JP3361763B2 - Electronic component supply method in electronic component mounting apparatus - Google Patents
Electronic component supply method in electronic component mounting apparatusInfo
- Publication number
- JP3361763B2 JP3361763B2 JP02707799A JP2707799A JP3361763B2 JP 3361763 B2 JP3361763 B2 JP 3361763B2 JP 02707799 A JP02707799 A JP 02707799A JP 2707799 A JP2707799 A JP 2707799A JP 3361763 B2 JP3361763 B2 JP 3361763B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component supply
- supply unit
- electronic
- unit group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】Detailed Description of the Invention
【０００１】[0001]
【発明の属する技術分野】本発明は、複数の電子部品供
給ユニットから、実装ヘッドによって、順次電子部品を
取り出してプリント基板に実装する電子部品実装装置に
おける電子部品の供給方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for supplying electronic components in an electronic component mounting apparatus for sequentially picking up electronic components from a plurality of electronic component supply units by a mounting head and mounting them on a printed circuit board.
【０００２】[0002]
【従来の技術】プリント基板に対して所定の順序で電子
部品を自動的に実装していく電子部品実装装置において
は、実装すべき電子部品の種類に対応して複数の電子部
品供給ユニットが設けられている。そして、先端に部品
吸着ノズルを有した部品実装ヘッドが、あらかじめ設定
された部品実装順序にしたがい、所定の電子部品を保有
する電子部品供給ユニットの部品取り出し口まで移動
し、そこで電子部品を吸着してプリント基板への実装動
作を行なっていく。2. Description of the Related Art In an electronic component mounting apparatus for automatically mounting electronic components on a printed circuit board in a predetermined order, a plurality of electronic component supply units are provided corresponding to the types of electronic components to be mounted. Has been. Then, the component mounting head having the component suction nozzle at the tip moves to the component pick-up port of the electronic component supply unit holding the predetermined electronic component according to the preset component mounting order, and sucks the electronic component there. The mounting operation on the printed circuit board is performed.
【０００３】ところで、従来の電子部品実装装置では、
同一種類の電子部品に対して電子部品供給ユニットを、
実装する電子部品の使用する数に応じて一台または複数
台用意するとともに、実装すべき電子部品の種類と数に
応じてそれらの電子部品供給ユニットを本体上に設置し
ていた。したがって、それら本体上に設置した一連の電
子部品供給ユニットは、実装する電子部品の種類ごと
に、常に部品供給動作に関与しており、一の電子部品の
種類を保有する一台または複数台の電子部品供給ユニッ
トが部品切れとなった場合には、その都度実装動作を停
止し、部品切れとなった電子部品供給ユニットに新たな
電子部品を補充していた。By the way, in the conventional electronic component mounting apparatus,
An electronic component supply unit for the same type of electronic component,
One or a plurality of electronic components are prepared according to the number of electronic components to be mounted, and those electronic component supply units are installed on the main body according to the type and number of electronic components to be mounted. Therefore, a series of electronic component supply units installed on the main body is always involved in the component supply operation for each type of electronic component to be mounted, and one or a plurality of electronic component types having one type of electronic component are held. When the electronic component supply unit runs out of components, the mounting operation is stopped each time, and a new electronic component is replenished to the electronic component supply unit that has run out of components.
【０００４】[0004]
【発明が解決しようとする課題】上述したように、従来
は一の電子部品の種類を保有する電子部品供給ユニット
に部品切れが生ずるたびに、電子部品実装装置の動作を
停止して新たな電子部品を補充しなければならなかった
ので、電子部品実装装置の稼動率が低いという問題があ
った。As described above, conventionally, whenever an electronic component supply unit holding one type of electronic component runs out of components, the operation of the electronic component mounting apparatus is stopped and a new electronic component is mounted. Since the components had to be replenished, there was a problem that the operation rate of the electronic component mounting apparatus was low.
【０００５】また、電子部品供給ユニットの部品切れは
従来から公知のリトライ機能によって検出できるが、部
品切れはユニットの配置に関係なく順不同にいずれかの
電子部品供給ユニットに発生し、その時間的間隔もばら
ばらであるため、部品切れを生ずるたびに作業員は部品
切れの生じた電子部品供給ユニットに電子部品を補充し
なければならない煩わしさがあった。Also, although the electronic component supply unit can be detected by the conventionally known retry function, the component exhaustion occurs in any one of the electronic component supply units in any order regardless of the arrangement of the units, and the time interval between them may be detected. Since they are disjointed, each time there is a shortage of components, the worker has to replenish the electronic component supply unit in which the shortage of components has been made with electronic components.
【０００６】本発明は、このような従来の課題を解決す
るためになされたもので、電子部品実装装置の動作をで
きるだけ停止させることなく部品の補充作業を行なおう
とするものであって、しかもその補充作業が容易な電子
部品供給方法の提供を目的とする。The present invention has been made in order to solve such a conventional problem, and is intended to replenish components without stopping the operation of the electronic component mounting apparatus as much as possible. It is an object of the present invention to provide an electronic component supply method that facilitates the refilling work.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するた
め、請求項１に係る発明は、固定して配置された複数の
電子部品供給ユニットを有し、これらの電子部品供給ユ
ニットから順次所定の電子部品を取り出してプリント基
板に実装する移動可能なヘッドを備え、かつ、プリント
基板に実装する電子部品をそれぞれ保有する複数台の電
子部品供給ユニットにより電子部品供給ユニット群を形
成するとともに、この電子部品供給ユニット群を前記プ
リント基板の移送路の両側に対向して複数組配置した電
子部品実装装置における電子部品供給方法であって、前
記複数組の電子部品供給ユニット群から一組の電子部品
供給ユニット群を選択して、この選択した電子部品供給
ユニット群の電子部品供給ユニットのみから電子部品を
取り出してプリント基板に実装し、前記選択した電子部
品供給ユニット群内のいずれの電子部品供給ユニットに
も実装しようとする電子部品がないときには、前記プリ
ント基板の移送路の反対側に配置された他の一組の電子
部品供給ユニット群から、直ちに電子部品を取り出して
プリント基板に実装する方法としてある。In order to achieve the above object, the invention according to claim 1 has a plurality of electronic component supply units fixedly arranged, and a predetermined number of electronic component supply units are sequentially arranged from these electronic component supply units. An electronic component supply unit group is formed by a plurality of electronic component supply units each having a movable head for taking out electronic components and mounting them on a printed circuit board, and each of which has an electronic component mounted on the printed circuit board. An electronic component supply method in an electronic component mounting apparatus in which a plurality of component supply unit groups are arranged facing each other on both sides of a transfer path of the printed circuit board, wherein one set of electronic component supply is performed from the plurality of electronic component supply unit groups. select unit group, print only the electronic component feeding unit of the selected electronic component feeding unit group takes out an electronic component When there is no electronic component to be mounted on a board and to be mounted on any of the selected electronic component supply units in the selected electronic component supply unit group, another set arranged on the opposite side of the transfer path of the printed circuit board. In this method, the electronic components are immediately taken out from the electronic component supply unit group and mounted on the printed circuit board.
【０００８】また、請求項２に係る発明は、請求項１記
載の電子部品供給方法において、前記電子部品供給ユニ
ット群に同一種類の電子部品を供給する複数個の電子部
品供給ユニットを設け、該複数個の電子部品供給ユニッ
トのいずれにも同一種類の電子部品がなくなったとき、
電子部品を取り出す電子部品供給ユニット群を他の一組
の電子部品供給ユニット群に切り換える方法としてあ
る。According to a second aspect of the present invention, in the electronic component supply method according to the first aspect, a plurality of electronic component supply units for supplying the same type of electronic components to the electronic component supply unit group are provided, When the same type of electronic component is no longer present in any of the multiple electronic component supply units,
Another set of electronic component supply unit groups that take out electronic components
This is a method of switching to the electronic component supply unit group.
【０００９】上述した本発明の電子部品供給方法によれ
ば、部品供給動作に関与していた電子部品供給ユニット
群のうちのいずれかの電子部品供給ユニットに部品切れ
が生じた場合、他に用意してある電子部品供給ユニット
群に切り換えて部品供給動作を続行する。According to the above-described electronic component supply method of the present invention, if one of the electronic component supply units involved in the component supply operation is out of components, another component is prepared. The electronic component supply unit group is switched over to continue the component supply operation.
【００１０】[0010]
【発明の実施の形態】以下、本発明の一実施例について
図面を参照して説明する。まず、図２にもとづいて本発
明の電子部品供給方法が実施される電子部品実装装置の
実施例の概要を説明する。BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. First, an outline of an embodiment of an electronic component mounting apparatus in which the electronic component supply method of the present invention is implemented will be described based on FIG.
【００１１】同図に示す電子部品実装装置は、プリント
基板Ｐの移送路１０上に設けた搬送コンベア１１と、電
子部品を供給する二組の電子部品供給ユニット群２０，
３０と、電子部品供給ユニット群２０又は３０から電子
部品を取り出してプリント基板Ｐ上に実装する実装ヘッ
ド４０とを備えている。The electronic component mounting apparatus shown in FIG. 1 includes a conveyor 11 provided on a transfer path 10 for a printed circuit board P, two sets of electronic component supply unit groups 20 for supplying electronic components,
30 and a mounting head 40 that picks up an electronic component from the electronic component supply unit group 20 or 30 and mounts the electronic component on the printed circuit board P.
【００１２】二組の電子部品供給ユニット群２０及び３
０は、移送路１０の前後両側にそれぞれ対向して配置し
てある。これら各電子部品供給ユニット群２０，３０
は、それぞれプリント基板Ｐに実装すべき全種類の電子
部品をそれぞれ保有する複数台の電子部品供給ユニット
２１ａ，２１ｂ，・・（３１ａ，３１ｂ，・・）からな
っている。ここで、特に実装個数の多い電子部品は、二
台以上の電子部品供給ユニットに保有させてある。これ
ら各電子部品供給ユニット２１ａ，２１ｂ，・・（３１
ａ，３１ｂ，・・）は、各一枚の取付け基台２２（３
２）上に並べて設けられている。したがって、各電子部
品供給ユニット群２０，３０は、取付け基台２２（３
２）ごと電子部品実装装置の本体１に着脱することがで
きる。Two sets of electronic component supply unit groups 20 and 3
0s are arranged on both front and rear sides of the transfer path 10 so as to face each other. These electronic component supply unit groups 20, 30
Is composed of a plurality of electronic component supply units 21a, 21b, ... (31a, 31b, ...) Each of which holds all types of electronic components to be mounted on the printed circuit board P. Here, an electronic component having a particularly large number of mounted components is held in two or more electronic component supply units. Each of these electronic component supply units 21a, 21b, ... (31
a, 31b, ...) are each one mounting base 22 (3
2) They are provided side by side. Therefore, each of the electronic component supply unit groups 20 and 30 has a mounting base 22 (3
2) can be attached to and detached from the main body 1 of the electronic component mounting apparatus.
【００１３】このような構成の電子部品実装装置は、搬
送コンベア１１によって所定位置にプリント基板Ｐを配
置した後、いずれか一方の電子部品供給ユニット群２０
又は３０から実装ヘッド４０が電子部品を吸着し、プリ
ント基板Ｐの所定位置に実装する。In the electronic component mounting apparatus having such a configuration, after the printed circuit board P is arranged at a predetermined position by the transport conveyor 11, one of the electronic component supply unit groups 20 is placed.
Alternatively, the mounting head 40 picks up an electronic component from 30 and mounts it on a predetermined position of the printed board P.
【００１４】次に、上述した電子部品実装装置における
電子部品供給方法を、図１のフローチャートにもとづい
て説明する。電子部品の供給は、いずれか一方の電子部
品供給ユニット群２０又は３０のみから行なわれる。い
ま、本体１の後部側にある電子部品供給ユニット群２０
から電子部品の供給を行なう旨、図示しない制御装置か
ら指令が出されると（ステップ（以下、単にＳと略す）
１）、実装ヘッド４０はその選択された電子部品供給ユ
ニット群２０から電子部品の吸着動作を行なう。[0014] Next, an electronic component supplying method in the above-described electronic component mounting apparatus will be described with reference to the flowchart of FIG. The electronic components are supplied from only one of the electronic component supply unit groups 20 or 30. Now, the electronic component supply unit group 20 on the rear side of the main body 1
When a command is issued from a control device (not shown) to supply electronic components from the controller (step (hereinafter simply abbreviated as S))
1), the mounting head 40 picks up electronic components from the selected electronic component supply unit group 20.
【００１５】すなわち、電子部品供給ユニット群２０に
設けられた電子部品供給ユニット２１ａ，２１ｂ，・・
の中から実装すべき所定の電子部品を保有する電子部品
供給ユニットを選択し（Ｓ２）、実装ヘッド４０がその
電子部品実装装置の部品取り出し口ａの上方まで移動す
る。そして、その部品取り出し口ａの上方から実装ヘッ
ド４０が下降して電子部品の吸着動作を行なう（Ｓ
３）。That is, the electronic component supply units 21a, 21b, ... Provided in the electronic component supply unit group 20.
An electronic component supply unit holding a predetermined electronic component to be mounted is selected from among the above (S2), and the mounting head 40 is moved to above the component ejection port a of the electronic component mounting apparatus. Then, the mounting head 40 descends from above the component take-out port a to perform the suction operation of the electronic component (S).
3).
【００１６】続いて、実装ヘッド４０に電子部品が吸着
保持されているか否かを検出し（Ｓ４）、吸着保持され
ている場合にはその電子部品をプリント基板Ｐに実装す
る（Ｓ５）。一方、実装ヘッド４０に電子部品が吸着保
持されていなかった場合には、再度同じ電子部品供給ユ
ニットに対して電子部品の吸着動作を行なう。この繰返
し動作（Ｓ６）を一定回数行ない（これをリトライ機能
という）、それでもなお、実装ヘッド４０に電子部品が
吸着されない場合には、その電子部品供給ユニットは
「部品切れ」と判定し、制御装置にその旨を記憶させる
（Ｓ７）。Subsequently, it is detected whether or not the electronic component is sucked and held by the mounting head 40 (S4), and if the electronic component is sucked and held, the electronic component is mounted on the printed board P (S5). On the other hand, if the electronic component is not sucked and held by the mounting head 40, the electronic component suction operation is performed again on the same electronic component supply unit. If the electronic component is not adsorbed by the mounting head 40 by repeating this repeating operation (S6) a certain number of times (this is called a retry function), the electronic component supply unit determines that the component is out, and the control device To that effect is stored (S7).
【００１７】次いで、同じ電子部品供給ユニット群２０
の中に、「部品切れ」と判定された電子部品供給ユニッ
トと同一種類の電子部品を保有する電子部品供給ユニッ
トがあるか否かを検索する（Ｓ８）。これをオルタネー
ト機能といい、あらかじめ制御装置に電子部品供給ユニ
ット群２０内の電子部品供給ユニット２１ａ，２１ｂ，
・・についての「電子部品供給ユニットの型式」、「保
有する電子部品の形式，寸法」等の情報を記憶してお
き、その情報を検索して行なう。Next, the same electronic component supply unit group 20
It is searched whether or not there is an electronic component supply unit having an electronic component of the same type as the electronic component supply unit determined to be "out of components" (S8). This is called an alternation function, and the control device is previously provided with the electronic component supply units 21a, 21b in the electronic component supply unit group 20,
Information such as "model of electronic component supply unit" and "type and size of electronic component possessed" is stored and retrieved.
【００１８】検索の結果、同一種類の電子部品を保有す
る電子部品供給ユニットが存在した場合には、さらにそ
のユニットが「部品切れ」となっていないかを検査し
（Ｓ９）、「部品切れ」でない場合には、その電子部品
供給ユニットを選択して（Ｓ１０）、実装ヘッド４０に
よって電子部品の吸着動作を行なわせる（Ｓ３）。As a result of the search, when there is an electronic component supply unit holding the same type of electronic component, it is further inspected whether the unit is "part out" (S9) and "part out". If not, the electronic component supply unit is selected (S10), and the mounting head 40 performs the electronic component suction operation (S3).
【００１９】一方、その電子部品供給ユニットも「部品
切れ」の場合には、さらにオルタネート機能を繰返し、
それでもなお同一種類の電子部品を保有しかつ「部品切
れ」でない電子部品供給ユニットが存在しなかったとき
は、本体後部側の電子部品供給ユニット群２０からの部
品供給を打ち切り、その電子部品供給ユニット群２０は
「部品切れ」である旨の信号を制御装置に記憶させ、か
つ信号灯等の表示手段でその旨を表示する。制御装置
は、電子部品供給ユニット群２０において、ある種類の
電子部品が「部品切れ」との信号を受けると、部品の供
給対象ユニットとして電子部品供給ユニット群３０を選
択し（Ｓ１１，Ｓ１２）、Ｓ２〜Ｓ１０の工程を実行
し、電子部品実装装置の動作（実装動作）を停止するこ
となく電子部品の供給動作を行なっていく。On the other hand, when the electronic component supply unit is also “parts out”, the alternate function is further repeated,
If there is still no electronic component supply unit that holds the same type of electronic component and is not "part out", then the component supply from the electronic component supply unit group 20 on the rear side of the main body is terminated, and the electronic component supply unit is terminated. The group 20 causes the control device to store a signal indicating that it is "out of parts", and displays it on a display means such as a signal light. When the electronic device supply unit group 20 receives a signal that an electronic component of a certain type is "parts out", the control device selects the electronic component supply unit group 30 as a component supply target unit (S11, S12), The steps S2 to S10 are executed, and the electronic component supply operation is performed without stopping the operation (mounting operation) of the electronic component mounting apparatus.
【００２０】ただし、電子部品供給ユニット群３０が、
電子部品供給ユニット群２０を選択する以前すでに選択
されていた場合には、その電子部品供給ユニット群３０
も「部品切れ」となっているので、電子部品実装装置の
動作を停止してアラーム等でその旨を作業員に知らせる
（Ｓ１３）。However, the electronic component supply unit group 30 is
If the electronic component supply unit group 20 is already selected before it is selected, the electronic component supply unit group 30 is selected.
Is also “parts out”, the operation of the electronic component mounting apparatus is stopped and an alarm or the like is used to notify the worker of this (S13).
【００２１】もっとも、電子部品供給ユニット群３０で
「部品切れ」となっている電子部品供給ユニットと電子
部品供給ユニット群２０で「部品切れ」となっている電
子部品供給ユニットとでは、供給する電子部品が異なっ
ていることが多いので、このような場合には、電子部品
供給ユニット群３０は「部品切れ」と表示されているに
もかかわらず、電子部品供給ユニット群２０で「部品切
れ」となった部品を供給することも可能である。[0021] However, the electronic component supply unit that is "out of component" in the electronic component supply unit group 30 and the electronic component supply unit that is "out of component" in the electronic component supply unit group 20 are Since the parts are often different, in such a case, the electronic component supply unit group 30 displays “parts out” although the electronic component supply unit group 30 displays “parts out”. It is also possible to supply parts that have become obsolete.
【００２２】また、一方側の電子部品供給ユニット群か
ら部品供給動作が行なわれている間に、「部品切れ」と
なった電子部品供給ユニット群に対し、電子部品の補充
を行なっておき、「部品切れ」の信号をリセットしてお
けば、電子部品実装装置を停止することなく、継続して
電子部品の供給動作を行なうことができる。Also, while the electronic component supply unit group on one side is performing the component supply operation, the electronic component supply unit group which has become "partial" has been replenished with electronic components. By resetting the signal "parts out", it is possible to continuously supply the electronic components without stopping the electronic component mounting apparatus.
【００２３】「部品切れ」の電子部品供給ユニット群に
対する電子部品の補充作業は、取付け基台２２（３２）
を本体１から取り外し機外にて行なうことができる。し
たがって、補充作業は充分広い場所で、実装ヘッドやこ
れを駆動するロボット等がない状態で行なわれるので、
補充作業に際してに危険はともなわない。また、電子部
品の補充は、「部品切れ」の電子部品供給ユニットだけ
でなく、電子部品供給ユニット群の全てのユニットに対
して一括して行なえばよいので、いちいち「部品切れ」
のユニットを捜す必要もなく、補充作業が容易となりし
かも補充漏れの心配もなくなる。The replenishment work of the electronic parts to the "out of parts" electronic parts supply unit group is performed by the mounting base 22 (32).
Can be removed from the main body 1 and performed outside the machine. Therefore, the replenishment work is performed in a sufficiently wide area without the mounting head or the robot for driving the mounting head.
There is no danger during replenishment work. In addition, electronic parts can be replenished not only for electronic parts supply units that are "out of parts" but also for all units in the electronic parts supply unit group, so "out of parts" can be added to each unit.
There is no need to search for a unit, and refilling work becomes easy, and there is no concern about refilling leakage.
【００２４】なお、あらかじめ、電子部品を補充した別
の電子部品供給ユニット群を用意しておき、本体１に実
装してある電子部品供給ユニット群が「部品切れ」とな
った場合にはそのユニット群ごと交換することもでき
る。このようにすると、電子部品の補充作業がより一層
容易となる。If another electronic component supply unit group supplemented with electronic components is prepared in advance and the electronic component supply unit group mounted on the main body 1 becomes "parts out", that unit It is also possible to exchange the entire group. This makes it easier to replenish electronic components.
【００２５】なお、本発明は上述した一実施例に限定さ
れるものではなく、発明の要旨を変更しない範囲で種々
の変形実施が可能である。例えば、電子部品供給ユニッ
ト群は二組に限定されることなく、必要に応じた数の組
だけ用意して、例えば、設置箇所もプリント回路基板移
送路の両側の対向する位置に２個ずつ設置することも可
能であり、その設置箇所もプリント回路基板移送路の両
側の対向する位置でなくともよい。The present invention is not limited to the above-described embodiment, and various modifications can be made without changing the gist of the invention. For example, the electronic component supply unit group is not limited to two sets, and as many sets as necessary are prepared. For example, two installation parts are installed at opposite positions on both sides of the printed circuit board transfer path. It is also possible that the installation locations are not at opposite positions on both sides of the printed circuit board transfer path.
【００２６】また、従来の電子部品供給ユニットと本発
明の電子部品供給ユニット群とを組み合わせて使用する
ことも可能であり、あるいは、取付け基台を介在するこ
となく、直接本体上に電子部品供給ユニットを取り付け
た状態のままで、電子部品供給ユニット群として制御す
るようにしてもよい。It is also possible to use the conventional electronic component supply unit and the electronic component supply unit group of the present invention in combination, or to supply the electronic component directly onto the main body without interposing a mounting base. You may make it control as an electronic component supply unit group with the unit attached.
【００２７】[0027]
【発明の効果】以上説明したように、本発明の電子部品
供給方法によれば、一の電子部品供給ユニット群に「部
品切れ」が生じた場合、別の電子部品供給ユニット群か
ら電子部品を供給するようにしたので、電子部品実装装
置を停止させることなく稼動率の向上を図ることができ
る。As described above, according to the electronic component supply method of the present invention, when "a component exhaustion" occurs in one electronic component supply unit group, the electronic component is supplied from another electronic component supply unit group. Since it is supplied, it is possible to improve the operating rate without stopping the electronic component mounting apparatus.
【図１】本発明の実施例に係る電子部品供給方法を説明
するためのフローチャートである。FIG. 1 is a flowchart illustrating an electronic component supply method according to an embodiment of the present invention.
【図２】同方法を実施するための電子部品実装装置の一
例を示す概略斜視図である。FIG. 2 is a schematic perspective view showing an example of an electronic component mounting apparatus for carrying out the method.
１０ 移送路
１１ 搬送コンベア
２０，３０ 電子部品供給ユニット群
２１ａ，２１ｂ，・・，３１ａ，３１ｂ 電子部品供給
ユニット
２２，３２ 取付け基台
４０ 実装ヘッド10 transfer path 11 transport conveyor 20, 30 electronic component supply unit group 21a, 21b, ..., 31a, 31b electronic component supply unit 22, 32 mounting base 40 mounting head
フロントページの続き (56)参考文献 特開 昭62−216400（ＪＰ，Ａ) 特開 平２−172632（ＪＰ，Ａ) 特開 平３−221334（ＪＰ，Ａ) 特開 平４−10700（ＪＰ，Ａ) 特開 平10−150294（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 13/02 Continuation of the front page (56) Reference JP 62-216400 (JP, A) JP 2-172632 (JP, A) JP 3-221334 (JP, A) JP 4-10700 (JP , A) JP-A-10-150294 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H05K 13/02
Claims (2)
ユニットを有し、これらの電子部品供給ユニットから順
次所定の電子部品を取り出してプリント基板に実装する
移動可能なヘッドを備え、かつ、プリント基板に実装す
る電子部品をそれぞれ保有する複数台の電子部品供給ユ
ニットにより電子部品供給ユニット群を形成するととも
に、この電子部品供給ユニット群を前記プリント基板の
移送路の両側に対向して複数組配置した電子部品実装装
置における電子部品供給方法であって、 前記複数組の電子部品供給ユニット群から一組の電子部
品供給ユニット群を選択して、この選択した電子部品供
給ユニット群の電子部品供給ユニットのみから電子部品
を取り出してプリント基板に実装し、 前記選択した電子部品供給ユニット群内のいずれの電子
部品供給ユニットにも実装しようとする電子部品がない
ときには、前記プリント基板の移送路の反対側に配置さ
れた他の一組の電子部品供給ユニット群から、直ちに電
子部品を取り出してプリント基板に実装することを特徴
とした電子部品実装装置における電子部品供給方法。1. A plurality of electronic component supply units fixedly arranged, and a movable head for sequentially taking out predetermined electronic components from these electronic component supply units and mounting them on a printed circuit board, and An electronic component supply unit group is formed by a plurality of electronic component supply units each having an electronic component to be mounted on the printed circuit board, and a plurality of electronic component supply unit groups are opposed to each other on both sides of the transfer path of the printed circuit board. An electronic component supply method in an arranged electronic component mounting apparatus, wherein a set of electronic component supply unit groups is selected from the plurality of sets of electronic component supply unit groups, and electronic component supply of the selected electronic component supply unit group is performed. mounted on a printed board from the unit only retrieves the electronic components, any of said selected electronic component feeding unit group When there is no electronic component to be mounted in the child component supply unit, the electronic component is immediately taken out from another set of electronic component supply unit groups arranged on the opposite side of the transfer path of the printed circuit board to the printed circuit board. An electronic component supply method in an electronic component mounting apparatus, which is characterized by mounting.
て、 前記電子部品供給ユニット群に同一種類の電子部品を供
給する複数個の電子部品供給ユニットを設け、該複数個
の電子部品供給ユニットのいずれにも同一種類の電子部
品がなくなったとき、電子部品を取り出す電子部品供給
ユニット群を他の一組の電子部品供給ユニット群に切り
換えることを特徴とした電子部品実装装置における電子
部品供給方法。2. The electronic component supply method according to claim 1, wherein the electronic component supply unit group is provided with a plurality of electronic component supply units for supplying electronic components of the same type, and the plurality of electronic component supply units are provided. An electronic component supply method in an electronic component mounting apparatus, characterized in that when there is no electronic component of the same type in any of them, the electronic component supply unit group for taking out the electronic component is switched to another set of electronic component supply unit groups.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02707799A JP3361763B2 (en) | 1999-02-04 | 1999-02-04 | Electronic component supply method in electronic component mounting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02707799A JP3361763B2 (en) | 1999-02-04 | 1999-02-04 | Electronic component supply method in electronic component mounting apparatus |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05973292A Division JP3176691B2 (en) | 1992-02-14 | 1992-02-14 | Electronic component supply method in electronic component mounting apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11284391A JPH11284391A (en) | 1999-10-15 |
| JP3361763B2 true JP3361763B2 (en) | 2003-01-07 |
Family
ID=12211021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02707799A Expired - Fee Related JP3361763B2 (en) | 1999-02-04 | 1999-02-04 | Electronic component supply method in electronic component mounting apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3361763B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5913048B2 (en) * | 2012-11-01 | 2016-04-27 | ヤマハ発動機株式会社 | Electronic component mounting device |
-
1999
- 1999-02-04 JP JP02707799A patent/JP3361763B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11284391A (en) | 1999-10-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3313224B2 (en) | Electronic component mounting equipment | |
| JP3728350B2 (en) | Component mounting method and component mounting apparatus | |
| JPH09130084A (en) | Parts mounter and parts mounting facility | |
| KR19980070362A (en) | Electronic component mounting method and electronic component mounting device | |
| JP3361763B2 (en) | Electronic component supply method in electronic component mounting apparatus | |
| JP3176691B2 (en) | Electronic component supply method in electronic component mounting apparatus | |
| JP4676302B2 (en) | Surface mounter and control method of surface mounter | |
| JPH10261893A (en) | Electronic part feeding mehtod and device | |
| JP3571870B2 (en) | Electronic component supply device | |
| JP4087633B2 (en) | Component mounting method, component mounter, and mounting order determination program | |
| JPH09283986A (en) | Method and device for supplying part | |
| JP2836057B2 (en) | Mounter feeder placement method | |
| JP2000252684A (en) | Surface mounting apparatus provided with tray feeder | |
| JP2516913B2 (en) | Parts replenishment method | |
| KR100213874B1 (en) | Electronic component tape and system for using the said tape | |
| JP3335675B2 (en) | Component mounting method and component mounting machine | |
| JP2000091795A (en) | Apparatus for mounting electronic component | |
| JP3552806B2 (en) | Component mounting method | |
| JP7295966B2 (en) | Holder management device and display method | |
| JP4117748B2 (en) | Control method of electronic component mounting apparatus | |
| JP3821526B2 (en) | Component mounting equipment | |
| JPH11289189A (en) | Method and device for mounting parts | |
| JP2786713B2 (en) | Component mounting method | |
| JP7420698B2 (en) | Management device, component mounting system equipped with the same, and management method | |
| WO2024122019A1 (en) | Feeder storage |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071018 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081018 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091018 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091018 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101018 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101018 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111018 Year of fee payment: 9 |
|
| LAPS | Cancellation because of no payment of annual fees |