JP5770300B2 - 処理ノードの熱制御のための方法および装置 - Google Patents

処理ノードの熱制御のための方法および装置 Download PDF

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JP5770300B2
JP5770300B2 JP2013536717A JP2013536717A JP5770300B2 JP 5770300 B2 JP5770300 B2 JP 5770300B2 JP 2013536717 A JP2013536717 A JP 2013536717A JP 2013536717 A JP2013536717 A JP 2013536717A JP 5770300 B2 JP5770300 B2 JP 5770300B2
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processing
processing nodes
processing node
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JP2013546070A (ja
JP2013546070A5 (enExample
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ブラノーバー アレキサンダー
ブラノーバー アレキサンダー
ディー． ナフチガー サミュエル
ディー． ナフチガー サミュエル
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Advanced Micro Devices Inc
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234—Power saving characterised by the action undertaken
    • G06F1/324—Power saving characterised by the action undertaken by lowering clock frequency
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234—Power saving characterised by the action undertaken
    • G06F1/3296—Power saving characterised by the action undertaken by lowering the supply or operating voltage
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/50—Reducing energy consumption in communication networks in wire-line communication networks, e.g. low power modes or reduced link rate

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Power Sources (AREA)
  • Microcomputers (AREA)
JP2013536717A 2010-10-29 2011-10-25 処理ノードの熱制御のための方法および装置 Active JP5770300B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/915,361 US8793512B2 (en) 2010-10-29 2010-10-29 Method and apparatus for thermal control of processing nodes
US12/915,361 2010-10-29
PCT/US2011/057640 WO2012058202A1 (en) 2010-10-29 2011-10-25 Method and apparatus for thermal control of processing nodes

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JP2013546070A JP2013546070A (ja) 2013-12-26
JP2013546070A5 JP2013546070A5 (enExample) 2014-12-11
JP5770300B2 true JP5770300B2 (ja) 2015-08-26

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US (1) US8793512B2 (enExample)
EP (1) EP2635948B1 (enExample)
JP (1) JP5770300B2 (enExample)
KR (1) KR101845504B1 (enExample)
CN (1) CN103189814B (enExample)
WO (1) WO2012058202A1 (enExample)

Families Citing this family (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8984305B2 (en) * 2010-12-21 2015-03-17 Intel Corporation Method and apparatus to configure thermal design power in a microprocessor
US8484496B2 (en) * 2011-04-22 2013-07-09 Qualcomm Incorporated Method and system for thermal management of battery charging concurrencies in a portable computing device
US8185758B2 (en) * 2011-06-30 2012-05-22 Intel Corporation Method and system for determining an energy-efficient operating point of a platform
US8930724B2 (en) * 2011-08-17 2015-01-06 Broadcom Corporation Semiconductor device predictive dynamic thermal management
US8769316B2 (en) 2011-09-06 2014-07-01 Intel Corporation Dynamically allocating a power budget over multiple domains of a processor
US8954770B2 (en) 2011-09-28 2015-02-10 Intel Corporation Controlling temperature of multiple domains of a multi-domain processor using a cross domain margin
US9074947B2 (en) 2011-09-28 2015-07-07 Intel Corporation Estimating temperature of a processor core in a low power state without thermal sensor information
US8832478B2 (en) 2011-10-27 2014-09-09 Intel Corporation Enabling a non-core domain to control memory bandwidth in a processor
US9026815B2 (en) 2011-10-27 2015-05-05 Intel Corporation Controlling operating frequency of a core domain via a non-core domain of a multi-domain processor
US8943340B2 (en) 2011-10-31 2015-01-27 Intel Corporation Controlling a turbo mode frequency of a processor
US9158693B2 (en) 2011-10-31 2015-10-13 Intel Corporation Dynamically controlling cache size to maximize energy efficiency
US9304570B2 (en) * 2011-12-15 2016-04-05 Intel Corporation Method, apparatus, and system for energy efficiency and energy conservation including power and performance workload-based balancing between multiple processing elements
US20120095607A1 (en) * 2011-12-22 2012-04-19 Wells Ryan D Method, Apparatus, and System for Energy Efficiency and Energy Conservation Through Dynamic Management of Memory and Input/Output Subsystems
EP2798430A4 (en) * 2011-12-29 2015-11-25 Intel Corp ADAPTIVE THERMAL THROTTLE THROTTLE WITH USER CONFIGURATION CAPABILITY
US9158351B2 (en) * 2012-03-29 2015-10-13 Intel Corporation Dynamic power limit sharing in a platform
US9360909B2 (en) * 2012-04-19 2016-06-07 Intel Corporation System, method and apparatus for energy efficiency and energy conservation by configuring power management parameters during run time
US9383789B2 (en) 2012-06-21 2016-07-05 Apple Inc. Thermal control apparatus and methodology
US9218045B2 (en) * 2012-06-30 2015-12-22 Intel Corporation Operating processor element based on maximum sustainable dynamic capacitance associated with the processor
US9285818B2 (en) * 2012-07-26 2016-03-15 Qualcomm Incorporated Autonomous thermal controller for power management IC
KR101975409B1 (ko) * 2012-07-26 2019-05-08 삼성전자주식회사 시스템 온 칩 및 그것의 온도 제어 방법
US9075611B2 (en) * 2012-09-12 2015-07-07 Htc Corporation Electronic device with power management mechanism and power management method thereof
US9164931B2 (en) 2012-09-29 2015-10-20 Intel Corporation Clamping of dynamic capacitance for graphics
CN103810141A (zh) * 2012-11-09 2014-05-21 辉达公司 处理器和包括其的电路板
US9946319B2 (en) * 2012-11-20 2018-04-17 Advanced Micro Devices, Inc. Setting power-state limits based on performance coupling and thermal coupling between entities in a computing device
KR102005765B1 (ko) 2012-12-17 2019-07-31 삼성전자주식회사 시스템-온 칩과, 이의 동작 방법
DE102012112672A1 (de) * 2012-12-19 2014-06-26 Endress + Hauser Gmbh + Co. Kg Verfahren zur Stabilisierung der Taktfrequenz eines Microcontrollers
US8975954B2 (en) * 2013-01-08 2015-03-10 Qualcomm Incorporated Method for performing adaptive voltage scaling (AVS) and integrated circuit configured to perform AVS
EP2973180B1 (en) 2013-03-15 2020-01-15 OLogN Technologies AG Systems, methods and apparatuses for securely storing and providing payment information
US9494996B2 (en) * 2013-03-15 2016-11-15 Intel Corporation Processor having frequency of operation information for guaranteed operation under high temperature events
US9411395B2 (en) * 2013-04-18 2016-08-09 Intel Corporation Method and apparatus to control current transients in a processor
US9360906B2 (en) 2013-05-01 2016-06-07 Advanced Micro Devices, Inc. Power management for multiple compute units
US9304573B2 (en) * 2013-06-21 2016-04-05 Apple Inc. Dynamic voltage and frequency management based on active processors
US9195291B2 (en) 2013-06-21 2015-11-24 Apple Inc. Digital power estimator to control processor power consumption
US9471088B2 (en) * 2013-06-25 2016-10-18 Intel Corporation Restricting clock signal delivery in a processor
US9377836B2 (en) 2013-07-26 2016-06-28 Intel Corporation Restricting clock signal delivery based on activity in a processor
US9250910B2 (en) 2013-09-27 2016-02-02 Intel Corporation Current change mitigation policy for limiting voltage droop in graphics logic
US9389675B2 (en) * 2013-12-19 2016-07-12 International Business Machines Corporation Power management for in-memory computer systems
US9514715B2 (en) 2013-12-23 2016-12-06 Intel Corporation Graphics voltage reduction for load line optimization
KR101538458B1 (ko) 2014-01-03 2015-07-23 연세대학교 산학협력단 3차원 매니코어 프로세서를 위한 전압섬 형성 방법
US9182768B2 (en) * 2014-01-08 2015-11-10 Nvidia Corporation Voltage optimization circuit and managing voltage margins of an integrated circuit
US10067555B2 (en) 2014-02-20 2018-09-04 Advanced Micro Devices, Inc. Control of performance levels of different types of processors via a user interface
US9606605B2 (en) 2014-03-07 2017-03-28 Apple Inc. Dynamic voltage margin recovery
CN106164810B (zh) * 2014-04-04 2019-09-03 英派尔科技开发有限公司 使用基于电压的功能的性能变化的指令优化
US9977439B2 (en) 2014-04-08 2018-05-22 Qualcomm Incorporated Energy efficiency aware thermal management in a multi-processor system on a chip
US9671767B2 (en) 2014-05-14 2017-06-06 Advanced Micro Devices, Inc. Hybrid system and method for determining performance levels based on thermal conditions within a processor
US9652019B2 (en) * 2014-06-02 2017-05-16 Advanced Micro Devices, Inc. System and method for adjusting processor performance based on platform and ambient thermal conditions
US9400308B2 (en) * 2014-07-03 2016-07-26 Qualcomm Incorporated Multi-domain heterogeneous process-voltage-temperature tracking for integrated circuit power reduction
US9791904B2 (en) * 2014-08-15 2017-10-17 Intel Corporation Balanced control of processor temperature
CN105829991B (zh) * 2014-09-17 2020-02-04 联发科技股份有限公司 操作计算系统的方法及其计算系统
US9811142B2 (en) 2014-09-29 2017-11-07 Apple Inc. Low energy processor for controlling operating states of a computer system
US9903764B2 (en) 2014-09-30 2018-02-27 Samsung Electronics Co., Ltd. Integrated circuit for estimating power of at least one node using temperature and a system including the same
EP3193235B1 (en) 2014-12-12 2021-02-24 VIA Alliance Semiconductor Co., Ltd. Graphics processing system and power gating method thereof
US10877530B2 (en) 2014-12-23 2020-12-29 Intel Corporation Apparatus and method to provide a thermal parameter report for a multi-chip package
US10216526B2 (en) * 2015-01-14 2019-02-26 Mediatek Inc. Controlling method for optimizing a processor and controlling system
US10698459B2 (en) * 2015-02-17 2020-06-30 Apple Inc. Electronic devices and method of controlling an electronic device
US9860189B2 (en) * 2015-04-30 2018-01-02 Dell Products Lp Systems and methods to enable network communications for management controllers
US10429909B2 (en) 2015-06-01 2019-10-01 Hewlett Packard Enterprise Development Lp Managing power in a high performance computing system for resiliency and cooling
CN105045702B (zh) * 2015-07-22 2018-03-20 Tcl移动通信科技（宁波）有限公司 一种根据芯片温度来保护芯片的方法、系统及芯片
US10739835B2 (en) * 2015-07-23 2020-08-11 Hewlett-Packard Development Company, L.P. Power management for electronic devices
CN106407143B (zh) 2015-07-29 2020-07-31 南京中兴新软件有限责任公司 控制移动终端中cpu的热插拔操作的方法和装置
CN105159815B (zh) * 2015-09-02 2018-06-19 浪潮(北京)电子信息产业有限公司 高性能计算集群系统故障预测方法和装置
KR102324267B1 (ko) 2015-09-10 2021-11-12 에스케이하이닉스 주식회사 반도체장치 및 반도체시스템
US9720033B2 (en) * 2015-09-29 2017-08-01 Apple Inc. On-chip parameter measurement
US10120426B2 (en) 2015-12-09 2018-11-06 Research & Business Foundation Sungkyunkwan University Thermal management apparatus and method using dynamic thermal margin, and semiconductor processor device, non-volatile data storage device and access control method using the same
KR101719074B1 (ko) * 2015-12-09 2017-04-05 성균관대학교산학협력단 동적 열적 마진을 이용하는 반도체 프로세서 장치를 위한 열 관리 방법 및 장치
US10527503B2 (en) 2016-01-08 2020-01-07 Apple Inc. Reference circuit for metrology system
US10108564B2 (en) * 2016-03-28 2018-10-23 Qualcomm Incorporated Active and stall cycle based dynamic scaling of processor frequency and bus bandwidth
US10248173B2 (en) 2016-03-31 2019-04-02 Intel Corporation Determining thermal margins in a multi-die processor
US10296067B2 (en) * 2016-04-08 2019-05-21 Qualcomm Incorporated Enhanced dynamic clock and voltage scaling (DCVS) scheme
CN106066813B (zh) * 2016-05-26 2020-03-13 努比亚技术有限公司 资源调度装置、移动终端及资源调度方法
US10359833B2 (en) 2016-06-20 2019-07-23 Qualcomm Incorporated Active-core-based performance boost
CN106163181A (zh) * 2016-07-25 2016-11-23 苏州市龙源电力科技股份有限公司 一种简易背光电气控制柜
KR102673675B1 (ko) * 2016-12-06 2024-06-12 삼성전자주식회사 전자 장치 및 전자 장치에서의 표면 발열을 제어하기 위한 방법
CN110199242B (zh) * 2017-02-24 2023-08-29 英特尔公司 基于使用参数配置处理器的基本时钟频率
JP6872440B2 (ja) 2017-06-30 2021-05-19 ルネサスエレクトロニクス株式会社 半導体装置および半導体装置の制御方法
TWI628666B (zh) * 2017-08-10 2018-07-01 群聯電子股份有限公司 溫度控制方法、記憶體儲存裝置及記憶體控制電路單元
US10565079B2 (en) 2017-09-28 2020-02-18 Intel Corporation Determination of idle power state
CN108509018B (zh) * 2018-03-27 2021-02-19 联想(北京)有限公司 一种控制方法及电子设备、存储介质
US11216276B2 (en) * 2018-12-27 2022-01-04 Intel Corporation Controlling power state demotion in a processor
US12141624B2 (en) * 2019-01-08 2024-11-12 Hewlett-Packard Development Company, L.P. Stabilizing performance of processing devices
US11140243B1 (en) 2019-03-30 2021-10-05 Snap Inc. Thermal state inference based frequency scaling
US11442513B1 (en) 2019-04-16 2022-09-13 Snap Inc. Configuration management based on thermal state
US11175709B2 (en) * 2019-08-26 2021-11-16 Intel Corporation Per chiplet thermal control in a disaggregated multi-chiplet system
US11366506B2 (en) * 2019-11-22 2022-06-21 Intel Corporation System, apparatus and method for globally aware reactive local power control in a processor
US11106267B2 (en) * 2019-11-27 2021-08-31 Amazon Technologies, Inc. Dynamic processor core frequency adjustment
US11435806B2 (en) * 2019-12-16 2022-09-06 Advanced Micro Devices, Inc. Automatic voltage reconfiguration
US11347198B2 (en) 2020-09-04 2022-05-31 Apple Inc. Adaptive thermal control system
CN112068688A (zh) * 2020-09-09 2020-12-11 北京字节跳动网络技术有限公司 省电方法、装置、电子设备及计算机可读介质
EP4191380A4 (en) 2021-01-13 2024-03-06 Samsung Electronics Co., Ltd. ELECTRONIC DEVICE AND METHOD FOR CONTROLLING HEATING BASED ON USER ACTIVITY IN AN ELECTRONIC DEVICE
CN112764509B (zh) * 2021-02-03 2024-03-01 北京灵汐科技有限公司 计算核、计算核温度调整方法、设备、介质、芯片和系统
US11822399B2 (en) 2021-07-28 2023-11-21 Apple Inc. Temperature control loop for integrated circuit
EP4137913A1 (en) * 2021-08-17 2023-02-22 Axis AB Power management in processing circuitry which implements a neural network
US12411474B2 (en) * 2021-12-13 2025-09-09 Mediatek Inc. Integrated circuit configurable to perform adaptive thermal ceiling control in per-functional-block manner, associated main circuit, associated electronic device and associated thermal control method
US20250155955A1 (en) * 2023-11-10 2025-05-15 Hewlett Packard Enterprise Development Lp Region-aware power & energy regulation
US20250306998A1 (en) * 2024-03-28 2025-10-02 Intel Corporation Apparatus, system and method of multicore processor power control

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6172611B1 (en) 1998-10-19 2001-01-09 Telcom Semiconductor, Inc. Independent hardware thermal sensing and monitoring
US7886164B1 (en) 2002-11-14 2011-02-08 Nvidia Corporation Processor temperature adjustment system and method
US7882369B1 (en) 2002-11-14 2011-02-01 Nvidia Corporation Processor performance adjustment system and method
US20060161375A1 (en) * 2004-12-30 2006-07-20 Allen Duberstein Optimizing processing speed based on measured temperatures
US7502948B2 (en) 2004-12-30 2009-03-10 Intel Corporation Method, system, and apparatus for selecting a maximum operation point based on number of active cores and performance level of each of the active cores
US7562234B2 (en) 2005-08-25 2009-07-14 Apple Inc. Methods and apparatuses for dynamic power control
US7263457B2 (en) * 2006-01-03 2007-08-28 Advanced Micro Devices, Inc. System and method for operating components of an integrated circuit at independent frequencies and/or voltages
US7552346B2 (en) 2006-05-03 2009-06-23 International Business Machines Corporation Dynamically adapting software for reducing a thermal state of a processor core based on its thermal index
CN100517176C (zh) * 2006-06-21 2009-07-22 国际商业机器公司 实现热调节逻辑的数据处理系统和方法
US7650518B2 (en) * 2006-06-28 2010-01-19 Intel Corporation Method, apparatus, and system for increasing single core performance in a multi-core microprocessor
US7584369B2 (en) * 2006-07-26 2009-09-01 International Business Machines Corporation Method and apparatus for monitoring and controlling heat generation in a multi-core processor
US7793125B2 (en) * 2007-01-10 2010-09-07 International Business Machines Corporation Method and apparatus for power throttling a processor in an information handling system
US8032772B2 (en) * 2007-11-15 2011-10-04 Intel Corporation Method, apparatus, and system for optimizing frequency and performance in a multi-die microprocessor
US20090235108A1 (en) * 2008-03-11 2009-09-17 Gold Spencer M Automatic processor overclocking
JP2009230670A (ja) * 2008-03-25 2009-10-08 Fuji Xerox Co Ltd プロセッサシステム
US9032223B2 (en) * 2008-09-05 2015-05-12 Intel Corporation Techniques to manage operational parameters for a processor
US20100073068A1 (en) * 2008-09-22 2010-03-25 Hanwoo Cho Functional block level thermal control
US8443209B2 (en) * 2009-07-24 2013-05-14 Advanced Micro Devices, Inc. Throttling computational units according to performance sensitivity
US20110191602A1 (en) * 2010-01-29 2011-08-04 Bearden David R Processor with selectable longevity
US8495395B2 (en) * 2010-09-14 2013-07-23 Advanced Micro Devices Mechanism for controlling power consumption in a processing node
US8726055B2 (en) * 2010-09-20 2014-05-13 Apple Inc. Multi-core power management

Also Published As

Publication number Publication date
EP2635948B1 (en) 2021-07-07
EP2635948A1 (en) 2013-09-11
JP2013546070A (ja) 2013-12-26
KR20140001902A (ko) 2014-01-07
WO2012058202A1 (en) 2012-05-03
KR101845504B1 (ko) 2018-05-18
US20120110352A1 (en) 2012-05-03
CN103189814A (zh) 2013-07-03
US8793512B2 (en) 2014-07-29
CN103189814B (zh) 2017-06-09

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