JP3449596B2 - Electronic component mounting method and device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention temporarily holds a plurality of electronic components sequentially supplied from a component supply unit by a plurality of nozzles of a mounting head according to an instruction from a control unit,
The present invention relates to an electronic component mounting method and apparatus for sequentially mounting the components on a printed circuit board.

[0002]

2. Description of the Related Art FIGS. 4 and 5 are external perspective views showing a schematic structure of a general electronic component mounting apparatus. Of these, FIG. 4 is a multi-function medium speed machine type, and FIG. 5 is a high speed machine. It shows the type.

In FIG. 4, the electronic component mounting apparatus is equipped with a mounting head 3 which takes out an electronic component from a component supply unit 1, moves it to a mounting table 2 and performs mounting positioning. Reference numeral 4 is a board recognition unit for recognizing the printed circuit board 5 positioned on the mounting table 2, and reference numeral 6 is a component inspection unit for inspecting the state of the electronic component held by the mounting head 3. Reference numeral 7 denotes a transfer rail for transferring the printed circuit board 5 onto the mounting table 2. 8 is an operation unit, 9 is a control unit, 1
2 is a storage unit. Also in FIG. 5, the main part has the same configuration as that described above, and the common elements are denoted by the same reference numerals.

In response to the recent demand for efficiency in mounting production, the mounting head 3 has a plurality of nozzles 10 as shown in FIG. 6, so that the component supply time is shortened and the productivity is improved. In addition, the electronic component mounting apparatus is configured such that the electronic components 11 sequentially taken out from the component supply unit 1 are once held by the plurality of nozzles 10 of the mounting head 3 and then sequentially mounted at the mounting positions on the printed circuit board 5. ing. Reference symbols a, b, c, and e in FIGS.
3 shows the correspondence relationship between the electronic component 11 that is supplied from the substrate and is held by the nozzle 10 of the mounting head 3 and the mounting position on the printed circuit board 5.

Further, the storage unit 12 shown in FIGS.
As is well known, a mounting program 13 called NC data for performing various mounting controls is installed, and an example thereof is shown in FIG. 7. In FIG. 6 and FIG. 7, the mounting program 13 includes the electronic components 11 specified by the component number 105 in the order of the mounting number 101 that instructs the supply and mounting order of the electronic components 11.
From the component supply unit 1 to, for example, Z1, Z2 ... (Fig. 6
(A), (b), (c), (e) in (a) are taken out in this order, and for example, (X1, Y) at the mounting position (coordinate X103, coordinate Y104) on the printed circuit board 5 designated by the control command 102.
1), (X2, Y2) ... (a, b, in FIG. 6B)
c, e) are mounted in this order.

The auxiliary instruction 106 is the name of the electronic component 11,
It is for linking information such as shape.

[0007]

SUMMARY OF THE INVENTION In the above conventional configuration,
The order of the mounting number 101 in the mounting program 13 is the supply order in which the nozzle 10 of the mounting head 3 takes out the electronic component 11 from the component supply unit 1, and the nozzle 10 of the mounting head 3 holds and prints a plurality of electronic components 11. The mounting order for mounting the electronic components at the mounting position on the substrate 5 is defined at the same time, and the supply order of the electronic components and the mounting order have a one-to-one correspondence. Therefore, even if the order of supplying or mounting the electronic component 11 is changed to improve the efficiency of the work, there is still room for improvement in the efficiency of the other work. For example, a, b, in FIG.
The order of c and e is an appropriate order as a supply order from the component supply unit 1 of the electronic component 11, but the order of a, b, c, and e in FIG. The mounting order in No. 5 is not necessarily an appropriate order.

The present invention has been made in view of the above circumstances, and a main object of the present invention is to provide an electronic component mounting method and an electronic component mounting apparatus capable of improving efficiency in all operations.

[0009]

In order to achieve the above object, the first invention of the present application is such that a plurality of electronic components sequentially supplied from a component supply unit are supplied to a plurality of mounting heads in accordance with an instruction from a control unit. In the electronic component mounting method in which the nozzles are once held and then sequentially mounted at the mounting positions on the printed circuit board, the electronic components held by the nozzles of the mounting head are provided.
The supply order is the order of mounting the electronic components held by the nozzles.
The order is characterized by instructing independently .

In this method, the order of supplying electronic components and the order of mounting electronic components are not in a one-to-one correspondence, but the order of supplying and mounting electronic components is set within a range that can be simultaneously held by each nozzle of the mounting head. Since they can be designated independently, for example, the mounting order of electronic components can be prioritized, and the supply order can be optimized within a range that can be simultaneously held by each nozzle of the mounting head. As a result, the efficiency can be improved for all the work.

According to a second invention of the present application, a plurality of electronic components sequentially supplied from a component supply unit are once held by a plurality of nozzles of a mounting head according to an instruction from a control unit, and then mounted on a printed circuit board. sequentially in the electronic component mounting apparatus for mounting, the control unit, holding at each nozzle of the mounting head
The supply order of the electronic components to be held was held by each nozzle.
A storage medium storing a mounting program for instructing independently of the order of mounting electronic components; and an input / output unit for rewritably mounting the mounting program on the control unit from the storage medium. To do.

With this device, the first method of the present invention can be embodied, and further, the operation part of the storage medium mounted on the control unit by operating the input / output unit can independently provide the electronic component supply order and the mounting order instruction portion. Since it can be created, edited, changed, etc., a more suitable mounting program can be obtained.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the accompanying drawings to provide an understanding of the present invention. The following embodiments are examples embodying the present invention and are not of the nature to limit the technical scope of the present invention.

This embodiment is shown in FIGS. 1 to 3.
It can be applied to an electronic component mounting apparatus similar to the conventional example as shown in FIGS.

As shown in FIGS. 4 and 5, the electronic component mounting method according to the present embodiment (hereinafter referred to as the “present method”) sequentially supplies from the component supply unit 1 in accordance with an instruction from the control unit 9. As in the conventional example, the plurality of electronic components to be formed are temporarily held by the plurality of nozzles 10 of the mounting head 3 and then sequentially mounted at the mounting positions on the printed circuit board 5. However, this method is different from the conventional example in that the control unit 9 independently instructs the order of supply and mounting of electronic components within a range that can be simultaneously held by the nozzles 10 of the mounting head 3.

In the electronic component mounting apparatus to which the present method can be applied, as shown in FIGS. 1, 4 and 5, the control unit 9 supplies the electronic components within a range that can be simultaneously held by the nozzles 10 of the mounting head 3. And a recording medium (not shown) such as a floppy disk or a hard disk storing an installation program 13 'for individually instructing the mounting order and the mounting order are mounted in the control unit 9 and are an input / output unit for this mounting. CRT,
It also has an operation unit 8 such as a keyboard. Also, FIG.
The mounting program 13 'in 1 is a component supply order 1 for designating the supply order of electronic components in the conventional mounting program configuration.
10 is added and the mounting number 10 is specified to specify the supply order of electronic components.
It is designed to use 1.

FIG. 2 is a flow chart showing the outline of the mounting procedure of the electronic component mounting apparatus according to this method, and FIG. 3 is an explanatory diagram showing the outline of the operation of the electronic component mounting apparatus according to this method. Figure 1
3 and 4 and 5, the electronic component mounting apparatus is
The component supply unit 1 is equipped with the required number of electronic components for mounting, and the nozzles 10 of the mounting head 3 hold the required electronic components and mount them on the printed circuit board 5. Here, components are sequentially supplied by the mounting head 3 having the four nozzles 10. Reference numerals a, b, c, and e in FIG. 3 indicate the correspondence relationship between the electronic component 11 supplied from the component supply unit 1 and held by the nozzle 10 of the mounting head 3 and the mounting position on the printed circuit board 5. Shows.

Before the start of production, the operator operates the operation unit 8 to install the mounting program 13 'in the storage unit 12 such as the internal memory of the control unit 9. As the mounting program 13 ', a program that is manually created in advance and stored in a storage medium is used.

When the production is started, the control section 9 first calls the mounting program 13 'from the storage section 12 by the mounting start processing step of S1 in FIG. Indicate the step in row N0.

[0020]

[Table 1]

According to this instruction, initial processing of various control target parts and mechanical drive parts is executed, and the printed circuit board 5 is set on the mounting table 2.

Then, the control section 9 performs the following four steps of the mounting program 13 'in the component supplying step of S2.
Read as a group.

[0023]

[Table 2]

That is, as an instruction of the electronic component supply order, from the component supply order 110, the batch holding instruction 107, which means that the nozzles 10 of the mounting head 3 can hold simultaneously, is T1 and the four data N. _Z 1, N _Z 2, N
Read _Z 3 and N _Z 4. The supply order specified by the data N _Z 1, N _Z 2, N _Z 3, N _Z 4 of the part supply order 110 (independent of the mounting order of the mounting number 101, manually specified when the mounting program 13 ′ is created. Electronic parts are taken out from the parts supply unit 1 in the order of supply, and supply processing is executed (in FIG. 3, the electronic parts are collectively taken out from the nearest a, b, and c supply positions, and then one is skipped. Removed from the supply position).

In the component outage detection processing step of S3, the presence or absence of the component outage is determined, and when the component outage occurs, for example, the parts cassette in use in the component supply unit 1 is in a standby state where the same kind of components can be supplied. Perform predetermined processing such as switching to the parts cassette.

Next, in the positioning component mounting processing step of S4, the four electronic components which are first taken out from the component supply unit 1 and held in the nozzle 10 of the mounting head 3 are mounted in the mounting program 1.
As the instruction of the mounting order of the 3 ′ electronic component, the mounting number 101
Printing on the mounting table 2 in the mounting order designated as N4, N2, N1, and N3 (mounting order specified manually when the mounting program 13 'was created independently of the supply order of the component supply order 110). Mounting position coordinate X1 specified by N4, N2, N1, and N3 of mounting number 101 on board 5.
03, coordinate Y104, and perform accurate positioning while performing appropriate control processing specified by the control command 102 on the target component by the control unit 9 (in FIG. 3, the nearest e, b, a, and c Positioned in order to the mounting position).

In the mounting target component processing determination step of S5, the next mounting number N5 / component supply order N _Z 5 (collective holding instruction T
2) Subsequent mounting target component processing is determined, and the above steps S2 to S5 are performed until the mounting number END / component supply order Z _Ze (collective holding instruction Te) at which the mounting production of one printed circuit board 5 is completed.
When the mounting is completed by repeating (the electronic components are sequentially taken out from the nearest k, 1, m, and n supply positions in FIG. 3), the mounting end processing step of S6 is executed.

As described above, in the present embodiment, the electronic component supply order and the mounting order are not in a one-to-one correspondence, but within a range in which the nozzles 10 of the mounting head 3 can simultaneously hold the electronic parts. Since the order of both supply and mounting can be specified independently of each other, for example, the mounting order of electronic components can be prioritized, and the supply order can be optimized within a range that can be simultaneously held by each nozzle of the mounting head. As a result, the efficiency can be improved for all the work.

Further, the control unit 9 controls each nozzle 1 of the mounting head 3.
The operator operates the operation unit 8 to operate a storage medium storing an installation program 13 ′ for independently instructing the order of supply and mounting, within a range that can be simultaneously held by 0, and the control unit 9
By rewritably mounting it in the storage unit 12, the mounting program 13 'can be newly created, saved, reused for production as required, or separately edited or changed. The mounting program 13 'can be centrally managed by the host computer and transferred by communication means, so that the mounting program 13' can be easily managed and backed up. In this way, a more suitable mounting program 13 'can be obtained.

In the above embodiment, the mounting head 3 is used.
The case where four nozzles 10 are arranged in series has been exemplified.
It may be arranged in parallel, and the number of nozzles is 2
Of course, the number may be three or five or more.

[0031]

As is apparent from the above description, according to the method of the present invention, the order of both supply and mounting of electronic components can be specified independently within a range that can be simultaneously held by each nozzle of the mounting head. Then, for example, the mounting order of electronic components can be prioritized, and the supply order can be optimized within a range that can be simultaneously held by the nozzles of the mounting head. As a result, the efficiency can be improved for all the work.

Further, according to the apparatus capable of embodying the method of the present invention, the instruction parts of the electronic component supply order and the mounting order in the mounting program of the storage medium mounted in the control section are independently created by the operation of the input / output section. Since it is possible to edit, change, etc., a more suitable mounting program can be obtained.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a configuration example of a mounting program embodying an electronic component mounting method according to an embodiment of the present invention.

FIG. 2 is a flowchart showing a mounting procedure according to the present method.

FIG. 3 is an explanatory diagram showing an operation of the electronic component mounting apparatus according to the present method.

FIG. 4 is an external perspective view showing a schematic configuration of an example of a general electronic component mounting apparatus.

FIG. 5 is an external perspective view showing a schematic configuration in another example of a general electronic component mounting apparatus.

FIG. 6 is an explanatory diagram showing the vicinity of a nozzle of the electronic component mounting apparatus.

FIG. 7 is an explanatory diagram showing a configuration example of a mounting program that embodies a conventional method.

[Explanation of symbols]

1 Parts supply department 2 Mounting table 3 mounting head 5 printed circuit boards 8 Operation unit (input / output unit) 9 control unit 10 nozzles 12 Memory 13 'mounting program 101 mounting number 102 control commands 103 coordinate X 104 coordinate Y 110 Parts supply order 105 part number 106 Auxiliary command

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Claims (7)

(57) [Claims] According to an instruction from a controller, a plurality of electronic components sequentially supplied from a component supply unit are temporarily held by a plurality of nozzles of a mounting head, and then sequentially mounted at a mounting position on a printed circuit board. In the component mounting method, the order of supplying electronic components held by each nozzle of the mounting head
The order of mounting the electronic components held by each nozzle
Is an electronic component mounting method characterized by independent instructions. 2. A mounting professional for performing various mounting controls.
In addition to the instruction of the mounting order of electronic parts in Gram,
The electronic component mounting method according to claim 1, wherein the electronic component supply order is instructed . 3. An electronic component for sequentially holding a plurality of electronic components sequentially supplied from a component supply unit by a plurality of nozzles of a mounting head according to an instruction from a control unit and then sequentially mounting the electronic components at a mounting position on a printed circuit board. electronics in the component mounting apparatus, the control unit holds at each nozzle of the mounting head
The order of product supply is determined by the
An electronic component mounting apparatus comprising: a mounting program that gives an instruction independent of the mounting order, and supplies and mounts electronic components based on the mounting program. 4. The electronic component according to claim 3 , wherein the mounting program can be newly created, saved, reused, separately edited, or changed, and the mounting program is rewritably mounted on a control unit. Mounting device. Wherein said mounting program is managed by the host computer, according to claim 3 also can be transferred by the communication means
Is an electronic component mounting apparatus described in 4 . 6. An electronic device for sequentially holding a plurality of electronic components sequentially supplied from a component supply unit by a plurality of nozzles of a mounting head according to an instruction from a control unit and then sequentially mounting the electronic components at a mounting position on a printed circuit board. In the component mounting apparatus, the storage unit stores a mounting program that instructs the supply order of the electronic components held by the nozzles of the mounting head independently of the mounting order of the electronic components held by the nozzles. An electronic component mounting apparatus comprising: a medium; and an input / output unit for rewritably mounting the mounting program on a control unit from the storage medium. 7. A mounting program, in addition to the mounting order of electronic components, electronic component mounting apparatus according to claim 3 or 6, wherein was set to instruct the supply order of the electronic components.