JP5731994B2 - Sandblasting - Google Patents

Description

The present invention relates to a sandblasting process.

  Conventionally, when glass, stone, metal, plastic, ceramic, or the like is cut to form a relief, processing by sandblasting has been performed. A photosensitive resin layer patterned by a photolithography method or the like is provided as a mask material on the object to be processed, and then a sandblasting process is performed in which a non-mask portion is selectively cut by spraying an abrasive.

  As the photosensitive resin composition used as the mask material for sandblast treatment, for example, a negative photosensitive resin composition containing an alkali-soluble resin, a urethane (meth) acrylate compound, and a photopolymerization initiator is generally used. is there. As the alkali-soluble resin, a cellulose derivative or a carboxyl group-containing acrylic resin is used (for example, see Patent Documents 1 to 3).

  In order to increase the blast resistance of the photosensitive resin composition, it is necessary to increase the elasticity of the film after curing. For this purpose, it is necessary to increase the blending amount of the urethane (meth) acrylate compound as much as possible. However, when the compounding amount of the urethane (meth) acrylate compound is increased, the adhesiveness of the photosensitive resin composition layer before curing is increased, so that the photomask is contaminated at the time of exposure, and the edge fusion at the time of forming a dry film. There was a problem. Therefore, it is necessary to reduce the adhesiveness of the photosensitive resin composition layer before curing by reducing the blending amount of the urethane (meth) acrylate compound at the expense of blast resistance.

  On the other hand, a photosensitive resin composition containing an alkali-soluble resin, a urethane (meth) acrylate compound, a photopolymerization initiator, and an organic filler has been studied as a photosensitive resin composition for sandblasting (see, for example, Patent Document 4). In particular, as the organic filler, a polymer of (meth) acrylic acid ester is suitable, and by adding the organic filler, the coating of the photosensitive resin composition is improved by improving the thixotropy, There was an effect that no firing residue was generated during firing. However, the blast resistance was not improved.

Japanese Patent No. 3449572 Japanese Patent No. 3846958 Japanese Patent Laid-Open No. 10-69851 JP 2002-148798 A

An object of the present invention is to perform a sandblasting treatment using a photosensitive resin composition for sandblasting having high blast resistance, low adhesiveness of the photosensitive resin composition before curing, less photomask contamination and edge fusion. Is to provide.

As a result of intensive studies to solve the above problems, a photosensitive resin layer made of a photosensitive resin composition is attached to the object to be processed, and after exposure, the non-exposed portion is washed away with an alkali developer, and then sandblasted. And exposing the photosensitive resin layer made of the photosensitive resin composition to wash the non-exposed portion with an alkaline developer to form a resist image. In the sand blasting process in which the photosensitive resin composition is attached to the object to be processed, a resist image is formed on the object to be processed, and subsequently subjected to a sand blasting process to process the object to be processed. B) Sand blasting containing a photopolymerization initiator, (C) urethane (meth) acrylate compound, and (D) urethane beads The above problem was solved by the processing .

  Moreover, it discovered that it was preferable that the average particle diameter of (D) urethane bead is 10 micrometers or less.

  Moreover, it discovered that it was preferable that the glass transition temperature of (D) urethane bead is -10 degrees C or less.

The photosensitive resin composition need use the sandblasting of the present invention, even when a high amount of (C) a urethane (meth) acrylate compound, reduced tack in that it contains (D) a urethane beads, It is possible to reduce the contamination and edge fusion of photomasks, which have been problems in the past. Moreover, even if (D) urethane beads are contained, the fine particle size is required when fine patterns are required without impairing conventional photosensitive characteristics and developability. Thus, the effect that the resolution is not impaired can be obtained. Moreover, blast resistance improves by containing a urethane bead, The effect that the effect that the glass transition temperature of (D) urethane bead is low becomes larger is acquired.

It is sectional drawing which showed the structure of the dry film. It is sectional drawing which showed the structure of the dry film.

Hereinafter, the photosensitive resin composition need use the sandblasting of the present invention (hereinafter, may be abbreviated as "photosensitive resin composition") will be described in detail.

  (A) Examples of the alkali-soluble resin include alkali-soluble cellulose derivatives and carboxyl group-containing acrylic resins.

  Examples of the alkali-soluble cellulose derivative include cellulose acetate phthalate, hydroxypropylmethylcellulose phthalate, hydroxypropylmethylcellulose acetate phthalate, and hydroxypropylmethylcellulose acetate succinate.

  Examples of the carboxyl group-containing acrylic resin include an acrylic polymer having (meth) acrylate as a main component and copolymerized with an ethylenically unsaturated carboxylic acid. Further, other monomers having a copolymerizable ethylenically unsaturated group may be copolymerized.

  Examples of the (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, n-hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, glycidyl (meth) Acrylate, lauryl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, 2- (dimethylamino) ethyl (meth) acrylate, 2- (diethylamino) ethyl (meth) acrylate, 2, , 2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate.

  Monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid are preferably used as the ethylenically unsaturated carboxylic acid, and dicarboxylic acids such as maleic acid, fumaric acid, and itaconic acid, and anhydrides and half esters thereof. It can also be used. Among these, acrylic acid and methacrylic acid are particularly preferable.

  Examples of the other monomer having a copolymerizable ethylenically unsaturated group include styrene, α-methylstyrene, p-methylstyrene, p-ethylstyrene, p-methoxystyrene, p-ethoxystyrene, p. -Chlorostyrene, p-bromostyrene, (meth) acrylonitrile, (meth) acrylamide, diacetone acrylamide, vinyl toluene, vinyl acetate, vinyl-n-butyl ether and the like.

  (A) It is preferable that the acid value of alkali-soluble resin is 30-500 mgKOH / g, and it is more preferable that it is 100-300 mgKOH / g. If the acid value is less than 30 mg KOH / g, the alkali development time tends to be long. On the other hand, if it exceeds 500 mg KOH / g, the blast resistance may be lowered.

The mass average molecular weight of the (A) alkali-soluble resin is preferably 10,000 to 200,000, and more preferably 10,000 to 150,000. If the weight average molecular weight is less than 10,000, it may be difficult to form the photosensitive resin composition used in the present invention in a film state. On the other hand, if it exceeds 200,000, the solubility in an alkali developer may be increased. Tend to get worse.

  (B) As the photopolymerization initiator, benzophenone, N, N′-tetramethyl-4,4′-diaminobenzophenone (Michler ketone), N, N′-tetraethyl-4,4′-diaminobenzophenone, 4-methoxy- 4'-dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propanone- Aromatic ketones such as 1; 2-ethylanthraquinone, phenanthrenequinone, 2-tert-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, 2,3-diphenyl Anthraquinone, 1-chloroanthraquinone, -Quinones such as methyl anthraquinone, 1,4-naphthoquinone, 9,10-phenanthraquinone, 2-methyl-1,4-naphthoquinone, 2,3-dimethylanthraquinone; benzoin methyl ether, benzoin ethyl ether, benzoin phenyl Benzoin ether compounds such as ether; benzoin compounds such as benzoin, methylbenzoin, and ethylbenzoin; benzyl derivatives such as benzyldimethyl ketal; 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o- Chlorophenyl) -4,5-di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenyl Imidazole dimer, 2- (p- 2,4,5-triarylimidazole dimers such as toxiphenyl) -4,5-diphenylimidazole dimer; acridines such as 9-phenylacridine, 1,7-bis (9,9'-acridinyl) heptane Derivatives: N-phenylglycine, N-phenylglycine derivatives, coumarin compounds and the like. The substituents of the aryl groups of two 2,4,5-triarylimidazoles in the 2,4,5-triarylimidazole dimer may give the same and symmetrical compounds, but differently Asymmetric compounds may be provided. Moreover, you may combine a thioxanthone type compound and a tertiary amine compound like the combination of diethyl thioxanthone and dimethylaminobenzoic acid. These are used alone or in combination of two or more.

  (C) The urethane (meth) acrylate compound is a reaction product of a compound having a terminal isocyanate group obtained by reacting a compound having a polyvalent hydroxyl group and a polyvalent isocyanate compound and a (meth) acrylate compound having a hydroxyl group. Is mentioned. Examples of the compound having a polyvalent hydroxyl group include polyesters and polyethers having a hydroxyl group. Examples of polyesters include polyesters obtained by ring-opening polymerization of lactones, polycarbonates, ethylene glycol, and propylene glycol. And polyesters obtained by condensation reaction of alkylene glycol such as diethylene glycol, triethylene glycol and dipropylene glycol with dicarboxylic acid such as maleic acid, fumaric acid, glutaric acid and adipic acid. Specific examples of the lactones include δ-valerolactan, ε-caprolactone, β-propiolactone, α-methyl-β-propiolactone, β-methyl-β-propiolactone, α, α-dimethyl- β-propiolactone, β, β-dimethyl-β-propiolactone and the like can be mentioned. Specific examples of the polycarbonates include reaction products of diols such as bisphenol A, hydroquinone, and dihydroxycyclohexanone with carbonyl compounds such as diphenyl carbonate, phosgene, and succinic anhydride. Specific examples of the polyethers include polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and polypentamethylene glycol.

  Specific examples of the polyvalent isocyanate compound that reacts with the compound having a polyvalent hydroxyl group include dimethylene diisocyanate, trimethylene diisocyanate, tetramethylene diisocyanate, pentamethylene diisocyanate, hexamethylene diisocyanate, heptamethylene diisocyanate, 2,2- Dimethylpentane-1,5-diisocyanate, octamethylene diisocyanate, 2,5-dimethylhexane-1,6-diisocyanate, 2,2,4-trimethylpentane-1,5-diisocyanate, nonamethylene diisocyanate, 2,2,4 -Aliphatic or alicyclic diisocyanate compounds such as trimethylhexane diisocyanate, decamethylene diisocyanate, isophorone diisocyanate Its alone or a mixture of two or more compounds can be used.

  Furthermore, as a (meth) acrylate compound having a hydroxyl group, specifically, hydroxymethyl acrylate, hydroxymethyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 3-hydroxypropyl acrylate, 3-hydroxypropyl methacrylate, etc. Moreover, the compound etc. which added 1-10 mol of (epsilon) -caprolactone to them can be mentioned.

  The (C) urethane (meth) acrylate compound according to the present invention may contain a carboxyl group. By containing a carboxyl group, the solubility in the resin layer removal liquid tends to be improved. The (C) urethane (meth) acrylate compound containing a carboxyl group is obtained by first reacting a diisocyanate compound with a diol compound having a carboxyl group so that isocyanate groups remain at both ends, and then the terminal isocyanate of this reaction product. It can be obtained by reacting a group with a (meth) acrylate compound having a hydroxyl group.

  (D) The urethane beads preferably have an average particle diameter of 1 to 200 μm, more preferably 10 μm or less. The smaller the average particle size, the better the resolution of the resist image. The average particle diameter is a value of a volume average particle diameter measured by a laser diffraction / scattering particle size distribution analyzer. In addition, the glass transition temperature of (D) urethane beads is preferably 35 ° C. or lower, more preferably −10 ° C. or lower. The smaller the glass transition temperature, the higher the blast resistance. The glass transition temperature is a value measured according to JIS K7121.

  (D) A method for producing urethane beads is, for example, a method in which an organic phase containing a polyisocyanate compound and a polyol compound is dispersed and reacted in a water tank containing water and a dispersant (for example, JP 2004-107476 etc.). Moreover, the method (for example, patent 3100787 etc.) which disperse | distributes polyisocyanate prepolymer in the water containing a suspension stabilizer, and makes it react is mentioned.

  Examples of (D) urethane beads include Negami Industrial Art Pearl (registered trademark), Sanyo Chemical Industries Meltex (registered trademark), and the like.

You may make the photosensitive resin layer used for this invention contain components other than the said component (A)-(D) as needed. Such components include photopolymerizable monomers, solvents, thermal polymerization inhibitors, plasticizers, colorants (dyes, pigments), photochromic agents, photochromic agents, thermochromic inhibitors, fillers, antifoaming Agents, flame retardants, adhesion-imparting agents, leveling agents, peeling accelerators, antioxidants, fragrances, thermosetting agents, water and oil repellents, and the like, each containing about 0.01 to 20% by mass. Can do. These components can be used individually by 1 type or in combination of 2 or more types.

  The photopolymerizable monomer is a compound having at least one polymerizable ethylenically unsaturated group in the molecule other than the component (C) urethane (meth) acrylate compound. For example, it is obtained by reacting α, β-unsaturated carboxylic acid with a compound obtained by reacting α, β-unsaturated carboxylic acid with polyhydric alcohol, bisphenol A-based (meth) acrylate compound, or glycidyl group-containing compound. Examples thereof include compounds, alkyl (meth) acrylates, ethylene oxide or propylene oxide-modified (meth) acrylates. These photopolymerizable compounds can be used alone or in combination of two or more.

  Further, as the photopolymerizable monomer, a compound having three or more polymerizable ethylenically unsaturated groups in the molecule may be used. Examples of the photopolymerizable compound having three or more polymerizable ethylenically unsaturated groups in the molecule include trimethylolpropane tri (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, and pentaerythritol tri (meth). Examples include those containing at least one of acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and trimethylolpropane triglycidyl ether tri (meth) acrylate. It is done.

In the photosensitive resin composition used in the present invention , the compounding amount of component (A) is 15 to 55% by mass with respect to the total amount of components (A), (B), (C), and (D). Is preferable, and it is more preferable that it is 25-45 mass%. When the blending amount of the component (A) is less than 15% by mass, the film property may be deteriorated or the alkali developability may be deteriorated. When the compounding amount of the component (A) exceeds 55% by mass, the blast resistance may be lowered.

  The blending amount of the component (B) is preferably 0.1 to 10% by mass, and 0.2 to 5% by mass with respect to the total amount of the components (A), (B), (C) and (D). It is more preferable that When the blending amount of the component (B) is less than 0.1% by mass, the photopolymerizability tends to be insufficient. On the other hand, when it exceeds 10% by mass, absorption increases on the surface of the photosensitive resin layer during exposure, and photocrosslinking inside the photosensitive resin layer tends to be insufficient.

  The compounding amount of the component (C) is preferably 10 to 60% by mass and preferably 30 to 50% by mass with respect to the total amount of the components (A), (B), (C) and (D). More preferred. When the blending amount of the component (C) is less than 10% by mass, the blast resistance is lowered and the photosensitivity tends to be insufficient. On the other hand, when it exceeds 60 mass%, the adhesiveness of the film surface tends to increase.

  The compounding amount of the component (D) is preferably 3 to 30% by mass, and preferably 5 to 20% by mass with respect to the total amount of the components (A), (B), (C) and (D). More preferred. When the blending amount of the component (D) is less than 3% by mass, the blast resistance tends to decrease, the occurrence of edge fusion, the increase in tackiness before curing, and the like. On the other hand, if it exceeds 30% by mass, resolution and photosensitivity tend to be insufficient.

As shown in FIG. 1, the photosensitive resin composition used in the present invention may have a dry film structure in which a support 1, a photosensitive resin layer 3, and a cover film 4 are laminated. Moreover, as shown in FIG. 2, it is good also as a structure of the dry film which the support body 1, the peeling layer 2, the photosensitive resin layer 3, and the cover film 4 laminated | stacked. The support 1 is preferably a transparent film that transmits actinic rays. A thinner thickness is preferable because light refraction is less, and a thicker thickness is preferable because of excellent coating stability, but 10 to 100 μm is preferable. Examples of such a film include films of polyethylene terephthalate and polycarbonate. Examples of the release layer 2 include polyvinyl alcohol, a mixture of an alkali-soluble resin and urethane (meth) acrylate. The cover film 4 only needs to be able to peel off the uncured or cured photosensitive resin layer, and a resin having a high releasability is used. Examples thereof include a polyethylene film, a polypropylene film, and a polyethylene film coated with a release agent such as silicon. The photosensitive resin layer 3 is a layer made of a photosensitive resin composition.

  There are a direct method and an indirect method for using the dry film. In the direct method, first, the cover film 4 is removed, and then it is pasted using a laminator or the like so that the photosensitive resin layer 3 is in contact with the object to be processed. Next, after exposing through the mask film which was in the relief image from the support body 1 side, the support body 1 is peeled. Alternatively, when the resolution is required, the support 1 is peeled and then exposed from the release layer side through a mask film that is in the relief image. The exposed part is cured. Next, the non-exposed portion is washed away with an alkaline developer and washed with water. Subsequently, sandblasting is performed to process the object.

  The indirect method is often used when a dry film cannot be laminated or contact exposure can be performed on an object to be processed. First, the support 1 is peeled after the dry film is exposed through the mask film in the relief image. Alternatively, when the resolution is required, the support 1 is peeled and then exposed from the release layer side through a mask film that is in the relief image. The exposed part is cured. Next, the non-exposed portion is washed away with an alkaline developer and washed with water. As a result, a resist image is formed on the cover film 4. The resist image is attached to the object to be processed using an aqueous adhesive or the like. Next, the cover film 4 is peeled off to form a resist image on the object to be processed. Subsequently, sandblasting is performed to process the object.

  The thickness of the photosensitive resin layer is preferably 10 to 150 μm, and more preferably 30 to 120 μm. If the thickness of the photosensitive resin layer is too large, problems such as a decrease in resolution and high costs are likely to occur. Conversely, if it is too thin, the blast resistance tends to decrease.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to this Example.

(Examples 1-10, Comparative Examples 1-4)
Each component shown in Table 1 was mixed to obtain a photosensitive resin composition. In addition, the unit of each component compounding amount in Table 1 represents a mass part. The obtained coating solution was coated on a polyethylene terephthalate (PET) film (trade name: R310, 25 μm thickness, manufactured by Mitsubishi Chemical Polyester Film) using a wire bar, and dried at 80 ° C. for 8 minutes. The solvent component was skipped and the photosensitive film which provided the photosensitive resin layer (dry film thickness: 50 micrometers) which consists of the photosensitive resin composition of Examples 1-10 and Comparative Examples 1-4 on the single side | surface of PET film was obtained. .

In Table 1, each component is as follows.
(A-1) a copolymer resin (mass average molecular weight 70000) obtained by copolymerizing methyl methacrylate / n-butyl acrylate / methacrylic acid at a mass ratio of 58/15/27;
(B-1) 2- (2'-chlorophenyl) -4,5-diphenylimidazole dimer (B-2) 4,4'-bis (diethylamino) benzophenone (C-1) EBECRYL (registered trademark) 210 ( (Daicel Cytec Co., Ltd.)
(D-1) Art Pearl (registered trademark) C-200 transparent (manufactured by Negami Kogyo Co., Ltd., average particle size: 32 μm, glass transition temperature: −13 ° C.)
(D-2) Art Pearl (registered trademark) C-400 transparent (manufactured by Negami Kogyo Co., Ltd., average particle size: 15 μm, glass transition temperature: −13 ° C.)
(D-3) Art Pearl (registered trademark) C-600 transparent (manufactured by Negami Kogyo Co., Ltd., average particle diameter: 10 μm, glass transition temperature: −13 ° C.)
(D-4) Art Pearl (registered trademark) C-800 transparent (manufactured by Negami Kogyo Co., Ltd., average particle diameter 6 μm, glass transition temperature −13 ° C.)
(D-5) Art Pearl (registered trademark) P-800T (manufactured by Negami Kogyo Co., Ltd., average particle size 6 μm, glass transition temperature -34 ° C.)
(D-6) Art Pearl (registered trademark) CF-600T (manufactured by Negami Kogyo Co., Ltd., average particle size 10 μm, glass transition temperature 9 ° C.)
(D-7) Art Pearl (registered trademark) JB-800T (manufactured by Negami Kogyo Co., Ltd., average particle size 6 μm, glass transition temperature -52 ° C.)
(D-8) Art Pearl (registered trademark) CE-800T (manufactured by Negami Kogyo Co., Ltd., average particle size 6 μm, glass transition temperature 34 ° C.)
(E-1) Pentaerythritol triacrylate (E-2) Art Pearl (registered trademark) G-800 transparent (manufactured by Negami Industrial Co., Ltd., acrylic beads, average particle size 6 μm)
(E-3) Art Pearl (registered trademark) GR-400 transparent (manufactured by Negami Kogyo Co., Ltd., acrylic beads, average particle size 15 μm)
MEK Methyl ethyl ketone (2-butanone)

  The photosensitive films of Examples 1 to 10 and Comparative Examples 1 to 4 were attached to a 3 mm thick glass plate so that the photosensitive resin layer was in contact with the glass plate, and then 50, 70, 100, 150, and 200 μm lines And exposure through a photomask having a space pattern. Subsequently, the PET film was peeled off, and alkali development was performed with a 1.0 mass% sodium carbonate aqueous solution to remove the photosensitive resin layer in the non-exposed area. Under the present circumstances, about Examples 3-10 and Comparative Examples 1-3, it turned out that a 70 micrometer line & space can be resolved. In addition, Example 1 was able to resolve a 200 μm line and space, and Example 2 and Comparative Example 4 were able to resolve a 150 μm line and space. (D) It has confirmed that the one where the average particle diameter of a urethane bead or an acrylic bead is small has high resolution, and it is more preferable that an average particle diameter is 10 micrometers or less.

  Next, sandblasting was performed using silicon carbide powder (GC # 1200, manufactured by Naniwa Polishing Industry). In Examples 5, 7, 9 and 10, it was possible to cut to 1 mm in the depth direction. Moreover, in Examples 1-4, it was able to cut to 700 micrometers in the depth direction. In Examples 6 and 8, it was possible to cut to 300 μm in the depth direction. On the other hand, in Comparative Examples 1 to 4 containing no (D) urethane beads, the photosensitive resin layer disappeared when it was cut to 100 μm, and no further polishing was possible. Therefore, it can be seen that the inclusion of (D) urethane beads significantly improves the blast resistance, and the lower the glass transition temperature, the greater the effect, and the glass transition temperature being −10 ° C. or lower. It turned out to be more preferable.

  On the other hand, in order to examine edge fusion, the above photosensitive film was cut into 10 cm × 10 cm, overlapped 10 sheets, placed in a black plastic bag, and stored in an atmosphere of 30 ° C. and 60% RH for 8 days. When the edge of the cut film was taken out after storage and checked, the photosensitive films of Examples 1 to 10 containing urethane beads and Comparative Examples 3 and 4 containing acrylic beads were 10 sheets each other. There was no sticking. On the other hand, in the photosensitive films of Comparative Examples 1 and 2, the photosensitive resin layer protruded from the end portion, and the end portions of the 10 films adhered, and edge fusion occurred. Therefore, when acrylic beads are used, it is not possible to achieve both high blast resistance and properties that are difficult to generate edge fusion, but when urethane beads are used, it is understood that two properties can be compatible. It was.

The present invention is applicable to a wide sandblasting.

DESCRIPTION OF SYMBOLS 1 Support body 2 Release layer 3 Photosensitive resin layer 4 Cover film

Claims (3)

After a photosensitive resin layer made of a photosensitive resin composition is pasted on the object to be processed and exposed, the unexposed part is washed away with an alkaline developer, followed by sand blasting, and sand blasting to process the object to be processed. Alternatively, after exposing the photosensitive resin layer made of the photosensitive resin composition, the non-exposed portion is washed away with an alkaline developer to form a resist image, and the resist image is attached to the object to be processed. In the sand blasting process for forming a resist image, subsequently performing the sand blasting process, and processing the object to be processed,
A sandblasting process, wherein the photosensitive resin composition contains (A) an alkali-soluble resin, (B) a photopolymerization initiator, (C) a urethane (meth) acrylate compound, and (D) urethane beads. (D) The sand blasting treatment according to claim 1, wherein the urethane beads have an average particle size of 10 μm or less. (D) Sandblast treatment according to claim 1 or 2, wherein the glass transition temperature of the urethane beads is -10 ° C or lower.

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