JP5737953B2 - Component mounting equipment - Google Patents

Description

  The present invention relates to a component mounting apparatus that picks up a component from a component supply device by a component mounting head and mounts the component on a mounting point on a substrate positioned at a component mounting position.

  For example, Patent Document 1 describes an electrical circuit assembly method using the following component mounting apparatus. This method is a method of mounting by comparing the number of component mounting points in one whole substrate or at least one mounting region (hereinafter referred to as mounting range) with the remaining number of components wound and stored on a reel. . According to this method, by storing components having substantially the same characteristics in a tape wound around a reel, the characteristics of the components (for example, the luminance class of the light emitting diode) are substantially the same in each mounting range. The components can be mounted so that

  For example, Patent Document 2 describes an electronic component mounting method using the following component mounting apparatus. In this method, the mounting data is divided into a plurality of mounting ranges (component mounting groups), and mounting in the next block is not started until mounting in the current mounting range is completed. According to this method, since the component mounted in the current mounting range and the component mounted in the next mounting range are not mixed, it is possible to mount the components so that the characteristics of the components are substantially the same in each mounting range. it can.

Japanese Patent Application No. 2009-180239 (paragraph numbers 0039 to 0043, FIG. 13) Japanese Patent No. 3043492 (paragraph number 0012, FIG. 1)

  As a component supply device that supplies components to a component mounting device, there is a device that supplies components in a wafer state. This wafer has a large number of identical parts formed on the entire surface, and is cut for each part. The wafer is placed on a tray accommodated in the component supply device, and the tray is pulled out into the component mounting device, whereby a plurality of wafer cut components are supplied in a wafer state. However, wafer cut parts located in spaced positions in the wafer often have some variation in characteristics. In the component mounting apparatuses described in the above-mentioned Patent Documents 1 and 2, the wafer cut parts within each mounting range. In some cases, the wafer cut component is mounted in a state where the above characteristics vary.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a component mounting apparatus capable of mounting a wafer cut component so that the characteristics of the wafer cut component are substantially the same within a predetermined mounting range. There is to do.

In order to solve the above problem, the structural feature of the invention according to claim 1 is that a component mounting head picks up a component from a component supply device and mounts it on a mounting point on a board positioned at the component mounting position. In the apparatus, the plurality of wafer cut parts which are cut into a plurality of wafer cut parts and supplied to the part supply position in the wafer state are collected in the order of wafer cut parts having a small characteristic change by continuously positioning the parts mounted. Wafer cut component mounting means for causing the component mounting apparatus to perform control for mounting to the mounting point on the substrate positioned at a position, and suppressing characteristic variation between components of the same component type to be mounted within a predetermined range. each is required range, sets a plurality of blocks partitioning the substrate, at least a predetermined acceptable components as information of the information and said block of said substrate The distance and the block storage unit that associates and stores the information including a predetermined allowable number of pitches, acquires information of the block based on the component the information of the substrate positioned on the mounting position, taken in the wafer cutting part the abnormality or occurrence of a recovery of the part taken for abnormality of the wafer cut part, said distance position on the supply wafer between the parts to be mounted to the block exceeds the distance between the allowable component or pitch number of the allowable pitch When it is determined that the number exceeds the number, a wafer cut component mounting availability determination unit that determines that mounting on the block is impossible is provided.

The invention according to claim 2 is characterized in that a component mounting head picks up a component from a component supply device and mounts it on a mounting point on a substrate positioned at a component mounting position, and cuts into a plurality of wafer cut components. The plurality of wafer-cut components supplied to the component supply position in the wafer state are collected in order of wafer cut components having a small characteristic change by being continuously positioned and positioned on the substrate at the component mounting position. The wafer cutting component mounting means for causing the component mounting apparatus to perform mounting control on the mounting point, and the substrate for each range where it is necessary to suppress the characteristic variation between components of the same component type to be mounted within a predetermined range. setting a plurality of blocks partitioning, serial in association with information including at least a predetermined recovery allowable number as information of the information and said block of said substrate A block storage unit to said component mounting position on the acquired information of the block based on the positioning information of said substrate, said collecting abnormal or the wafer of the wafer cut parts in the mounting of the wafer cut parts to the block If the recovery times of components collected for abnormal cut parts exceeds the recovery allowable number, by which and a wafer cut component mounting determination unit to skip it is determined that the attachment is not to the block is there.

According to a third aspect of the present invention, in the second aspect of the present invention, the wafer cut component mounting availability determination unit is configured to determine whether the remaining number of the wafer cut components is included in the block and the number of the recovery points. If it is less than the sum of the numbers, it is determined that the mounting on the block is impossible.

According to a fourth aspect of the present invention, in the second or third aspect , the wafer cut component mounting availability determination unit is configured to determine whether the remaining number of the wafer cut components is included in the current block and the number of the mounting points. If it is less than the sum of the allowable recovery number but greater than or equal to the sum of the number of mounting points included in the next block and the allowable recovery number, the mounting to the next block is more than the mounting to the current block. It is a priority.

  A structural feature of the invention according to claim 5 is that, in any one of claims 1 to 4, when the substrate is a substrate composed of a plurality of sub-substrates of the same substrate type, the plurality of blocks are: It is set in each of the sub-boards, and when the wafer-cut component mounting availability determination means determines that mounting of the wafer-cut components in one block is impossible, the sub-board including the block Skipping the mounting of the wafer-cut component onto the substrate.

  According to the first aspect of the present invention, the wafer cut component mounting means performs control for collecting the wafer cut components in order of components having a small characteristic change by continuously positioning and mounting the wafer cut components on the mounting points on the substrate. Generally, since the characteristics of wafer cut parts have some continuity between adjacent wafer cut parts, the wafer cut parts can be mounted so that the characteristics of the wafer cut parts are substantially the same by the above-described control.

  The block storage means stores a plurality of blocks that divide the substrate for each range in which it is necessary to suppress the characteristic variation between components of the same component type to be mounted within a predetermined range. Then, the wafer cut component mounting availability determination means determines that the component distance on the supply wafer exceeds a predetermined allowable component distance or the number of pitches due to the occurrence of component sampling abnormality or recovery of component sampling for the component abnormality. If the predetermined allowable number of pitches is exceeded, it is determined that mounting on the block is impossible. In general, wafer cut parts located at a distance in the wafer often have some characteristic variation. However, according to the present invention, the wafer cut parts are in a state where the characteristics of the wafer cut parts vary in each block. It is possible to efficiently prevent the wafer from being mounted and to efficiently mount the wafer cut component on a plurality of mounting points on the substrate.

  According to the second aspect of the present invention, the wafer cut component mounting availability determination unit determines whether or not the part collection abnormality or the number of times of recovery of the component sampling for the component abnormality exceeds a predetermined allowable number of recovery in mounting the wafer cut component on the block. In this case, it is determined that mounting on the block is impossible, and skipped. In general, wafer cut parts located at a distance in the wafer often have some characteristic variation. However, according to the present invention, the wafer cut parts are in a state where the characteristics of the wafer cut parts vary in each block. It is possible to efficiently mount the wafer-cut component to a plurality of mounting points on the substrate.

  According to the third aspect of the present invention, the wafer cut component mountability determination unit determines that the remaining number of wafer cut components is less than the sum of the number of mounting points included in the block and the allowable recovery number. It is judged that wearing is impossible. In general, there are many variations in characteristics of wafer cut parts on different wafers, but according to the present invention, it is efficient to mount the wafer cut parts in a state where the characteristics of the wafer cut parts vary in each block. Therefore, the wafer cut component can be efficiently mounted on a plurality of mounting points on the substrate.

  According to the fourth aspect of the present invention, the wafer cut component mounting availability determination means has the remaining number of wafer cut components less than the sum of the number of mounting points in the current block and the allowable number of recovery, but the number of mounting points in the next block. If it is equal to or greater than the sum of the number and the allowable number of recovery, control is performed to attach to the next block. Therefore, waste of the wafer cut component can be prevented, and the manufacturing cost of the substrate on which the wafer cut component is mounted can be reduced.

  According to the invention according to claim 5, when the block is set in each child substrate, the wafer cutting component mounting availability determination means determines that mounting of the wafer cutting component in one block is impossible. The mounting of the wafer cut component on the sub-board including the block is skipped. Therefore, since the wafer cut parts are not attached to other blocks on the sub-board that is clearly defective, it is possible to prevent a lot of wafer cut parts from being wasted and to reduce the mounting cost. Can be made.

1 is a perspective view showing an embodiment of a component mounting apparatus according to the present invention. It is a side view which shows the component supply apparatus of the component mounting apparatus of FIG. (A), (B) shows a substrate of a substrate type consisting of a single substrate and a plurality of sub-substrates of the same substrate type that are conveyed by the substrate conveying device of FIG. FIG. It is a top view which shows the wafer cut components supplied with the wafer state by the components supply apparatus of FIG. (A), (B) is a figure which shows the process in the case of extract | collecting the wafer cut components of FIG. 4 in zigzag form, and the process in the case of extract | collecting helically. It is a figure which shows the block set to the board | substrate of FIG. 3 (A). It is a figure which shows the table data with which the information of the board | substrate and the information of the block were linked | related. It is a figure which shows the order in the case of extract | collecting the wafer cut components of FIG. 4 in zigzag form. 3 is a flowchart for explaining the operation of the component mounting apparatus of FIG. 1. 6 is a flowchart for explaining another operation of the component mounting apparatus of FIG. 1.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the substrate transport direction is referred to as the X-axis direction, the direction perpendicular to the X-axis direction in the horizontal plane is referred to as the Y-axis direction, and the direction perpendicular to the X-axis direction and the Y-axis direction is referred to as the Z-axis. It is called a direction. As shown in FIG. 1, the component mounting apparatus 10 includes a component supply device 20, a component mounting device 30, and a control device 1 (corresponding to “wafer cut component mounting control means” of the present invention), and 2 in the X-axis direction. The units are arranged in series and connected by the substrate transfer device 50. Although FIG. 1 shows a case where two component mounting apparatuses 10 are arranged, the present invention can be applied to one or a plurality of component mounting apparatuses 10.

  As shown in FIG. 2, the component supply device 20 includes a housing 21, and the housing 21 is movably supported by a support portion 22 having casters 22 a and wheels 22 b. In the housing 21, a tray stocker 23 in which a pallet R on which a tray T for accommodating the wafer cut component P in a wafer state (see FIG. 4) is attached is detachably accommodated is provided so as to be movable up and down.

  A tray carrying-in device 24 for carrying in a pallet R with a new tray T attached is provided at the upper part of the housing 21, and a tray for discharging the pallet R with an empty tray T attached at the lower part of the housing 21. A discharge device 25 is provided. In addition, a tray moving device 26 that moves the pallet R on which the tray T is attached between the tray stocker 23 and the component supply position A is provided at the front portion of the housing 21 on the component mounting apparatus 10 side.

  In the component supply device 20, when the tray T in which the wafer cut components P are accommodated in the wafer state is attached to the pallet R and is loaded into the tray carry-in device 24, the tray stocker 25 is lifted and the tray T is moved together with the pallet R. It is transferred to the temporary storage stage which is the uppermost stage of the tray stocker 25. Then, the tray stocker 25 is lowered, the tray T is positioned at the height of the component supply position A, and the tray T is pulled together with the pallet R from the temporary storage stage of the tray stocker 25 to the component supply position A.

  Then, the tray stocker 25 is raised and the predetermined storage stage is positioned at the height of the component supply position A, and the tray T is stored in the predetermined storage stage of the tray stocker 25 from the component supply position A together with the pallet R by the tray moving device 26. Is done. In the same manner, the tray T in which the wafer cut parts P are stored in a wafer state is stored together with the pallet R in each storage stage of the tray stocker 25. Then, the wafer cut component P on the tray T pulled out from the tray stocker 25 to the component supply position A at the time of component mounting is sucked by a suction nozzle 39 of a component mounting device 30 to be described later, and the substrate transport device 50 mounts the component. It is mounted on the substrate S (see FIG. 1) positioned at the position.

  As shown in FIG. 1, the component mounting device 30 includes an XY robot. The XY robot is mounted on a base 31 and is disposed above the substrate transfer device 50 and the component supply device 20. Is provided with a Y-axis slide 33 that can move in the Y-axis direction. The Y-axis slide 33 is moved in the Y-axis direction by a ball screw mechanism having a ball screw connected to the output shaft of the Y-axis servomotor 34. An X-axis slide 35 is guided by the Y-axis slide 33 so as to be movable in the X-axis direction orthogonal to the Y-axis direction. An X-axis servomotor 36 is installed on the Y-axis slide 33, and an unillustrated ball screw rotatably connected to the output shaft of the X-axis servomotor 36 and rotatably supported by the Y-axis slide 33 is attached to the X-axis slide 35. The X-axis slide 35 is moved in the X-axis direction by screwing with the fixed ball nut.

  On the X-axis slide 35, a component mounting head 36 is provided. As shown in FIG. 2, the component mounting head 36 holds a board recognition camera 37 and a rotating body 38 that can rotate about the Z axis. The rotating body 38 includes a plurality of nozzle holders 40 that are movable in the Z-axis direction that detachably hold the suction nozzle 39 that sucks the wafer-cut component P, and that are equiangularly spaced on the circumference of the rotation axis. (For example, 12) are provided. Further, as shown in FIG. 1, a component recognition camera 41 is fixed on the base 31. The component mounting head 36 having one suction nozzle 39 may be used.

  In the component mounting apparatus 30, the substrate mark provided on the substrate S positioned at the component mounting position is detected by the substrate recognition camera 37. Then, the position of the component mounting head 36 is corrected in the XY directions based on the position of the board mark. Further, the wafer cut component P sucked by the suction nozzle 39 is captured by the component recognition camera 41 while moving from the component supply position A of the component supply apparatus 20 to a predetermined position on the substrate S, and the center of the suction nozzle 39 is captured. A misalignment of the wafer-cut component P with respect to is detected. Based on this misalignment or the like, the movement amount of the component mounting head 36 in the XY direction or the like is corrected. As a result, the wafer cut part P is accurately mounted at a predetermined coordinate position on the substrate S.

  As shown in FIG. 1, the board | substrate conveyance apparatus 50 consists of a thing of the double conveyor type which arranged two conveyance apparatuses 51 and 52 in parallel as an example. The conveying devices 51 and 52 are respectively guided in parallel by a pair of guide rails 53a and 53b facing each other in parallel on the base 31 of the component mounting device 30, respectively. A pair of unillustrated conveyor belts that support and transport the substrate S are arranged in parallel so as to face each other. In addition, the substrate transport device 50 is provided with an unillustrated clamp device that lifts and clamps the substrate S transported to a predetermined position.

  In this substrate transport apparatus 50, the substrate S on which the wafer cut component P is mounted is transported to the component mounting position in the X-axis direction by the conveyor belt while being guided by the guide rails 53a and 53b. The substrate S transported to the component mounting position is positioned and clamped at the component mounting position by a clamp device.

  As the substrate S that is transported by the substrate transport device 50 and mounted by the component mounting device 10, for example, as shown in FIG. 3A, the substrate S of a single substrate type Ss, or FIG. As shown in FIG. 4, there is a substrate S of a substrate type St composed of a plurality of sub-substrates Stt of the same substrate type. Each substrate S (St) is mounted with each wafer cut component P in a single state, and then divided into each sub-substrate Stt. As the wafer cut component P to be mounted on the substrate S (St) made of the substrate S (Ss) or the child substrate Stt by the component mounting apparatus 30, for example, the wafer cut component P whose mounting component type is Pa and the mounting component type is Pb. There are wafer cut parts P and the like. For example, as shown in FIG. 4, a number of wafer cut parts P (Pa or Pb) are formed in a lattice (illustration spots) on the entire surface of a wafer U made of silicon or the like, and the wafer cut parts P are cut into individual parts. It is supplied by the component supply device 20 in a state.

  The wafer cut component mounting part of the control device 1 collects a plurality of wafer cut components P supplied to the component supply position A in succession and collects them in the order of wafer cut components with small characteristic changes and positions them at the component mounting position. The mounting control is performed on the mounting point on the substrate S. For example, as shown in the arrow in FIG. 5A, the part collecting step sequentially collects the wafer cut parts P from the left end of the uppermost stage of the wafer U in the right direction and reaches the right end of the uppermost stage. The wafer cut parts P are sequentially collected from the right end to the left and moved to the left end when the left end is reached, and the wafer cut parts P are sequentially collected from the left end to the right in a zigzag shape. There is a step of sequentially collecting cut parts P.

  Further, as another part collecting step, for example, there is a step of sequentially collecting the wafer cut parts P in a spiral manner from the outermost periphery to the inner periphery of the wafer U as indicated by an arrow in FIG. The operator stores a part collection process program in a storage unit of a general control device (not shown). Generally, since the characteristics of the wafer cut parts P are somewhat continuous between adjacent wafer cut parts P, the characteristics of the wafer cut parts P are substantially the same according to the above-described sampling process of the wafer cut parts P. Thus, the wafer cut component P can be mounted on the substrate S.

  Further, the operator sets a plurality of blocks that divide the substrate S for each range in which it is necessary to suppress the characteristic variation between the wafer cut components P of the same component type to be mounted on the substrate S within a predetermined range. . And the table data which linked | related the information of the board | substrate S and the information of a block is produced previously, and it memorize | stores in the block memory | storage part of the control apparatus 1. FIG. Specific examples of the block include a series of circuits composed of wafer-cut components P having uniform characteristics or mutually related circuits, or a sub-substrate in a multi-piece substrate in which a large number of sub-substrates are assembled.

  For example, as shown in FIG. 6, on a substrate S (Ss), a range including a mounting point e on which m wafer cut parts P (Pa) are mounted is set as a block B (E), and n wafers are set. A range including the mounting point f where the cut part P (Pa) is mounted is set as a block B (F), and a range including the mounting point g where the o wafer cut parts P (Pb) are mounted is set as a block B ( G). For example, as shown in FIG. 7, as the information of the substrate S, the substrate type Ss and the child substrate (the substrate type Ss is not a child substrate, “−” is displayed) and the like, and the information of the block B is the block type E. , F, G, number of mounting points m, n, o, mounting component types Pa, Pa, Pb, allowable recovery number s, t, u and allowable component distances v, w, x, etc. are created. And stored in the block storage unit of the control device 1.

Here, the recovery allowable number is a predetermined allowable value that takes into account the recovery of sampling of the wafer-cut component P or the recovery of component with respect to the abnormality of the wafer-cut component P. Further, the allowable inter-component distance is an allowable value of the distance between the positions of the components mounted in the block B on the supply wafer, and is expressed by the following formula (1).
Allowable part distance = (distance between adjacent wafer cut parts P on the supply wafer)
X (number of mounting points in block B + allowable number of recovery-1) (1)

In addition, it is good also as an allowable pitch number instead of the distance between allowable components. This allowable pitch number is an allowable value of the pitch number on the supply wafer between components mounted in the block B, and is expressed by the following equation (2).
Permissible pitch number = number of mounting points in block B + recovery permissible number−1 (2)

  The block types E, F, and G in the table data D are arranged in the mounting order, but are not limited to this mounting order. After the wafer cutting parts P (Pa) are continuously mounted, the wafer cutting parts P are arranged. The order in which (Pb) is continuously mounted may be used, or the order in which the wafer cut parts P (Pa) and the wafer cut parts P (Pb) are alternately mounted may be used.

  The wafer cutting component mounting availability determination unit of the control device 1 performs the following process when the wafer cutting component P sampling abnormality or the component sampling recovery for the wafer cutting component P abnormality occurs. That is, if it is determined that the distance between the positions of the parts mounted on the block B on the supply wafer exceeds the predetermined allowable distance between the parts, or the pitch number exceeds the predetermined allowable pitch number, the process proceeds to the block B. Control is performed to determine that mounting is impossible. Alternatively, control is performed to determine that mounting on the block B is impossible even when the number of parts collection recovery times exceeds a predetermined allowable recovery number. In general, the wafer cut part P located at a distance in the wafer U often has some variation in characteristics, but according to the control method described above, the characteristics of the wafer cut part P vary within each block B. In this state, it is possible to efficiently prevent the wafer cut component P from being mounted and to efficiently mount the wafer cut component P on a plurality of mounting points on the substrate S.

  For example, assuming that the number m of mounting points g of the mounting points g of the block B (G) set on the substrate S (Ss) shown in FIG. 6 is 3, the margin number s in the block B (G) is set to two. Think about the case. In this case, if the distance between adjacent wafer cut parts P in the wafer U shown in FIG. 8 is d, the allowable part distance is 4d according to the equation (1). The allowable pitch number is 4. Therefore, for example, no. No. 1 in which the distance between the allowable parts from the wafer cut part P (Pb) 1 is within 4y or the allowable pitch number is within 4. It is necessary to complete the mounting of the block B (G) to the five mounting points g with the wafer cutting parts P (Pb) up to 5, and when this mounting is impossible, the wafer cutting parts P (in the block B (G) It is determined that the mounting of Pb) is impossible.

  Further, the wafer cutting component mounting availability determination unit of the control device 1 determines that the remaining number of wafer cutting components P supplied in the wafer state is less than the sum of the mounting points included in the block B and the recovery allowable number. Control is performed to determine that mounting on the block B is impossible. In general, the wafer cut parts P in different wafers U often have variations in characteristics. However, according to the control method described above, the wafer cut parts P are in a state in which the characteristics of the wafer cut parts P vary in each block B. It is possible to efficiently prevent the P from being mounted and to efficiently mount the wafer cut component P at a plurality of mounting points on the substrate S.

  For example, the number m of mounting points e of the mounting points e of the block B (E) set on the substrate S (Ss) shown in FIG. 6 is five, and the margin number s in the block B (E) is set to three. Think about the case. In this case, when there are less than eight wafer cut parts P supplied in the wafer state, it is determined that mounting on the block B (E) is impossible.

  Next, regarding the operation of mounting the wafer cutting component P in the block B of the substrate S by the control device 1, the flowchart shown in FIG. 9, the diagram showing the block B set on the substrate S in FIG. 6, and the table in FIG. This will be described with reference to data D. The control device 1 acquires information on the board S to be mounted (board type Ss and child board) from the overall control device (step 1), and information on the block B of the board type Ss (block types E, F, G). , The number of mounting points m, n, o, the mounting component types Pa, Pa, Pb, the allowable recovery numbers s, t, u and the allowable inter-component distances v, w, x) are acquired (step 2).

  The control device 1 determines the number of remaining wafer cut parts P (Pa) to be mounted in the current block B (E) to be mounted first, that is, the wafer cut parts in the tray T drawn to the part supply position A. The remaining number of parts of P (Pa) is read (step 3), and the read number of remaining parts is less than the sum of the number of mounting points (m) in the current block B (E) and the allowable number of recovery (s). (Step 4). When it is determined that the read remaining component number is equal to or greater than the sum of the number of mounting points (m) in the current block B (E) and the allowable recovery number (s), it is drawn to the component supply position A. A predetermined wafer cut part P (Pa) of the wafer U, for example, No. shown in FIG. The suction nozzle 39 is positioned on one wafer cut part P (Pa), and the wafer cut part P (Pa) is collected by the suction nozzle 39. Then, “1” is added to the number y of parts collection (step 5).

  The control device 1 picks up and inspects the collected wafer cut part P (Pa) with the part recognition camera 41 (step 6), and determines whether the inspection result of the collected wafer cut part P (Pa) is good. Is determined (step 7). When it is determined that the inspection result of the collected wafer cut part P (Pa) is good, the collected wafer cut part P (Pa) is mounted on the mounting point (e) in the current block B (E). (Step 8), it is determined whether or not component mounting in the current block B (E) is completed (Step 9).

  When the control device 1 determines that the component mounting in the current block B (E) is not yet completed, the controller 1 collects the suction nozzle 39 previously. No. 1 adjacent to the wafer cut part P (Pa). The suction nozzle 39 is positioned on the second wafer cut part P (Pa) (step 13). Then, returning to step 5, the wafer cut component P (Pa) is sampled by the suction nozzle 39, and "1" is added to the component sampling frequency y, and the processing from step 6 is executed.

  On the other hand, when the control device 1 determines in step 9 that the component mounting in the current block B (E) has been completed, it is determined whether or not the component mounting of all the blocks B has been completed on the board S (Ss). Judgment is made (step 14), and if the component mounting of all the blocks B has not been completed, the process returns to step 3 and the above-described processing is executed. .

  On the other hand, when it is determined in step 7 that the inspection result of the collected wafer cut part P (Pa) is defective, the control apparatus 1 discards the wafer cut part P (Pa) (step 10). Then, the distance d between adjacent wafer cut parts P (Pa) on the wafer U is added to the value obtained by subtracting “1” from the number of parts collected y, and the wafer cut mounted in the block B (E) is added. The distance between the positions of the parts P (Pa) on the wafer U is obtained (step 11). Then, it is determined whether or not the obtained distance exceeds a predetermined allowable component distance (v) (step 12).

  When the control device 1 determines that the obtained distance does not exceed the predetermined allowable inter-component distance (v), the No. No. 1 adjacent to the wafer cut part P (Pa). The suction nozzle 39 is positioned on the second wafer cut part P (Pa) (step 13), the process returns to step 5 and the wafer cut part P (Pa) is sampled by the suction nozzle 39, and the processing after step 6 is executed. To do. Since the component mounting apparatus 10 of the present embodiment includes a plurality of suction nozzles 39, the wafer cut component P is the sum of the number of mounting points (m) and the number of margins (s) included in the current block B (E). (Pa) can be collected at a time, and the component mounting control time including recovery in the current block B (E) can be greatly shortened.

  On the other hand, when it is determined in step 12 that the obtained distance exceeds the predetermined allowable inter-component distance (v), it is determined that component mounting in the current block B (E) is impossible (step 15). . Then, the component collection count y is reset (step 16), and it is determined whether or not the mounting of all the blocks B on the board S (Ss) is completed (step 14), and the mounting of all the blocks B is completed. If not, the process returns to step 3 to execute the above-described processing. If the component mounting of all the blocks B has been completed, the mounting processing is stopped.

  On the other hand, when the controller 1 determines in step 4 that the remaining number of parts read is less than the sum of the number of mounting points (m) in the current block B (E) and the allowable recovery number (s), It is determined whether or not there is a next block B on which the same wafer cut part P (Pa) as the wafer cut part P (Pa) to be attached to the current block B (E) is attached (step 17). If it is determined, it is determined whether or not the number of remaining parts read in step 3 is less than the sum of the number of mounting points (n) of the next block B (F) and the allowable recovery number (t) (step 18). . When it is determined that the remaining number of parts is equal to or greater than the sum of the number of mounting points (n) of the next block B (F) and the allowable number of recovery (t), mounting in the next block B (F) In order to execute with priority over the mounting in (E), the process proceeds to step 5 to execute the above-described processing.

  On the other hand, the controller 1 determines in step 17 that there is no next block B in which the same wafer cut component P (Pa) as the wafer cut component P (Pa) mounted in the current block B (E) is mounted. When it is determined in step 18 that the number of remaining parts is less than the sum of the number of mounting points (n) of the next block B (F) and the allowable number of recovery (t), the board S (Ss to be mounted) ) Is a substrate S (St) made of the child substrate Stt (step 19), and when it is judged that the substrate S (Ss) to be mounted is not the substrate S (St) made of the child substrate Stt It is determined that component mounting of the board S (Ss) is impossible (step 20), and the mounting process is stopped.

  On the other hand, when the control device 1 determines in step 19 that the substrate S to be mounted is the substrate S (St) that is the child substrate Stt, it determines that component mounting of the child substrate Stt is impossible (step S1). 21). Then, the presence or absence of the next child substrate Stt in the substrate S (St) is confirmed (step 22). If it is determined that there is the next child substrate Stt, the process returns to step 3 to block B of the next child substrate Stt. The remaining number of parts of the wafer cut part P to be mounted on is read, and the processes after step 4 are executed. On the other hand, when it is determined in step 22 that there is no next child board Stt, the mounting process is stopped.

  As described above, according to the component mounting apparatus 10 of the present embodiment, in step 13 of FIG. 9 and the like, the wafer cut component mounting unit of the control device 1 has the characteristic that the wafer cut component P is continuously positioned. Control is performed so that components with the smallest change are collected in order and mounted on the mounting points on the substrate S. In general, since the characteristics of the wafer cut parts P are somewhat continuous between adjacent wafer cut parts P, the wafer cut parts P are mounted so that the characteristics of the wafer cut parts P are substantially the same by the control described above. be able to.

  Further, the block storage unit of the control device 1 stores a plurality of blocks that divide the substrate for each range in which it is necessary to suppress the characteristic variation between components of the same component type to be mounted within a predetermined range. . Then, in step 12 of FIG. 9 or the like, the wafer cutting component mounting availability determination unit of the control device 1 determines the distance between the positions of the components on the supply wafer U due to the occurrence of component sampling abnormality or recovery of component sampling for the component abnormality. If the distance between the predetermined allowable parts is exceeded or the number of pitches exceeds the predetermined allowable number of pitches, it is determined that mounting on the block B is impossible. In general, the wafer cut parts P located at positions separated in the wafer U often have some characteristic variation. However, according to the control method described above, the characteristics of the wafer cut parts P in each block B are different. The wafer cut component P can be efficiently mounted on a plurality of mounting points on the substrate S by efficiently preventing the wafer cut component P from being mounted in a dispersed state.

  In step 4 in FIG. 9 and the like, the wafer cut component mounting availability determination unit of the control device 1 has a remaining number of wafer cut components P that is less than the sum of the number of mounting points included in the block B and the allowable recovery number. In this case, it is determined that mounting on the block B is impossible. In general, the wafer cut parts P in different wafers U often have variations in characteristics. However, according to the above-described control method, the wafer cut parts P are in a state where the characteristics of the wafer cut parts P vary in each block B. The wafer cut component P can be efficiently mounted at a plurality of mounting points on the substrate S by efficiently preventing the mounting of the wafer cut component P.

  Further, in step 18 in FIG. 9 and the like, the determination as to whether or not the wafer cutting component P can be mounted by the control device 1 is as follows, although the remaining number of wafer cutting components P is less than the sum of the number of mounting points in the current block B and the allowable recovery number. When the number of mounting points in block B is equal to or greater than the sum of the allowable number of recovery, control for mounting on the next block B is performed, so that waste of wafer cut parts can be prevented, and wafer cut parts P The manufacturing cost of the substrate S on which is mounted can be reduced.

  Further, when the block B is set in each sub-substrate Stt in step 19 in FIG. 9 or the like, when the control device 1 determines that the wafer cut part P cannot be mounted in one block B, Since the control for skipping the mounting of the wafer cut component P on the sub-substrate Stt including the block B is performed, the mounting of the wafer cut component P on the other block B in the sub-substrate Stt that is clearly defective is performed. Therefore, it is possible to prevent a large number of wafer cut parts P from being wasted and to reduce the mounting cost.

  Next, another operation for mounting the wafer cutting component P in the block B of the substrate S by the control device 1 will be described with reference to the flowchart of FIG. 10 corresponding to the flowchart of FIG. The operation of the control device 1 is different only in steps 11, 12, and 16 in the flowchart of FIG. 9, and only the steps related to the corresponding steps will be described below.

  In step 7, when the control apparatus 1 determines that the inspection result of the collected wafer cut part P (Pa) is defective, the wafer cut part P (Pa) is discarded (step 10), and the current block B “1” is added to the number of times of recovery z in (E) (step 31). Then, it is determined whether or not the number of recovery times z is equal to or greater than the allowable recovery number (s) (step 32).

  When the control device 1 determines that the number of recovery times z is less than the allowable recovery number (s) in the current block B (E), the control device 1 selects the No. No. 1 adjacent to the wafer cut part P (Pa). The suction nozzle 39 is positioned on the second wafer cut part P (Pa) (step 13), the process returns to step 5 and the wafer cut part P (Pa) is sampled by the suction nozzle 39, and the processing after step 6 is executed. To do.

  On the other hand, if it is determined in step 32 that the number of times of recovery z exceeds the allowable recovery number (s) in the current block B (E), it is determined that component mounting in the current block B (E) is impossible. (Step 15). Then, the number of times of recovery z is reset (step 36), and it is determined whether or not the mounting of all blocks B on the board S (Ss) is completed (step 14), and the mounting of all blocks B is not completed. If so, the process returns to step 3 to execute the above-described processing, and when the component mounting of all the blocks B has been completed, the mounting processing is stopped.

  As described above, according to the component mounting apparatus 10 of the present embodiment, in step 31 of FIG. 9 and the like, the wafer cut component mounting availability determination unit of the control device 1 performs the component mounting of the wafer cut component P on the block B. If the number of parts collection recovery for a collection abnormality or a part abnormality exceeds a predetermined allowable number of recovery, it is determined that mounting on the block B is impossible and the process skips. In general, the wafer cut parts P located at positions separated in the wafer U often have some characteristic variation. However, according to the control method described above, the characteristics of the wafer cut parts P in each block B are different. The wafer cut component P can be prevented from being mounted in a dispersed state, and the wafer cut component P can be efficiently mounted on a plurality of mounting points on the substrate S.

  DESCRIPTION OF SYMBOLS 1 ... Control apparatus (wafer cut component mounting control means), 10 ... Component mounting apparatus, 20 ... Component supply apparatus, 30 ... Component mounting apparatus, 50 ... Board conveyance apparatus, P ... -Wafer cut parts, S ... substrate, B ... block.

Claims (5)

In a component mounting apparatus in which a component mounting head collects a component from a component supply device and mounts it on a mounting point on a board positioned at the component mounting position.
The plurality of wafer cut parts that are cut into a plurality of wafer cut parts and supplied to the part supply position in the wafer state are sequentially collected, and the wafer cut parts with the smallest characteristic change are collected in order and positioned at the part mounting position. Wafer cut component mounting means for causing the component mounting apparatus to perform control of mounting on the mounting point on the substrate,
A plurality of blocks that divide the substrate are set for each range in which it is necessary to suppress the characteristic variation between components of the same component type to be mounted within a predetermined range, and at least predetermined as the substrate information and the block information Block storage means for storing the information including the distance between the allowable parts and the information including the predetermined allowable pitch number in association with each other ;
Information on the block is acquired based on the information on the substrate positioned at the component mounting position, and the wafer cut component is collected into the block due to an abnormality in collecting the wafer cut component or an abnormality in the wafer cut component. distance position on the supply wafer between the parts to be mounted is greater than the distance between the allowable component, or if the number of pitches is determined to exceed the number of the allowable pitch is mounted to the block is determined to not be A component mounting apparatus comprising: a wafer cut component mounting availability determination unit. In a component mounting apparatus in which a component mounting head collects a component from a component supply device and mounts it on a mounting point on a board positioned at the component mounting position.
The plurality of wafer cut parts that are cut into a plurality of wafer cut parts and supplied to the part supply position in the wafer state are sequentially collected, and the wafer cut parts with the smallest characteristic change are collected in order and positioned at the part mounting position. Wafer cut component mounting means for causing the component mounting apparatus to perform control of mounting on the mounting point on the substrate,
A plurality of blocks that divide the substrate are set for each range in which it is necessary to suppress the characteristic variation between components of the same component type to be mounted within a predetermined range, and at least predetermined as the substrate information and the block information Block storage means for associating and storing information including an allowable number of recovery ,
The block information is acquired based on the information of the substrate positioned at the component mounting position, and the component for the wafer cut component sampling abnormality or the wafer cut component abnormality in mounting the wafer cut component to the block If the recovery times of sampling exceeds the recovery acceptable number, the component mounting apparatus is characterized in that and a wafer cut component mounting determination unit to skip it is determined that the attachment is not to the block . In claim 2 ,
The wafer cut component mounting availability determination unit determines that the mounting to the block is not possible when the number of remaining wafer cut components is less than the sum of the number of mounting points included in the block and the allowable recovery number. A component mounting apparatus characterized by being determined to be possible. In claim 2 or 3 ,
The wafer cut component mounting availability determination means is configured such that the remaining number of wafer cut components is less than the sum of the number of mounting points included in the current block and the allowable number of recovery, but the number of mounting points included in the next block A component mounting apparatus characterized in that when it is equal to or greater than the sum of the number and the allowable recovery number, mounting to the next block is performed with priority over mounting to the current block. In any one of Claims 1-4,
When the substrate is a substrate composed of a plurality of sub-substrates of the same substrate type, the plurality of blocks are set in each sub-substrate,
When it is determined that the wafer cut component cannot be mounted in one block, the wafer cut component mountability determination unit skips mounting of the wafer cut component on the child substrate including the block. A component mounting apparatus characterized by

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