JPS61161000A - Mounting of part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a component mounting method for mounting electronic components on a mounted object (hereinafter referred to as a board). Component mounting was carried out in the following manner using a component mounting machine as shown in Figure 3.

That is, in accordance with a component mounting instruction program (hereinafter referred to as a mounting program) stored in the controller 1, components are taken out from the component supply section 2 by the mounting head section 3.
- Mount the component on the board fixed on the Y table 4 using the mounting head 3. If the component cannot be mounted normally at this time, use the mounting head 3 to remove the component and try again. , performs a mounting operation to mount components. The components are mounted on the board by repeating the above operations.

Problems to be Solved by the Invention However, in the component mounting method described above, components are mounted on the assumption that all components of the same type have no distinction and can be treated equally.
There is a problem in that it is difficult to reliably mount parts such as F and UHF diodes, which are ranked and cannot be used together with other ranks, without mixing with other ranks. Ta.

This is due to the following reasons.

In other words, as shown in FIG. 4, although the parts are the same part 6, they are ranked every N parts, and are taped so that there are distinguishing points 6 between each rank to distinguish each rank. Consider the case O. Normally, the number of tapings by rank N is one board, or
The number is equal to or larger than the required number of components for one pattern, so when the component mounting for one board or one pattern is completed, the remaining number of components of the same rank is required for mounting. If the number is less than the specified number, the components must be manually reloaded into the component supply unit 2 so that the next component mounting starts from the first component position of the next rank. On the other hand, if there are many cases where the mounting is not performed normally and N or more components are taken out from the component supply section 2 and mounted during the mounting, the completed board will be a defective board because components of different ranks will be mixed together. There is a drawback that it becomes .

Means for Solving the Problems In order to solve the above problems, the component mounting method of the present invention includes:
When mounting ranked parts, there is a process of counting how many parts of the same rank remain in the parts supply unit, and comparing that number with the number of parts required to complete one pattern. It consists of a process and a process for managing the component mounting process based on the process results.

Function Since the present invention consists of the steps described above, when mounting components that have been ranked according to the same electrical characteristics and are taped to a single tape, the remaining components of the same rank remaining in the component supply section are removed. Since the number is always known, before starting implementation to the pattern, compare the number of ranked parts required for implementation to the pattern, and if the remaining number is greater, start implementation to the pattern. If the number remaining is less, the parts of that rank remaining in the parts supply section are discarded,
Start implementation with parts of the next rank.

Also, if the remaining number of chips becomes zero due to an insertion error during the mounting process, the mounting process is interrupted and the operator is asked for instructions.

If ranked components are mounted using the component mounting method described above, only components of the same rank will be mounted on one pattern, and components of different ranks will not be mounted together, which will prevent the occurrence of defective patterns. It can be prevented.

Embodiment Hereinafter, one embodiment of the present invention will be described based on the accompanying drawings.

In FIG. 2, numeral 7 is a component supply section where mounted components are set, and 8 is a component supply section where the components set in component supply section 6 are sent one step ahead, and the component is taken and mounted on a board.
9 is an X-Y table section for moving the board to the mounting position; 10 is an α-table section for carrying the board into the X-Y table section;
The loader section 11 is an unloader section that transports the substrate. Further, 12 is a detector for detecting the distinguishing points of parts taped according to rank, and 13 is a controller for controlling all of the above.

A component mounting method in the electronic component mounting machine configured as described above will be explained based on the flowchart of FIG. 1.

In this embodiment, the number N of taping by rank is first set in the controller (step 1), and then the number n of times the ranked parts are taken out from the parts supply section is set to zero (step 7 step 2). Next, execute the mounting program (step 3), determine whether the component to be mounted is ranked or not (step 4), and if it is ranked, add 1 to the number of times n to be taken out (step 5), and perform the mounting operation (step 6).
After executing , take out number n and number of tapings by rank N
Step 7) If n≧N, it is determined that there are no more components of the same rank, and it is determined whether the mounting program has been completed.Step 8). If it has been completed, the next pattern or board mounting is started. Return to step 2 to begin. On the other hand, if the implementation program is not finished,
Ask the operator for instructions so that parts of different ranks are not mixed and mounted (Step 9).

In step 7, compare n (if N, check whether the implementation program has finished or not (step 10); if not, proceed to implement the next step of the implementation program.
Start with whelk 3. If it has been finished, the parts with the same rank still remain in the N-n side parts supply section 7, so move the ranked parts to the take-out position (step 11).
To implementation - Using Sodo 8, execute the N-rx rotation section feed operation (step 12) so that the next implementation starts from the beginning of the next rank, freeze to step 2,
Mounting on the next pattern or board begins.

If the above mounting method is used, only components of the same rank are mounted on one pattern or board, and components of different ranks are not mixedly mounted.

As in the previous embodiment, even if there are a plurality of ranked parts, if the number of take-outs n and the number of tapings by rank N are memorized for each part, they can be mounted in the same way. is possible.

Effects of the Invention As described above, in the present invention, when mounting ranked components, the number of components of the same rank remaining in the component supply section is reduced to 1.
If the number of ranked components is greater than the number of ranked components required for pattern mounting, the mounting operation will start; conversely, if there are fewer remaining components, the remaining components can be discarded and mounted from a new rank. When the remaining number reaches zero, the operator is asked for instructions.

By managing the mounting process as described above, it is possible to prevent parts of different ranks from being mixedly mounted on the same pattern, and there is an effect that the occurrence of defective patterns is eliminated.

[Brief explanation of the drawing]

FIG. 1 is a flowchart showing a mounting method in a first embodiment of the present invention, FIG. 2 is a perspective view of an electronic component mounter using the same embodiment, and FIG. 3 is a diagram of a conventional electronic component mounter. The perspective view and FIG. 4 are front views of the ranked parts. 7...Component supply section, 8...Mounting head. Name of agent: Patent attorney Toshio Nakao and 1 other person Award 1
Figure 4 Rank■ Rang■6-=(jj
Zuri 7, Procedural amendment Showa EO October 1'& B each

Claims (1)

[Claims] It has a component mounting process in which components are sequentially taken out from the component supply section and mounted on the object to be mounted using a mounting head according to instructions from the control program, and the components are ranked according to the same characteristics.
When mounting parts taped together,
The process of counting the number of remaining parts by subtracting the number of parts that have been mounted from the pre-input number of parts in the same rank, and comparing the number of ranked parts required to mount one pattern with the above remaining number. A component mounting method consisting of a step of comparing the results and a step of managing the component mounting process based on the comparison results.