JP5772329B2 - 半導体装置の製造方法、半導体装置、電子機器 - Google Patents

半導体装置の製造方法、半導体装置、電子機器 Download PDF

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Publication number
JP5772329B2
JP5772329B2 JP2011157977A JP2011157977A JP5772329B2 JP 5772329 B2 JP5772329 B2 JP 5772329B2 JP 2011157977 A JP2011157977 A JP 2011157977A JP 2011157977 A JP2011157977 A JP 2011157977A JP 5772329 B2 JP5772329 B2 JP 5772329B2
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Japan
Prior art keywords
wiring
plug
circuit board
conductive layer
forming
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2011157977A
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English (en)
Japanese (ja)
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JP2013026329A5 (enExample
JP2013026329A (ja
Inventor
生枝 三橋
生枝 三橋
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Sony Corp
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Sony Corp
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Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2011157977A priority Critical patent/JP5772329B2/ja
Priority to US13/547,698 priority patent/US9153490B2/en
Priority to CN201210241867.7A priority patent/CN103022062B/zh
Priority to CN201610797377.3A priority patent/CN106449676A/zh
Publication of JP2013026329A publication Critical patent/JP2013026329A/ja
Publication of JP2013026329A5 publication Critical patent/JP2013026329A5/ja
Priority to US14/841,958 priority patent/US9627429B2/en
Application granted granted Critical
Publication of JP5772329B2 publication Critical patent/JP5772329B2/ja
Priority to US15/087,918 priority patent/US9525004B2/en
Priority to US15/370,818 priority patent/US10249674B2/en
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Solid State Image Pick-Up Elements (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2011157977A 2011-07-19 2011-07-19 半導体装置の製造方法、半導体装置、電子機器 Expired - Fee Related JP5772329B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2011157977A JP5772329B2 (ja) 2011-07-19 2011-07-19 半導体装置の製造方法、半導体装置、電子機器
CN201210241867.7A CN103022062B (zh) 2011-07-19 2012-07-12 固体摄像器件及其制造方法和电子设备
CN201610797377.3A CN106449676A (zh) 2011-07-19 2012-07-12 半导体装置和电子设备
US13/547,698 US9153490B2 (en) 2011-07-19 2012-07-12 Solid-state imaging device, manufacturing method of solid-state imaging device, manufacturing method of semiconductor device, semiconductor device, and electronic device
US14/841,958 US9627429B2 (en) 2011-07-19 2015-09-01 Semiconductor device and electronic device having bonded substrates
US15/087,918 US9525004B2 (en) 2011-07-19 2016-03-31 Solid-state imaging device, manufacturing method of solid-state imaging device, manufacturing method of semiconductor device, semiconductor device, and electronic device
US15/370,818 US10249674B2 (en) 2011-07-19 2016-12-06 Semiconductor device and electronic apparatus including a semiconductor device having bonded sensor and logic substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011157977A JP5772329B2 (ja) 2011-07-19 2011-07-19 半導体装置の製造方法、半導体装置、電子機器

Publications (3)

Publication Number Publication Date
JP2013026329A JP2013026329A (ja) 2013-02-04
JP2013026329A5 JP2013026329A5 (enExample) 2014-09-04
JP5772329B2 true JP5772329B2 (ja) 2015-09-02

Family

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JP2011157977A Expired - Fee Related JP5772329B2 (ja) 2011-07-19 2011-07-19 半導体装置の製造方法、半導体装置、電子機器

Country Status (1)

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JP (1) JP5772329B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6349121B2 (ja) * 2014-03-27 2018-06-27 株式会社ディスコ 積層デバイスの製造方法
JP6385727B2 (ja) * 2014-06-13 2018-09-05 株式会社ディスコ 貼り合わせウェーハ形成方法
JP6345519B2 (ja) * 2014-07-09 2018-06-20 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2016131179A (ja) * 2015-01-13 2016-07-21 ソニー株式会社 半導体装置、および半導体装置の製造方法、固体撮像素子、撮像装置、並びに電子機器
US10727264B2 (en) * 2015-06-05 2020-07-28 Sony Corporation Imaging element, electronic device, manufacturing apparatus, and manufacturing method
US9947700B2 (en) * 2016-02-03 2018-04-17 Semiconductor Energy Laboratory Co., Ltd. Imaging device and electronic device
US10756132B2 (en) 2016-03-29 2020-08-25 Sony Corporation Solid-state imaging device, method of manufacturing the same, and electronic apparatus
JP2019057572A (ja) 2017-09-20 2019-04-11 東芝メモリ株式会社 金属配線の形成方法
CN111627940B (zh) * 2019-02-27 2023-08-11 中芯集成电路（宁波）有限公司 Cmos图像传感器封装模块及其形成方法、摄像装置
JP2022126473A (ja) * 2021-02-18 2022-08-30 ソニーグループ株式会社 撮像装置およびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005123327A (ja) * 2003-10-15 2005-05-12 Seiko Epson Corp 半導体装置および半導体装置の製造方法
JP2006269766A (ja) * 2005-03-24 2006-10-05 Toshiba Corp 半導体装置及びその製造方法
JP2006303062A (ja) * 2005-04-19 2006-11-02 Sony Corp 半導体装置の製造方法
JP2008071980A (ja) * 2006-09-15 2008-03-27 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JP5442394B2 (ja) * 2009-10-29 2014-03-12 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器
JP5775288B2 (ja) * 2009-11-17 2015-09-09 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 半導体装置

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JP2013026329A (ja) 2013-02-04

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