JP5782162B2 - Photosensitive film for sandblasting - Google Patents

Description

  The present invention relates to a photosensitive film for sandblasting.

  Conventionally, when glass, stone, metal, plastic, ceramic, or the like is cut to form a relief, processing by sandblasting has been performed. The sandblasting process is a process of selectively cutting a non-mask portion by spraying an abrasive after providing a photosensitive resin layer patterned by a photolithography method or the like as a mask material on a non-processed body.

  As a photosensitive resin composition used as a mask material for the sandblast treatment, for example, a dry film in which a photosensitive resin layer is provided on a support such as a polyester film is used. As a photosensitive resin layer, it is common to contain alkali-soluble resin, urethane (meth) acrylate, and a photoinitiator. As the alkali-soluble resin, a cellulose derivative or a carboxyl group-containing acrylic resin is used (for example, see Patent Documents 1 to 3).

  In order to increase the blast resistance of such a photosensitive resin composition, it is necessary to increase the elasticity of the film after curing. For this purpose, it is necessary to increase the blending amount of urethane (meth) acrylate as much as possible. there were. However, if the amount of urethane (meth) acrylate is increased, the adhesiveness of the photosensitive resin layer increases in the stage before curing, so that the photosensitive resin layer is not peeled off from the support and transferred to the non-treated body. It was difficult. Therefore, it was necessary to reduce the amount of urethane acrylate at the expense of blast resistance.

  In order to solve this problem, for example, polyvinyl alcohol or partially saponified polyvinyl acetate or a water-soluble resin layer to which ethylene glycol, propylene glycol, polyethylene glycol or the like is added is generally provided as a release layer ( For example, Patent Documents 4 and 5). This method makes it possible to peel the support from the photosensitive resin layer.

  However, if the release layer is not heated at a temperature of 60 ° C. or higher when the support is peeled off, the support cannot be peeled off from the photosensitive resin layer, and the heating process is increased by one step. Is large, there is a drawback that a great deal of labor is required to heat the entire surface. In addition, the release layer is provided by water-based coating, and there is a problem that it takes a long time to dry the release layer, and there is a problem that repellency is likely to occur when a photosensitive resin layer is applied on the release layer. there were.

Japanese Patent No. 3449572 Japanese Patent No. 3846958 Japanese Patent Laid-Open No. 10-69851 JP 59-137948 A JP-A-6-161098

  An object of the present invention is to provide a photosensitive film for sandblasting, in which the support can be easily peeled from the photosensitive resin layer, and even if the photosensitive resin layer is coated on the peeling layer, repelling defects are less likely to occur. Is to provide.

As a result of intensive studies to solve the above problems, the present inventors have found that the release layer contains (A ′) an alkali-soluble resin and (C ′) a urethane (meth) acrylate compound, and the photosensitive resin layer has (A ) an alkali-soluble resin, (B) a photopolymerization initiator, seeing containing the (C) a urethane (meth) acrylate compound, the release layer has the above-mentioned problems are eliminated by sandblasting photosensitive film is non-photosensitive.

  Further, the mass ratio of (A ′) / (C ′) is preferably larger than the mass ratio of (A) / (C), and (A ′) alkali-soluble resin and (C ′) urethane (meta It was found that the acrylate compound is preferably the same compound as the (A) alkali-soluble resin and (C) the urethane (meth) acrylate compound of the photosensitive resin layer, respectively, thus solving the above problems.

  The release layer used in the photosensitive film for sandblasting of the present invention can be solvent-based coated, and is composed of the same component or the same component as the photosensitive resin layer. Resistant defects are unlikely to occur. Moreover, the coating time can be shortened and the tact time is improved.

  When the release layer contains (A ′) an alkali-soluble resin and (C ′) urethane (meth) acrylate compound, the larger the (A ′) / (C ′) mass ratio of the release layer, the greater the release from the support. The power becomes lighter. Therefore, since the peeling force can be freely controlled by changing the mass ratio, the type of the support, the photosensitive resin layer, and the cover film can be easily selected. (C) It is not necessary to contain urethane (meth) acrylate, and in that case, the peel force becomes lightest. Moreover, when the mass ratio of (A ′) / (C ′) in the release layer is larger than the mass ratio of (A) / (C) in the photosensitive resin layer, the peelability from the support is improved. be able to. Further, there is an effect that the support can be easily peeled from the photosensitive resin layer without heating the release layer when peeling the support.

It is a schematic sectional drawing of the photosensitive film for sandblasting of this invention.

  Hereinafter, the photosensitive film for sandblasting of the present invention will be described in detail.

  As shown in FIG. 1, the photosensitive film for sandblasting of the present invention has a structure in which a support 1, a release layer 2, a photosensitive resin layer 3, and a cover film 4 are laminated. There are direct and indirect methods of use. In the direct method, first, the cover film 4 is removed, and then it is pasted using a laminator or the like so that the photosensitive resin layer 3 is in contact with the non-treated body. Next, after exposing through the mask film which was in the relief image from the support body 1 side, the support body 1 is peeled from the interface of the peeling layer 2 and the support body 1. FIG. Alternatively, when resolution is required, in order to reduce the refraction of light, the support 1 is peeled off and then exposed from the release layer 2 side through a mask film corresponding to the relief image. The exposed photosensitive resin layer 3 portion is cured. At this time, since the release layer 2 is non-photosensitive, curing does not occur. Next, the release layer 2 and the non-exposed portion are washed away with an alkaline developer and washed with water. Next, a sand blast process is performed and a non-processed body is processed.

  The indirect method is often used when the non-processed body is a curved surface or is three-dimensional, when the photosensitive film cannot be passed through a laminate roll, or when close exposure cannot be performed. First, after exposing the photosensitive film through the mask film in the relief image, the support 1 is peeled from the interface between the release layer 2 and the support 1. Alternatively, when the resolution is required, in order to reduce the refraction of light, the support 1 is peeled and then exposed from the release layer 2 side through the mask film in the relief image. The exposed photosensitive resin layer 3 portion is cured. At this time, since the release layer 2 is non-photosensitive, curing does not occur. Next, the release layer 2 and the non-exposed portion are washed away with an alkaline developer and washed with water. As a result, a resist image made of a photosensitive resin layer is formed on the cover film 4. The resist image is brought into contact with the non-processed body using an aqueous adhesive or the like. Next, the cover film 4 is peeled off, and a resist image is formed on the non-processed body. Next, a sand blast process is performed and a non-processed body is processed.

  As the support, a transparent film that transmits actinic rays is preferable. As for the thickness, the thinner one is preferable because light is less refracted, and the thicker one is excellent in coating stability, so 10 to 100 μm is preferable. Examples of such a film include films of polyethylene terephthalate and polycarbonate.

  As the cover film, it is sufficient that the uncured or cured photosensitive resin layer can be peeled off, and a resin having high releasability is used. For example, films, such as a polyethylene film and a polypropylene film, are mentioned. Moreover, the film by which release agents, such as silicone, were applied to these films is mentioned.

  Examples of the alkali-soluble cellulose derivative contained in the release layer include cellulose acetate phthalate, hydroxypropylmethylcellulose phthalate, hydroxypropylmethylcellulose acetate phthalate, and hydroxypropylmethylcellulose acetate succinate.

  As the carboxyl group-containing acrylic resin contained in the release layer, a monomer having a (meth) acrylate as a main component and having an ethylenically unsaturated carboxylic acid and other copolymerizable ethylenically unsaturated groups (hereinafter, Any acrylic polymer obtained by copolymerization of “polymerizable monomer”) may be used.

  Examples of the (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, n-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, glycidyl (meth) acrylate, lauryl (meth) acrylate, tetrahydrofur Furyl (meth) acrylate, 2- (dimethylamino) ethyl (meth) acrylate, 2- (diethylamino) ethyl (meth) acrylate, 2,2,2-trifluoroethyl (meth) acrylate Rate, 2,2,3,3-tetrafluoro propyl (meth) acrylate.

  Monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid are preferably used as the ethylenically unsaturated carboxylic acid, and dicarboxylic acids such as maleic acid, fumaric acid, and itaconic acid, and anhydrides and half esters thereof. It can also be used. Among these, acrylic acid and methacrylic acid are particularly preferable.

  Examples of the other polymerizable monomers include styrene, α-methylstyrene, p-methylstyrene, p-ethylstyrene, p-methoxystyrene, p-ethoxystyrene, p-chlorostyrene, p-bromostyrene, (Meth) acrylonitrile, (meth) acrylamide, diacetone acrylamide, vinyl toluene, vinyl acetate, vinyl n-butyl ether and the like can be mentioned.

  The acid value of the component (A ′) is preferably 30 to 500 mgKOH / g, and more preferably 100 to 300 mgKOH / g. If the acid value is less than 30 mg KOH / g, the alkali development time tends to be long. On the other hand, if it exceeds 500 mg KOH / g, Tg increases and cracks tend to occur as a film. Further, the mass average molecular weight of the component (A ′) is preferably 10,000 to 200,000, and more preferably 10,000 to 150,000. If the weight average molecular weight is less than 10,000, it may be difficult to form the release layer in a coating state, while if it exceeds 200,000, the solubility in an alkali developer tends to deteriorate.

  The (C ′) urethane (meth) acrylate compound contained in the release layer is a reaction product of a compound having a terminal isocyanate group obtained by reacting a diol compound and a diisocyanate compound and a (meth) acrylate compound having a hydroxyl group. Say. Examples of the diol compound include polyesters having a hydroxyl group at the terminal, polyethers, and the like. Polyesters obtained by ring-opening polymerization of lactones, polycarbonates, ethylene glycol, propylene glycol, diethylene glycol, Examples thereof include polyesters obtained by condensation reaction of alkylene glycol such as triethylene glycol and dipropylene glycol and dicarboxylic acid such as maleic acid, fumaric acid, glutaric acid and adipic acid. Specific examples of the lactones include δ-valerolactan, ε-caprolactone, β-propiolactone, α-methyl-β-propiolactone, β-methyl-β-propiolactone, α, α-dimethyl- β-propiolactone, β, β-dimethyl-β-propiolactone and the like can be mentioned. Specific examples of the polycarbonates include reaction products of diols such as bisphenol A, hydroquinone, and dihydroxycyclohexanone with carbonyl compounds such as diphenyl carbonate, phosgene, and succinic anhydride. Specific examples of the polyethers include polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and polypentamethylene glycol.

  Specific examples of the diisocyanate compound that reacts with the diol compound include dimethylene diisocyanate, trimethylene diisocyanate, tetramethylene diisocyanate, pentamethylene diisocyanate, hexamethylene diisocyanate, heptamethylene diisocyanate, 2,2-dimethylpentane-1,5- Diisocyanate, octamethylene diisocyanate, 2,5-dimethylhexane-1,6-diisocyanate, 2,2,4-trimethylpentane-1,5-diisocyanate, nanomethylene diisocyanate, 2,2,4-trimethylhexane diisocyanate, decamethylene Aliphatic or alicyclic diisocyanate compounds such as diisocyanate and isophorone diisocyanate can be mentioned, and the compound alone Other mixtures of two or more can be used.

  Furthermore, as the (meth) acrylate compound having a hydroxyl group, specifically, hydroxymethyl acrylate, hydroxymethyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 3-hydroxypropyl acrylate, 3-hydroxypropyl methacrylate, These may be used alone or in combination of two or more.

  The component (C ′) may contain a carboxyl group. By containing a carboxyl group, the solubility in the resin layer removal liquid tends to be improved. The component (C ′) containing a carboxyl group is first reacted with a diisocyanate compound and a diol compound having a carboxyl group so that isocyanate groups remain at both ends, and then the terminal isocyanate group of the reaction product is subjected to hydroxyl groups. It can be obtained by reacting a (meth) acrylate compound having

  The mass average molecular weight of the component (C ′) is preferably 1000 to 40000.

  The photosensitive resin layer contains at least (A) an alkali-soluble resin, (B) a photopolymerization initiator, and (C) a urethane (meth) acrylate compound.

  Examples of the component (A) alkali-soluble resin include the alkali-soluble cellulose derivatives and carboxyl group-containing acrylic resins described above. (C) As a urethane (meth) acrylate compound, the said component (C ') is mentioned.

  The acid value of component (A) is preferably 30 to 500 mgKOH / g, and more preferably 100 to 300 mgKOH / g. If the acid value is less than 30 mg KOH / g, the alkali development time tends to be long. On the other hand, if the acid value exceeds 500 mg KOH / g, sticking to a non-treated body may be deteriorated.

  Further, the mass average molecular weight of the component (A) is preferably 10,000 to 200,000, and more preferably 10,000 to 150,000. When the mass average molecular weight is less than 10,000, it may be difficult to form the photosensitive resin layer in a film state. On the other hand, when it exceeds 200,000, the solubility in an alkali developer tends to deteriorate.

  The mass average molecular weight of the component (C) is preferably 1000 to 40000.

  As the component (B), benzophenone, N, N′-tetramethyl-4,4′-diaminobenzophenone (Michler ketone), N, N′-tetraethyl-4,4′-diaminobenzophenone, 4-methoxy-4′- Such as dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propanone-1, etc. Aromatic ketone; 2-ethylanthraquinone, phenanthrenequinone, 2-tert-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, 2,3-diphenylanthraquinone, 1 -Chloroanthraquinone, 2-methyl Quinones such as anthraquinone, 1,4-naphthoquinone, 9,10-phenanthraquinone, 2-methyl-1,4-naphthoquinone, 2,3-dimethylanthraquinone; benzoin methyl ether, benzoin ethyl ether, benzoin phenyl ether, etc. Benzoin ether compounds; benzoin compounds such as benzoin, methylbenzoin and ethylbenzoin; benzyl derivatives such as benzyldimethyl ketal; 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5-di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer 2-mer (p-methoxy) Enyl) -4,5-diphenylimidazole dimer, 2,4,5-triarylimidazole dimer; acridine derivatives such as 9-phenylacridine, 1,7-bis (9,9'-acridinyl) heptane N-phenylglycine, N-phenylglycine derivatives, coumarin compounds and the like. The substituents of the aryl groups of two 2,4,5-triarylimidazoles in the 2,4,5-triarylimidazole dimer may give the same and symmetrical compounds, but differently Asymmetric compounds may be provided. Moreover, you may combine a thioxanthone type compound and a tertiary amine compound like the combination of diethyl thioxanthone and dimethylaminobenzoic acid. These may be used alone or in combination of two or more.

  You may make the photosensitive resin layer contain components other than the said component (A)-(C) as needed. Such components include photopolymerizable monomers, solvents, thermal polymerization inhibitors, plasticizers, colorants (dyes, pigments), photochromic agents, photochromic materials, thermochromic inhibitors, fillers, antifoaming Agents, flame retardants, adhesion-imparting agents, leveling agents, peeling accelerators, antioxidants, fragrances, thermosetting agents, water repellents and oil repellents, etc., each containing about 0.01 to 20% by mass Can do. These components can be used individually by 1 type or in combination of 2 or more types.

  The photopolymerizable monomer is a compound having at least one polymerizable ethylenically unsaturated group in the molecule other than the component (C) urethane (meth) acrylate. For example, a compound obtained by reacting a polyhydric alcohol with an α, β-unsaturated carboxylic acid; a bisphenol A (meth) acrylate compound; obtained by reacting a glycidyl group-containing compound with an α, β-unsaturated carboxylic acid Compound; Nonylphenoxypolyethyleneoxyacrylate; γ-chloro-β-hydroxypropyl-β ′-(meth) acryloyloxyethyl-o-phthalate, β-hydroxyalkyl-β ′-(meth) acryloyloxyalkyl-o-phthalate, etc. (Meth) acrylic acid alkyl ester, EO, PO-modified nonylphenyl (meth) acrylate, and the like. Here, EO and PO represent ethylene oxide and propylene oxide, the EO-modified compound has a block structure of ethylene oxide group, and the PO-modified compound has a block structure of propylene oxide group. Is. These photopolymerizable compounds can be used alone or in combination of two or more.

  Further, as the photopolymerizable monomer, a compound having three or more polymerizable ethylenically unsaturated groups in the molecule may be used. Examples of the photopolymerizable compound having three or more polymerizable ethylenically unsaturated groups in the molecule include trimethylolpropane tri (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, and pentaerythritol tri (meth). Examples include those containing at least one of acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and trimethylolpropane triglycidyl ether tri (meth) acrylate. It is done.

  The mass ratio of (A ′) / (C ′) of the release layer is preferably in the range of 2/8 to 9.5 / 0.5. More preferably, it is 3/7 to 9/1, and further preferably 4/6 to 8/2. The greater the value, the lighter the peel force from the support. If it is less than 2/8, the peeling force from the support becomes heavy and the support may be difficult to peel off. When the ratio is larger than 9.5 / 0.5, the characteristics are the same as when (C ′) is 100 mass%. The adjustment of the peeling force is preferably changed by a direct method and an indirect method. When carrying out the direct method, the cover film is peeled off first, and the support is peeled off later. Therefore, the peel force at the interface between the support and the release layer compared to the peel force at the interface between the photosensitive resin layer and the cover film. It is preferable to increase the weight. When performing the indirect method, the support is peeled off first, and then the cover film is peeled off. Therefore, the peeling force at the interface between the support and the peeling layer is compared with the peeling force at the interface between the photosensitive resin layer and the cover film. It is preferable to lighten.

  The mass ratio (A) / (C) of the photosensitive resin layer is preferably smaller than the mass ratio (A ′) / (C ′) of the release layer. The mass ratio of (A) / (C) is preferably in the range of 1/9 to 6/4, and more preferably 2/8 to 5/5. If it is less than 1/9, the viscosity may be improved and the film property before exposure may be lowered. If it is larger than 6/4, the blast resistance may be insufficient.

  The thickness of the release layer is preferably 0.5 to 15 μm, and more preferably 1 to 10 μm. If the thickness of the release layer is too large, the resolution tends to decrease and the cost tends to increase. On the other hand, if it is too thin, the peelability tends to decrease. Moreover, it is preferable that the thickness of the photosensitive resin layer is 10-150 micrometers, and it is more preferable that it is 30-120 micrometers. If the thickness of the photosensitive resin layer is too large, problems such as reduced resolution, high cost, and edge fusion are likely to occur. Conversely, if it is too thin, the blast resistance tends to decrease.

  In the present invention, (A ′) alkali-soluble resin and (C ′) urethane (meth) acrylate compound of the release layer are respectively (A) alkali-soluble resin and (C) urethane (meth) acrylate compound of the photosensitive resin layer. The same compound is preferred. The same means that the chemical structural formula, molecular weight, acid value and the like are all the same.

  Hereinafter, the present invention will be described in more detail by way of examples. However, the present invention is not limited to these examples.

(Examples 1-14)
Each component shown in Table 1 was mixed and the coating liquid for peeling layers was obtained. In addition, the unit of each component compounding amount in Table 1 represents a mass part. The obtained coating solution was applied onto a polyethylene terephthalate (PET) film (trade name: R310, 25 μm thickness, manufactured by Mitsubishi Chemical Polyester Film Co., Ltd., a support) using a wire bar, and at 80 ° C. for 4 minutes. It dried and the solvent component was skipped and the peeling layers 1-10 (dry film thickness: 4 micrometers) were obtained on the single side | surface of PET film.

Next, each component shown in Table 2 was mixed, and the coating liquid for photosensitive resin layers was obtained. In addition, the unit of each component compounding quantity in Table 2 represents a mass part. Using a combination of the release layer and the photosensitive resin layer shown in Table 3, using an applicator, apply a coating solution for the photosensitive resin layer on the release layer, and dry at 80 ° C. for 8 minutes. It skipped and the photosensitive resin layers 1-8 (dry film thickness: 70 micrometers) were obtained on the peeling layer. After drying, a silicone-coated PET film (trade name: PET-75 × 1-A3, manufactured by Nipper Co., Ltd., cover film) was attached to the surface of the photosensitive resin layer to prepare photosensitive films of Examples 1-14. Examples 1 to 4 are reference examples.

In Table 1 and Table 2, each component is as follows.
(A-1); cellulose acetate phthalate (manufactured by Wako Pure Chemical Industries, Ltd.)
(A-2); hydroxypropyl methylcellulose phthalate (manufactured by Shin-Etsu Chemical Co., Ltd.)
(A-3); copolymer resin (mass average molecular weight 70000) obtained by copolymerizing methyl methacrylate / n-butyl acrylate / methacrylic acid at a mass ratio of 58/15/27,
(A-4); copolymer resin (mass average molecular weight 30000) obtained by copolymerizing methyl methacrylate / n-butyl acrylate / methacrylic acid at a mass ratio of 55/20/25
(B-1) 2- (2'-Chlorophenyl) -4,5-diphenylimidazole dimer (B-2) 4,4'-bis (diethylamino) benzophenone (C-1) Shikou (registered trademark) UV- 2000B (manufactured by Nippon Synthetic Chemical Industry)
(C-2) Purple light (registered trademark) UV-3000B (manufactured by Nippon Synthetic Chemical Industry Co., Ltd.)
(C-3) KRM (registered trademark) 8296 (manufactured by Daicel-Cytec)
(C-4) EBECRYL (registered trademark) 210 (manufactured by Daicel-Cytec)
(C-5) KRM (registered trademark) 7222 (manufactured by Daicel-Cytec Corp., 80% by mass solution using ethyl acetate as a solvent). The numerical value in a table | surface is the compounding quantity of the solution containing a solvent.

When the photosensitive resin layer coating the photosensitive resin layer was visually observed, observation of the repelling diameter of at least 2 cm, 1 per are 2m ² Examples 5-9, Examples 1-4 and 10-14 Was 3 per 2 m ² . That is, the release layer contains components (A ′) and (C ′), and (A ′) and (C ′) of the release layer and (A) and (C) of the photosensitive resin layer are the same compound. In some cases, the number of occurrences was small.

  Next, the cover film of the photosensitive film of Examples 1-14 was peeled, and it affixed on a 3 mm-thick glass plate. Next, it exposed through the photomask. Next, the support was peeled off without heat treatment, but Examples 1 to 12 could be easily peeled off by hand. On the other hand, Examples 13 and 14 in which the release layer contains components (A ′) and (C ′) and the mass ratio of (A ′) / (C ′) is equal to or less than the mass ratio of (A) / (C). Was able to be peeled off by peeling off the top part with a cutter and peeling at a high speed, but it was a slightly heavy peeling force. Subsequently, alkali development was performed with a 0.5% aqueous sodium carbonate solution, and the release layer and the photosensitive resin layer in the non-exposed area were removed. Next, when sandblasting was performed, good processing was achieved.

(Comparative Examples 1-8)
Each component shown in Table 2 was mixed, and the coating liquid for photosensitive resin layers 1-8 was obtained. Without using a release layer, the photosensitive resin layer was directly coated on a PET film (trade name: R310, 25 μm thickness, manufactured by Mitsubishi Chemical Polyester Film Co., Ltd.), dried at 80 ° C. for 8 minutes, and solvent components And a photosensitive resin layer (dry film thickness: 70 μm) was obtained on the PET film. After drying, a silicone-coated PET film (trade name: PET-75 × 1-A3, manufactured by Nipper Co., Ltd., cover film) was attached to the surface of the photosensitive resin layer to prepare photosensitive films of Comparative Examples 1-8.

  The cover films of the photosensitive films of Comparative Examples 1 to 8 were peeled off and attached to a 3 mm thick glass plate. Next, it exposed through the photomask. Next, peeling of the support was attempted without heat treatment, but peeling was very difficult, and the PET film as the support was torn once in 5 times.

(Comparative Examples 9-16)
2 parts by mass of polyethylene glycol # 600 (pure chemical) was mixed with 100 parts by mass of an 8% by mass aqueous solution of polyvinyl alcohol (trade name; Kuraray Poval PVA205) to obtain a coating solution for a release layer. The obtained coating solution was coated on a PET film (trade name: R310, 25 μm thickness, manufactured by Mitsubishi Chemical Polyester Film Co., Ltd., support) using a wire bar, and dried at 80 ° C. for 8 minutes. The components were skipped, and a release layer (dry film thickness: 4 μm) was obtained on one side of the PET film.

Next, each component shown in Table 2 was mixed, and the coating liquid for photosensitive resin layers 1-8 was obtained. Using the applicator, the coating solution obtained on the release layer was applied, dried at 80 ° C. for 8 minutes, the solvent component was skipped, and the photosensitive resin layers 1 to 8 (dry film thickness: 70 μm) on the release layer. ) After drying, a silicone-coated PET film (trade name: PET-75 × 1-A3, manufactured by Nipper Co., Ltd., cover film) was attached to the surface of the photosensitive resin layer to prepare photosensitive films of Comparative Examples 9-16. When the photosensitive resin layer was visually observed and repelling having a diameter of 2 cm or more was observed, 20 or more per 2 m ² were frequently generated.

  The cover film of the photosensitive film was peeled off and attached to a 3 mm thick glass plate. Next, it exposed through the photomask. Next, peeling of the support was attempted without heat treatment, but peeling was very difficult, and the PET film as the support was torn once in 5 times.

  The photosensitive film of the present invention can be widely applied to a photosensitive film for sandblasting.

DESCRIPTION OF SYMBOLS 1 Support body 2 Release layer 3 Photosensitive resin layer 4 Cover film

Claims (3)

In a photosensitive film for sandblasting in which a support, a release layer, a photosensitive resin layer, and a cover film are laminated in this order, the release layer contains (A ′) an alkali-soluble resin and (C ′) a urethane (meth) acrylate compound, and , the photosensitive resin layer (a) alkali-soluble resin, (B) a photopolymerization initiator, light-sensitive for sandblasting, which is a (C) viewed contains a urethane (meth) acrylate compound, the release layer is non-photosensitive Sex film.   The photosensitive film for sandblasting according to claim 1, wherein the mass ratio of (A ') / (C') is larger than the mass ratio of (A) / (C).   The (A ′) alkali-soluble resin and (C ′) urethane (meth) acrylate compound of the release layer are the same compounds as the (A) alkali-soluble resin and (C) urethane (meth) acrylate compound of the photosensitive resin layer, respectively. The photosensitive film for sandblasting according to claim 2.

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