JP5777656B2 - 基板支持装置及び基板処理装置 - Google Patents

基板支持装置及び基板処理装置 Download PDF

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Publication number
JP5777656B2
JP5777656B2 JP2013079038A JP2013079038A JP5777656B2 JP 5777656 B2 JP5777656 B2 JP 5777656B2 JP 2013079038 A JP2013079038 A JP 2013079038A JP 2013079038 A JP2013079038 A JP 2013079038A JP 5777656 B2 JP5777656 B2 JP 5777656B2
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Japan
Prior art keywords
substrate
lower plate
plate
sealing member
upper plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013079038A
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English (en)
Japanese (ja)
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JP2014013882A (ja
Inventor
サンコン ジョン
サンコン ジョン
ヒャンウォン キム
ヒャンウォン キム
ユシク シン
ユシク シン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GigaLane Co Ltd
Original Assignee
GigaLane Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GigaLane Co Ltd filed Critical GigaLane Co Ltd
Publication of JP2014013882A publication Critical patent/JP2014013882A/ja
Application granted granted Critical
Publication of JP5777656B2 publication Critical patent/JP5777656B2/ja
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2013079038A 2012-07-03 2013-04-05 基板支持装置及び基板処理装置 Active JP5777656B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120072522A KR101228484B1 (ko) 2012-07-03 2012-07-03 플라즈마 처리장치의 기판 재치대
KR10-2012-0072522 2012-07-03

Publications (2)

Publication Number Publication Date
JP2014013882A JP2014013882A (ja) 2014-01-23
JP5777656B2 true JP5777656B2 (ja) 2015-09-09

Family

ID=47842913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013079038A Active JP5777656B2 (ja) 2012-07-03 2013-04-05 基板支持装置及び基板処理装置

Country Status (4)

Country Link
JP (1) JP5777656B2 (ko)
KR (1) KR101228484B1 (ko)
CN (1) CN103531513B (ko)
TW (1) TWI493652B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101950692B1 (ko) * 2012-11-08 2019-02-21 엘지이노텍 주식회사 반도체 식각 장치
KR101599798B1 (ko) * 2014-05-07 2016-03-14 세교 (주) 플라즈마 처리장치의 기판재치대
TWI584706B (zh) * 2014-07-24 2017-05-21 Uvat Technology Co Ltd A plasma etch device for a printed circuit board
KR101600269B1 (ko) * 2014-10-24 2016-03-07 세교 (주) 플라즈마 처리장치의 기판재치대

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63236328A (ja) * 1987-03-25 1988-10-03 Hitachi Ltd 試料温度制御機構
JP4317608B2 (ja) * 1999-01-18 2009-08-19 東京エレクトロン株式会社 成膜装置
WO2003019618A2 (en) * 2001-08-27 2003-03-06 Matsushita Electric Industrial Co., Ltd. Plasma treating apparatus and plasma treating method
JP3640385B2 (ja) * 2001-12-26 2005-04-20 株式会社アルバック 焦電性高誘電体のエッチング方法及び装置
JP4539981B2 (ja) * 2005-05-17 2010-09-08 株式会社アルバック 基板保持装置
JP4361045B2 (ja) * 2005-10-12 2009-11-11 パナソニック株式会社 プラズマ処理装置及びプラズマ処理方法
KR100734016B1 (ko) * 2006-07-06 2007-06-29 주식회사 래디언테크 기판 재치대 및 이를 구비한 플라즈마 처리 장치
JP2010225775A (ja) * 2009-03-23 2010-10-07 Panasonic Corp プラズマ処理装置
KR100981120B1 (ko) * 2009-09-09 2010-09-10 주식회사 맥시스 트레이 및 이를 이용한 제조장치
KR101040697B1 (ko) * 2009-11-25 2011-06-13 세메스 주식회사 정전척
JP2011114178A (ja) * 2009-11-27 2011-06-09 Samco Inc プラズマ処理装置及びプラズマ処理方法

Also Published As

Publication number Publication date
CN103531513B (zh) 2016-04-13
CN103531513A (zh) 2014-01-22
KR101228484B1 (ko) 2013-01-31
JP2014013882A (ja) 2014-01-23
TW201403744A (zh) 2014-01-16
TWI493652B (zh) 2015-07-21

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