JP5736272B2 - 青色発光蛍光体及び該青色発光蛍光体を用いた発光装置 - Google Patents

青色発光蛍光体及び該青色発光蛍光体を用いた発光装置 Download PDF

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Publication number
JP5736272B2
JP5736272B2 JP2011173867A JP2011173867A JP5736272B2 JP 5736272 B2 JP5736272 B2 JP 5736272B2 JP 2011173867 A JP2011173867 A JP 2011173867A JP 2011173867 A JP2011173867 A JP 2011173867A JP 5736272 B2 JP5736272 B2 JP 5736272B2
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Japan
Prior art keywords
blue light
emitting phosphor
light emitting
powder
phosphor
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Expired - Fee Related
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JP2011173867A
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Japanese (ja)
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JP2013035957A (ja
JP2013035957A5 (https=
Inventor
福田　晃一
晃一 福田
仁 天谷
仁 天谷
誠司 野口
誠司 野口
稲垣　徹
徹 稲垣
真樹 田中
真樹 田中
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Ube Material Industries Ltd
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Ube Material Industries Ltd
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Priority to JP2011173867A priority Critical patent/JP5736272B2/ja
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Publication of JP2013035957A5 publication Critical patent/JP2013035957A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

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JP2011173867A 2011-08-09 2011-08-09 青色発光蛍光体及び該青色発光蛍光体を用いた発光装置 Expired - Fee Related JP5736272B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011173867A JP5736272B2 (ja) 2011-08-09 2011-08-09 青色発光蛍光体及び該青色発光蛍光体を用いた発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011173867A JP5736272B2 (ja) 2011-08-09 2011-08-09 青色発光蛍光体及び該青色発光蛍光体を用いた発光装置

Publications (3)

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JP2013035957A JP2013035957A (ja) 2013-02-21
JP2013035957A5 JP2013035957A5 (https=) 2014-03-27
JP5736272B2 true JP5736272B2 (ja) 2015-06-17

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JP2011173867A Expired - Fee Related JP5736272B2 (ja) 2011-08-09 2011-08-09 青色発光蛍光体及び該青色発光蛍光体を用いた発光装置

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JP (1) JP5736272B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0636841B2 (ja) 1990-03-27 1994-05-18 株式会社東洋製作所 加圧式凍結濃縮装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6729393B2 (ja) * 2015-01-07 2020-07-22 宇部興産株式会社 蛍光体及び発光装置並びに蛍光体の製造方法
CN116410745B (zh) * 2021-12-31 2023-10-24 江苏博睿光电股份有限公司 一种荧光粉材料

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4077170B2 (ja) * 2000-09-21 2008-04-16 シャープ株式会社 半導体発光装置
JP4168776B2 (ja) * 2002-02-15 2008-10-22 三菱化学株式会社 発光装置及びそれを用いた照明装置
JP4096619B2 (ja) * 2002-05-17 2008-06-04 松下電器産業株式会社 プラズマディスプレイ装置の製造方法
JP2006012770A (ja) * 2004-05-27 2006-01-12 Hitachi Ltd 発光装置及び該発光装置を用いた画像表示装置
JP2006312654A (ja) * 2005-04-07 2006-11-16 Sumitomo Chemical Co Ltd 蛍光体
JP2008050523A (ja) * 2006-08-28 2008-03-06 Hitachi Ltd プラズマディスプレイ装置および発光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0636841B2 (ja) 1990-03-27 1994-05-18 株式会社東洋製作所 加圧式凍結濃縮装置

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