JP5740901B2 - 発光装置および表示装置 - Google Patents

発光装置および表示装置 Download PDF

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Publication number
JP5740901B2
JP5740901B2 JP2010232752A JP2010232752A JP5740901B2 JP 5740901 B2 JP5740901 B2 JP 5740901B2 JP 2010232752 A JP2010232752 A JP 2010232752A JP 2010232752 A JP2010232752 A JP 2010232752A JP 5740901 B2 JP5740901 B2 JP 5740901B2
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JP
Japan
Prior art keywords
light emitting
emitting elements
column
emitting element
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010232752A
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English (en)
Japanese (ja)
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JP2012089572A5 (enExample
JP2012089572A (ja
Inventor
奥山　浩之
浩之 奥山
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Sony Corp
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Sony Corp
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Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2010232752A priority Critical patent/JP5740901B2/ja
Priority to US13/268,245 priority patent/US9373274B2/en
Publication of JP2012089572A publication Critical patent/JP2012089572A/ja
Publication of JP2012089572A5 publication Critical patent/JP2012089572A5/ja
Application granted granted Critical
Publication of JP5740901B2 publication Critical patent/JP5740901B2/ja
Priority to US15/167,410 priority patent/US9786638B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N9/00—Details of colour television systems
    • H04N9/12—Picture reproducers
    • H04N9/30—Picture reproducers using solid-state colour display devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2010232752A 2010-10-15 2010-10-15 発光装置および表示装置 Expired - Fee Related JP5740901B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010232752A JP5740901B2 (ja) 2010-10-15 2010-10-15 発光装置および表示装置
US13/268,245 US9373274B2 (en) 2010-10-15 2011-10-07 Light-emitting device and display device
US15/167,410 US9786638B2 (en) 2010-10-15 2016-05-27 Light-emitting device and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010232752A JP5740901B2 (ja) 2010-10-15 2010-10-15 発光装置および表示装置

Publications (3)

Publication Number Publication Date
JP2012089572A JP2012089572A (ja) 2012-05-10
JP2012089572A5 JP2012089572A5 (enExample) 2013-11-14
JP5740901B2 true JP5740901B2 (ja) 2015-07-01

Family

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JP2010232752A Expired - Fee Related JP5740901B2 (ja) 2010-10-15 2010-10-15 発光装置および表示装置

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US (2) US9373274B2 (enExample)
JP (1) JP5740901B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12009452B2 (en) 2018-07-23 2024-06-11 Samsung Electronics Co., Ltd. Electronic device including LED transmission device, and control method therefor

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JP5845557B2 (ja) 2010-03-30 2016-01-20 ソニー株式会社 半導体発光素子の製造方法
JP5740901B2 (ja) 2010-10-15 2015-07-01 ソニー株式会社 発光装置および表示装置
US9356070B2 (en) 2012-08-15 2016-05-31 Epistar Corporation Light-emitting device
TWI457890B (zh) * 2012-08-17 2014-10-21 聚積科技股份有限公司 Display structure and display
KR101452768B1 (ko) 2012-08-21 2014-10-21 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
KR101730075B1 (ko) * 2013-03-15 2017-04-25 애플 인크. 리던던시 스킴을 갖춘 발광 다이오드 디스플레이 및 통합 결함 검출 테스트를 갖는 발광 다이오드 디스플레이를 제작하는 방법
US9252375B2 (en) 2013-03-15 2016-02-02 LuxVue Technology Corporation Method of fabricating a light emitting diode display with integrated defect detection test
DE102013104046A1 (de) * 2013-04-22 2014-10-23 Osram Opto Semiconductors Gmbh Optische Anordnung und Anzeigegerät
US9111464B2 (en) * 2013-06-18 2015-08-18 LuxVue Technology Corporation LED display with wavelength conversion layer
JP2015092529A (ja) * 2013-10-01 2015-05-14 ソニー株式会社 発光装置、発光ユニット、表示装置、電子機器、および発光素子
US9450147B2 (en) * 2013-12-27 2016-09-20 Apple Inc. LED with internally confined current injection area
JP6328497B2 (ja) * 2014-06-17 2018-05-23 ソニーセミコンダクタソリューションズ株式会社 半導体発光素子、パッケージ素子、および発光パネル装置
US9633883B2 (en) 2015-03-20 2017-04-25 Rohinni, LLC Apparatus for transfer of semiconductor devices
CN105552190B (zh) * 2015-04-30 2018-10-09 美科米尚技术有限公司 微型发光二极管
CN105405943A (zh) * 2015-05-21 2016-03-16 美科米尚技术有限公司 微型发光二极管
KR102377794B1 (ko) * 2015-07-06 2022-03-23 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
KR102396325B1 (ko) * 2015-10-12 2022-05-13 삼성전자주식회사 엘이디 디스플레이 장치의 광학 부재 및 엘이디 디스플레이 장치
CN106097900B (zh) * 2016-06-22 2019-04-30 深圳市华星光电技术有限公司 微发光二极管显示面板
TWI589023B (zh) * 2016-06-27 2017-06-21 國立暨南國際大學 半導體裝置用基材及使用其之半導體裝置
US10356858B2 (en) * 2016-09-26 2019-07-16 Prilit Optronics, Inc. MicroLED display panel
US10529701B2 (en) * 2016-09-26 2020-01-07 Prilit Optronics, Inc. MicroLED display panel
US10141215B2 (en) 2016-11-03 2018-11-27 Rohinni, LLC Compliant needle for direct transfer of semiconductor devices
JP6298962B1 (ja) * 2016-11-21 2018-03-28 台湾▲ロ▼旦股▲分▼有限公司 チップの固定方法
US10504767B2 (en) 2016-11-23 2019-12-10 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
US10471545B2 (en) 2016-11-23 2019-11-12 Rohinni, LLC Top-side laser for direct transfer of semiconductor devices
KR102415243B1 (ko) * 2017-09-19 2022-06-30 엘지이노텍 주식회사 반도체 모듈 및 이를 포함하는 표시 장치
JP6411685B1 (ja) * 2017-10-12 2018-10-24 ルーメンス カンパニー リミテッド ディスプレイ用ｌｅｄモジュール組立体
KR102419272B1 (ko) * 2017-12-19 2022-07-11 엘지디스플레이 주식회사 발광 사운드 소자, 사운드 출력 장치 및 디스플레이 장치
KR101953797B1 (ko) * 2017-12-26 2019-03-04 엘지디스플레이 주식회사 마이크로led 표시장치 제조방법
JP7157331B2 (ja) * 2017-12-27 2022-10-20 日亜化学工業株式会社 発光装置
US11037911B2 (en) 2017-12-27 2021-06-15 Nichia Corporation Light emitting device
US10593852B2 (en) * 2018-06-20 2020-03-17 Innolux Corporation Display device having a plurality of main pads, a plurality of redundant pads, and a light-emitting device
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KR102558857B1 (ko) 2018-11-16 2023-07-25 삼성전자주식회사 디스플레이 모듈 및 이를 이용한 대형 디스플레이 장치
KR102653341B1 (ko) 2018-11-16 2024-04-02 삼성전자주식회사 마스크를 포함하는 마이크로 led 전사 장치 및 이를 이용한 마이크로 led 전사 방법
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WO2020167401A1 (en) * 2019-02-12 2020-08-20 Corning Incorporated Uniformizing an array of leds having asymmetric optical characteristics
KR102801393B1 (ko) 2019-03-27 2025-04-30 삼성전자주식회사 마이크로 led 전사 장치 및 이를 이용한 마이크로 led 전사 방법
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KR102755912B1 (ko) 2019-07-12 2025-01-17 삼성전자주식회사 Led 전사 방법 및 이에 의해 제조된 디스플레이 모듈
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Publication number Priority date Publication date Assignee Title
US12009452B2 (en) 2018-07-23 2024-06-11 Samsung Electronics Co., Ltd. Electronic device including LED transmission device, and control method therefor

Also Published As

Publication number Publication date
US20120092389A1 (en) 2012-04-19
JP2012089572A (ja) 2012-05-10
US9786638B2 (en) 2017-10-10
US20160276323A1 (en) 2016-09-22
US9373274B2 (en) 2016-06-21

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