JP5792831B2 - 貼り合せ装置および貼り合せ方法 - Google Patents

貼り合せ装置および貼り合せ方法 Download PDF

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Publication number
JP5792831B2
JP5792831B2 JP2013548190A JP2013548190A JP5792831B2 JP 5792831 B2 JP5792831 B2 JP 5792831B2 JP 2013548190 A JP2013548190 A JP 2013548190A JP 2013548190 A JP2013548190 A JP 2013548190A JP 5792831 B2 JP5792831 B2 JP 5792831B2
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Japan
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disk
pressure
bonding
diameter dimension
vacuum
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JP2013548190A
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Japanese (ja)
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JPWO2013084761A1 (ja
Inventor
才野　耕作
耕作 才野
充 田辺
充 田辺
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Tazmo Co Ltd
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Tazmo Co Ltd
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Priority to JP2013548190A priority Critical patent/JP5792831B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2013548190A 2011-12-07 2012-11-28 貼り合せ装置および貼り合せ方法 Active JP5792831B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013548190A JP5792831B2 (ja) 2011-12-07 2012-11-28 貼り合せ装置および貼り合せ方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011267432 2011-12-07
JP2011267432 2011-12-07
PCT/JP2012/080675 WO2013084761A1 (ja) 2011-12-07 2012-11-28 貼り合せ装置および貼り合せ方法
JP2013548190A JP5792831B2 (ja) 2011-12-07 2012-11-28 貼り合せ装置および貼り合せ方法

Publications (2)

Publication Number Publication Date
JPWO2013084761A1 JPWO2013084761A1 (ja) 2015-04-27
JP5792831B2 true JP5792831B2 (ja) 2015-10-14

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ID=48574133

Family Applications (1)

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JP2013548190A Active JP5792831B2 (ja) 2011-12-07 2012-11-28 貼り合せ装置および貼り合せ方法

Country Status (4)

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JP (1) JP5792831B2 (zh)
KR (1) KR101906509B1 (zh)
TW (1) TWI503232B (zh)
WO (1) WO2013084761A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11728200B2 (en) 2019-05-23 2023-08-15 Samsung Electronics Co., Ltd. Wafer bonding apparatuses

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105957817A (zh) * 2016-07-12 2016-09-21 武汉新芯集成电路制造有限公司 一种晶圆键合方法
CN109545692B (zh) * 2018-11-22 2020-06-26 武汉新芯集成电路制造有限公司 一种降低晶圆键合边缘扭曲度的方法
JP7394638B2 (ja) * 2020-01-28 2023-12-08 東京エレクトロン株式会社 研削装置、及び研削方法
KR102345736B1 (ko) * 2020-02-28 2022-01-03 대한민국 밸브 연마장치 및 방법
JP7488738B2 (ja) * 2020-09-18 2024-05-22 日機装株式会社 真空積層装置及び積層体の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090017248A1 (en) * 2007-07-13 2009-01-15 3M Innovative Properties Company Layered body and method for manufacturing thin substrate using the layered body
JP2009032082A (ja) * 2007-07-27 2009-02-12 Canon Inc データ処理装置、制御方法、及びプログラム
CN103258762B (zh) * 2007-08-10 2016-08-03 株式会社尼康 基板贴合装置及基板贴合方法
JP5798721B2 (ja) * 2010-04-07 2015-10-21 株式会社ニコン 基板位置合せ装置、基板貼り合せ装置、基板位置合せ方法および積層半導体の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11728200B2 (en) 2019-05-23 2023-08-15 Samsung Electronics Co., Ltd. Wafer bonding apparatuses

Also Published As

Publication number Publication date
JPWO2013084761A1 (ja) 2015-04-27
WO2013084761A1 (ja) 2013-06-13
KR101906509B1 (ko) 2018-10-10
TW201341194A (zh) 2013-10-16
TWI503232B (zh) 2015-10-11
KR20140099463A (ko) 2014-08-12

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