JP5748384B2 - 多孔質SiC基板を有する発光ダイオードおよび製造方法 - Google Patents

多孔質SiC基板を有する発光ダイオードおよび製造方法 Download PDF

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Publication number
JP5748384B2
JP5748384B2 JP2006533962A JP2006533962A JP5748384B2 JP 5748384 B2 JP5748384 B2 JP 5748384B2 JP 2006533962 A JP2006533962 A JP 2006533962A JP 2006533962 A JP2006533962 A JP 2006533962A JP 5748384 B2 JP5748384 B2 JP 5748384B2
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Prior art keywords
led
light emitting
porous layer
light
substrate
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Expired - Lifetime
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Japanese (ja)
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JP2007507895A (ja
JP2007507895A5 (cg-RX-API-DMAC10.html
Inventor
リ ティン
リ ティン
イベットソン ジェームズ
イベットソン ジェームズ
ケラー ブレンド
ケラー ブレンド
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Wolfspeed Inc
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Cree Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/61—Electrolytic etching
    • H10P50/613—Electrolytic etching of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/70—Surface textures, e.g. pyramid structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
JP2006533962A 2003-09-30 2004-09-21 多孔質SiC基板を有する発光ダイオードおよび製造方法 Expired - Lifetime JP5748384B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/676,953 US6972438B2 (en) 2003-09-30 2003-09-30 Light emitting diode with porous SiC substrate and method for fabricating
US10/676,953 2003-09-30
PCT/US2004/031050 WO2005034254A1 (en) 2003-09-30 2004-09-21 Light emitting diode with porous sic substrate and method for fabricating

Publications (3)

Publication Number Publication Date
JP2007507895A JP2007507895A (ja) 2007-03-29
JP2007507895A5 JP2007507895A5 (cg-RX-API-DMAC10.html) 2007-11-08
JP5748384B2 true JP5748384B2 (ja) 2015-07-15

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JP2006533962A Expired - Lifetime JP5748384B2 (ja) 2003-09-30 2004-09-21 多孔質SiC基板を有する発光ダイオードおよび製造方法

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Country Link
US (1) US6972438B2 (cg-RX-API-DMAC10.html)
EP (1) EP1668710B1 (cg-RX-API-DMAC10.html)
JP (1) JP5748384B2 (cg-RX-API-DMAC10.html)
KR (1) KR20060090813A (cg-RX-API-DMAC10.html)
CN (1) CN100470854C (cg-RX-API-DMAC10.html)
CA (1) CA2536154A1 (cg-RX-API-DMAC10.html)
TW (1) TW200518355A (cg-RX-API-DMAC10.html)
WO (1) WO2005034254A1 (cg-RX-API-DMAC10.html)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006525682A (ja) 2003-04-30 2006-11-09 クリー インコーポレイテッド 高出力固体発光素子パッケージ
US7005679B2 (en) 2003-05-01 2006-02-28 Cree, Inc. Multiple component solid state white light
US7534633B2 (en) 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
US8174037B2 (en) 2004-09-22 2012-05-08 Cree, Inc. High efficiency group III nitride LED with lenticular surface
JP2006179511A (ja) * 2004-12-20 2006-07-06 Sumitomo Electric Ind Ltd 発光装置
KR20090009772A (ko) 2005-12-22 2009-01-23 크리 엘이디 라이팅 솔루션즈, 인크. 조명 장치
JP2009530798A (ja) 2006-01-05 2009-08-27 イルミテックス, インコーポレイテッド Ledから光を導くための独立した光学デバイス
KR101198763B1 (ko) * 2006-03-23 2012-11-12 엘지이노텍 주식회사 기둥 구조와 이를 이용한 발광 소자 및 그 형성방법
US20070241326A1 (en) * 2006-04-18 2007-10-18 Samsung Electronics Co., Ltd. Organic light emitting diode display and manufacturing method thereof
US8008676B2 (en) 2006-05-26 2011-08-30 Cree, Inc. Solid state light emitting device and method of making same
US8174025B2 (en) * 2006-06-09 2012-05-08 Philips Lumileds Lighting Company, Llc Semiconductor light emitting device including porous layer
US20080025037A1 (en) * 2006-07-28 2008-01-31 Visteon Global Technologies, Inc. LED headlamp
US8310143B2 (en) 2006-08-23 2012-11-13 Cree, Inc. Lighting device and lighting method
JP2010506402A (ja) 2006-10-02 2010-02-25 イルミテックス, インコーポレイテッド Ledのシステムおよび方法
JP4835377B2 (ja) * 2006-10-20 2011-12-14 日立電線株式会社 半導体発光素子
KR100826412B1 (ko) * 2006-11-03 2008-04-29 삼성전기주식회사 질화물 반도체 발광 소자 및 제조방법
US9310026B2 (en) 2006-12-04 2016-04-12 Cree, Inc. Lighting assembly and lighting method
US8337045B2 (en) * 2006-12-04 2012-12-25 Cree, Inc. Lighting device and lighting method
US8021904B2 (en) * 2007-02-01 2011-09-20 Cree, Inc. Ohmic contacts to nitrogen polarity GaN
US7808657B2 (en) * 2007-06-28 2010-10-05 International Business Machines Corporation Wafer and stage alignment using photonic devices
JP5431320B2 (ja) 2007-07-17 2014-03-05 クリー インコーポレイテッド 内部光学機能を備えた光学素子およびその製造方法
US11114594B2 (en) 2007-08-24 2021-09-07 Creeled, Inc. Light emitting device packages using light scattering particles of different size
US8368100B2 (en) * 2007-11-14 2013-02-05 Cree, Inc. Semiconductor light emitting diodes having reflective structures and methods of fabricating same
US9634191B2 (en) * 2007-11-14 2017-04-25 Cree, Inc. Wire bond free wafer level LED
US8536584B2 (en) * 2007-11-14 2013-09-17 Cree, Inc. High voltage wire bond free LEDS
US9431589B2 (en) 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages
US8080849B2 (en) * 2008-01-17 2011-12-20 International Business Machines Corporation Characterizing films using optical filter pseudo substrate
JP2011512037A (ja) 2008-02-08 2011-04-14 イルミテックス, インコーポレイテッド エミッタ層成形のためのシステムおよび方法
US8637883B2 (en) * 2008-03-19 2014-01-28 Cree, Inc. Low index spacer layer in LED devices
TW201034256A (en) 2008-12-11 2010-09-16 Illumitex Inc Systems and methods for packaging light-emitting diode devices
JP5330880B2 (ja) * 2009-03-27 2013-10-30 学校法人 名城大学 発光ダイオード素子及びその製造方法
US9093293B2 (en) 2009-04-06 2015-07-28 Cree, Inc. High voltage low current surface emitting light emitting diode
US8476668B2 (en) 2009-04-06 2013-07-02 Cree, Inc. High voltage low current surface emitting LED
US8449128B2 (en) 2009-08-20 2013-05-28 Illumitex, Inc. System and method for a lens and phosphor layer
US8585253B2 (en) 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array
WO2011037877A1 (en) 2009-09-25 2011-03-31 Cree, Inc. Lighting device with low glare and high light level uniformity
KR20130007557A (ko) 2010-01-27 2013-01-18 예일 유니버시티 GaN 소자의 전도도 기반 선택적 에칭 및 그의 응용
US8329482B2 (en) 2010-04-30 2012-12-11 Cree, Inc. White-emitting LED chips and method for making same
US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
US8455882B2 (en) 2010-10-15 2013-06-04 Cree, Inc. High efficiency LEDs
WO2012066461A1 (en) * 2010-11-19 2012-05-24 Koninklijke Philips Electronics N.V. Islanded carrier for light emitting device
US10435812B2 (en) 2012-02-17 2019-10-08 Yale University Heterogeneous material integration through guided lateral growth
WO2014004261A1 (en) 2012-06-28 2014-01-03 Yale University Lateral electrochemical etching of iii-nitride materials for microfabrication
WO2014030686A1 (ja) * 2012-08-22 2014-02-27 住友大阪セメント株式会社 色素増感型太陽電池用ペースト、多孔質光反射絶縁層、及び色素増感型太陽電池
US9711352B2 (en) 2013-03-15 2017-07-18 Yale University Large-area, laterally-grown epitaxial semiconductor layers
CN104241262B (zh) 2013-06-14 2020-11-06 惠州科锐半导体照明有限公司 发光装置以及显示装置
US9299899B2 (en) 2013-07-23 2016-03-29 Grote Industries, Llc Flexible lighting device having unobtrusive conductive layers
US9978589B2 (en) 2014-04-16 2018-05-22 Yale University Nitrogen-polar semipolar and gallium-polar semipolar GaN layers and devices on sapphire substrates
US11095096B2 (en) 2014-04-16 2021-08-17 Yale University Method for a GaN vertical microcavity surface emitting laser (VCSEL)
CN106233429B (zh) 2014-04-16 2019-06-18 耶鲁大学 获得平坦的半极性氮化镓表面的方法
EP3201952B1 (en) 2014-09-30 2023-03-29 Yale University A method for gan vertical microcavity surface emitting laser
US11018231B2 (en) 2014-12-01 2021-05-25 Yale University Method to make buried, highly conductive p-type III-nitride layers
US10554017B2 (en) 2015-05-19 2020-02-04 Yale University Method and device concerning III-nitride edge emitting laser diode of high confinement factor with lattice matched cladding layer
CN205944139U (zh) 2016-03-30 2017-02-08 首尔伟傲世有限公司 紫外线发光二极管封装件以及包含此的发光二极管模块
CN109564850A (zh) 2016-08-12 2019-04-02 耶鲁大学 通过在生长期间消除氮极性小面而在异质衬底上生长的无堆垛层错的半极性和非极性gan
KR102391610B1 (ko) 2017-08-04 2022-04-28 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지 및 광원 장치
CN114787964A (zh) 2019-10-31 2022-07-22 耶鲁大学 多孔iii族氮化物以及其使用和制造方法
US11592166B2 (en) 2020-05-12 2023-02-28 Feit Electric Company, Inc. Light emitting device having improved illumination and manufacturing flexibility
US11876042B2 (en) 2020-08-03 2024-01-16 Feit Electric Company, Inc. Omnidirectional flexible light emitting device
FR3132593B1 (fr) * 2022-02-08 2025-04-18 Centre Nat Rech Scient Creation d’une fenetre de sortie de rayonnement pour un composant photoemetteur
CN119092616A (zh) * 2024-08-26 2024-12-06 泉州三安半导体科技有限公司 一种发光二极管封装体及发光装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4056415A (en) * 1975-08-04 1977-11-01 International Telephone And Telegraph Corporation Method for providing electrical isolating material in selected regions of a semiconductive material
US4866005A (en) * 1987-10-26 1989-09-12 North Carolina State University Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide
US4946547A (en) * 1989-10-13 1990-08-07 Cree Research, Inc. Method of preparing silicon carbide surfaces for crystal growth
US5200022A (en) * 1990-10-03 1993-04-06 Cree Research, Inc. Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
US5298767A (en) * 1992-10-06 1994-03-29 Kulite Semiconductor Products, Inc. Porous silicon carbide (SiC) semiconductor device
JPH077180A (ja) * 1993-06-16 1995-01-10 Sanyo Electric Co Ltd 発光素子
JPH077179A (ja) 1993-06-16 1995-01-10 Sanyo Electric Co Ltd 発光素子
JPH08148280A (ja) * 1994-04-14 1996-06-07 Toshiba Corp 半導体装置およびその製造方法
DE19548115C2 (de) * 1994-12-27 2002-08-29 Nissan Motor Elektrochemisches Ätzverfahren für ein Halbleitersubstrat sowie Vorrichtung zur Durchführung des Verfahrens
JP3985065B2 (ja) * 1997-05-14 2007-10-03 忠弘 大見 多孔質シリコン基板の形成方法及び多孔質シリコン基板の形成装置
US5939732A (en) * 1997-05-22 1999-08-17 Kulite Semiconductor Products, Inc. Vertical cavity-emitting porous silicon carbide light-emitting diode device and preparation thereof
CN1222641C (zh) * 1998-02-12 2005-10-12 Acm研究公司 电镀设备及方法
US6225647B1 (en) * 1998-07-27 2001-05-01 Kulite Semiconductor Products, Inc. Passivation of porous semiconductors for improved optoelectronic device performance and light-emitting diode based on same
TW465123B (en) * 2000-02-02 2001-11-21 Ind Tech Res Inst High power white light LED
US7319247B2 (en) * 2000-04-26 2008-01-15 Osram Gmbh Light emitting-diode chip and a method for producing same
JP3830083B2 (ja) * 2001-03-07 2006-10-04 スタンレー電気株式会社 半導体装置およびその製造方法
JP4055503B2 (ja) * 2001-07-24 2008-03-05 日亜化学工業株式会社 半導体発光素子
JP3802424B2 (ja) * 2002-01-15 2006-07-26 株式会社東芝 半導体発光素子及びその製造方法
JP3782357B2 (ja) * 2002-01-18 2006-06-07 株式会社東芝 半導体発光素子の製造方法
JP4590905B2 (ja) * 2003-10-31 2010-12-01 豊田合成株式会社 発光素子および発光装置

Also Published As

Publication number Publication date
TW200518355A (en) 2005-06-01
CN1860619A (zh) 2006-11-08
EP1668710B1 (en) 2014-12-24
KR20060090813A (ko) 2006-08-16
US6972438B2 (en) 2005-12-06
US20050184307A1 (en) 2005-08-25
CA2536154A1 (en) 2005-04-14
WO2005034254A1 (en) 2005-04-14
CN100470854C (zh) 2009-03-18
EP1668710A1 (en) 2006-06-14
JP2007507895A (ja) 2007-03-29

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