JP2786713B2 - Component mounting method - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method in a component mounting machine that mounts electronic components, for example.

2. Description of the Related Art An example of an electronic component mounting method in a conventional electronic component mounting machine will be described.

In conventional electronic component mounting machines, when performing mounting while switching suction nozzles to mount various electronic components, a plurality of suction nozzles are mounted on the mounting head and the suction nozzles are switched and used according to the mounting data. Electronic components are mounted.

In addition, an electronic component mounting machine having a plurality of mounting heads is used in order to reduce the mounting tact. In this case, suction nozzles of exactly the same type as the other mounting heads are attached to each mounting head, and mounting operations are performed while selecting and switching only suction nozzles of a type that can be mounted on one mounting head.

As an example, FIG. 4 shows an electronic component mounting machine c in which five suction nozzles a can be attached to one mounting head b and ten such mounting heads b are provided. In this case, the types of the suction nozzles a are limited to five types.

Problems to be Solved by the Invention However, in the electronic component mounting method using the electronic component mounting machine c as described above, 1) The type of the suction nozzle a that can be used is the type of the suction nozzle a attached to one mounting head b. To increase the number of types, a suction nozzle a attached to one mounting head b
It is necessary to increase the types. However, the number of suction nozzles a that can be attached to one mounting head b is limited to about five due to the size of the machine and the like. If more types of suction nozzles a are required, the suction nozzles a are required. Must be replaced each time.

2) If more suction nozzles a than the number of suction nozzles a that can be attached to one mounting head b for one electronic circuit board are required, mounting of components on the board is one. It cannot be done with one electronic component mounting machine.

Have the problem of saying.

The present invention has been made in view of the above problems, and in a machine for mounting components such as electronic components, if the type of suction nozzle is within the number of suction nozzles that can be mounted on the component mounting machine, all of the suction nozzles are mounted on the machine, and various components are mounted. It is an object of the present invention to provide a component mounting method capable of mounting components while switching suction nozzles according to mounting data and enabling various electronic components and the like to be mounted on a single component mounting machine. It is.

Means for Solving the Problems In order to achieve the above object, the present invention can hold a part by suction or the like and mount a plurality of holding members mountable at a predetermined position to one mounting head. Also, in a component mounting method in which a component mounting machine equipped with a plurality of mounting heads mounted with the plurality of holding members, the component is mounted on an object to be mounted while switching and using the holding member according to a mounted component. A first step of mounting a holding member different from the other mounting heads as necessary on the head, and inputting to the machine which type of holding member is mounted on which mounting head on which station; A second step of inputting which holding member is to be used to the machine, and attaching the holding member required for mounting input in the second step to the mounting position of the holding member input in the first step. The holding member is switched and used by a third step of selecting according to a component to be mounted based on the placement information.

According to the above configuration of the present invention, when mounting various components using the component mounting machine, all of the holding members attached to each mounting head of the component mounting machine by a predetermined number are set as different types of holding members. Also, since the mounting operation is performed by switching the selected members while selecting the holding member specified by the mounting data of the components, various components corresponding to the maximum number of holding members that can be mounted on one component mounting machine are mounted. can do.

Embodiment An electronic component mounting method according to one embodiment of the present invention will be described below with reference to the drawings.

FIG. 2 is a perspective view showing an example of an electronic component mounting machine used in the present invention. This electronic component mounting machine has mounting head units 3 and 13 in the information of the transport unit 12 where an electronic circuit board 11 on which electronic components are to be mounted is transported and positioned. A component supply means 14 for supplying electronic components to the mounting head units 3 and 13 is provided at the back of the transport unit 13.

The mounting head unit 3 has ten mounting heads 2,
Each mounting head 2 is provided with five suction nozzles (holding members) 1 for sucking components and mounting them at predetermined positions.

FIG. 3 is a schematic view of the mounting head unit 3 of the electronic component mounting machine shown in FIG. Here, the numbers up to indicate the mounting station of the suction nozzle 1, A is a suction position at which the suction nozzle 1 sucks a component from the component supply means 14, and B is an electronic circuit board which mounts the sucked component on an object to be mounted. 11
A mounting position C mounted above is a switching position at which the suction nozzle 1 is selected for switching according to the mounting data. Each of the mounting stations is provided with a sensor 21 for automatically detecting the type of the suction nozzle 1 attached thereto from the display attached to the nozzle 1, and a detection signal from the sensor 21 is transmitted to a control unit 22 of the electronic component mounting machine. 2). Control unit 22
Is input from the operation panel 23 (FIG. 2) and the like, and controls the electronic component mounting machine so that necessary mounting can be performed.

An example of the operation of the electronic component mounting method using the electronic component mounting machine configured as described above will be described with reference to the flowchart shown in FIG.

Prior to the mounting operation, a suction nozzle 1 different from the others is mounted on each mounting head 2 as necessary.

In such a state, first, the mounting head unit 3
In step 1, which kind of suction nozzle 1 is attached to which station is input. Here, the nozzle numbers are assigned to the suction nozzles 1 according to the types thereof. At each nozzle mounting station, the sensor 21 automatically reads the numbers and inputs them to the control unit 22. Next, in step 2, a nozzle number necessary for mounting the electronic component is included in the data for mounting the electronic component on the operation panel 23.
Is input to the control unit 22.

When the mounting operation is started, the mounting head 2 positioned at C is switched according to the selection of the suction nozzle 1 in accordance with the mounting data in step 3. In this case, if there is no suction nozzle 1 indicated by the mounting data in the mounting head 2 at the position C, the step of using the suction nozzle 1 attached to the mounting head 2 in the mounting data is preferentially executed. Therefore, the program is switched so as to select the suction nozzle 1 specified in that step.

Next, in step S4, the component corresponding to the selection is sucked on the condition that the mounting head 2 which has been switched in response to the selection of the suction nozzle 1 at the suction position A in A is present.
Then, in step 5, the suction nozzle 1 is switched in response to the selection in the mounting position B in accordance with the selection, and there is a mounting head 2 in which the suction nozzle 1 according to the selection sucks the electronic component. The electronic components sucked and held by the mounting head 2 are mounted on the electronic circuit board 11.

Next, if the mounting of all the electronic components has not been completed in step 6, the mounting head unit 3 is rotated by one index in step 7, and the processes from step 3 onward are repeated until the mounting of the necessary electronic components is completed.

Thus, in an electronic component mounting machine in which up to 50 types of suction nozzles 1 are mounted on the mounting head unit 3, 50 types of electronic components can be mounted on the electronic circuit board 11 while selecting the suction nozzle 1.

In order to carry out such a method, the control unit 22 receives various necessary data such as position information of each mounting head 3 and type information of the suction nozzle 1 which is switched to a use position of each mounting head 2. , And perform necessary operation control.

In the mounting control by the control unit 22, the mounting order in which the electronic components can be mounted in the shortest time is automatically determined based on the data for mounting the components and the input mounting position information of the suction nozzle to the mounting head. And the mounting operation can be performed.

Effects of the Invention According to the present invention, when mounting a component on an object to be mounted using a component mounting machine, all of the holding members attached to each mounting head of the component mounting machine by a predetermined number are different types of holding members. However, since the switching operation is performed while selecting the holding members specified by the mounting data of the components while performing the mounting operation, various components corresponding to the maximum number of holding members that can be mounted in one component mounting machine can be used. The number of components that can be mounted and can be handled and mounted simultaneously by one component mounting machine is greatly increased, and the practical effect is large.

[Brief description of the drawings]

FIG. 1 is a flowchart of a mounting operation in an electronic component mounting method according to one embodiment of the present invention. FIG. 2 is a perspective view of an electronic component mounting machine used in one embodiment of the present invention.
FIG. 4 is a schematic view of a mounting head unit of the machine, and FIG. 4 is a schematic view of a mounting head unit conventionally used. DESCRIPTION OF SYMBOLS 1 ... Suction nozzle 2 ... Mounting head 3 ... Mounting head unit 11 ... Electronic circuit board 14 ... Component supply means 21 ... Sensor 22 ... Control part 23 ... Operation panel

Claims (1)

(57) [Claims] A plurality of holding members capable of holding components by suction or the like and mounting them at predetermined positions can be mounted on one mounting head, and a plurality of mounting heads mounted with the plurality of holding members are provided. In a component mounting method in which a component mounting machine is used to mount a component on a mounted object while switching and using a holding member according to a mounted component, a mounting member different from other mounting heads may be used for each mounting head as necessary. A first step of inputting to the machine which type of holding member is attached to which mounting head of which mounting head, and a second step of inputting which holding member to use for the mounted component to the machine. Process and the second
Switching between the holding members by a third step of selecting the holding members required for mounting input in the step based on the mounting position information of the holding members input in the first step according to the component to be mounted. Component mounting method characterized by the above-mentioned.