JP5774562B2 - ガラス基板の製造方法 - Google Patents
ガラス基板の製造方法 Download PDFInfo
- Publication number
- JP5774562B2 JP5774562B2 JP2012189288A JP2012189288A JP5774562B2 JP 5774562 B2 JP5774562 B2 JP 5774562B2 JP 2012189288 A JP2012189288 A JP 2012189288A JP 2012189288 A JP2012189288 A JP 2012189288A JP 5774562 B2 JP5774562 B2 JP 5774562B2
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- etching
- cleaning
- manufacturing
- etched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011521 glass Substances 0.000 title claims description 177
- 239000000758 substrate Substances 0.000 title claims description 163
- 238000004519 manufacturing process Methods 0.000 title claims description 43
- 238000000034 method Methods 0.000 claims description 82
- 230000008569 process Effects 0.000 claims description 79
- 238000004140 cleaning Methods 0.000 claims description 73
- 238000005530 etching Methods 0.000 claims description 58
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 38
- 239000007789 gas Substances 0.000 claims description 26
- 229910052786 argon Inorganic materials 0.000 claims description 19
- 239000012159 carrier gas Substances 0.000 claims description 17
- 238000001312 dry etching Methods 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 14
- 229940070337 ammonium silicofluoride Drugs 0.000 claims description 9
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 claims description 7
- 239000004973 liquid crystal related substance Substances 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 34
- 230000005611 electricity Effects 0.000 description 19
- 230000003068 static effect Effects 0.000 description 19
- 229910052757 nitrogen Inorganic materials 0.000 description 18
- 239000010409 thin film Substances 0.000 description 15
- 239000006060 molten glass Substances 0.000 description 13
- 238000007788 roughening Methods 0.000 description 11
- 238000003756 stirring Methods 0.000 description 9
- 239000010408 film Substances 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- -1 ammonium fluorosilicate Chemical compound 0.000 description 6
- 238000005352 clarification Methods 0.000 description 6
- 239000013078 crystal Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 238000010583 slow cooling Methods 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000005416 organic matter Substances 0.000 description 3
- 238000007500 overflow downdraw method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011143 downstream manufacturing Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VUZPPFZMUPKLLV-UHFFFAOYSA-N methane;hydrate Chemical compound C.O VUZPPFZMUPKLLV-UHFFFAOYSA-N 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003280 down draw process Methods 0.000 description 1
- 239000006025 fining agent Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/006—Other surface treatment of glass not in the form of fibres or filaments by irradiation by plasma or corona discharge
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0075—Cleaning of glass
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Surface Treatment Of Glass (AREA)
- Drying Of Semiconductors (AREA)
- Liquid Crystal (AREA)
- Cleaning In General (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012189288A JP5774562B2 (ja) | 2012-08-29 | 2012-08-29 | ガラス基板の製造方法 |
| KR1020130099615A KR101521345B1 (ko) | 2012-08-29 | 2013-08-22 | 글래스 기판의 제조 방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012189288A JP5774562B2 (ja) | 2012-08-29 | 2012-08-29 | ガラス基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014047086A JP2014047086A (ja) | 2014-03-17 |
| JP2014047086A5 JP2014047086A5 (enExample) | 2014-08-14 |
| JP5774562B2 true JP5774562B2 (ja) | 2015-09-09 |
Family
ID=50607128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012189288A Expired - Fee Related JP5774562B2 (ja) | 2012-08-29 | 2012-08-29 | ガラス基板の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5774562B2 (enExample) |
| KR (1) | KR101521345B1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017073580A1 (ja) * | 2015-10-29 | 2017-05-04 | 旭硝子株式会社 | ディスプレイ用ガラス基板、及びディスプレイ用ガラス基板の製造方法 |
| WO2022185557A1 (ja) * | 2021-03-05 | 2022-09-09 | ナルックス株式会社 | ガラス基板に微細凹凸表面構造を製造する方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005097018A (ja) * | 2003-09-22 | 2005-04-14 | Air Water Inc | 難帯電ガラス基板の製法およびそれによって得られた難帯電ガラス基板 |
| JP4448458B2 (ja) * | 2005-02-04 | 2010-04-07 | エア・ウォーター株式会社 | 基板洗浄方法および基板洗浄装置 |
| TWI543948B (zh) * | 2009-05-07 | 2016-08-01 | 日本電氣硝子股份有限公司 | 玻璃基板及其製造方法 |
| CN102770944B (zh) * | 2010-02-25 | 2013-11-06 | 积水化学工业株式会社 | 蚀刻方法及装置 |
-
2012
- 2012-08-29 JP JP2012189288A patent/JP5774562B2/ja not_active Expired - Fee Related
-
2013
- 2013-08-22 KR KR1020130099615A patent/KR101521345B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140029214A (ko) | 2014-03-10 |
| KR101521345B1 (ko) | 2015-05-18 |
| JP2014047086A (ja) | 2014-03-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5813813B2 (ja) | ディスプレイ用ガラス基板の製造方法、ガラス基板及びディスプレイ用パネル | |
| JP5679513B2 (ja) | ガラス基板及びその製造方法 | |
| JP5687088B2 (ja) | ガラス基板の製造方法 | |
| US9126858B2 (en) | Method for making glass substrate for display, glass substrate and display panel | |
| JP2010275167A (ja) | ガラス基板の製造方法 | |
| JP5572196B2 (ja) | ガラス基板、および、ガラス基板の製造方法 | |
| JP2014201445A (ja) | ディスプレイ用ガラス基板、その製造方法及びそれを用いたディスプレイ用パネルの製造方法 | |
| JP6263534B2 (ja) | ガラス基板の製造方法、ガラス基板、および、ディスプレイ用パネル | |
| JP2014201446A (ja) | ディスプレイ用ガラス基板及びその製造方法、並びにディスプレイ用パネルの製造方法 | |
| JP5774562B2 (ja) | ガラス基板の製造方法 | |
| JP2014009124A (ja) | ディスプレイ用ガラス基板の製造方法、および、ディスプレイ用ガラス基板の製造装置 | |
| JP5572195B2 (ja) | ガラス基板、および、ガラス基板の製造方法 | |
| CN103373818B (zh) | 显示器用玻璃基板的制造方法、玻璃基板以及显示器用面板 | |
| JPWO2016152932A1 (ja) | ガラス基板の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140627 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140627 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20141023 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20141028 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141219 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150602 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150701 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5774562 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |