JPH07306885A - Electronic component mount system - Google Patents

Abstract

PURPOSE:To decrease the number of component cassettes which are replaced at the time of rearrangement. CONSTITUTION:Mounted component information to a mounted printed circuit board 305 is supplied from a printed circuit board design CAD system 100 to a mount data generation system 200. An array data storage part 203a is stored with the last array state of component cassettes 302 at a component supply part 301 by an electronic component mounting machine 300. A mount data generation part 201a compares the array data in the array data storage part 203a with the kinds of electronic components shown by the mounted component information and when a common electronic component is found, a component array indication 204 is sent out while the array of the component cassette 302 is reflected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting system comprising an electronic component mounting machine for mounting electronic components on a printed circuit board, and a mounting data creation system for instructing the electronic component mounting machine a component mounting sequence. .

[0002]

2. Description of the Related Art When an electronic component is mounted on a printed circuit board, first, a CAD system is used to determine mounted component information such as the type of mounted component on the printed circuit board and the component mounting coordinate position. And N to the electronic component mounting machine
An electronic component mounting data creating system (NC data creating device) that supplies C (numerical control) data creates NC data based on such information, and mounts electronic parts on a printed circuit board together with this NC data. In this case, the instruction of the component arrangement is supplied to the electronic component mounter.

[0003]

However, in the above-described conventional electronic component mounting system, when different printed circuit boards are to be produced, NC data is created from the beginning, and therefore, the components of the electronic component mounting machine are required. The order of arrangement of the component cassettes in the supply unit will also be completely different. Therefore, there is a problem that switching the printed circuit boards to be produced requires a great deal of labor and lowers the operating rate of the equipment. It is possible to solve such a problem and improve the operating rate of the electronic equipment. Realization of a component mounting system was desired.

[0004]

In order to solve the above-mentioned problems, an electronic component mounting system of the present invention includes an array data storage unit for storing an array of electronic components in a component supply unit of an electronic component mounting machine. Set up. Then, when receiving the mounting part information of the electronic part on an arbitrary circuit board, the array data of the previous electronic part is taken out from the array data storage unit, and the array data of the electronic part and the electronic part indicated in the mounting part information. When there is a common electronic component, a mounting data creation unit that creates a new component arrangement instruction based on the position of the common electronic component in the component supply unit is provided.

[0005]

In the electronic component mounting system of the present invention, when the electronic component mounting machine mounts an electronic component on an arbitrary circuit board, the mounting data creating system receives the mounted component information on the circuit board. The mounting data creation unit of the mounting data creation system compares the electronic component indicated in the received mounting component information with the array data of the previous electronic component in the electronic component mounting machine stored in the array data storage unit,
If there is a common electronic component, a new component arrangement instruction is output based on the position in the arrangement.

[0006]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 is a block diagram showing an embodiment of an electronic component mounting system of the present invention. Prior to this explanation, an electronic component mounting system having a basic configuration will be explained. Figure 2
It is a block diagram of the electronic component mounting system. The system shown in the figure is a printed circuit board design CAD system 100, a mounting data creation system 200, and an electronic component mounting machine 300.
Consists of.

Printed circuit board design CAD system 100
Is a system for designing a printed circuit board and comprises a design terminal device 101 and a storage device 102. The design terminal device 101 is a terminal device for designing a circuit board, and at the time of designing, creates mounting component information such as the type of mounting component on the printed circuit board and the component mounting coordinate position. The storage device 102 is a storage unit for storing the mounted component information.

The mounting data creating system 200 is a system (NC data creating device) for creating mounting data of electronic parts on a printed circuit board.
The mounted component information from the AD system 100 is input via the information transmission means 401, and various NC data is sent to the electronic component mounter 300 via the information transmission means 402. The mounting data creation system 200 includes a creation terminal device 201, a printing device 202, and a storage device 203. The creation terminal device 201 creates NC data and, at the same time, mount component information input from the printed circuit board design CAD system 100. Based on the above, the component arrangement instruction 204 is printed out by the printer 202.

The component arrangement instruction 204 is for instructing the operator of the arrangement (setting change) of the arrangement sequence of mounting the electronic components mounted on the printed circuit board on the electronic component mounter 300. Therefore, the arrangement order of the electronic components is determined at the time of creating the NC data based on the mounted component information, and therefore the printed circuit boards having common components usually differ.

The electronic component mounter 300 is controlled by the NC data from the mounting data creation system 200, and its configuration is as follows. Figure 3
FIG. 3 is a plan view showing the configuration of electronic component mounter 300.
In the figure, a component supply unit 301 arranges a plurality of component cassettes 302 at predetermined positions, and a unique number (1, 2, 3, ..., N) is assigned to each position to be mounted. In the NC data instructing the electronic component mounter 300 of the sequence, the component to be mounted is designated by this number. The component cassette 302 is a cassette that stores electronic components such as reels or stick components. Furthermore, the component supply unit 301 is configured to be movable parallel to the arrangement direction of the component cassettes 302, and electronic components of an arbitrary component cassette 302 can be mounted on the component mounting head 30.
It can be taken out at 3.

The component mounting head 303 includes a component supply unit 30.
The electronic component is taken out from the component cassette 302 of No. 1, rotated in the arrow direction, and mounted on the mounted printed circuit board 305 on the XY table 304, and 306 indicates the component mounting position. The XY table 304 is mounted with the mounted printed circuit board 305 and is installed so as to be movable in the XY directions, as shown by the arrows in the drawing. The mounted printed circuit board 305 is conveyed from the loading side by the conveyor 307, the electronic components are mounted on the XY table 304, and then the printed circuit board 305 is conveyed to the ejection side.

Next, the operation of the electronic component mounting system will be described. FIG. 4 is a flowchart of the work. First, as the work of the design department, printed circuit board design C
A printed circuit board is designed by the AD system 100 (step S1). The design result is the information transmission means 4
01 via the production technology department mounting data creation system 2
Sent to 00. In the mounting data creation system 200,
As mentioned above, the printed circuit board design CAD system 1
Based on the mounted component information from 00, NC data and component arrangement instruction 204 are created (step S2).

In the manufacturing department, as the setup change work, first, the component arrangement instruction 204 output from the mounting data creation system 200 is referred to (step S3), and the electronic component to be used is made into a component based on the component arrangement instruction 204. It is attached to the cassette 302 (step S4). Then, the component cassette 302 of the component supply unit 301 in the electronic component mounter 300 is entirely replaced with the component cassette 302 in which the electronic component is mounted in step S4 (step S5). That is, the previous array and the current array are completely independent component array instructions 204 in the mounting data creation system 200, even if common electronic components are included in them. It becomes completely irrelevant.

Thereafter, the NC data from the mounting data creating system 200 is input to the electronic component mounting machine 300 (step S6), and the mounted printed circuit board 305 is inserted (step S7). And when the above work is completed,
The electronic component mounter 300 mounts electronic components on the mounted printed circuit board 305 (step S8).

For such an electronic component mounting system,
An electronic component mounting system in which the previous arrangement of the component cassettes 302 in the component supply unit 301 of the electronic component mounting machine 300 is reflected in the subsequent component arrangement instruction 204 will be described below as an embodiment. <Embodiment> As shown in FIG. 1, the electronic component mounting system of this embodiment is a printed circuit board design CAD system 100.
2, a mounting data creation system 200, and an electronic component mounting machine 300. The printed circuit board design CAD system 100 and the electronic component mounting machine 300 are similar in configuration to the electronic component mounting system shown in FIG. is there.

That is, the printed circuit board design CAD system 100 includes a design terminal device 101 and a storage device 102, and sends mounted component information to the mounting data creation system 200 by the information transmission means 401. The information transmission means 401 is used for the printed circuit board design CAD system 10.
A LAN (local area network) to which 0 is connected, a premises line, or the like is used, but not limited to these configurations, and a magnetic medium, paper tape, or the like may be used.

As shown in FIG. 3, in the electronic component mounter 300, a component cassette 302 for mounting is arranged in advance in the component supply unit 301, and an arbitrary electronic component 308 is taken out from the component supply unit 301 to be mounted. Mounted printed circuit board 30
5 is to be implemented. Then, information transmission of NC data and the like from the mounting data creation system 200 to the electronic component mounting machine 300 is performed by the information transmitting means 402.

The mounting data generating system 200 is similar to the electronic component mounting system shown in FIG.
01, the printing device 202 and the storage device 203,
The creation terminal device 201 is provided with a mounting data creation unit 201a, and the storage device 203 is provided with an array data storage unit 203a. When a mounting data creating unit 201a requests the mounting data creating system 200 to create NC data, the mounting data creating unit 201a reads the array data of the previous electronic component from the array data storage unit 203a and the printed circuit board that is the creation request data data. It has a function of comparing the mounted component information from the design CAD system 100 and transmitting a new component arrangement instruction 204 based on the comparison result. The array data storage unit 203a stores the previous array data of the component cassette 302 in the component supply unit 301.

It should be noted that the component arrangement instruction 204 is issued by the printer 20.
In addition to printing on paper by 2 and outputting, the creation terminal device 20
Various configurations can be used as long as they can instruct the operator of the setup change without error such as displaying on the display of No. 1. Further, also in the information transmission means 402, a serial interface such as RS-232C or LA
Transmission by electrical means such as N is conceivable, but it is not particularly limited to this, and when the operator of the mounting data creation system 200 creates NC data for the first time, the arrangement of the component cassette 302 is arranged. Directly create terminal device 20
1 may be input and stored in the array data storage unit 203a.

Next, the operation of the electronic component mounting system of the above embodiment will be described. FIG. 5 is an explanatory diagram showing the procedure. -Procedure 1: When creating NC data for the first time, the current arrangement of the component cassettes 302 of the component supply unit 301 is operated by manually operating the terminal device 201 to create the component arrangement information 501. The component arrangement information 501 indicates the arrangement by uniquely associating the electronic components with the numbers (1, 2, 3, ..., N) unique to the place where the component cassette 302 of the component supply unit 301 is arranged. This is first stored in the array data storage unit 203a. However, if the current arrangement of the component cassette 302 is not used, the NC data can be created with a new component arrangement by resetting the contents of the arrangement data storage unit 203a. This is,
This is the initial state shown in FIG.

[Procedure 2: Printed circuit board design C]
It is obtained from the AD system 100 via the information transmission means 401. Then, the mounting data creation unit 201a stores the component placement information 501 stored in the array data storage unit 203a,
The component arrangement information 50 is compared with the component configuration of the mounted component information 511 from the printed circuit board design CAD system 100.
1, the electronic component mounter 3 has already been included.
The parts arranged in the parts supply unit 301 of 00 are used as they are in the NC data 512 to be created, so that the unique number and the electronic parts are made to correspond to the place where the parts cassette 302 is arranged. Is stored in the component placement information 513 as the existing component placement.

Step 3: Creation The terminal device 201 creates NC data from the mounting part information 511 according to the mounting position, mounting angle, etc. of the component on the printed circuit board to the target electronic component mounting machine 300. At this time, the parts supply unit 301
In the data item instructing the arrangement of the parts cassette 302 in, the contents of the parts arrangement information 513 are preferentially used. Furthermore, when a component not included in the component placement information 513 is placed or a component to be mounted is replaced, the content is stored as a new component placement to prepare for the next NC data creation.

[Step 4] The mounting data creation unit 201a
From the component arrangement information 513, the component cassette 302 that needs to be newly arranged is specified, and the component arrangement instruction 514 is created. The component arrangement instruction 514 corresponds to the component arrangement instruction 204 shown in FIG. The above operation is the flow of the first creation shown in FIG. 5, and when creating the NC data for the second and subsequent times, the same process is performed from the above procedure 2 using the component placement information 513 of the first creation. The component placement information 523 is updated to create a new component arrangement instruction 524.

In this way, NC data reflecting the arrangement status of the component cassettes 302 in the component supply unit 301 at the time of NC data generation can be created while updating the component placement information. Further, in this embodiment, since the NC data that reflects the arrangement state of the electronic component mounting machine 300 at the time of setup change is used, when an arbitrary printed circuit board is produced, the NC data may be created immediately before the production. is necessary.

Therefore, the setup change work in this embodiment is
It looks like this: FIG. 6 is a flow chart for explaining the work of this embodiment. First, as the work of the design department, the printed circuit board design CAD system 100 designs the printed circuit board (step S1), and the design result is sent to the mounting data creation system 200 via the information transmission means 401. The operation is similar to that of the basic electronic component mounting system shown in.

In the manufacturing department, as the setup change work, the mounting data creation system 200, as described above, based on the mounted part information (511, 521, ... In FIG. 5) from the printed circuit board design CAD system 100, NC.
Create data and component arrangement instructions 204 (step S
2). Then, according to the component arrangement instruction 204 output from the mounting data creation system 200, the component cassette 302
Check if there is a place where the placement of the is changed (step S
3). In step S3, if there is a change location, the component at the change location is mounted on the component cassette 302 (step S4), and only the component cassette 302 at the change location in the component supply unit 301 is replaced (step S).
5).

After that, the NC data from the mounting data creating system 200 is input to the electronic component mounting machine 300 (step S6), and the mounted printed circuit board 305 is inserted (step S7). Then, the electronic component mounter 300
The electronic component mounting operation is performed (step S8). If there is no place to change in step S3, the process directly proceeds to step S6 and NC data is input.

As described above, in the above-described embodiment, since the component arrangement instruction 204 reflecting the previous arrangement state of the component cassette 302 in the component supply unit 301 is created, even if there is a place where the arrangement is changed. Therefore, only the component cassette 302 at the change location needs to be replaced, and therefore, the setup change operation can be promptly executed.

In the above embodiment, among the electronic components mounted on the printed circuit board, the ones which are frequently used are
By always arranging the components in the component supply unit 301 of the electronic component mounter 300, it is possible to omit the component cassette 302 replacement when performing the setup change work. Therefore, in the component placement information 501, 513, 523, ... Shown in FIG. 5, a fixed portion for always placing a fixed electronic component is provided. Then, in this fixed arrangement portion, the above-mentioned step 3
At the time of arranging parts, new parts are not allocated. Therefore, in the component supply unit 301 which is fixedly arranged,
NC data in which constant parts are always arranged is created, and replacement of the parts cassette 302 can be omitted.

[0030]

As described above, according to the electronic component mounting system of the present invention, a new component arrangement instruction is made based on the previous component arrangement in the component supply section of the electronic component mounting machine. The number of electronic components to be replaced at the time of setup change can be reduced, and as a result, the setup change man-hour can be reduced and the operation rate of the facility can be improved.

[Brief description of drawings]

FIG. 1 is a block diagram showing a configuration of an electronic component mounting system of the present invention.

FIG. 2 is a block diagram showing a configuration of an electronic component mounting system having a basic configuration.

FIG. 3 is a plan view showing a configuration of an electronic component mounter.

FIG. 4 is a work flowchart of an electronic component mounting system having a basic configuration.

FIG. 5 is an explanatory diagram of a procedure in the electronic component mounting system of the present invention.

FIG. 6 is a work flowchart in the electronic component mounting system of the present invention.

[Explanation of symbols]

 201a Mounting data creation unit 203a Array data storage unit 204 Component array instruction 300 Electronic component mounter 301 Component supply unit 302 Component cassette 305 Mounted printed circuit board 308 Electronic component

Claims (2)

[Claims] 1. An electronic component mounter that includes a component supply unit in which electronic components are arranged, takes out an arbitrary electronic component from the component supply unit and mounts the electronic component on a circuit board, and mounting the electronic component on the arbitrary circuit board. A mounting data creation system that outputs, to the electronic component mounter, a component arrangement instruction that determines the relationship between the arrangement of electronic components in the component supply unit of the electronic component mounter and the mounting position on the circuit board based on the component information. In the electronic component mounting system, the mounting data creation system includes an array data storage unit that stores an array of electronic components in the component supply unit of the electronic component mounting machine, and a mounting component of the electronic components on an arbitrary circuit board. When the information is received, the previous array data of the electronic component is retrieved from the array data storage unit, and is displayed in the array data of the electronic component and the mounted component information. And a mounting data creation unit that creates a new component arrangement instruction based on the arrangement position of the common electronic component in the component supply unit when there is a common electronic component. An electronic component mounting system characterized by the above. 2. The electronic component mounting system according to claim 1, wherein the electronic component mounting machine comprises an area for fixedly arranging the electronic component and an area for arranging an arbitrary electronic component in the component supply section. The electronic device is characterized in that the array data storage unit of the mounting data creation system is configured to store component arrangement information corresponding to the fixedly arranged region and the region in which the arbitrary electronic component is arranged. Component mounting system.