013079472A JP 2013079472 A JP2013079472 A JP 2013079472A JP 5795021 B2 JP5795021 B2 JP 5795021B2
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- Prior art keywords
- carbon nanotube
- nanotube array
- fixed layer
- carbon nanotubes
- generating member
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
- F28F2013/006—Heat conductive materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Resistance Heating (AREA)
Description
102 放熱器
104 熱界面材料層
106 基材
108 ヒートシンク
12 発熱部材
14 固定層
16 パターン化されたカーボンナノチューブアレイ
162 第一端
164 第二端
18 表面
20 基材
22 カーボンナノチューブアレイ
Claims (4)
- 発熱部材の表面に固定された放熱構造体であって、
パターン化されたカーボンナノチューブアレイと、
固定層と、
を含み、
前記パターン化されたカーボンナノチューブアレイは、前記固定層により前記発熱部材に固定され、
前記パターン化されたカーボンナノチューブアレイは、第一部と第二部に区分され、
第一部におけるカーボンナノチューブは互いに平行され、それぞれ対向設置された第一端及び第二端を含み、前記第一端は、固定層に埋め込まれており、第二端は固定層から離れて延伸し、第一部におけるカーボンナノチューブの高さが固定層の厚さより高く、
第二部におけるカーボンナノチューブは互いに平行され、固定層に埋め込まれており、第二部におけるカーボンナノチューブの高さが固定層の厚さに相当しており、
第一部におけるカーボンナノチューブは、第二部におけるカーボンナノチューブによって隔てられて、間隔をおいて配置され、
第一部におけるカーボンナノチューブ及び第二部におけるカーボンナノチューブは交互に配置されてパターン化されたカーボンナノチューブアレイを構成し、
前記発熱部材は、集積回路チップであることを特徴とする放熱構造体。 - 前記パターン化されたカーボンナノチューブアレイの第一端は、前記発熱部材の表面に直接接触していることを特徴とする請求項1に記載の放熱構造体。
- 前記固定層の厚さは0.1mm〜1mmであることを特徴とする請求項1または2に記載の放熱構造体。
- 発熱部材を提供する第一ステップと、
発熱部材の一つの表面に溶融状態の固定層を形成する第二ステップと、
基材に対向設置される第一端及び第二端を有するカーボンナノチューブアレイを形成し、前記第二端が前記基材に連接する第三ステップと、
前記カーボンナノチューブアレイの第一端を溶融状態の固定層に挿入してから、前記固定層を冷却して凝固させる第四ステップと、
前記カーボンナノチューブアレイの基材を除去する第五ステップと、
前記カーボンナノチューブアレイをパターン化して、前記発熱部材の表面に放熱構造体を形成する第六ステップと、
によって製造された放熱構造体であって、
発熱部材の表面に固定されて用いられ、
パターン化されたカーボンナノチューブアレイと、
固定層と、
を含み、
前記パターン化されたカーボンナノチューブアレイは、対向設置された第一端及び第二端を含み、前記第一端は、前記固定層により前記発熱部材に固定され、
前記発熱部材は、集積回路チップであることを特徴とする放熱構造体。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810068460.2 | 2008-07-11 | ||
CN200810068460.2A CN101626674B (zh) | 2008-07-11 | 2008-07-11 | 散热结构及其制备方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009164975A Division JP5485603B2 (ja) | 2008-07-11 | 2009-07-13 | 放熱構造体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013168665A JP2013168665A (ja) | 2013-08-29 |
JP5795021B2 true JP5795021B2 (ja) | 2015-10-14 |
Family
ID=41504077
Family Applications (2)
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JP2009164975A Active JP5485603B2 (ja) | 2008-07-11 | 2009-07-13 | 放熱構造体の製造方法 |
JP2013079472A Active JP5795021B2 (ja) | 2008-07-11 | 2013-04-05 | 放熱構造体 |
Family Applications Before (1)
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JP2009164975A Active JP5485603B2 (ja) | 2008-07-11 | 2009-07-13 | 放熱構造体の製造方法 |
Country Status (3)
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---|---|
US (1) | US20100006278A1 (ja) |
JP (2) | JP5485603B2 (ja) |
CN (1) | CN101626674B (ja) |
Families Citing this family (14)
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KR101458846B1 (ko) | 2004-11-09 | 2014-11-07 | 더 보드 오브 리전츠 오브 더 유니버시티 오브 텍사스 시스템 | 나노섬유 리본과 시트 및 트위스팅 및 논-트위스팅 나노섬유 방적사의 제조 및 애플리케이션 |
CN101880035A (zh) | 2010-06-29 | 2010-11-10 | 清华大学 | 碳纳米管结构 |
TWI442014B (zh) | 2010-11-24 | 2014-06-21 | Ind Tech Res Inst | 散熱元件及散熱元件的處理方法 |
CN102538554A (zh) * | 2010-12-28 | 2012-07-04 | 常州碳元科技发展有限公司 | 设置线状散热体的复合散热结构及其实现方法 |
CN102544343B (zh) * | 2012-03-02 | 2014-03-05 | 杭州电子科技大学 | 一种提高led基板散热性能的方法 |
CN104769834B (zh) | 2012-08-01 | 2020-02-07 | 德克萨斯州大学系统董事会 | 卷曲和非卷曲加捻纳米纤维纱线及聚合物纤维扭转和拉伸驱动器 |
CN103367275B (zh) * | 2013-07-10 | 2016-10-05 | 华为技术有限公司 | 一种界面导热片及其制备方法、散热系统 |
CN103668367B (zh) * | 2013-12-06 | 2016-07-20 | 宁波微极电子科技有限公司 | 微纳结构阵列散热片的制造方法 |
WO2015180135A1 (en) * | 2014-05-30 | 2015-12-03 | Huawei Technologies Co., Ltd. | Heat dissipation structure and synthesizing method thereof |
CN105197875B (zh) | 2014-06-19 | 2017-02-15 | 清华大学 | 图案化碳纳米管阵列的制备方法及碳纳米管器件 |
JP6589124B2 (ja) * | 2015-04-09 | 2019-10-16 | パナソニックIpマネジメント株式会社 | 樹脂構造体とその構造体を用いた電子部品、電子機器 |
JP2017224686A (ja) * | 2016-06-14 | 2017-12-21 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法 |
CN111407031B (zh) * | 2019-01-04 | 2022-03-22 | 清华大学 | 利用散热片的布料,以及利用该布料的衣服和口罩 |
CN112358855B (zh) * | 2020-10-26 | 2021-12-28 | 深圳烯湾科技有限公司 | 碳纳米管导热片及其制备方法 |
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-
2008
- 2008-07-11 CN CN200810068460.2A patent/CN101626674B/zh active Active
-
2009
- 2009-07-09 US US12/499,947 patent/US20100006278A1/en not_active Abandoned
- 2009-07-13 JP JP2009164975A patent/JP5485603B2/ja active Active
-
2013
- 2013-04-05 JP JP2013079472A patent/JP5795021B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2010021552A (ja) | 2010-01-28 |
JP5485603B2 (ja) | 2014-05-07 |
US20100006278A1 (en) | 2010-01-14 |
CN101626674A (zh) | 2010-01-13 |
CN101626674B (zh) | 2015-07-01 |
JP2013168665A (ja) | 2013-08-29 |
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