JP5737840B2 - ミスト化防止成分を有する組成物 - Google Patents
ミスト化防止成分を有する組成物 Download PDFInfo
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- JP5737840B2 JP5737840B2 JP2009526722A JP2009526722A JP5737840B2 JP 5737840 B2 JP5737840 B2 JP 5737840B2 JP 2009526722 A JP2009526722 A JP 2009526722A JP 2009526722 A JP2009526722 A JP 2009526722A JP 5737840 B2 JP5737840 B2 JP 5737840B2
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- KBGVNNBYWSFXEL-UHFFFAOYSA-N bis[[bis(ethenyl)-phenylsilyl]oxy]-diphenylsilane Chemical compound C=1C=CC=CC=1[Si](C=C)(C=C)O[Si](C=1C=CC=CC=1)(C=1C=CC=CC=1)O[Si](C=C)(C=C)C1=CC=CC=C1 KBGVNNBYWSFXEL-UHFFFAOYSA-N 0.000 description 1
- MFWYAJVOUCTAQI-UHFFFAOYSA-N bis[[ethenyl(dimethyl)silyl]oxy]-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C=C MFWYAJVOUCTAQI-UHFFFAOYSA-N 0.000 description 1
- QCZJJBSPIBMMEF-UHFFFAOYSA-N bis[[ethenyl(diphenyl)silyl]oxy]-diphenylsilane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C=C)O[Si](C=1C=CC=CC=1)(C=1C=CC=CC=1)O[Si](C=C)(C=1C=CC=CC=1)C1=CC=CC=C1 QCZJJBSPIBMMEF-UHFFFAOYSA-N 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000011111 cardboard Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- YGZSVWMBUCGDCV-UHFFFAOYSA-N chloro(methyl)silane Chemical compound C[SiH2]Cl YGZSVWMBUCGDCV-UHFFFAOYSA-N 0.000 description 1
- NNKJLYMBVRDUEI-UHFFFAOYSA-N chloro-tris(ethenyl)silane Chemical compound C=C[Si](Cl)(C=C)C=C NNKJLYMBVRDUEI-UHFFFAOYSA-N 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000001047 cyclobutenyl group Chemical group C1(=CCC1)* 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- JJRDHFIVAPVZJN-UHFFFAOYSA-N cyclotrisiloxane Chemical compound O1[SiH2]O[SiH2]O[SiH2]1 JJRDHFIVAPVZJN-UHFFFAOYSA-N 0.000 description 1
- MQUBEBJFHBANKV-UHFFFAOYSA-N di(propan-2-yl)silicon Chemical compound CC(C)[Si]C(C)C MQUBEBJFHBANKV-UHFFFAOYSA-N 0.000 description 1
- MAYIDWCWWMOISO-UHFFFAOYSA-N dichloro-bis(ethenyl)silane Chemical compound C=C[Si](Cl)(Cl)C=C MAYIDWCWWMOISO-UHFFFAOYSA-N 0.000 description 1
- VTEHVUWHCBXMPI-UHFFFAOYSA-N dichloro-bis(prop-2-enyl)silane Chemical compound C=CC[Si](Cl)(Cl)CC=C VTEHVUWHCBXMPI-UHFFFAOYSA-N 0.000 description 1
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- NWQIWFOQNHTTIA-UHFFFAOYSA-N diethoxy-bis(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(CC=C)OCC NWQIWFOQNHTTIA-UHFFFAOYSA-N 0.000 description 1
- UCXUKTLCVSGCNR-UHFFFAOYSA-N diethylsilane Chemical compound CC[SiH2]CC UCXUKTLCVSGCNR-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- AOJUJJFLGKIMAZ-UHFFFAOYSA-N dimethyl(propyl)silane Chemical compound CCC[SiH](C)C AOJUJJFLGKIMAZ-UHFFFAOYSA-N 0.000 description 1
- ZDSFBVVBFMKMRF-UHFFFAOYSA-N dimethyl-bis(prop-2-enyl)silane Chemical compound C=CC[Si](C)(C)CC=C ZDSFBVVBFMKMRF-UHFFFAOYSA-N 0.000 description 1
- BPMIDHXKNWMZGV-UHFFFAOYSA-N dimethyl-bis[tris(ethenyl)silyloxy]silane Chemical compound C=C[Si](C=C)(C=C)O[Si](C)(C)O[Si](C=C)(C=C)C=C BPMIDHXKNWMZGV-UHFFFAOYSA-N 0.000 description 1
- UBHZUDXTHNMNLD-UHFFFAOYSA-N dimethylsilane Chemical compound C[SiH2]C UBHZUDXTHNMNLD-UHFFFAOYSA-N 0.000 description 1
- UTUAUBOPWUPBCH-UHFFFAOYSA-N dimethylsilylidene(dimethyl)silane Chemical compound C[Si](C)=[Si](C)C UTUAUBOPWUPBCH-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- JFBGHMBNYAOHHQ-UHFFFAOYSA-N diphenyl-bis[tris(ethenyl)silyloxy]silane Chemical compound C=1C=CC=CC=1[Si](O[Si](C=C)(C=C)C=C)(O[Si](C=C)(C=C)C=C)C1=CC=CC=C1 JFBGHMBNYAOHHQ-UHFFFAOYSA-N 0.000 description 1
- ABSBLRNNSMGDFG-UHFFFAOYSA-N diphenyl-triphenylsilyloxy-tris(ethenyl)silyloxysilane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(O[Si](C=C)(C=C)C=C)O[Si](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 ABSBLRNNSMGDFG-UHFFFAOYSA-N 0.000 description 1
- VDCSGNNYCFPWFK-UHFFFAOYSA-N diphenylsilane Chemical compound C=1C=CC=CC=1[SiH2]C1=CC=CC=C1 VDCSGNNYCFPWFK-UHFFFAOYSA-N 0.000 description 1
- BXLNWOAYQXBHCY-UHFFFAOYSA-N diphenylsilylidene(diphenyl)silane Chemical compound C1=CC=CC=C1[Si](C=1C=CC=CC=1)=[Si](C=1C=CC=CC=1)C1=CC=CC=C1 BXLNWOAYQXBHCY-UHFFFAOYSA-N 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- KKZSBFWLCPRELF-UHFFFAOYSA-N ethenyl-[2-[ethenyl(dimethyl)silyl]ethyl]-dimethylsilane Chemical compound C=C[Si](C)(C)CC[Si](C)(C)C=C KKZSBFWLCPRELF-UHFFFAOYSA-N 0.000 description 1
- IXGYSZDFZQSXDT-UHFFFAOYSA-N ethenyl-[ethenyl(diethyl)silyl]oxy-diethylsilane Chemical compound CC[Si](CC)(C=C)O[Si](CC)(CC)C=C IXGYSZDFZQSXDT-UHFFFAOYSA-N 0.000 description 1
- IRXHLEQCYIPNIJ-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-[ethenyl-[ethenyl(dimethyl)silyl]oxy-methylsilyl]oxy-methylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C)C=C IRXHLEQCYIPNIJ-UHFFFAOYSA-N 0.000 description 1
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 1
- JTVVAJRXBICJNY-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-methyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C=C)O[Si](C)(C)C=C JTVVAJRXBICJNY-UHFFFAOYSA-N 0.000 description 1
- KOTMCFXAUIHFAW-UHFFFAOYSA-N ethenyl-[ethenyl(diphenyl)silyl]oxy-phenyl-triphenylsilyloxysilane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C=1C=CC=CC=1)O[Si](C=1C=CC=CC=1)(C=C)O[Si](C=C)(C=1C=CC=CC=1)C1=CC=CC=C1 KOTMCFXAUIHFAW-UHFFFAOYSA-N 0.000 description 1
- OFVIRRZRPPRVFE-UHFFFAOYSA-N ethenyl-bis[[ethenyl(dimethyl)silyl]oxy]-methylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C=C)O[Si](C)(C)C=C OFVIRRZRPPRVFE-UHFFFAOYSA-N 0.000 description 1
- CAUNPCJNHQVGOE-UHFFFAOYSA-N ethenyl-bis[[ethenyl(diphenyl)silyl]oxy]-phenylsilane Chemical compound C=1C=CC=CC=1[Si](C=C)(C=1C=CC=CC=1)O[Si](C=1C=CC=CC=1)(C=C)O[Si](C=C)(C=1C=CC=CC=1)C1=CC=CC=C1 CAUNPCJNHQVGOE-UHFFFAOYSA-N 0.000 description 1
- PITANJVKTXCWKI-UHFFFAOYSA-N ethoxy-tris(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(CC=C)CC=C PITANJVKTXCWKI-UHFFFAOYSA-N 0.000 description 1
- CZWMHRRXWSJTFD-UHFFFAOYSA-N ethyl(silylmethyl)silane Chemical compound CC[SiH2]C[SiH3] CZWMHRRXWSJTFD-UHFFFAOYSA-N 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- SLSJGAYGERTZPI-UHFFFAOYSA-N methyl(2-silylethyl)silane Chemical compound C[SiH2]CC[SiH3] SLSJGAYGERTZPI-UHFFFAOYSA-N 0.000 description 1
- UPARUZSLIVQDTG-UHFFFAOYSA-N methyl(methylsilyl)silane Chemical compound C[SiH2][SiH2]C UPARUZSLIVQDTG-UHFFFAOYSA-N 0.000 description 1
- DLNFKXNUGNBIOM-UHFFFAOYSA-N methyl(silylmethyl)silane Chemical compound C[SiH2]C[SiH3] DLNFKXNUGNBIOM-UHFFFAOYSA-N 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- GPMUSVLJDRVPRF-UHFFFAOYSA-N penta-1,4-dien-3-yl(propyl)silane Chemical compound C(=C)C(C=C)[SiH2]CCC GPMUSVLJDRVPRF-UHFFFAOYSA-N 0.000 description 1
- QFXXGTZVYQQGFZ-UHFFFAOYSA-N phenyl(phenylsilyl)silane Chemical compound C=1C=CC=CC=1[SiH2][SiH2]C1=CC=CC=C1 QFXXGTZVYQQGFZ-UHFFFAOYSA-N 0.000 description 1
- 238000011020 pilot scale process Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000003223 protective agent Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052990 silicon hydride Inorganic materials 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- HVXTXDKAKJVHLF-UHFFFAOYSA-N silylmethylsilane Chemical compound [SiH3]C[SiH3] HVXTXDKAKJVHLF-UHFFFAOYSA-N 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- JMTMWSZLPHDWBQ-UHFFFAOYSA-N tetrakis[ethenyl(dimethyl)silyl] silicate Chemical compound C=C[Si](C)(C)O[Si](O[Si](C)(C)C=C)(O[Si](C)(C)C=C)O[Si](C)(C)C=C JMTMWSZLPHDWBQ-UHFFFAOYSA-N 0.000 description 1
- 229960002415 trichloroethylene Drugs 0.000 description 1
- OVFFWUHKSNMAOJ-UHFFFAOYSA-N tris(ethenyl)-[ethenyl(dimethyl)silyl]oxysilane Chemical compound C=C[Si](C)(C)O[Si](C=C)(C=C)C=C OVFFWUHKSNMAOJ-UHFFFAOYSA-N 0.000 description 1
- XHIBIZYPCKQDCU-UHFFFAOYSA-N tris(ethenyl)-[ethenyl(diphenyl)silyl]oxysilane Chemical compound C=1C=CC=CC=1[Si](C=C)(O[Si](C=C)(C=C)C=C)C1=CC=CC=C1 XHIBIZYPCKQDCU-UHFFFAOYSA-N 0.000 description 1
- PKRKCDBTXBGLKV-UHFFFAOYSA-N tris(ethenyl)-methylsilane Chemical compound C=C[Si](C)(C=C)C=C PKRKCDBTXBGLKV-UHFFFAOYSA-N 0.000 description 1
- BUIMIAHJJBAZDE-UHFFFAOYSA-N tris(ethenyl)-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C=C)(C=C)C=C BUIMIAHJJBAZDE-UHFFFAOYSA-N 0.000 description 1
- FYGPPKCOTKWOQD-UHFFFAOYSA-N tris(ethenyl)-triphenylsilyloxysilane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(O[Si](C=C)(C=C)C=C)C1=CC=CC=C1 FYGPPKCOTKWOQD-UHFFFAOYSA-N 0.000 description 1
- IGJPWUZGPMLVDT-UHFFFAOYSA-N tris(ethenyl)-tris(ethenyl)silyloxysilane Chemical compound C=C[Si](C=C)(C=C)O[Si](C=C)(C=C)C=C IGJPWUZGPMLVDT-UHFFFAOYSA-N 0.000 description 1
- YQPHUWZVHLZEPI-UHFFFAOYSA-N tris[[ethenyl(dimethyl)silyl]oxy]-methylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(O[Si](C)(C)C=C)O[Si](C)(C)C=C YQPHUWZVHLZEPI-UHFFFAOYSA-N 0.000 description 1
- XYVYGTWMOAIWOG-UHFFFAOYSA-N tris[[ethenyl(dimethyl)silyl]oxy]-phenylsilane Chemical compound C=C[Si](C)(C)O[Si](O[Si](C)(C)C=C)(O[Si](C)(C)C=C)C1=CC=CC=C1 XYVYGTWMOAIWOG-UHFFFAOYSA-N 0.000 description 1
- FVCWOMJCBKSGAO-UHFFFAOYSA-N tris[ethenyl(dimethyl)silyl] methyl silicate Chemical compound C=C[Si](C)(C)O[Si](OC)(O[Si](C)(C)C=C)O[Si](C)(C)C=C FVCWOMJCBKSGAO-UHFFFAOYSA-N 0.000 description 1
- VEDJZFSRVVQBIL-UHFFFAOYSA-N trisilane Chemical compound [SiH3][SiH2][SiH3] VEDJZFSRVVQBIL-UHFFFAOYSA-N 0.000 description 1
- ZQTYRTSKQFQYPQ-UHFFFAOYSA-N trisiloxane Chemical compound [SiH3]O[SiH2]O[SiH3] ZQTYRTSKQFQYPQ-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
(i)ミスト発生の条件下でミスト化されやすい、シリコーン系コーティング成分;および、
(ii)、ミスト化防止量の分岐ポリシロキサン成分であって、:
(a)分子当たり少なくとも2つの不飽和炭化水素官能基を有する、1つ以上の有機ケイ素化合物、この不飽和炭化水素官能基は、ヒドロシリル化条件下で、シリルヒドリド含有化合物によりヒドロシリル化反応を受けることが可能である;そして
(b)分子当たり少なくとも2つのシリルヒドリド官能基を有する、1つ以上のシリルヒドリド含有化合物。
を含有する成分混合物のヒドロシリル化条件下での共重合から生成する、分岐ポリシロキサン成分、
を含有する組成物(すなわち、コーティング製剤)を調製することによって達成された。
ミスト化防止成分(分岐ポリシロキサン)の合成
本実施例において、成分Aと称される成分は、市販の200から300cPsの粘度をもつ、式MviD110Mviの二官能性ビニル末端のポリシロキサンである。成分Bと称される成分は、市販の6,000から15,000cPsの粘度、および155から180ppmの水素化物含量をもつ、式MD500DH 6.5Mの六官能性シリルヒドリド含有ポリシロキサンであり、式中、6.5は、D基中で不規則に組み合わされたDH基の平均数を表す。成分Cと称される成分は、市販の10重量%の白金を含む触媒製剤である。
ミスト化防止成分を含むコーティング製剤の合成
2ガロンのプラスチック製ペール缶に、100ppmの白金と0.4%のジアリルマレアート阻害剤を含む市販のMViD110MVi溶液94部(1,880g)を入れた。ミスト防止添加剤を、6部(120g)の量でペール缶に入れ、そしてドリル形の攪拌翼を取り付けたかくはん機で混合した。架橋剤、市販の水素化物(MD30DH 15M)を、5.5部(110g)の量でペール缶に加えた。この混合物をドリル形の攪拌翼を取り付けたかくはん機で充分に混合した。
ミスト化防止成分を含むコーティング製剤の合成
2ガロンのプラスチック製ペール缶に、l00ppmの白金と0.4%のジアリルマレアート阻害剤を含む市販のMViD100DVi 2.5MVi溶液87.8部(1,656g)を入れた。ミスト防止添加剤を、6部(113g)の量でペール缶に入れ、そしてドリル形の攪拌翼を取り付けたかくはん機で混合した。架橋剤、市販の水素化物(MD30DH 15M)を、6.0部(113g)の量でペール缶に加えた。この混合物をドリル形の攪拌翼を取り付けたかくはん機で充分に混合した。
コーティングプロセス
パイロットスケールのコーティング機を、総てのコーティングとミスト化の研究に使用した。5本ロールのコーティング機を毎分3,000フィートで運転した。基体は、幅18インチのオーティスミル(Otis Mill)UV350の紙であった。コーティング機には、3x5フィートの空気浮遊−ガス加熱式乾燥機を装備し、550°Fに設定した。被膜重量は、約0.8ポンド/リーム(lb/ream)に設定した。ミストの測定は、紙の基体を毎分3,000フィートでコーティングしながら、TSI社(TSI Incorporated, Shoreview, Minnesota)によって製造されたDUSTTRAK8520アエロゾル監視装置で行った。この測定は、バックアップロールと塗布ロールとの間の接触点に相当する高さで、インナーゲートロールとアウターゲートロールの上部で行った。
Claims (5)
- 組成物であって、
(i)ミスト発生の条件下でミスト化されやすい、シリコーン系コーティング成分;および、
(ii)分岐ポリシロキサンミスト化防止成分であって:
(a)分子当たり少なくとも2つの不飽和炭化水素官能基を有する、1つ以上の有機ケイ素化合物、ここでこの不飽和炭化水素官能基は、ヒドロシリル化条件下で、シリルヒドリド含有化合物によりヒドロシリル化反応を受けることが可能である;そして
(b)分子当たり少なくとも2つのシリルヒドリド官能基を有する、1つ以上のシリルヒドリド含有化合物;
を含有する成分混合物のヒドロシリル化条件下での共重合から生成する、分岐ポリシロキサンミスト化防止成分、
(ただし、
(i)成分(a)または(b)の少なくとも1つは、分子当たり少なくとも3つの官能基を有する;
(ii)成分(a)が、分子当たり、より小さい数の官能基を持つもう1つの成分(b)より、分子当たり、より大きい数の官能基をもつ場合、そのとき、分子当たり、より大きい数の官能基をもつ成分(a)は、分子当たり、より小さい数の官能基をもつ成分(b)のモル量と等しいかもしくは少ないモル量で存在し、成分(b)が、分子当たり、より小さい数の官能基を持つもう1つの成分(a)より、分子当たり、より大きい数の官能基をもつ場合、そのとき、分子当たり、より大きい数の官能基をもつ成分(b)は、分子当たり、より小さい数の官能基をもつ成分(a)より少ないモル量で存在し;そして、
(iii)不飽和炭化水素化合物は、組成物から除外される;
(iv)ここで成分(a)の不飽和炭化水素官能基が、成分(b)のシリルヒドリド官能基に対するモル比において、4.25:1から2:1までの範囲内であり;
(v)成分(ii)は、組成物の全量に基づいて0.1〜15重量パーセントの量で組成物に含まれる、
という条件である)
を含有する、組成物。 - 成分(a)または(b)の1つが、分子当たり少なくとも4つの官能基を持ち、そして分子当たり2つまたは3つの官能基を持つもう1つの成分(a)または(b)より少ないモル量である、請求項1に記載の組成物。
- 成分(a)または(b)の1つが、分子当たり少なくとも6つの官能基を持ち、そして分子当たり2つまたは3つの官能基を持つもう1つの成分(a)または(b)より少ないモル量である、請求項1に記載の組成物。
- コーティングプロセスであって、請求項1〜3のいずれか1項に記載の組成物をミスト発生の条件下で基体に塗布することを含有し、前記組成物が、分岐ポリシロキサン成分は無いが他は同じである組成物と比較して、前記ミスト発生の条件に置かれた場合に減少されたミスト化を示し、前記組成物を硬化することを含有する、コーティングプロセス。
- 硬化されたシリコーン系コーティングまたはフィルムであって、請求項1〜3のいずれか1項に記載の組成物で被覆された基体を1つもしくはそれ以上の硬化工程にかけることによって生成した、硬化されたシリコーン系コーティングまたはフィルム。
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US11/515,463 US7560167B2 (en) | 2006-09-01 | 2006-09-01 | Composition containing anti-misting component |
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PCT/US2007/019112 WO2008027494A2 (en) | 2006-09-01 | 2007-08-30 | Composition containing anti-misting component |
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-
2006
- 2006-09-01 US US11/515,463 patent/US7560167B2/en active Active
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US7560167B2 (en) | 2009-07-14 |
WO2008027494A2 (en) | 2008-03-06 |
EP2057238B1 (en) | 2012-10-10 |
US20080058479A1 (en) | 2008-03-06 |
JP2014088556A (ja) | 2014-05-15 |
CN101535428B (zh) | 2012-10-10 |
JP2010502778A (ja) | 2010-01-28 |
WO2008027494A3 (en) | 2008-04-10 |
CN101535428A (zh) | 2009-09-16 |
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