JP5744015B2 - 基板を電磁妨害から遮蔽するための方法 - Google Patents
基板を電磁妨害から遮蔽するための方法 Download PDFInfo
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- JP5744015B2 JP5744015B2 JP2012515172A JP2012515172A JP5744015B2 JP 5744015 B2 JP5744015 B2 JP 5744015B2 JP 2012515172 A JP2012515172 A JP 2012515172A JP 2012515172 A JP2012515172 A JP 2012515172A JP 5744015 B2 JP5744015 B2 JP 5744015B2
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- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000004671 saturated fatty acids Chemical class 0.000 description 1
- 235000003441 saturated fatty acids Nutrition 0.000 description 1
- 231100000241 scar Toxicity 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 238000007592 spray painting technique Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
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- C08G59/50—Amines
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- H05K9/0073—Shielding materials
- H05K9/0079—Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges
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- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
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Description
SE(dB)=20log(Ei/Et)
本発明のものではない従来からの導電粒子入りの接着剤を、比較の目的で作成および試験した。この材料は、12.7重量%のDGEBF、1.5重量%のジエチレントリアミン、および85.8重量%(40体積%)の上述の種類Aの銀フレークを含んでいた。これらの成分を、Hauschild社のDAC 150 FVミキサで一様になるまで混合した。この材料を、その場で形成されるガスケットまたは接着剤を模擬すべく厚さ40ミルのディスクに成形した。次いで、成形物を1時間にわたって160℃で硬化させた。得られた材料は、充てん材がポリマー母材の全体に均一に位置した典型的な一様な形態を呈した。シート抵抗(Ω/スクエア)は、Bridge Technology社のSRM 4点プローブヘッドを備えたKeithly社の580マルチメータで測定するには高すぎた。上述の方法Iによって試験した遮蔽の有効性(SE)は、2.6GHz〜18GHzの周波数において平均で18デシベルであった。
本発明の自己組織化接着剤を、以下の処方を使用して作成し、すなわち27.8重量%のDGEBF、10.7重量%のアミン付加物硬化剤、および61.5重量%(15体積%)の種類Aの銀フレークを使用して作成した。この材料を、実施例1の手順に従って成形し、硬化させ、試験した。シート抵抗を測定したところ、0.001Ω/スクエア未満であり、SEは、平均で105デシベルであった。実施例1と比べて、この実施例の自己組織化接着材料は、より低い導電粒子の濃度ではるかに優れたSEを示した。
本発明の自己組織化接着フィルムを、25.3重量%のDGEBF、9.7重量%のアミン付加物硬化剤、および65.0重量%(17体積%)の種類Aの銀フレークを使用して作成した。これらの成分を、Hauschild社のDAC 150 FVミキサで一様になるまで混合した。ドローダウンバーを使用し、この材料の厚さ1.5ミルのフィルムを、厚さ0.125インチのG11エポキシ基板からなる非導電性の基板に直接キャストした。次いで、被覆されたこの基板を、1時間にわたって160℃で硬化させた。硬化後のフィルムのシート抵抗は、0.05Ω/スクエアであった。方法Iによって試験したSEは、8GHz〜12GHzの周波数において平均で72デシベルであった。
本発明の導電性部分硬化フィルムを、実施例2に記載の処方を使用して作成した。厚さ3ミルのフィルムを、ドローダウンバーを使用して、Wrightlon 5200という剥離フィルムからなる非導電性の基板にキャストした。被覆されたこの基板を、8分間にわたって90℃で途中まで硬化させ、すなわちB段階とした。これにより、複合材料のレイアップの作業に必要な適度な水準の粘性および柔軟性を呈する材料が得られた。
本発明のペーストのバッチを、36.0重量%のDGEBF、26.8重量%のアミン付加物硬化剤、および50.2重量%(10体積%)の種類Bの銀フレークという処方を使用して作成した。次いで、溶媒ブレンドを、50部の溶媒ブレンドに対して100重量部のペーストという比で、ペーストへと混合した。溶媒ブレンドは、50重量%のアセトン、18重量%のトルエン、16重量%のメチルエチルケトン、11重量%の酢酸エチル、および5重量%のリグロインで構成されている。1重量%未満の流動性調整剤を混合物へと加えた。
本発明のスプレー塗装材料を、溶媒のないペーストが10.3重量%のDGEBF、3.9重量%のアミン付加物硬化剤、および85.8重量%(40体積%)の種類Bの銀フレークを含む点を除き、実施例5で説明したとおりに処方し、適用し、試験した。得られた硬化後のコーティングは、厚さが1.5ミルであり、表面抵抗が0.015Ω/スクエアであった。このコーティングのSEが、図1に示されている。
本発明のスプレー塗装材料を、溶媒のないペーストの処方が実施例2の処方である点を除き、実施例5に記載のとおりに処方して適用した。この塗料混合物を、G11エポキシ基板、PET、ポリカーボネート、および熱可塑性ウレタンを含む種々の非導電性の基板にスプレーでコーティングした。試料を、表1に示した温度で1時間にわたって硬化させた。硬化した導電性コーティングは、すべての試料について厚さ1.5〜2.0ミルであった。コーティング−基板の接着を、3M(商標)#250テープでASTM D3359に従って測定した。シート抵抗を、4点プローブによって測定し、SEを、方法Iによって8GHz〜12GHzの周波数において測定した。最初の試験の後で、試料5AをASTM B−117の87時間の塩水噴霧に暴露し、その後に試料5ACとして再度試験した。すべての結果が、表1に示されている。
本発明の試料一式を、硬化後の自己組織化コーティングのシート抵抗とSEとの間の相関関係を割り出すために製造した。本発明のいくつかのスプレー塗料コーティングを、実施例5に一致したやり方で製造した。本発明のさらなる溶媒なしのフィルムコーティングを、実施例3に従って製造した。すべての試料を、厚さ0.125インチのG11エポキシ基板上に硬化させた。
Claims (24)
- 基板を電磁妨害から遮蔽する方法であって、
基板を用意するステップと、
基板に電磁妨害(EMI)遮蔽組成物を供給するステップと
を含み、
前記EMI遮蔽組成物が、硬化のプロセスにおいて伝導性の経路を形成する不均質構造体へと自己組織化できる被覆された充てん材と硬化性の有機化合物を含み、
前記硬化性の有機化合物は、樹脂と硬化剤を含み、
前記被覆された充てん材は、非極性のコーティングで被覆した充てん材粒子を含み、
前記自己組織化は、前記充てん材粒子の非極性コーティングと前記硬化性の有機化合物間の反発相互作用の結果である、
方法。 - 前記EMI遮蔽組成物が硬化することにより、該組成物を通る伝導性の経路が形成される、請求項1に記載の方法。
- 前記EMI遮蔽組成物が、エポキシ樹脂と、エポキシ硬化剤と、脂肪酸で被覆された伝導性充てん材とを含んでいる、請求項1に記載の方法。
- 前記エポキシ樹脂がビスフェノールFのジグリシジルエーテルを含んでいる、請求項3に記載の方法。
- 前記エポキシ硬化剤が、無水フタル酸とジエチレントリアミンとの間の反応に基づく無水ポリアミン付加化合物を含んでいる、請求項3に記載の方法。
- 前記EMI遮蔽組成物が導電性充てん材を含んでいる、請求項1に記載の方法。
- 前記非極性のコーティングがステアリン酸を含んでいる、請求項1に記載の方法。
- 前記被覆された充てん材を、自己組織化の硬化の後で焼結された伝導性の経路を形成するように焼結することができる、請求項1に記載の方法。
- 前記EMI遮蔽組成物を、所定の線太さおよび所定の開口サイズを備える所定のパターンで前記基板に適用する、請求項1に記載の方法。
- 前記基板に適用された前記EMI遮蔽組成物が光学的に透明である、請求項9に記載の方法。
- 前記EMI遮蔽組成物が、約1MHz〜約40GHzの間で少なくとも20dBの遮蔽効果を有している、請求項1に記載の方法。
- 前記EMI遮蔽組成物が、約1MHz〜約40GHzの間で少なくとも約80dBの遮蔽効果をもたらす、請求項1に記載の方法。
- 前記EMI遮蔽組成物が、40体積パーセント未満の伝導性充てん材を含んでいる、請求項1に記載の方法。
- 前記EMI遮蔽組成物が、15体積パーセント未満の伝導性充てん材を含んでいる、請求項1に記載の方法。
- 前記EMI遮蔽組成物が、電磁パルスからの保護を提供する、請求項1に記載の方法。
- 前記基板が、電子装置を収容する筐体の少なくとも一部分を構成している、請求項1に記載の方法。
- 前記筐体がマイクロ電子回路を備えている、請求項16に記載の方法。
- 前記筐体が車両を構成している、請求項16に記載の方法。
- 前記EMI遮蔽組成物が、自己組織化されて、少なくとも1つの電気装置のための接地への経路を提供する、請求項1に記載の方法。
- 前記EMI遮蔽組成物がスプレーで適用される、請求項1に記載の方法。
- 前記EMI遮蔽組成物が、前記基板への適用に先立ってB段階のフィルムへと形成される、請求項1に記載の方法。
- 前記基板にEMI遮蔽組成物を供給するステップが、
少なくとも1つの不連続な伝導性の経路を含んでいるEMI遮蔽系の損傷した部位を特定するステップと、
EMI遮蔽組成物を前記損傷した部位に補填するステップと、
前記補填した組成物を硬化させることにより、前記損傷した部位の前記少なくとも1つの不連続な伝導性の経路を完成させる少なくとも1つの自己組織化による伝導性の経路を設けるステップと
を含む、請求項1に記載の方法。 - 前記EMI遮蔽系が、伝導性の金属薄板、金属箔、金属メッシュ、カーボン−金属繊維混合織物、金属化カーボン、または充てん用導電ポリマーのうちの少なくとも1つを含む、請求項22に記載の方法。
- 前記EMI遮蔽系が、硬化プロセスにおいて伝導性の経路を形成するように自己組織化できる充てん用の硬化性材料を含む、請求項22に記載の方法。
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US61/186,415 | 2009-06-12 | ||
PCT/US2010/038264 WO2010144770A1 (en) | 2009-06-12 | 2010-06-11 | Method for shielding a substrate from electromagnetic interference |
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JP2012515168A Pending JP2012529978A (ja) | 2009-06-12 | 2010-06-11 | 落雷からの基材の保護方法 |
JP2012515172A Active JP5744015B2 (ja) | 2009-06-12 | 2010-06-11 | 基板を電磁妨害から遮蔽するための方法 |
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CA2675274C (en) * | 2007-01-12 | 2015-10-27 | The Nordam Group, Inc. | Aircraft window erosion shield |
EP2139629B1 (en) * | 2007-03-26 | 2018-09-05 | LORD Corporation | Method for producing heterogeneous composites |
JP2008285115A (ja) * | 2007-05-21 | 2008-11-27 | Mitsubishi Heavy Ind Ltd | 航空機組立品およびその製造方法 |
GB0710425D0 (en) * | 2007-06-01 | 2007-07-11 | Hexcel Composites Ltd | Improved structural adhesive materials |
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US8158045B2 (en) * | 2007-07-20 | 2012-04-17 | Bae Systems Unmanned Aircraft Programs Inc. | Method for manufacturing lightning strike mitigation composites |
WO2009017859A2 (en) * | 2007-08-02 | 2009-02-05 | The Texas A & M University System | Dispersion, alignment and deposition of nanotubes |
US20090104437A1 (en) * | 2007-10-17 | 2009-04-23 | Michael Jeremiah Bortner | Scalable silver nano-particle colloid |
JP5055178B2 (ja) * | 2008-03-24 | 2012-10-24 | 三菱重工業株式会社 | 航空機組立品 |
US8178606B2 (en) * | 2009-02-16 | 2012-05-15 | Cytec Technology Corp. | Co-curable, conductive surfacing films for lightning strike and electromagnetic interference shielding of thermoset composite materials |
US20100315105A1 (en) * | 2009-06-12 | 2010-12-16 | Fornes Timothy D | Method for shielding a substrate from electromagnetic interference |
-
2010
- 2010-06-11 US US12/813,678 patent/US20100315105A1/en not_active Abandoned
- 2010-06-11 WO PCT/US2010/038264 patent/WO2010144770A1/en active Application Filing
- 2010-06-11 JP JP2012515168A patent/JP2012529978A/ja active Pending
- 2010-06-11 CN CN201080025953.3A patent/CN102803405B/zh active Active
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- 2010-06-11 JP JP2012515172A patent/JP5744015B2/ja active Active
- 2010-06-11 KR KR1020127000939A patent/KR20120037464A/ko not_active Application Discontinuation
- 2010-06-11 BR BRPI1010855A patent/BRPI1010855A2/pt not_active IP Right Cessation
- 2010-06-11 KR KR1020127000930A patent/KR20120046164A/ko not_active Application Discontinuation
- 2010-06-11 EP EP10726391.5A patent/EP2440623B1/en active Active
- 2010-06-11 WO PCT/US2010/038250 patent/WO2010144762A1/en active Application Filing
- 2010-06-11 US US12/813,586 patent/US20110014356A1/en not_active Abandoned
- 2010-06-11 CN CN201080025991.9A patent/CN102803406B/zh active Active
- 2010-06-11 EP EP10726389.9A patent/EP2440622B1/en active Active
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Also Published As
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EP2440623A1 (en) | 2012-04-18 |
CN102803405B (zh) | 2016-06-08 |
WO2010144770A1 (en) | 2010-12-16 |
US20110014356A1 (en) | 2011-01-20 |
KR20120037464A (ko) | 2012-04-19 |
JP2012529978A (ja) | 2012-11-29 |
US20160362565A1 (en) | 2016-12-15 |
BR112012000203A2 (pt) | 2016-11-22 |
EP2440623B1 (en) | 2016-10-05 |
KR20120046164A (ko) | 2012-05-09 |
WO2010144762A1 (en) | 2010-12-16 |
BRPI1010855A2 (pt) | 2016-04-05 |
US20170226351A9 (en) | 2017-08-10 |
US20100315105A1 (en) | 2010-12-16 |
EP2440622A1 (en) | 2012-04-18 |
CN102803405A (zh) | 2012-11-28 |
EP2440622B1 (en) | 2016-08-31 |
JP2012530359A (ja) | 2012-11-29 |
BR112012000203B1 (pt) | 2020-01-28 |
CN102803406A (zh) | 2012-11-28 |
CN102803406B (zh) | 2015-10-14 |
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